CN107248550A - The method for packing of oled panel - Google Patents
The method for packing of oled panel Download PDFInfo
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- CN107248550A CN107248550A CN201710496727.7A CN201710496727A CN107248550A CN 107248550 A CN107248550 A CN 107248550A CN 201710496727 A CN201710496727 A CN 201710496727A CN 107248550 A CN107248550 A CN 107248550A
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- oled panel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of method for packing of oled panel, the inorganic passivation layer of packaging protection layer is formed on substrate and oled layer by using the mode of evaporation, so as to which effectively encapsulated layer is spaced apart with oled layer, and then can prevent moisture micro in encapsulated layer or solvent from penetrating into inside OLED and causing luminous zone dim spot, further increase the packaging effect of oled panel, in addition for the oled panel of top emission type, it can also prevent from encapsulating Mura generation, the present invention forms the inorganic passivation layer by using the mode of evaporation simultaneously, the packaging cost of oled panel can effectively be reduced, just it can directly be deposited to form inorganic passivation layer after evaporation forms oled layer, it is easy to operation, utilization rate of equipment and installations is high.
Description
Technical field
The present invention relates to technical field of flat panel display, more particularly to a kind of method for packing of oled panel.
Background technology
Organic Light Emitting Diode (Organic Light Emitting Display, OLED) display device has spontaneous
Light, driving voltage are low, luminous efficiency is high, the response time is short, definition and contrast is high, nearly 180 ° of visual angles, temperature in use scope
Many advantages, such as wide, achievable Flexible Displays and large area total colouring, it is the display for most having development potentiality to be known as by industry
Device.
OLED is generally included：Substrate, the anode on substrate, the hole injection layer on anode, located at sky
Hole transmission layer on the implanted layer of cave, the luminescent layer on hole transmission layer, the electron transfer layer on luminescent layer, it is located at
Electron injecting layer on electron transfer layer and the negative electrode on electron injecting layer.The principle of luminosity of OLED is semiconductor material
Material and luminous organic material pass through carrier injection and composite guide photoluminescence under electric field driven.Specifically, OLED is usual
Using ITO pixel electrodes and metal electrode anode and negative electrode respectively as device, under certain voltage driving, electronics and hole
Electron transfer layer and hole transmission layer are injected into from negative electrode and anode respectively, electronics and hole are respectively through electron transfer layer and sky
Cave transport layer moves to luminescent layer, and is met in luminescent layer, forms exciton and excites light emitting molecule, the latter relaxes through overshoot
Henan and send visible ray.But it is due to that organic material is very sensitive to steam and oxygen, easily with steam or oxygen reaction, water/oxygen
Infiltration can reduce the life-span of OLED significantly, to reach requirement of the commercialization for OLED service life and stability,
OLED requires very high for packaging effect：Service life is at least at 10E4 hours, and water vapor transmittance is less than 10-6g/m2/
Day, oxygen penetration rate is less than 10-5cc/m2/day(1atm).Therefore, the close of device inside is improved by the encapsulation of OLED
Feng Xing, isolates with external environment condition as far as possible, most important for the stabilized illumination of OLED, is to influence the pass of product yield
One of key factor.
Existing OLED packaged type is mainly cover plate packaged type, i.e., coating can be with ultraviolet on encapsulation cover plate
(UV) glass cement (Frit) of the frame glue (DAM) of solidification or radium-shine encapsulation (Laser sealing) provides one for OLED
Individual closed environment relatively, so that good water/oxygen obstructing capacity can be reached within a certain period of time.
But traditional cover plate encapsulation usually requires to add filler (Filler) between cover plate and oled substrate, one is
For increasing the mechanical strength of display panel, especially for large-sized display panel, two, which can be by MOLECULE DESIGN, makes
Obtaining Filler has absorbent function, so that the life-span for improving OLED, three be the oled panel for top emission type,
Filler may further be used to eliminate the generation of Newton's ring.Filler is generally the organic resin of low viscosity, containing micro moisture or
Person's solvent, if the cathode contacts directly with OLED, will penetrate into OLED devices from poroid (pinhole) defect on negative electrode
Inside part, so as to cause luminous zone dim spot；In addition, for the oled panel of top emission type, to improve the transmitance of transparent cathode
And then it is photochromic to improve device, it will usually the organic film of a floor height refractive index is formed on negative electrode, generally Filler
Can the organic film photochromic with the improvement have an effect at a certain temperature and display panel is produced mura, so by Filler
Completely cut off necessary with the organic film.And the conventional method solved the above problems is then that chemical vapor deposition is used on negative electrode
(chemical vapor deposition, CVD) or ald (Atomic Layer Deposition, ALD)
Mode forms layer protective layer or passivation layer (Passivation), usually silicon nitride (SiN) layer or silica (SiO)
Layer etc., but CVD equipment and ALD equipment both equipment prices are expensive, and it is film-made that speed is low, cause the encapsulation of oled panel
Cost increase.
Nearly 2 years, the exploration encapsulated on flexible OLED panel carried out like a raging fire, still, the envelope of flexible OLED devices
Dress up this meeting increases 1-5 times in the cost that conventional cover plate is encapsulated, though flexible OLED shows the display trend for future, passes
The oled panel of system cover plate encapsulation can't disappear.Therefore, the cost of reduction conventional cover plate encapsulation just turns into a key.
The content of the invention
It is an object of the invention to provide a kind of method for packing of oled panel, by the way of evaporation on oled layer shape
Into the inorganic passivation layer of packaging protection layer, so that encapsulated layer be spaced apart with oled layer, the encapsulation of oled panel can be effectively reduced
Cost, and it is easy to operation, utilization rate of equipment and installations is high.
To achieve the above object, the present invention provides a kind of method for packing of oled panel, comprises the following steps：
Step S1, offer substrate, form oled layer on the substrate；
Step S2, form packaging protection layer on the substrate and oled layer, the packaging protection layer includes at least two layers
Inorganic passivation layer and at least one layer of organic buffer layer, wherein, the inorganic passivation layer of individual layer and the organic buffer layer of individual layer are handed over successively
For being stacked, the inorganic passivation layer is than the organic buffer layer many one layers in the number of plies, and each inorganic passivation layer is by nothing
Machine deposition material makes to be formed by way of evaporation；
Step S3, make encapsulated layer on the substrate and packaging protection layer, the packaging protection layer is by the encapsulated layer
It is spaced apart with oled layer.
In the packaging protection layer, the material of the inorganic passivation layer is lithium fluoride.
Oled layer formed in the step S1 includes anode layer, organic function layer and the moon set gradually from the bottom to top
In pole layer, the packaging protection layer, the whole face of inorganic passivation layer of basecoat covers the cathode layer of the oled layer.
In the packaging protection layer, the thickness of the inorganic passivation layer of basecoat is 3-6 μm.
In the packaging protection layer, the inorganic passivation layer is gradually reduced by order thickness from the bottom to top.
In the packaging protection layer, the material of the organic buffer layer is organic vapor deposition material, and the organic buffer layer leads to
The mode for crossing evaporation makes to be formed；Or, the material of the organic buffer layer is packaging plastic material.
In the packaging protection layer, the thickness of each organic buffer layer is no more than 500nm.
The encapsulated layer includes being oppositely arranged located at the peripheral frame glue of the oled layer, with the substrate on the substrate
And cross space by cover plate of the frame glue together with the substrate bonding and located at the frame glue, cover plate and substrate
Interior packed layer.
The encapsulated layer includes encapsulating face glue-line on the substrate and oled layer and relative with the substrate set
Put and the cover plate by the encapsulating face glue-line together with the substrate bonding.
The encapsulated layer includes the encapsulating face glue-line being located on the substrate and oled layer with located at the substrate and encapsulation
Packaging film on the glue-line of face.
Beneficial effects of the present invention：The method for packing of the oled panel of the present invention, by using the mode of evaporation in substrate
And the inorganic passivation layer of packaging protection layer, so as to effectively be spaced apart encapsulated layer with oled layer, Jin Erke are formed on oled layer
Prevent moisture micro in encapsulated layer or solvent from penetrating into inside OLED and causing luminous zone dim spot, further increase
The packaging effect of oled panel, in addition for the oled panel of top emission type, can also prevent from encapsulating Mura generation, while this hair
The bright mode by using evaporation forms the inorganic passivation layer, can effectively reduce the packaging cost of oled panel, in evaporation shape
It just can directly be deposited to form inorganic passivation layer after into oled layer, be easy to operation, utilization rate of equipment and installations is high.
In order to be able to be further understood that the feature and technology contents of the present invention, refer to below in connection with the detailed of the present invention
Illustrate and accompanying drawing, however accompanying drawing only provide with reference to and explanation use, not for being any limitation as to the present invention.
Brief description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the embodiment to the present invention, technical scheme will be made
And other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 is the schematic flow sheet of the method for packing of the oled panel of the present invention；
Packaging protection layer formed in step S2 of the Fig. 2 for the method for packing first embodiment of the oled panel of the present invention
Schematic diagram；
Fig. 3 is the step S3 of the method for packing first embodiment of the oled panel of present invention schematic diagram；
Packaging protection layer formed in step S2 of the Fig. 4 for the method for packing second embodiment of the oled panel of the present invention
Schematic diagram；
Fig. 5 is the step S3 of the method for packing second embodiment of the oled panel of present invention schematic diagram；
Fig. 6 is the step S3 of the method for packing 3rd embodiment of the oled panel of present invention schematic diagram.
Embodiment
Further to illustrate the technological means and its effect of the invention taken, below in conjunction with being preferable to carry out for the present invention
Example and its accompanying drawing are described in detail.
Referring to Fig. 1, the present invention provides a kind of method for packing of oled panel, the method for packing of oled panel of the present invention
First embodiment, specifically includes following steps：
Step S1, offer substrate 10, form oled layer 20 on the substrate 10.
Specifically, the substrate 10 is thin film transistor (TFT) (TFT) array base palte, thereon with TFT layer 11, the substrate 10
Underlay substrate can be rigid substrates, such as such as glass substrate, or flexible base board, flexible polyimides (PI)
Substrate.
Specifically, the anode layer that the oled layer 20 formed in the step S1 includes setting gradually from the bottom to top (is not schemed
Show), organic function layer 21 and cathode layer 22.
Specifically, the oled panel can be the oled panel of top emission type, and the cathode layer 22 is using the side being deposited
Formula makes to be formed, and its material is magnesium silver alloy (Mg/Ag), or the oled panel of bottom emitting type, and cathode layer 22 is using steaming
The mode of plating makes to be formed, and its material is aluminium (Al).
Specifically, the step S1 also includes, after evaporation forms cathode layer 22, oled layer 20 cathode layer 22 it
Upper evaporation forms organic refracting layer (not shown) of a floor height refractive index, to improve the photochromic of OLED.
Step S2, the formation packaging protection layer 30 on the substrate 10 and oled layer 20, the packaging protection layer 30 include
At least two layers inorganic passivation layer 31 and at least one layer of organic buffer layer 32, wherein, the inorganic passivation layer 31 of individual layer and having for individual layer
Machine cushion 32 successively it is alternately laminated set, the inorganic passivation layer 31 than the organic buffer layer 32 many one layers in the number of plies,
Each inorganic passivation layer 31 makes to be formed by inorganic deposition material by way of evaporation.
Specifically, in the packaging protection layer 30, the material of the inorganic passivation layer 31 is transparent or with higher
Cross the inorganic deposition material of rate.
Lithium fluoride (LiF) is a kind of stable inorganic thing, is a kind of white crystal for being insoluble in water, is industrially had well
Using available for nuclear industry, porcelain enamel industry, optical glass manufacture, drier, fluxing agent etc., and in OLED industries, LiF leads to
Frequently as electron injecting layer material, and its filminess is transparent.Therefore, further, it is described inorganic blunt in the present invention
The material for changing layer 31 is preferably lithium fluoride (LiF), and the LiF films are high due to compactness, can effectively improve packaging effect.
Specifically, in the packaging protection layer 30, the whole face of inorganic passivation layer 31 of basecoat covers the oled layer 20,
I.e. whole face covers the cathode layer 22 of oled layer 20.
Specifically, in the packaging protection layer 30, the thickness of the inorganic passivation layer 31 of basecoat is 3-6 μm.
Specifically, in the packaging protection layer 30, the thickness of each organic buffer layer 32 is no more than 500nm.
Specifically, in the packaging protection layer 30, the inorganic passivation layer 31 is gradually subtracted by order thickness from the bottom to top
It is small.
Specifically, in the packaging protection layer 30, the material of the organic buffer layer 32 is organic material, and it specifically can be with
For organic vapor deposition material or packaging plastic material.
Further, the organic buffer layer 32 is preferably organic vapor deposition material, so that the organic buffer layer 32 can lead to
The mode for crossing evaporation makes to be formed, and so after evaporation forms inorganic passivation layer 31, just can be deposited to form organic buffer layer immediately
32, the time for passing piece is reduced, the utilization rate of equipment is improved.
Specifically, as shown in Fig. 2 in the present embodiment, the packaging protection layer 30 includes two layers of He of inorganic passivation layer 31
One layer of organic buffer layer 32；Two layers of inorganic passivation layer 31 is respectively the first inorganic passivation layer 311 and the second inorganic passivation 312.
The specific manufacturing process of formation packaging protection layer 30 is in the step S2：Shape is deposited on organic refracting layer
Into the first inorganic passivation layer 311 that a layer thickness is 3-6 μm, then evaporation forms a layer thickness on the first inorganic passivation layer again
For 100nm organic buffer layer 32, finally evaporation forms a layer thickness is 500-1000nm's on the organic buffer layer 32 again
Second inorganic passivation layer 312, so as to obtain the packaging protection layer 30.
Step S3, encapsulated layer 40 is made on the substrate 10 and packaging protection layer 30, the packaging protection layer 30 is by institute
Encapsulated layer 40 is stated to be spaced apart with oled layer 20.
Specifically, as shown in figure 3, the encapsulated layer 40 formed in the step S3, which is included on the substrate 10, is located at institute
The frame glue 41 of the periphery of oled layer 20 is stated, is oppositely arranged and is bonded in by the frame glue 41 with the substrate 10 with the substrate 10
Cover plate 42 together and packed layer 43 in space is crossed located at the frame glue 41, cover plate 42 and substrate 10, i.e., described envelope
Fill the encapsulating structure that layer 40 is traditional Dam＆Filler formulas, the encapsulated layer 40 and packaging protection layer 30 together constitute it is low into
This mixing (hybrid) encapsulating structure.
Specifically, the cover plate 42 is glass plate or metallic plate etc..
The method for packing of the oled panel of the present invention, is formed by using the mode of evaporation on substrate 10 and oled layer 20
Encapsulated layer 40, effectively can be spaced apart, and then can prevent encapsulated layer by the inorganic passivation layer 31 of packaging protection layer 30 with oled layer 20
Micro moisture or solvent penetrate into inside OLED and cause luminous zone dim spot in 40, further increase oled panel
Packaging effect, in addition for the oled panel of top emission type, because packaging protection layer 30 can improve encapsulated layer 40 with being used for
Photochromic organic refracting layer is separated, therefore can also prevent from encapsulating Mura generation, while side of the present invention by using evaporation
Formula forms the inorganic passivation layer 31, can effectively reduce the packaging cost of oled panel, after evaporation forms oled layer 20 just
It directly can be deposited to form inorganic passivation layer 31, be easy to operation, utilization rate of equipment and installations is high.
The second embodiment of the method for packing of oled panel of the present invention, compared with above-mentioned first embodiment, its difference is,
Packaging protection layer 30 formed in the step S2, as shown in figure 4, including three layers of inorganic passivation layer 31 and two layers of organic buffer
Layer 32；Three layers of inorganic passivation layer 31 are respectively the first inorganic passivation of the 311, second inorganic passivation 312 and the 3rd of inorganic passivation layer
Layer 313, two layers of organic buffer layer 32 is respectively the first organic buffer layer 321 and the second organic buffer layer 322；In addition, such as Fig. 5
Shown, the encapsulated layer 40 formed in the step S3 includes the encapsulating face glue-line on the substrate 10 and oled layer 20
41 ' and the lid that is oppositely arranged and is bonded together by the encapsulating face glue-line 41 ' and the substrate 10 with the substrate 10
Plate 42 ', the i.e. encapsulated layer 40 are traditional face encapsulation (Face sealent) structure, the encapsulated layer 40 and packaging protection layer 30
Collectively form mixing (hybrid) encapsulating structure of low cost.Other technical characteristics are identical with above-mentioned first embodiment, herein
Repeat no more.
The 3rd embodiment of the method for packing of oled panel of the present invention, as shown in fig. 6, compared with above-mentioned first embodiment,
Its difference is that the encapsulated layer 40 formed in the step S3 includes the encapsulating face on the substrate 10 and oled layer 20
Glue-line 41 " is with the packaging film 42 " on the substrate 10 and encapsulating face glue-line 41 ".Other technical characteristics are with above-mentioned
One embodiment is identical, will not be repeated here.
In addition to the above embodiments, in the other embodiment of the method for packing of oled panel of the present invention, the encapsulated layer 40
Can also be using other encapsulating structures, such as glass cement (Frit) encapsulating structure.
In summary, the method for packing of oled panel of the invention, by using the mode of evaporation in substrate and oled layer
The upper inorganic passivation layer for forming packaging protection layer, so as to effectively be spaced apart encapsulated layer with oled layer, and then can prevent encapsulation
Micro moisture or solvent penetrate into inside OLED and cause luminous zone dim spot in layer, further increase oled panel
Packaging effect, in addition for the oled panel of top emission type, can also prevent encapsulate Mura generation, while the present invention by using
The mode of evaporation forms the inorganic passivation layer, can effectively reduce the packaging cost of oled panel, evaporation formed oled layer it
It just directly can be deposited to form inorganic passivation layer afterwards, be easy to operation, utilization rate of equipment and installations is high.
It is described above, for the person of ordinary skill of the art, can be with technique according to the invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to appended right of the invention
It is required that protection domain.
Claims (10)
1. a kind of method for packing of oled panel, it is characterised in that comprise the following steps：
Step S1, offer substrate (10), form oled layer (20) on the substrate (10)；
Step S2, packaging protection layer (30), the packaging protection layer (30) are formed on the substrate (10) and oled layer (20)
Including at least two layers inorganic passivation layer (31) and at least one layer of organic buffer layer (32), wherein, the inorganic passivation layer (31) of individual layer
With organic buffer layer (32) the alternately laminated setting successively of individual layer, the inorganic passivation layer (31) is than the organic buffer layer (32)
Many one layer in the number of plies, each inorganic passivation layer (31) makes to be formed by inorganic deposition material by way of evaporation；
Step S3, making encapsulated layer (40), the packaging protection layer (30) on the substrate (10) and packaging protection layer (30)
The encapsulated layer (40) is spaced apart with oled layer (20).
2. the method for packing of oled panel as claimed in claim 1, it is characterised in that in the packaging protection layer (30), institute
The material for stating inorganic passivation layer (31) is lithium fluoride.
3. the method for packing of oled panel as claimed in claim 1, it is characterised in that the OLED formed in the step S1
Layer (20) includes anode layer, organic function layer (21) and the cathode layer (22) set gradually from the bottom to top, the packaging protection layer
(30) in, the whole face of inorganic passivation layer (31) of basecoat covers the cathode layer (22) of the oled layer (20).
4. the method for packing of oled panel as claimed in claim 1, it is characterised in that in the packaging protection layer (30), most
The thickness of next layer of inorganic passivation layer (31) is 3-6 μm.
5. the method for packing of oled panel as claimed in claim 1, it is characterised in that in the packaging protection layer (30), institute
Inorganic passivation layer (31) is stated to be gradually reduced by order thickness from the bottom to top.
6. the method for packing of oled panel as claimed in claim 1, it is characterised in that in the packaging protection layer (30), institute
The material for stating organic buffer layer (32) is organic vapor deposition material, and the organic buffer layer (32) makes shape by way of evaporation
Into；Or, the material of the organic buffer layer (32) is packaging plastic material.
7. the method for packing of oled panel as claimed in claim 1, it is characterised in that in the packaging protection layer (30), often
The thickness of one organic buffer layer (32) is no more than 500nm.
8. the method for packing of oled panel as claimed in claim 1, it is characterised in that the encapsulated layer (40) is included in described
It is oppositely arranged and by the frame located at the frame glue (41) of the oled layer (20) periphery, with the substrate (10) on substrate (10)
Cover plate (42) that glue (41) and the substrate (10) are bonded together and located at the frame glue (41), cover plate (42) and substrate
(10) packed layer (43) in space is crossed.
9. the method for packing of oled panel as claimed in claim 1, it is characterised in that the encapsulated layer (40) includes being located at institute
State substrate (10) and encapsulating face glue-line (41 ') on oled layer (20) and be oppositely arranged and by described with the substrate (10)
The cover plate (42 ') that encapsulating face glue-line (41 ') is bonded together with the substrate (10).
10. the method for packing of oled panel as claimed in claim 1, it is characterised in that the encapsulated layer (40) includes being located at
The substrate (10) and encapsulating face glue-line (41 ") on oled layer (20) and located at the substrate (10) and encapsulating face glue-line
Packaging film (42 ") on (41 ').
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019075853A1 (en) * | 2017-10-17 | 2019-04-25 | 深圳市华星光电半导体显示技术有限公司 | Encapsulation method and encapsulation structure for flexible oled panel |
| CN110071223A (en) * | 2019-04-04 | 2019-07-30 | 深圳市华星光电半导体显示技术有限公司 | A kind of OLED encapsulating structure and OLED encapsulation method |
| CN110085761A (en) * | 2019-04-04 | 2019-08-02 | 深圳市华星光电技术有限公司 | Encapsulation cover plate and the display panel for using the encapsulation cover plate |
| WO2019205266A1 (en) * | 2018-04-28 | 2019-10-31 | 武汉华星光电半导体显示技术有限公司 | Flexible cover plate of display panel |
| CN110767730A (en) * | 2019-10-31 | 2020-02-07 | 云谷（固安）科技有限公司 | Display panel, preparation method thereof and display device |
| WO2020062762A1 (en) * | 2018-09-26 | 2020-04-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| WO2021042678A1 (en) * | 2019-09-02 | 2021-03-11 | 武汉华星光电半导体显示技术有限公司 | Display structure |
| CN113629211A (en) * | 2021-07-28 | 2021-11-09 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN114420864A (en) * | 2022-01-10 | 2022-04-29 | 南京迪视泰光电科技有限公司 | Packaging structure and preparation method thereof |
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