CN107246596A - Heat abstractor for LED chip and the LED/light source using the device - Google Patents
Heat abstractor for LED chip and the LED/light source using the device Download PDFInfo
- Publication number
- CN107246596A CN107246596A CN201710467660.4A CN201710467660A CN107246596A CN 107246596 A CN107246596 A CN 107246596A CN 201710467660 A CN201710467660 A CN 201710467660A CN 107246596 A CN107246596 A CN 107246596A
- Authority
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- China
- Prior art keywords
- heat
- heat conduction
- led chip
- conduction material
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses the LED/light source of the heat abstractor for LED chip and the use device.Wherein, heat abstractor includes heat-conducting substrate, the transparent laminas located at LED chip top surface located at LED chip bottom surface, transparent laminas covers LED chip top surface, its area is more than or equal to the area of LED chip top surface, and provided with the first Heat Conduction Material between transparent laminas and the heat-conducting substrate.The heat abstractor can realize that the top surface of LED chip and bottom surface are radiated simultaneously, effectively increase radiating efficiency.
Description
Technical field
The present invention relates to LED light source domain, more particularly to the heat abstractor for LED chip and the device is used
LED/light source.
Background technology
Current LED/light source is widely used to each lighting field, with small volume, the advantage such as power consumption is low, brightness is high.With
LED popularization and the demand to its power, LED shows that its superior performance, especially road, tunnel, automobile etc. shine
Bright to need larger power, the heat accordingly produced is also more.Therefore, radiating is become as a big problem, if heat can not and
When distribute, then can cause the optical attenuation of LED chips, reduce luminous efficiency.According to relevant as shown by data, temperature often rises 10
Degree Celsius, life-span drop by half can even make LED fail when serious, therefore, efficient heat abstractor, be the lifting LED longevity
The key of life.
China applies for a patent CN104214739A and discloses a kind of high-power LED heat radiating device, and it is pasted in LED/light source bottom surface
Heat-conducting substrate is covered, mono-layer graphite alkenyl interface is set between LED/light source and substrate, and in LED/light source bottom surface and mono-layer graphite
The composite bed of graphene and thermal conductive adhesive is filled on the contact interface at alkenyl interface.The program utilizes mono-layer graphite alkenyl interface
The heat that LED/light source is produced is conducted to substrate, improves radiating efficiency.
However, this scheme have the shortcomings that it is obvious：The program only sets cooling system in the bottom surface of LED/light source, and
Not to top surface（Light-emitting area）Handled.When LED/light source works, the heat shortage for being gathered in top surface fast and effectively radiates
Means, can still result in heat accumulation, influence LED radiating.
The content of the invention
In order to solve the above-mentioned problems in the prior art, the present invention propose the heat abstractor for LED chip with
And use the LED/light source of the device.
According to an aspect of the present invention, it is proposed that a kind of heat abstractor of LED chip, described device includes：Located at LED
The heat-conducting substrate of die bottom surface, located at the transparent laminas of LED chip top surface, the transparent laminas covers LED chip top surface,
Its area is more than or equal to the area of LED chip top surface, and provided with first between the transparent laminas and the substrate
Heat Conduction Material.
Further, the transparent laminas is water white transparency signle crystal alumina (Al2O3), water white transparency polycrystal alumina
(Al2O3), water white transparency monocrystalline silicon carbide (SiC), water white transparency magnesium oxide single crystal (MgO), water white transparency magnesium aluminate spinel
(MgAl2O4), water white transparency spinel-type aluminum oxynitride (AlON), water white transparency yttrium（Y2O3）, water white transparency yttrium aluminium
Garnet（Y3Al5O12）Or diamond single crystal piece.
Further, the light transmittance of the transparent laminas is more than 95%, and thermal conductivity is more than 5W/ (mK), and thickness is 0.1-
5mm。
Further, between the transparent laminas and LED chip top surface, provided with the second Heat Conduction Material.
Further, between LED chip bottom surface and the heat-conducting substrate, provided with the 3rd Heat Conduction Material.
Further, between first Heat Conduction Material and the transparent laminas, provided with the 4th Heat Conduction Material.
Further, between first Heat Conduction Material and heat-conducting substrate, provided with the 5th Heat Conduction Material.
Further, first Heat Conduction Material is high heat conduction and has the material of certain flexibility, including pyrolytic graphite film,
Expandable graphite sheet, graphene film, carbon nano-tube film, composite heat-conducting graphite film, aluminium foil, copper foil etc., thickness are 10-500 microns, heat
Conductance is more than 150W/ (mK).
Further, second Heat Conduction Material be transparent heat-conducting glue, 5-50 microns of thickness, light transmittance is more than 95%.
Further, the 3rd Heat Conduction Material is heat-conducting glue, thermal grease conduction or Metal Substrate heat-conducting pad, thickness 10-500
Micron.
Further, the 4th Heat Conduction Material and/or the 5th Heat Conduction Material are heat-conducting glue or thermal grease conduction, thickness 10-
500 microns.
According to another aspect of the invention, it is proposed that a kind of LED/light source, including：LED chip, and any one above-mentioned side
The heat abstractor of case.
Heat abstractor for LED chip and the LED/light source using the device proposed by the present invention, with prior art phase
Than having the advantage that：Heat-conducting system is constituted in the top surface of LED chip using transparent laminas and the first Heat Conduction Material, in not shadow
Ring and realize that chip two sides is radiated simultaneously on the basis of lighting, than existing one side（Bottom surface）Scattering system is more beneficial for dissipating for heat
Lose, the service life of device can be effectively improved.
Brief description of the drawings
Fig. 1 is construction for heat radiating device schematic diagram of the invention.Wherein, 1 is the first Heat Conduction Material, and 2 be the second Heat Conduction Material, and 3 are
3rd Heat Conduction Material, 4 be the 4th Heat Conduction Material, and 5 be the 5th Heat Conduction Material, and 6 be LED chip, and 7 be heat-conducting substrate, and 8 lead to be transparent
Backing.
Fig. 2 is the close-up schematic view of the construction for heat radiating device of the present invention.Wherein, 2 be the second Heat Conduction Material, and 3 be the
Three Heat Conduction Materials, 6 be LED chip, and 8 be transparent laminas.
Fig. 3 is the temperature variation curve of the heat abstractor of different embodiments of the present invention.
Embodiment
Be described more fully below the present invention specific embodiment, it should be noted that the embodiments described herein be served only for for example,
It is not intended to limit the invention.In the following description, in order to provide thorough understanding of the present invention, a large amount of certain details are elaborated
Section.It will be apparent, however, to one skilled in the art that, it is not necessary to carry out the present invention using these specific details.
In other instances, in order to avoid obscuring the present invention, known structure, circuit, material or method are not specifically described.
Throughout the specification, meaning is referred to " one embodiment ", " embodiment ", " example " or " example "
, be comprised in reference to special characteristic, structure or the characteristic that the embodiment or example are described at least one embodiment of the invention.
Therefore, in each local phrase " in one embodiment " occurred, " in embodiment ", " example " of entire disclosure
Or " example " is not necessarily all referring to same embodiment or example.Furthermore, it is possible to will be specific with any appropriate combination and/or sub-portfolio
Feature, structure or property combination in one or more embodiments or example.The present invention is carried out below with reference to accompanying drawing specific
Description.
In the description carried out below in conjunction with accompanying drawing to technical scheme, size, the ratio of each element of attached middle school
And position relationship is that connected mode between exemplary, illustrated each element is also intended merely to illustrate, it is not
For limiting the present invention.
Embodiment 1
Reference picture 1, the LED chip 6 used is Ou Silang finished product LED chips（Model：LE UW D1W5 01）, chip area 2cm
× 2cm, rated power 11W.The thickness of signle crystal alumina transparent laminas 8 is 300 microns, and area is 2cm × 2cm, thermal conductivity
23W/(m·K).Select pyrolytic graphite film as the first Heat Conduction Material 1, thickness is 40 microns, size is 10cm × 10cm, thermal conductivity
Rate is more than 500W/ (mK).
In the bottom surface of LED chip 6（Lower surface）Heat conduction aluminum substrate 7 is set, in the top surface of LED chip 6（Upper surface）Monocrystalline is set
Aluminum oxide transparent laminas 8.Specific packaging technology comprises the following steps：
（1）The separately formed heat conduction aluminum substrate 7 with fin；
（2）The second Heat Conduction Material 2 is set between transparent laminas 8 and the top surface of LED chip 6, second Heat Conduction Material 2 is transparent
PET heat-conducting glues, 10 microns of thickness；
（3）The 3rd Heat Conduction Material 3 is set between LED chip 6 and heat conduction aluminum substrate 7, the 3rd Heat Conduction Material 3 is heat-conducting silicone grease,
80 microns of thickness, thermal conductivity 2W/ (mK)；
（4）Select pyrolytic graphite film as the first Heat Conduction Material 1, cut and make its middle hollow out, the area of middle hollow out is less than
The area of transparent laminas 8, but the luminous component of LED chip 6 is not covered, so pyrolytic graphite film can be made not stop LED core
Piece lights, and ensure the void region edge of pyrolytic graphite film can fully be contacted with the edge of transparent laminas realize it is good
Heat transfer.The surrounding of graphite film can be arbitrary shape, but can be contacted with heat conduction aluminum substrate 7.Further to improve heat transfer
Efficiency, applies the 4th Heat Conduction Material 4 between the first Heat Conduction Material 1 and the edge of transparent laminas 8（Heat-conducting glue, thickness 5 is micro-
Rice）, apply the 5th Heat Conduction Material 5 between the first Heat Conduction Material film 1 and heat conduction aluminum substrate 7（Heat-conducting glue, 5 microns of thickness）；
（5）Above-mentioned signle crystal alumina transparent laminas 8, the first Heat Conduction Material 1, the second Heat Conduction Material 2, the 3rd Heat Conduction Material 3,
Four Heat Conduction Materials 4, the 5th Heat Conduction Material 5 and heat conduction aluminum substrate 7 assemble the heat abstractor for obtaining LED chip 6.
LED chip 6 is driven with dc source, using constant current mode, operating current 0.622A.Apart from LED chip 4cm,
It is respectively 20500 lumens, 40900 lumens, 88600 lumens and 145800 lumens that illumination is measured at 6cm, 8cm and 10cm.It is luminous
The temperature that LED chip 6 is measured after 2000 seconds reaches extreme value, is 99.7 °C, and basic with the temperature of time lengthening LED chip 6
Keep constant.
Comparative example 1
The scattering device structure of LED chip 6 is substantially same with embodiment 1, but without using following material：The transparent heat conduction of signle crystal alumina
Piece the 7, first, second, the 4th and the 5th Heat Conduction Material.Specifically,
The LED chip 6 used is Ou Silang finished product LED chips（Model LE UW D1W5 01, it is identical with embodiment 1）, core
Piece area 2cm × 2cm, rated power 11W.The 3rd Heat Conduction Material 3, described the are provided between LED chip 6 and heat conduction aluminum substrate 7
Three Heat Conduction Materials 3 are heat-conducting silicone grease, 80 microns of thickness, thermal conductivity 2W/ (mK).3rd Heat Conduction Material 3 and heat conduction aluminum substrate 7 enter
Luggage matches somebody with somebody the heat abstractor for obtaining LED chip 6.
LED chip is driven with dc source, using constant current mode, electric current 0.622A.Apart from LED chip 4cm, 6cm,
It is respectively 18700 lumens, 37800 lumens, 77200 lumens and 128000 lumens that illumination is measured at 8cm and 10cm.It is luminous 2000 seconds
The temperature of measurement LED chip 6 reaches extreme value afterwards, is 107.9 °C, and keeps permanent substantially with the temperature of time lengthening LED chip 6
It is fixed.
Embodiment 2
The LED chip 6 used is Ou Silang finished product LED chips（Model LE UW D1W5 01, it is identical with embodiment 1）, core
Piece area 2cm × 2cm, rated power 11W.Transparent laminas 8 is monocrystalline silicon carbide, and its thickness is 400 microns, and size is 2cm
× 2cm, thermal conductivity 300W/ (mK).First Heat Conduction Material 1 be pyrolytic graphite film, thickness be 40 microns, size be 10cm ×
10cm, thermal conductivity is more than 500W/ (mK).
In the bottom surface of LED chip 6（Lower surface）Heat conduction aluminum substrate 7 is set, in the top surface of LED chip 6（Upper surface）Monocrystalline is set
Carborundum transparent laminas 8.Specific packaging technology comprises the following steps：
（1）The separately formed heat conduction aluminum substrate 7 with fin；
（2）The second Heat Conduction Material 2 is provided between transparent laminas 8 and the top of LED chip 6, second Heat Conduction Material 2 is transparent
PET heat-conducting glues, 10 microns of thickness；
（3）Provided with the 3rd Heat Conduction Material 3 between LED chip 6 and heat conduction aluminum substrate 7, the heat-conducting silicone grease of the 3rd Heat Conduction Material 3,
80 microns of thickness, thermal conductivity 2W/ (mK)；
（4）Select pyrolytic graphite film as the first Heat Conduction Material 1, cut and make its middle hollow out, the area of middle hollow out is less than
The area of transparent laminas 8, but the luminous component of LED chip 6 is not covered, so pyrolytic graphite film can be made not stop LED core
Piece lights, and ensure the void region edge of pyrolytic graphite film can fully be contacted with the edge of transparent laminas realize it is good
Heat transfer.The surrounding of graphite film can be arbitrary shape, but can be contacted with heat conduction aluminum substrate 7.Further to improve heat transfer
Efficiency, applies the 4th Heat Conduction Material 4 between the first Heat Conduction Material 1 and the edge of transparent laminas 8（Heat-conducting glue, thickness 5 is micro-
Rice）, apply the 5th Heat Conduction Material 5 between the first Heat Conduction Material film 1 and heat conduction aluminum substrate 7（Heat-conducting glue, 5 microns of thickness）；
（5）Pass through monocrystalline silicon carbide transparent laminas 8, the first Heat Conduction Material 1, the second Heat Conduction Material 2, the 3rd Heat Conduction Material 3,
Four Heat Conduction Materials 4, the 5th Heat Conduction Material 5 and heat conduction aluminum substrate 7 assemble the heat abstractor for obtaining LED chip 6.
LED chip 6 is driven with dc source, using constant current mode, operating current 0.622A.Apart from LED chip 4cm,
It is respectively 30100 lumens, 51600 lumens, 100300 lumens and 191600 lumens that illumination is measured at 6cm, 8cm and 10cm.It is luminous
The temperature that LED chip 6 is measured after 2000 seconds reaches extreme value, is 85.3 °C, and basic with the temperature of time lengthening LED chip 6
Keep constant.
Obtained illumination data is measured in above-described embodiment and comparative example, at three kinds of LED chip heat abstractor different distances
As a result it is as shown in table 1.The temperature variation curve for drawing embodiment 1, embodiment 2 and comparative example 1 is as shown in Figure 3.
Illumination at 1. 3 kinds of LED chip heat abstractor diverse locations of table, unit：Lumen
| Material | 4cm | 6cm | 8cm | 10cm |
| Alumina single crystal piece+heat conduction aluminum substrate | 20500 | 40900 | 88600 | 145800 |
| Single-crystal silicon carbide piece+heat conduction aluminum substrate | 30100 | 51600 | 100300 | 191600 |
| Only heat conduction aluminum substrate | 18700 | 37800 | 77200 | 128000 |
Outside the Heat Conduction Material 3 of heat conduction aluminum substrate 7 and the 3rd, signle crystal alumina/monocrystalline silicon carbide transparent laminas 8, first are led
Hot material and related second, the four, the 5th Heat Conduction Materials constitute top surface heat-conducting system in the top surface of LED chip 6.Can by contrast
See：
（1）To in the about 1000s times of operating temperature after startup, the heating rate of the LED chip comprising top surface heat-conducting system（I.e.
The slope of curve）Less than the LED chip without top surface heat-conducting system；
（2）Compared with LED chip comprising top surface heat-conducting system is when without top surface heat-conducting system, operating temperature is lower, it is identical away from
It is stronger from place's illumination；
（3）Monocrystalline silicon carbide transparent laminas is higher than the thermal conductivity of signle crystal alumina transparent laminas, and this causes embodiment 2 to fill
The programming rate put is smaller than the device of embodiment 1, operating temperature is lower, illumination is stronger under same distance.
Above phenomenon shows：Top surface heat-conducting system can be such that the heat of LED chip is effectively conducted via the system to heat conduction aluminum
Substrate, when only including bottom surface cooling system compared with, its accumulation of heat speed is slower, LED chip temperature is lower, LED chip
Luminescent properties and service life are all improved.
It is pointed out that the second Heat Conduction Material, the 3rd Heat Conduction Material, the 4th Heat Conduction Material and the 5th Heat Conduction Material are for building
What the top surface system of LED chip was all not required, the essential features of equal non-invention technical scheme.In embodiment 1,2,
Set it is above-mentioned second, third, the 4th and the 5th Heat Conduction Material purpose, be only in that raising LED chip, transparent laminas, lead
Heat conduction efficiency between hot aluminium base and the first Heat Conduction Material, so as to further improve the integral heat sink performance of system, should not
It is interpreted as the limitation to technical solution of the present invention.
Although exemplary embodiment describing the present invention with reference to several, it is to be understood that, term used be explanation and it is exemplary,
And nonrestrictive term.Because the present invention can be embodied without departing from the spiritual or substantive of invention, institute in a variety of forms
Should be appreciated that above-described embodiment is not limited to any foregoing details, and the spirit and model that should be limited in appended claims
Widely explained in enclosing, therefore the whole changes fallen into claim or its equivalent scope and remodeling all should be right of enclosing and wants
Ask and covered.
Claims (12)
1. a kind of heat abstractor of LED chip, including：
Heat-conducting substrate located at LED chip bottom surface；
Located at the transparent laminas of LED chip top surface；
The transparent laminas covers LED chip top surface, and its area is more than or equal to the area of LED chip top surface, and
Between the transparent laminas and the substrate, provided with the first Heat Conduction Material.
2. device according to claim 1, it is characterised in that：
The transparent laminas is water white transparency signle crystal alumina (Al2O3), water white transparency polycrystal alumina (Al2O3), it is colourless
Transparent single crystal carborundum (SiC), water white transparency magnesium oxide single crystal (MgO), water white transparency magnesium aluminate spinel (MgAl2O4), it is colourless
Transparent spinel-type aluminum oxynitride (AlON), water white transparency yttrium（Y2O3）, water white transparency yttrium-aluminium-garnet
（Y3Al5O12）Or diamond single crystal piece.
3. device according to claim 1, it is characterised in that：
The light transmittance of the transparent laminas is more than 95%, and thermal conductivity is more than 5W/ (mK), and thickness is 0.1-5mm.
4. device according to claim 1, it is characterised in that：
Between the transparent laminas and LED chip top surface, provided with the second Heat Conduction Material.
5. device according to claim 1, it is characterised in that：
Between LED chip bottom surface and the heat-conducting substrate, provided with the 3rd Heat Conduction Material.
6. device according to claim 1, it is characterised in that：
Between first Heat Conduction Material and the transparent laminas, provided with the 4th Heat Conduction Material.
7. device according to claim 1, it is characterised in that：
Between first Heat Conduction Material and heat-conducting substrate, provided with the 5th Heat Conduction Material.
8. the device according to claim 1 to 7 any one, it is characterised in that：
First Heat Conduction Material is high heat conduction and has the material of certain flexibility, including pyrolytic graphite film, expandable graphite sheet, stone
Black alkene film, carbon nano-tube film, composite heat-conducting graphite film, aluminium foil, copper foil etc., thickness are 10-500 microns, and thermal conductivity is more than 150W/
(m·K)。
9. the device according to claim 4 or 8, it is characterised in that：
Second Heat Conduction Material be transparent heat-conducting glue, 5-50 microns of thickness, light transmittance is more than 95%.
10. device according to claim 1 or 5, it is characterised in that：
3rd Heat Conduction Material includes heat-conducting glue, thermal grease conduction or Metal Substrate heat-conducting pad, 10-500 microns of thickness.
11. the device according to claim 1 or 6 or 7, it is characterised in that：
4th Heat Conduction Material and/or the 5th Heat Conduction Material are heat-conducting glue or thermal grease conduction, 10-500 microns of thickness.
12. a kind of LED/light source, including：
LED chip；With
Heat abstractor according to claim 1 to 11 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710467660.4A CN107246596B (en) | 2017-06-20 | 2017-06-20 | heat dissipation device for LED chip and LED light source using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710467660.4A CN107246596B (en) | 2017-06-20 | 2017-06-20 | heat dissipation device for LED chip and LED light source using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107246596A true CN107246596A (en) | 2017-10-13 |
| CN107246596B CN107246596B (en) | 2019-12-06 |
Family
ID=60019284
Family Applications (1)
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|---|---|---|---|
| CN201710467660.4A Active CN107246596B (en) | 2017-06-20 | 2017-06-20 | heat dissipation device for LED chip and LED light source using same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063810A (en) * | 2018-10-16 | 2020-04-24 | 深圳光峰科技股份有限公司 | Light emitting device and method for manufacturing the same |
| CN112151479A (en) * | 2020-11-24 | 2020-12-29 | 度亘激光技术（苏州）有限公司 | Heat sink for device, semiconductor device and preparation method of heat sink for device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6838702B1 (en) * | 2003-10-10 | 2005-01-04 | Lambda Opto Technology Co., Ltd | Light emitting diode |
| CN201112414Y (en) * | 2007-09-21 | 2008-09-10 | 万喜红 | High power LED package structure |
| CN102185095A (en) * | 2011-04-26 | 2011-09-14 | 王海军 | Highly-efficient radiation high-power light emitting diode (LED) packaging structure |
| CN102588924A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator |
| CN202349696U (en) * | 2011-12-09 | 2012-07-25 | 四川鋈新能源科技有限公司 | High-heat-radiation, light-decay-resistant and high-light-efficiency light-emitting diode |
| CN202361327U (en) * | 2011-12-06 | 2012-08-01 | 肇庆全商联盟信息科技有限公司 | Novel heat sink of street lamp |
| CN202469988U (en) * | 2012-03-05 | 2012-10-03 | 陕西唐华能源有限公司 | Wing plate type three-dimensional light emitting diode (LED) heat radiator |
| CN104214739A (en) * | 2014-08-22 | 2014-12-17 | 浙江工业大学 | High-power LED (light emitting diode) grapheme-based heat radiation device |
-
2017
- 2017-06-20 CN CN201710467660.4A patent/CN107246596B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6838702B1 (en) * | 2003-10-10 | 2005-01-04 | Lambda Opto Technology Co., Ltd | Light emitting diode |
| CN201112414Y (en) * | 2007-09-21 | 2008-09-10 | 万喜红 | High power LED package structure |
| CN102185095A (en) * | 2011-04-26 | 2011-09-14 | 王海军 | Highly-efficient radiation high-power light emitting diode (LED) packaging structure |
| CN202361327U (en) * | 2011-12-06 | 2012-08-01 | 肇庆全商联盟信息科技有限公司 | Novel heat sink of street lamp |
| CN202349696U (en) * | 2011-12-09 | 2012-07-25 | 四川鋈新能源科技有限公司 | High-heat-radiation, light-decay-resistant and high-light-efficiency light-emitting diode |
| CN102588924A (en) * | 2012-03-05 | 2012-07-18 | 陕西唐华能源有限公司 | Double-layer fin-type three-dimensional LED (Light Emitting Diode) heat radiator |
| CN202469988U (en) * | 2012-03-05 | 2012-10-03 | 陕西唐华能源有限公司 | Wing plate type three-dimensional light emitting diode (LED) heat radiator |
| CN104214739A (en) * | 2014-08-22 | 2014-12-17 | 浙江工业大学 | High-power LED (light emitting diode) grapheme-based heat radiation device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063810A (en) * | 2018-10-16 | 2020-04-24 | 深圳光峰科技股份有限公司 | Light emitting device and method for manufacturing the same |
| CN111063810B (en) * | 2018-10-16 | 2021-11-12 | 深圳光峰科技股份有限公司 | Light emitting device and method for manufacturing the same |
| CN112151479A (en) * | 2020-11-24 | 2020-12-29 | 度亘激光技术（苏州）有限公司 | Heat sink for device, semiconductor device and preparation method of heat sink for device |
| CN112151479B (en) * | 2020-11-24 | 2021-02-12 | 度亘激光技术（苏州）有限公司 | Heat sink for device, semiconductor device and preparation method of heat sink for device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107246596B (en) | 2019-12-06 |
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