CN107238964B - Frameless liquid crystal panel, manufacturing method thereof and liquid crystal module - Google Patents
Frameless liquid crystal panel, manufacturing method thereof and liquid crystal module Download PDFInfo
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- CN107238964B CN107238964B CN201710651552.2A CN201710651552A CN107238964B CN 107238964 B CN107238964 B CN 107238964B CN 201710651552 A CN201710651552 A CN 201710651552A CN 107238964 B CN107238964 B CN 107238964B
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 269
- 239000011521 glass Substances 0.000 claims abstract description 267
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 238000007731 hot pressing Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 34
- 230000001154 acute effect Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000004936 stimulating effect Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The manufacturing method of the frameless liquid crystal panel comprises the steps of providing a first glass substrate and a second glass substrate which have the same size; enabling the first ends corresponding to the first and second glass substrates to have an acute-angle inclination angle; aligning the first glass substrate and the second glass substrate, wherein the two first ends correspond to each other and the two inclination angles are adjacent; filling conductive adhesive between the first ends of the first and second glass substrates, wherein conductive balls in the conductive adhesive are fixedly connected to the conductive wires on the second glass substrate, a chip on film of the liquid crystal panel is vertically attached to the side edges of the first ends of the first and second glass substrates, and the chip on film is connected with the conductive wires through the conductive balls; connecting the chip on film to a circuit board of the liquid crystal panel by using conductive adhesive; encapsulating each end of the first and second glass substrates with a black adhesive; the flip chip film is bent to make the circuit board be positioned on the backlight side of the backlight module. The invention realizes the frameless manufacturing of the liquid crystal panel. The invention also provides a frameless liquid crystal panel and a liquid crystal module.
Description
Technical Field
The invention relates to the field of liquid crystal display, in particular to a method for manufacturing a frameless liquid crystal panel, the frameless liquid crystal panel and a liquid crystal module.
Background
With the continuous development and technical maturity of display technologies, consumers have demanded displays such as LEDs (light emitting diodes), OLEDs (organic light emitting diodes), and QLEDs (quantum dot light emitting diodes) to meet the requirements of the displays such as color and brightness, and have higher demands on product appearance. Particularly, as the demand of large-size displays increases, the appearance is simplified and beautified, which becomes a necessary factor for the public to select the displays. And the ultra-narrow frame and even frameless display attracts the public, thereby greatly stimulating the display consumption market. At present, more technologies applied to the ultra-narrow bezel display have two main modes, the first mode is that no bezel is provided on two sides. The second way is three-sided frameless, which still cannot achieve the true effect of frameless.
Disclosure of Invention
The embodiment of the invention provides a method for manufacturing a frameless liquid crystal panel, so that the liquid crystal panel achieves a frameless effect in a real sense.
The first aspect of the embodiments of the present invention provides a method for manufacturing a frameless liquid crystal panel, including:
providing a first glass substrate and a second glass substrate, wherein the first glass substrate and the second glass substrate are the same in size, and a conductive wire is arranged on the second glass substrate;
processing the first and second glass substrates to enable first ends, corresponding to the first and second glass substrates, to have an acute-angle inclination angle;
aligning the first glass substrate and the second glass substrate to ensure that the first end of the first glass substrate corresponds to the first end of the second glass substrate and the inclination angles of the first glass substrate and the second glass substrate are adjacent;
filling the conductive adhesive between the first ends of the first and second glass substrates by using the conductive adhesive in a hot-pressing manner, and fixedly connecting conductive balls in the conductive adhesive to conductive wires on the second glass substrate, wherein the chip on film of the liquid crystal panel is vertically attached to the side edges of the first ends of the first and second glass substrates, and is connected with the conductive wires on the second glass substrate through the conductive balls;
connecting the chip on film to a circuit board of the liquid crystal panel by using conductive adhesive so as to connect the conductive wire on the first glass with the circuit board;
encapsulating each end of the first and second glass substrates with a black adhesive;
and aligning a backlight module with the first glass substrate and the second glass substrate, and bending the chip on film so that the circuit board is positioned on one side of the backlight module, which is far away from the first glass substrate and the second glass substrate.
Wherein the first and second glass substrates have the same inclination angle.
Wherein the inclination angle of the first and second glass substrates ranges from 50 degrees to 80 degrees.
The contact point of the first glass substrate and the conductive ball is a first point, the contact point of the second glass substrate and the conductive ball is a second point, and the center of the conductive ball is located on a connecting line of the first point and the second point.
Wherein the hot pressing mode is a side vertical hot pressing mode.
The invention provides a frameless liquid crystal panel, which comprises a first glass substrate, a second glass substrate, a backlight module, a chip on film and a circuit board which are sequentially arranged, wherein the first glass substrate and the second glass substrate have the same size, the first ends corresponding to the first glass substrate and the second glass substrate have acute inclination angles, a conductive wire is arranged on the first glass substrate, the first glass substrate and the second glass substrate are arranged in an aligned mode, the first end of the first glass substrate corresponds to the first end of the second glass substrate, the inclination angles of the first glass substrate and the second glass substrate are adjacent, the first ends of the first glass substrate and the second glass substrate are filled with conductive adhesive, the chip on film is vertically attached to the side edges of the first ends of the first glass substrate and the second glass substrate, the conductive ball of the conductive adhesive is connected with the conductive wire and the chip on film, the chip on film is connected to the circuit board, to connect the conductive wires with the circuit board.
Wherein the first and second glass substrates have the same inclination angle.
Wherein the inclination angle of the first and second glass substrates ranges from 50 degrees to 80 degrees.
The contact point of the first glass substrate and the conductive ball is a first point, the contact point of the second glass substrate and the conductive ball is a second point, and the center of the conductive ball is located on a connecting line of the first point and the second point.
The invention also provides a liquid crystal panel, which comprises a power supply module and the frameless liquid crystal panel, wherein the power supply module is connected to the backlight module of the frameless liquid crystal panel.
The embodiment of the invention has the following beneficial effects:
it can be seen that, according to the embodiments of the present invention, since the first ends corresponding to the first and second glass substrates are formed with the tilt angles, and the tilt angles of the first and second glass substrates are adjacent to each other, a guiding path is formed, when performing the hot pressing, the conductive balls tend to deform inside the first ends of the first and second glass substrates and do not tend to deform outside the first ends of the first and second glass substrates under the guiding of the guiding path, the flip chip film can be firmly and vertically attached to the side edges of the first ends of the first and second glass substrates without forming a connection region on an extension portion of the second glass substrate, and the flip chip film is attached to a plane, that is, without performing a frame capping on the connection region, thereby implementing a truly borderless liquid crystal panel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing a frameless liquid crystal panel according to a first embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a frameless liquid crystal panel according to a second embodiment of the present invention;
fig. 3 is a schematic block diagram of a liquid crystal module according to a third embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a method for fabricating a borderless liquid crystal panel is provided in a first embodiment of the present invention. The method comprises the following steps.
S101, providing a first glass substrate and a second glass substrate, wherein the first glass substrate and the second glass substrate are the same in size, and a conductive wire is arranged on the second glass substrate.
And the first glass substrate and the second glass substrate are cut and edged to obtain the first glass substrate and the second glass substrate with the same size. The first glass substrate may be a color filter substrate. The second glass substrate is an array substrate, and a thin film transistor is formed on the array substrate to form a display area. The conductive line is connected with the thin film transistor.
S102, processing the first glass substrate and the second glass substrate to enable first ends, corresponding to the first glass substrate and the second glass substrate, to have acute-angle inclination angles.
In this embodiment, the first and second glass substrates have the same tilt angle. The inclination angles of the first and second glass substrates range from 50 degrees to 80 degrees. In other embodiments, the first and second glass substrates may have different tilt angles, and the tilt angles of the first and second glass substrates may be adjusted according to actual needs.
S103, aligning the first glass substrate and the second glass substrate to enable the first end of the first glass substrate to correspond to the first end of the second glass substrate, and enabling the inclination angles of the first glass substrate and the second glass substrate to be adjacent.
It should be noted that the inclination angles of the first and second glass substrates are adjacent to each other such that the distance between the first ends of the first and second glass substrates gradually decreases from the edge of the first ends of the first and second glass substrates to the inside to form a guide path.
And S104, filling the conductive adhesive between the first ends of the first and second glass substrates by using the conductive adhesive in a hot-pressing mode, and fixedly connecting the conductive balls in the conductive adhesive to the conductive wires on the second glass substrate, wherein the chip on film of the liquid crystal panel is vertically attached to the side edges of the first ends of the first and second glass substrates, and is connected with the conductive wires on the second glass substrate through the conductive balls.
In this embodiment, the hot pressing manner is a vertical hot pressing manner, a point of the first glass substrate contacting the conductive ball is a first point, a point of the second glass substrate contacting the conductive ball is a second point, and a center of the conductive ball is located on a connection line between the first point and the second point.
It should be noted that the inclination angles of the first and second glass substrates are adjacent to each other such that the distance between the first ends of the first and second glass substrates gradually decreases from the edge of the first ends of the first and second glass substrates to the inside to form a guide path. When hot pressing is carried out, the centers of the conductive balls are connected with the first clicking second point, and under the guidance of the guide path, the conductive balls tend to deform inside the first ends of the first and second glass substrates more easily, but do not tend to deform outside the first ends of the first and second glass substrates, and the flip chip film is not influenced to be vertically attached to the side edges of the first ends of the first and second glass substrates. Of course, in other embodiments, the center of the conductive ball may be in a region where a connecting line of the first point and the second point is far away from the first end.
And S105, connecting the chip on film to a circuit board of the liquid crystal panel by using conductive adhesive, so that the conductive wire on the first glass is connected with the circuit board.
And S106, packaging the ends of the first glass substrate and the second glass substrate by using a black adhesive.
S107, aligning the backlight module with the first glass substrate and the second glass substrate, and bending the chip on film so that the circuit board is positioned on one side of the backlight module, which is far away from the first glass substrate and the second glass substrate.
The chip on film is vertically bent, so that the circuit board is positioned on one side of the backlight module, which is far away from the first glass substrate and the second glass substrate.
In this embodiment, the method for manufacturing a borderless liquid crystal panel includes providing first and second glass substrates having the same size, and processing the first and second glass substrates such that first ends of the first and second glass substrates corresponding to each other have an acute tilt angle; aligning the first glass substrate and the second glass substrate to ensure that the first end of the first glass substrate corresponds to the first end of the second glass substrate and the inclination angles of the first glass substrate and the second glass substrate are adjacent; filling the conductive adhesive between the first ends of the first and second glass substrates by using the conductive adhesive in a hot-pressing manner, and fixedly connecting conductive balls in the conductive adhesive to conductive wires on the second glass substrate, wherein the chip on film of the liquid crystal panel is vertically attached to the side edges of the first ends of the first and second glass substrates, and is connected with the conductive wires on the second glass substrate through the conductive balls; connecting the chip on film to a circuit board of the liquid crystal panel by using conductive adhesive so as to connect the conductive wire on the first glass with the circuit board; encapsulating each end of the first and second glass substrates with a black adhesive; and aligning a backlight module with the first glass substrate and the second glass substrate, and bending the chip on film so that the circuit board is positioned on one side of the backlight module, which is far away from the first glass substrate and the second glass substrate. Because the first ends corresponding to the first and second glass substrates are both formed with the inclination angles, and the inclination angles of the first and second glass substrates are adjacent to each other, a guide path is formed, when hot pressing is carried out, the conductive balls tend to deform towards the inner parts of the first ends of the first and second glass substrates and do not tend to deform towards the outer sides of the first ends of the first and second glass substrates under the guide of the guide path, the crystal covered film can be firmly and vertically attached to the side edges of the first ends of the first and second glass substrates, a connecting area is not required to be formed by extending a part of the second glass substrate, the crystal covered film is attached to the plane, namely, frame pressing cover is not required to be carried out on the connecting area, and therefore the true frameless liquid crystal panel is realized. In addition, since it is not necessary to extend a portion of the second glass substrate to form a connection region, the size of the second glass substrate is reduced, so that the second glass substrate has the same size as the first glass substrate, and the flip-chip film is bent, so that the circuit board is located on the side of the backlight module deviating from the first and second glass substrates, thereby reducing the size of the liquid crystal panel.
Referring to fig. 2, a borderless liquid crystal panel 200 according to a second embodiment of the present invention is provided. The frameless liquid crystal panel 200 includes a first glass substrate 210, a second glass substrate 220, a backlight module 230, a chip on film 240 and a circuit board 250, which are sequentially disposed. The first glass substrate 210 and the second glass substrate 220 have the same size, the first ends of the first and second glass substrates 210 and 220 have acute inclination angles, and the first glass substrate 210 is provided with a conductive wire 211. The first and second glass substrates 210 and 220 are aligned, a first end of the first glass substrate 210 corresponds to a first end of the second glass substrate 220, the first and second glass substrates 210 and 220 have adjacent tilt angles, and the first ends of the first and second glass substrates 210 and 220 are filled with a conductive adhesive 260. The flip-chip film 240 is vertically attached to the side edges of the first ends of the first and second glass substrates 210 and 220. The conductive balls 262 of the conductive paste 260 are connected to the conductive wires 211 and the chip on film 240, and the chip on film 240 is connected to the circuit board 250, so that the conductive wires 211 are connected to the circuit board 250.
The first glass substrate 210 and the second glass substrate 220 are cut and edged to obtain the first and second glass substrates 210 and 220 with the same size. The first glass substrate 210 may be a color filter substrate. The second glass substrate 220 is an array substrate on which a thin film transistor is formed to form a display region. The conductive line 211 is a conductive line connecting the thin film transistor.
In the present embodiment, the first and second glass substrates 210 and 220 have the same tilt angle. The first and second glass substrates 210 and 220 have a tilt angle ranging from 50 degrees to 80 degrees. In other embodiments, the first and second glass substrates 210 and 220 may have different tilt angles, and the tilt angles of the first and second glass substrates 210 and 220 may be adjusted according to actual needs.
It should be noted that the tilt angles of the first and second glass substrates 210 and 220 are adjacent to each other such that the distance between the first ends of the first and second glass substrates 210 and 220 is gradually decreased inward from the edge of the first ends of the first and second glass substrates 210 and 220 to form a guide path.
Further, the hot pressing manner is a vertical hot pressing manner, a point where the first glass substrate 210 contacts the conductive ball 211 is a first point, a point where the second glass substrate 220 contacts the conductive ball 211 is a second point, and a center of the conductive ball 211 is on a connection line of the first point and the second point.
It should be noted that the inclination angles of the first and second glass substrates are adjacent to each other such that the distance between the first ends of the first and second glass substrates gradually decreases from the edge of the first ends of the first and second glass substrates to the inside to form a guide path. When hot pressing is carried out, the centers of the conductive balls are connected with the first clicking second point, and under the guidance of the guide path, the conductive balls tend to deform inside the first ends of the first and second glass substrates more easily, but do not tend to deform outside the first ends of the first and second glass substrates, and the flip chip film is not influenced to be vertically attached to the side edges of the first ends of the first and second glass substrates. Of course, in other embodiments, the center of the conductive ball may be in a region where a connecting line of the first point and the second point is far away from the first end.
It should be noted that the flip-chip film 240 is vertically bent, so that the circuit board 250 is located at a side of the backlight module 230 away from the first and second glass substrates 210 and 220.
In this embodiment, the first glass substrate 210 and the second glass substrate 220 have the same size, the first ends of the first and second glass substrates 210 and 220 have an acute angle, and the first glass substrate 210 is provided with a conductive wire 211. The first and second glass substrates 210 and 220 are aligned, a first end of the first glass substrate 210 corresponds to a first end of the second glass substrate 220, the first and second glass substrates 210 and 220 have adjacent tilt angles, and the first ends of the first and second glass substrates 210 and 220 are filled with a conductive adhesive 260. The flip-chip film 240 is vertically attached to the side edges of the first ends of the first and second glass substrates 210 and 220. The conductive balls 262 of the conductive paste 260 are connected to the conductive wires 211 and the chip on film 240, and the chip on film 240 is connected to the circuit board 250, so that the conductive wires 211 are connected to the circuit board 250. Because the first ends of the first and second glass substrates 210 and 220 are formed with the tilt angles, and the tilt angles of the first and second glass substrates 210 and 220 are adjacent to each other, a guiding path is formed, when performing the hot pressing, the conductive balls 211 tend to deform inside the first ends of the first and second glass substrates 210 and 220 under the guiding of the guiding path, and do not tend to deform outside the first ends of the first and second glass substrates 210 and 220, the flip chip 240 can be firmly and vertically attached to the sides of the first ends of the first and second glass substrates 210 and 220, and a connection area does not need to be formed on an extension part of the second glass substrate 220, and the flip chip 240 is attached to a plane, i.e., no frame capping is needed on the connection area, thereby realizing the borderless liquid crystal panel 200 in a real sense. In addition, since a connection region does not need to be formed by extending a part of the second glass substrate 220, the size of the second glass substrate 220 is reduced in this embodiment, so that the second glass substrate 220 has the same size as the first glass substrate 210, and the cover glass 240 is bent, so that the circuit board 250 is located on the side of the backlight module 230 away from the first and second glass substrates 210 and 220, thereby reducing the size of the liquid crystal panel 200.
Referring to fig. 3, a liquid crystal module 300 is further provided according to a third embodiment of the present invention. The liquid crystal module 300 includes a power supply module 310 and a borderless liquid crystal panel. The power supply module 310 is connected to the backlight module of the frameless liquid crystal panel. In this embodiment, the frameless liquid crystal panel is the frameless liquid crystal panel 200 of the second embodiment. Since the frameless liquid crystal panel 200 has been described in detail in the second embodiment, it is not described herein again.
In the present embodiment, the liquid crystal module 300 includes a power module 310 and a borderless liquid crystal panel 200. The frameless liquid crystal panel 200 includes a first glass substrate 210, a second glass substrate 220, a backlight module 230, a chip on film 240 and a circuit board 250, which are sequentially disposed. The first glass substrate 210 and the second glass substrate 220 have the same size, the first ends of the first and second glass substrates 210 and 220 have acute inclination angles, and the first glass substrate 210 is provided with a conductive wire 211. The first and second glass substrates 210 and 220 are aligned, a first end of the first glass substrate 210 corresponds to a first end of the second glass substrate 220, the first and second glass substrates 210 and 220 have adjacent tilt angles, and the first ends of the first and second glass substrates 210 and 220 are filled with a conductive adhesive 260. The flip-chip film 240 is vertically attached to the side edges of the first ends of the first and second glass substrates 210 and 220. The conductive balls 262 of the conductive paste 260 are connected to the conductive wires 211 and the chip on film 240, and the chip on film 240 is connected to the circuit board 250, so that the conductive wires 211 are connected to the circuit board 250. Because the first ends of the first and second glass substrates 210 and 220 are formed with the tilt angles, and the tilt angles of the first and second glass substrates 210 and 220 are adjacent to each other, a guiding path is formed, when performing the hot pressing, the conductive balls 211 tend to deform inside the first ends of the first and second glass substrates 210 and 220 under the guiding of the guiding path, and do not tend to deform outside the first ends of the first and second glass substrates 210 and 220, the flip chip 240 can be firmly and vertically attached to the sides of the first ends of the first and second glass substrates 210 and 220, and a connection area does not need to be formed on an extension portion of the second glass substrate 220, and the flip chip 240 is attached to a plane, i.e., no frame capping is needed on the connection area, thereby realizing the borderless liquid crystal module 300 in a real sense. In addition, since a connection region does not need to be formed by extending a part of the second glass substrate 220, the size of the second glass substrate 220 is reduced in this embodiment, so that the second glass substrate 220 has the same size as the first glass substrate 210, and the flip-chip film 240 is bent, so that the circuit board 250 is located on the side of the backlight module 230 away from the first and second glass substrates 210 and 220, thereby reducing the size of the liquid crystal module 300.
Claims (10)
1. A method for manufacturing a frameless liquid crystal panel comprises the following steps:
providing a first glass substrate and a second glass substrate, wherein the first glass substrate and the second glass substrate are the same in size, and a conductive wire is arranged on the second glass substrate;
processing the first and second glass substrates to enable first ends, corresponding to the first and second glass substrates, to have an acute-angle inclination angle;
aligning the first glass substrate and the second glass substrate to ensure that the first end of the first glass substrate corresponds to the first end of the second glass substrate and the inclination angles of the first glass substrate and the second glass substrate are adjacent;
filling the conductive adhesive between the first ends of the first and second glass substrates by using the conductive adhesive in a hot-pressing manner, and fixedly connecting conductive balls in the conductive adhesive to conductive wires on the second glass substrate, wherein the chip on film of the liquid crystal panel is vertically attached to the side edges of the first ends of the first and second glass substrates, and is connected with the conductive wires on the second glass substrate through the conductive balls;
connecting the chip on film to a circuit board of the liquid crystal panel by using conductive adhesive, so that the conductive wire on the second glass substrate is connected with the circuit board;
encapsulating each end of the first and second glass substrates with a black adhesive;
and aligning a backlight module with the first glass substrate and the second glass substrate, and bending the chip on film so that the circuit board is positioned on one side of the backlight module, which is far away from the first glass substrate and the second glass substrate.
2. The method of claim 1, wherein the first and second glass substrates are tilted at the same angle.
3. The method of claim 2, wherein the first and second glass substrates are tilted at an angle ranging from 50 degrees to 80 degrees.
4. The method according to claim 1, wherein a point where the first glass substrate contacts the conductive ball is a first point, a point where the second glass substrate contacts the conductive ball is a second point, and a center of the conductive ball is on a line connecting the first point and the second point.
5. The method of claim 1, wherein the hot pressing is a side vertical hot pressing.
6. A frameless liquid crystal panel comprises a first glass substrate, a second glass substrate, a backlight module, a chip on film and a circuit board which are sequentially arranged, wherein the first glass substrate and the second glass substrate are same in size, first ends corresponding to the first glass substrate and the second glass substrate are provided with acute-angle dip angles, a conductive wire is arranged on the first glass substrate, the first glass substrate and the second glass substrate are arranged in an aligned mode, the first end of the first glass substrate corresponds to the first end of the second glass substrate, the dip angles of the first glass substrate and the second glass substrate are adjacent, the first ends of the first glass substrate and the second glass substrate are filled with conductive adhesive, the chip on film is vertically attached to the side edges of the first ends of the first glass substrate and the second glass substrate, the conductive ball of the conductive adhesive is connected with the conductive wire and the chip on film, the chip on film is connected to the circuit board, to connect the conductive wires with the circuit board.
7. The frameless liquid crystal panel of claim 6, wherein the first and second glass substrates have the same tilt angle.
8. The frameless liquid crystal panel of claim 7, wherein the first and second glass substrates have a tilt angle in a range of 50 degrees to 80 degrees.
9. The frameless liquid crystal panel of claim 6, wherein a point at which the first glass substrate contacts the conductive ball is a first point, a point at which the second glass substrate contacts the conductive ball is a second point, and a center of the conductive ball is on a line connecting the first point and the second point.
10. A liquid crystal module comprising a power supply module and the frameless liquid crystal panel of any one of claims 6-9, wherein the power supply module is connected to a backlight module of the frameless liquid crystal panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710651552.2A CN107238964B (en) | 2017-08-02 | 2017-08-02 | Frameless liquid crystal panel, manufacturing method thereof and liquid crystal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710651552.2A CN107238964B (en) | 2017-08-02 | 2017-08-02 | Frameless liquid crystal panel, manufacturing method thereof and liquid crystal module |
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| CN107884977A (en) * | 2017-12-26 | 2018-04-06 | 深圳市华星光电技术有限公司 | A kind of liquid crystal display and preparation method thereof |
| US10606135B2 (en) | 2017-12-29 | 2020-03-31 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Liquid crystal panel, method for fabricating thereof and display apparatus |
| CN108153070A (en) * | 2017-12-29 | 2018-06-12 | 惠州市华星光电技术有限公司 | A kind of liquid crystal display panel and preparation method thereof, display device |
| CN108008584B (en) * | 2017-12-29 | 2020-11-13 | 武汉华星光电技术有限公司 | Liquid crystal display device having a plurality of pixel electrodes |
| US10509277B2 (en) | 2017-12-29 | 2019-12-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Liquid crystal display device |
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