CN107234429A - A kind of fin electric device and technique - Google Patents
A kind of fin electric device and technique Download PDFInfo
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- CN107234429A CN107234429A CN201610191018.3A CN201610191018A CN107234429A CN 107234429 A CN107234429 A CN 107234429A CN 201610191018 A CN201610191018 A CN 201610191018A CN 107234429 A CN107234429 A CN 107234429A
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- rotating disk
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
- B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
- B23P21/006—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed the conveying means comprising a rotating table
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Abstract
The invention discloses a kind of fin electric device and technique, mobile device including bogey and installed in bogey bottom, and bearing box of the bogey by support frame and installed in support frame side is welded, support frame as described above is installed with dispenser in the middle part of upper surface, rotating disk is installed with the top of dispenser, that decile is gone back on the upper surface of rotating disk is installed with six U-shaped Double-station clamps, the upper surface of the bogey is also installed with nut feed mechanism, nut glue applying mechanism, vacuum material grabbing mechanism, metal-oxide-semiconductor automatic glue dispensing mechanism and testing agency.Pass through the rotating disk of six deciles, and six U-shaped Double-station clamps are set on rotating disk, and driven by dispenser, attaching nut feed mechanism, nut glue applying mechanism, vacuum material grabbing mechanism, metal-oxide-semiconductor automatic glue dispensing mechanism and testing agency, more facilitate so that coordinating between each assembly technology, and assembling is more facilitated.
Description
Technical field
The present invention relates to fin processing technique field, specially a kind of fin electric device and technique.
Background technology
Fin is a kind of device of the easy heat-generating electronic elements radiating in electrical equipment, yellow more by aluminium alloy
Copper or bronze make tabular, sheet, splintery etc., and cpu central processing unit will be used quite in such as computer
Power tube in power supply pipe in big fin, television set, row pipe, amplifirer will use fin.
General fin will apply last layer heat-conducting silicone grease in electronic component and radiating rib contact surface in use, make member
The heat that device is sent more effectively is transmitted on fin, then is dispersed into through fin in surrounding air,
For fin material, its heat conductivility of every kind of material is different, is arranged from high to low by heat conductivility
Row, are silver, copper, aluminium, steel respectively.Can be too expensive if but making fin of silver, thus it is best
Scheme is using copper, it is well known that the operating temperature of electronic device directly determines its service life and steady
It is qualitative, to allow the operating temperature of each parts of PC to be maintained in rational scope, except ensureing PC building rings
The temperature in border in the reasonable scope outside, it is necessary to align carry out radiating treatment.And as PC calculates energy
The enhancing of power, power consumption and heat dissipation problem are increasingly becoming the problem of not allowing to avoid, and any device is operationally all
There is certain loss, most loss becomes heat.Low-power device loss is small, without heat abstractor.
And high power device loss is big, if not taking cooling measure, the temperature of tube core can reach or more than permission
Junction temperature, device will be damaged.Therefore heat abstractor must be added, the most frequently used is exactly by power device
Install on a heat sink, heat is scattered to surrounding space using radiator, if necessary along with radiator fan,
Cooling radiating is strengthened with certain wind speed.Flowing cool water is also used on the power device of some large scale equipments
Coldplate, it has more preferable radiating effect.It is exactly under certain operating conditions, to pass through meter that radiating, which is calculated,
Calculate to determine suitable cooling measure and radiator.Power device is installed on a heat sink.Its main heat
It is the bottom that device is passed to by tube core to flow direction, and heat is scattered into surrounding space through radiator.If without wind
Fan is cooled down with certain wind speed, and this is referred to as natural cooling or Natural Heat Convection, in traditional power supply electronic class
Fin assembling industry in, because the species of product is various, batch is uneven, not of uniform size, specification is each
It is different, if its assembling process is realized and quite difficult with automation equipment, therefore, traditional assembling side
Method is still completed with pure craft：Manually nut is put, pad is manually put, manually puts metal-oxide-semiconductor, manually puts
Fin, screw is manually locked, therefore efficiency is low, cost is expensive, the need for much can not meet high speed production capacity.
The content of the invention
It is an object of the invention to provide a kind of fin electric device and technique, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the present invention provides following technical scheme：A kind of fin electric device, bag
Bogey and the mobile device installed in bogey bottom are included, and bogey is by support frame and installation
Bearing box in support frame side is welded, and segmentation is installed with the middle part of support frame as described above upper surface
Device, is installed with rotating disk, the upper surface of rotating disk at the top of dispenser and goes back being installed with for decile
Six U-shaped Double-station clamps, the upper surface of the bogey be also installed with nut feed mechanism,
Nut glue applying mechanism, vacuum material grabbing mechanism, metal-oxide-semiconductor automatic glue dispensing mechanism and testing agency, and nut feeding
Mechanism, nut glue applying mechanism, vacuum material grabbing mechanism, metal-oxide-semiconductor automatic glue dispensing mechanism and testing agency are with the inverse time
The direction annular array of pin is in the surrounding of rotating disk, and the top of support frame as described above is also installed with montant, and
The top of montant through the through hole at disk axes and the exposed top in rotating disk, montant exposed end also
Screw screw device is installed with, it is also solid on the support frame between testing agency and nut feed mechanism
Dingan County is aobvious to control rotating disk speed regulator, the shake that touch-screen is also separately positioned on support frame equipped with aobvious control touch-screen
Moving plate controller and the electrical connection of dispensing machine controller, air pressure valve is also installed with the bottom of support frame.
It is preferred that, the nut feed mechanism includes being fixedly mounted on the nut vibrating disk at the top of bearing box,
Arrival end on the discharging opening of the nut vibrating disc respectively with two conveying passages is fixedly connected, and two defeated
Expect that the port of export of passage is in contact with the entrance of the code material device on support frame.
It is preferred that, the nut glue applying mechanism is identical with the structure of metal-oxide-semiconductor automatic glue dispensing mechanism, includes
The support block on support frame is fixedly mounted on, the top of support block is connected with carrying tablet by slide rail, carried
The side of piece is connected with pusher, and the front of carrying tablet is provided with solid in two fixed covers, two fixed covers
Surely there is rubber gun, and the positive bottom of support block is additionally provided with connection sheet, and the end of connection sheet, which is connected with, to be connect
Glue box.
It is preferred that, the vacuum material grabbing mechanism includes L-shaped baffle plate, contiguous block and two metal-oxide-semiconductor vibrating discs,
And two metal-oxide-semiconductor vibrating discs pass through the upper of the blanking channel installed in its exit and L-shaped baffle bottom
Material device is fixedly connected, and L-shaped baffle plate is connected between two metal-oxide-semiconductor vibrating disks, and the right side of L-shaped baffle plate
Side and lower surface are equipped with slide rail, and the left surface of contiguous block and upper surface are equipped with what is be adapted with slide rail
Sliding block, contiguous block is slidably connected by the slide rail of the sliding block on its left surface and L-shaped baffle plate right flank, even
Connect and zigzag tread patterns part is provided with block, and close to being equipped with folder on two corresponding surfaces of sliding block on contiguous block
Hold and vacuum cup is fixed with device, clamping device, the top of vacuum cup is provided with vacuum generator, in L
The one end of shape baffle plate away from support frame is fixedly connected with lateral driver device.
A kind of electronic technique of fin, comprises the following steps：
S1, debugging：The rotating speed of rotating disk is adjusted operation rotating disk speed regulator first, is touched using aobvious control
Screen is to nut feed mechanism, nut glue applying mechanism, vacuum material grabbing mechanism, metal-oxide-semiconductor automatic glue dispensing mechanism and inspection
The operating rate for surveying mechanism is adjusted, and synchronizes the rotating speed of itself and rotating disk, is then opened using foot-operated
Pass makes dispenser drive rotating disk to carry out backwards rotation, so that a U in six U-shaped Double-station clamps
Shape Double-station clamp is moved to the lower section of nut feed mechanism；
S2, nut is put automatically：Shaken by nut vibrating disc, the nut in it is distinguished by discharging opening
Into in two conveying passages, exported by the port of export of two conveying passages, nut is entered code material device
It is interior, the two of the U-shaped Double-station clamp being individually positioned in nut by code material device below nut feed mechanism
In individual nut standing groove, then the U-shaped Double-station clamp of driven by rotary disc placing nut turns to nut dispensing
The lower section of mechanism；
S3, from dynamic point nut glue：Nut glue applying mechanism is carried out by pushers carrying tablet on slide rail
Slide, fixed cover is driven two rubber gun inclination movements, so that the pipette tips of rubber gun and U-shaped duplex
Nut in position fixture is alignd, and then dispensing is carried out to the nut in U-shaped Double-station clamp, in point
Pusher drives rubber gun to be resetted after the completion of glue, so that the nut after dispensing is obtained, and driven by rotary disc U
Shape Double-station clamp turns to the lower section of vacuum material grabbing mechanism；
S4, metal-oxide-semiconductor is put automatically：Vacuum material grabbing mechanism is shaken by two metal-oxide-semiconductor vibrating discs, makes MOS
Pipe is moved to L-shaped baffle plate side by blanking channel, is then braked by zigzag tread patterns part, fills clamping
The vacuum cup put is moved and the metal-oxide-semiconductor on MOS blanking pipes is gripped, and metal-oxide-semiconductor is carried
Rise to the position of U-shaped Double-station clamp phase level, then lateral driver device transverse shifting clamping device and
Vacuum cup, so that metal-oxide-semiconductor is placed on the nut after dispensing, after placement is finished, driven by rotary disc is put
The U-shaped Double-station clamp for putting metal-oxide-semiconductor is moved to the progress dispensing of metal-oxide-semiconductor automatic glue dispensing mechanism；
S5, from dynamic point metal-oxide-semiconductor glue：According to S3 identical manufacturing procedures, so as to obtain the MOS after dispensing
Pipe；
S6, radiating mortice lock screw：The fin of same size is selected, and fin is placed into corresponding U
In shape Double-station clamp, then carry out screw using screw screw device and screw, and product is removed；
S7, detection are checked：When U-shaped Double-station clamp is moved to below testing agency, by testing agency to U
The standing groove of shape Double-station clamp is detected.
The invention provides a kind of fin electric device and technique, comprise the following steps：
(1), by the rotating disk of six deciles, and six U-shaped Double-station clamps of setting on rotating disk, and lead to
Undue cutter driving, attaching nut feed mechanism, nut glue applying mechanism, vacuum material grabbing mechanism, metal-oxide-semiconductor are certainly
Dynamic point gluing mechanism and testing agency, more facilitate, and make dress so that coordinating between each assembly technology
With more facilitating, rotating disk is started by pedal and rotated counterclockwise, coordinates the nut feeder inversely installed
Structure, nut glue applying mechanism, vacuum material grabbing mechanism, metal-oxide-semiconductor automatic glue dispensing mechanism and testing agency, make device
More stablize, and coordinate U-shaped Double-station clamp, make accurate positioning, it is safe make assembly technology it
Between change and more facilitate, feeding speed is fast, fluent movements, and saves the time and artificial waste,
And vibrating disk feeding, the glue applying mechanism for correlation of arranging in pairs or groups, so as to realize the automatic assembling of fin：Automatically put
Nut, from dynamic point nut glue, put automatically metal-oxide-semiconductor, from dynamic point MOS glue, it is artificial take radiating mortice lock screw,
Therefore substantially increase operating efficiency, reduce cost, the need for can meeting high speed production capacity, versatility is wide,
Various different sizes, the fin of model are applicable, and fixture need not be changed, it is outer also without changing
Accessory is enclosed, can be directly general, it is very convenient.
(2) by setting six U-shaped Double-station clamps, six techniques is synchronously carried out, save
Two mounting grooves are provided with substantial amounts of time, and each U-shaped Double-station clamp, are substantially increased
Operating efficiency, sets nut vibrating disc and metal-oxide-semiconductor vibrating disc, coordinates vibrations disk controller, makes device
Feeding speed is fast, fluent movements, sets nut glue applying mechanism and metal-oxide-semiconductor automatic glue dispensing mechanism, points of engagement
Glue machine controller, use is more stablized, accurate positioning, and safe, using aobvious control touch-screen,
Make operation simpler, safeguard and more facilitate.
Brief description of the drawings
Fig. 1 is a kind of structural representation of fin electric device proposed by the present invention；
Fig. 2 is a kind of structural representation of fin electric device front view proposed by the present invention；
Fig. 3 is a kind of nut glue dropping machine structure schematic diagram of fin electric device proposed by the present invention；
Fig. 4 is a kind of structural representation of the vacuum material grabbing mechanism of fin electric device proposed by the present invention；
Fig. 5 is that a kind of partial structurtes of the vacuum material grabbing mechanism of fin electric device proposed by the present invention are shown
It is intended to；
Fig. 6 is a kind of structural representation of the nut feed mechanism of fin electric device proposed by the present invention.
In figure：1 bogey, 101 support frames, 102 bearing boxes, 2 mobile devices, 3 dispensers, 4
Rotating disk, 5U shapes Double-station clamp, 6 nut feed mechanisms, 601 nut vibrating disks, 602 conveying passages,
603 yards material device, 7 nut glue applying mechanisms, 8 vacuum material grabbing mechanisms, 801L shapes baffle plate, 802 contiguous blocks,
803MOS pipes vibrating disc, 804 blanking channels, 805 feeding devices, 806 zigzag tread patterns parts, 807 folders
Hold device, 808 vacuum cups, 809 lateral driver devices, 9MOS pipes automatic glue dispensing mechanism, 10 detections
Mechanism, 11 montants, 12 screw screw devices, 13 aobvious control touch-screens, 14 rotating disk speed regulators, 15 vibrations
Disk controller, 16 dispensing machine controllers, 17 air pressure valves, 18 support blocks, 19 carrying tablets, 20 pushers,
21 fixed covers, 22 rubber guns.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the invention, and
The embodiment being not all of.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, belong to the scope of protection of the invention.
Fig. 1-6 are referred to, the present invention provides a kind of technical scheme：A kind of fin electric device, including hold
Carry and put 1 and the mobile device 2 installed in the bottom of bogey 1, and bogey 1 is by support frame 101
It is welded with the bearing box 102 installed in the side of support frame 101, the middle part of the upper surface of support frame 101
Dispenser 3 is installed with, rotating disk 4, the upper surface of rotating disk 4 are installed with the top of dispenser 3
On go back the six U-shaped Double-station clamps 5 that are installed with of decile, the also fixed peace in upper surface of bogey 1
Equipped with nut feed mechanism 6, nut glue applying mechanism 7, vacuum material grabbing mechanism 8, metal-oxide-semiconductor automatic dispensing machine
Structure 9 and testing agency 10, and nut feed mechanism 6, nut glue applying mechanism 7, vacuum material grabbing mechanism 8,
Metal-oxide-semiconductor automatic glue dispensing mechanism 9 and testing agency 10 are with direction annular array counterclockwise the four of rotating disk 4
Week, the top of support frame 101 is also installed with montant 11, and the top of montant 11 passes through the axle of rotating disk 4
Through hole and the exposed top in rotating disk 4 at the heart, screw rotation is also installed with the exposed end of montant 11
Twist and be also fixedly mounted on mechanism 12, the support frame 101 between testing agency 10 and nut feed mechanism 6
There is aobvious control touch-screen 13, aobvious control touch-screen 13 is also separately positioned on the rotating disk speed regulator on support frame 101
14th, vibrations disk controller 15 and dispensing machine controller 16 are electrically connected, also solid in the bottom of support frame 101
Dingan County is equipped with air pressure valve 17.
Nut feed mechanism 6 includes the nut vibrating disk 601 for being fixedly mounted on the top of bearing box 102, nut
Arrival end on the discharging opening of vibrating disc 601 respectively with two conveying passages 602 is fixedly connected, and two defeated
Expect that the port of export of passage 602 is in contact with the entrance of the code material device 603 on support frame 101.
Nut glue applying mechanism 7 is identical with the structure of metal-oxide-semiconductor automatic glue dispensing mechanism 9, including being fixedly mounted
Support block 18 on support frame 101, the top of support block 18 is connected with carrying tablet 19 by slide rail,
The side of carrying tablet 19 is connected with pusher 20, and the front of carrying tablet 19 is provided with two fixed covers 21, two
Rubber gun 22 is respectively and fixedly provided with individual fixed cover 21, and the positive bottom of support block 18 is additionally provided with connection sheet,
The end of connection sheet, which is connected with, connects glue box.
Vacuum material grabbing mechanism 8 includes L-shaped baffle plate 801, contiguous block 802 and two metal-oxide-semiconductor vibrating discs 803,
And two metal-oxide-semiconductor vibrating discs 803 pass through the blanking channel 804 installed in its exit and L-shaped baffle plate
The feeding device 805 of 801 bottoms is fixedly connected, and the right flank and lower surface of L-shaped baffle plate 801 are all provided with
There is slide rail, the left surface of contiguous block 802 and upper surface are equipped with the sliding block being adapted with slide rail, contiguous block
802 are slidably connected by the slide rail of the sliding block on its left surface and the right flank of L-shaped baffle plate 801, contiguous block
It is provided with 802 on zigzag tread patterns part 806, and contiguous block 802 close on two corresponding surfaces of sliding block
Provided with clamping device 807, vacuum cup 808, the top of vacuum cup 808 are fixed with clamping device 807
Portion is provided with vacuum generator, and transverse direction is fixedly connected with the one end of L-shaped baffle plate 801 away from support frame 101
Drive device 809.
A kind of electronic technique of fin, comprises the following steps：
S1, debugging：The rotating speed of rotating disk 4 is adjusted operation rotating disk speed regulator 14 first, uses aobvious control
Touch-screen 13 is automatic to nut feed mechanism 6, nut glue applying mechanism 7, vacuum material grabbing mechanism 8, metal-oxide-semiconductor
Glue applying mechanism 9 and the operating rate of testing agency 10 are adjusted, and the rotating speed of itself and rotating disk 4 is carried out together
Step, then makes dispenser 3 drive rotating disk 4 to carry out backwards rotation, so that six U using floor push
A U-shaped Double-station clamp 5 in shape Double-station clamp 5 is moved to the lower section of nut feed mechanism 6；
S2, nut is put automatically：Shaken by nut vibrating disc 601, the nut in it is passed through discharging opening
Respectively enter in two conveying passages 602, exported by the port of export of two conveying passages 602, make nut
Into in code material device 603, nut is individually positioned under nut feed mechanism 6 by code material device 603
In two nut standing grooves of the U-shaped Double-station clamp 5 of side, then rotating disk 4 drives the U of placing nut
Shape Double-station clamp 5 turns to the lower section of nut glue applying mechanism 7；
S3, from dynamic point nut glue：Nut glue applying mechanism 7 promotes carrying tablet 19 in cunning by pusher 20
The enterprising line slip of rail, makes fixed cover 21 drive two inclination movements of rubber gun 22, so that rubber gun 22
Pipette tips alignd with the nut in U-shaped Double-station clamp 5, then in U-shaped Double-station clamp 5
Nut carry out dispensing, after the completion of dispensing pusher 20 drive rubber gun 22 resetted, so as to obtain
The nut after dispensing is obtained, and rotating disk 4 drives U-shaped Double-station clamp 5 to turn to vacuum material grabbing mechanism 8
Lower section；
S4, metal-oxide-semiconductor is put automatically：Vacuum material grabbing mechanism 8 is shaken by two metal-oxide-semiconductor vibrating discs 803,
Metal-oxide-semiconductor is moved to the side of L-shaped baffle plate 801 by blanking channel 804, then pass through zigzag tread patterns part
806 brakings, make the vacuum cup 808 on clamping device 807 move and to the MOS on MOS blanking pipes
Pipe is gripped, and metal-oxide-semiconductor is promoted into the position of the phase level of U-shaped Double-station clamp 5, then laterally
The transverse shifting clamping device 807 of drive device 809 and vacuum cup 808, so that metal-oxide-semiconductor is placed into a little
On nut after glue, after placement is finished, rotating disk 4 drives the U-shaped Double-station clamp 5 for placing metal-oxide-semiconductor to move
Move to metal-oxide-semiconductor automatic glue dispensing mechanism 9 and carry out dispensing；
S5, from dynamic point metal-oxide-semiconductor glue：According to S3 identical manufacturing procedures, so as to obtain the MOS after dispensing
Pipe；
S6, radiating mortice lock screw：The fin of same size is selected, and fin is placed into corresponding U
In shape Double-station clamp 5, then carry out screw using screw screw device 12 and screw, and product is removed；
S7, detection are checked：When U-shaped Double-station clamp 5 is moved to 10 lower section of testing agency, by detection machine
Structure 10 is detected to the standing groove of U-shaped Double-station clamp 5.
Although an embodiment of the present invention has been shown and described, for one of ordinary skill in the art
Speech, it is possible to understand that these embodiments can be carried out without departing from the principles and spirit of the present invention
A variety of change, modification, replacement and modification, the scope of the present invention is limited by appended claims and its equivalent
It is fixed.
Claims (5)
1. a kind of fin electric device and technique, mobile device (2) including bogey (1) and installed in bogey (1) bottom, and bearing box (102) of the bogey (1) by support frame (101) and installed in support frame (101) side is welded, it is characterised in that：Dispenser (3) is installed with the middle part of support frame as described above (101) upper surface, rotating disk (4) is installed with the top of dispenser (3), that decile is gone back on the upper surface of rotating disk (4) is installed with six U-shaped Double-station clamps (5), the upper surface of the bogey (1) is also installed with nut feed mechanism (6), nut glue applying mechanism (7), vacuum material grabbing mechanism (8), metal-oxide-semiconductor automatic glue dispensing mechanism (9) and testing agency (10), and nut feed mechanism (6), nut glue applying mechanism (7), vacuum material grabbing mechanism (8), metal-oxide-semiconductor automatic glue dispensing mechanism (9) and testing agency (10) with direction annular array counterclockwise rotating disk (4) surrounding, the top of support frame as described above (101) is also installed with montant (11), and the top of montant (11) passes through through hole and the exposed top in rotating disk (4) at rotating disk (4) axle center, screw screw device (12) is also installed with the exposed end of montant (11), aobvious control touch-screen (13) is also installed with support frame (101) between testing agency (10) and nut feed mechanism (6), aobvious control touch-screen (13) is also separately positioned on the rotating disk speed regulator (14) on support frame (101), shake disk controller (15) and dispensing machine controller (16) electrical connection, air pressure valve (17) is also installed with the bottom of support frame (101).
2. a kind of fin electric device according to claim 1, it is characterised in that：The nut feed mechanism (6) includes being fixedly mounted on the nut vibrating disk (601) at the top of bearing box (102), arrival end on the discharging opening of the nut vibrating disc 601 respectively with two conveying passages (602) is fixedly connected, and the port of export of two conveying passages (602) is in contact with the entrance of the code material device (603) on support frame (101).
3. a kind of fin electric device according to claim 1, it is characterised in that：The nut glue applying mechanism (7) is identical with the structure of metal-oxide-semiconductor automatic glue dispensing mechanism (9), include the support block (18) being fixedly mounted on support frame (101), the top of support block (18) is connected with carrying tablet (19) by slide rail, the side of carrying tablet (19) is connected with pusher (20), the front of carrying tablet (19) is provided with two fixed covers (21), rubber gun (22) is respectively and fixedly provided with two fixed covers (21), and support block (18) positive bottom is additionally provided with connection sheet, the end of connection sheet, which is connected with, connects glue box.
4. a kind of fin electric device according to claim 1, it is characterised in that：The vacuum material grabbing mechanism (8) includes L-shaped baffle plate (801), contiguous block (802) and two metal-oxide-semiconductor vibrating discs (803), and two metal-oxide-semiconductor vibrating discs (803) are fixedly connected by the blanking channel (804) installed in its exit with the feeding device (805) of L-shaped baffle plate (801) bottom, and the right flank and lower surface of L-shaped baffle plate (801) are equipped with slide rail, the left surface of contiguous block (802) and upper surface are equipped with the sliding block being adapted with slide rail, contiguous block (802) is slidably connected by the slide rail of the sliding block on its left surface and L-shaped baffle plate (801) right flank, zigzag tread patterns part (806) is provided with contiguous block (802), and close to being equipped with clamping device (807) on two corresponding surfaces of sliding block on contiguous block (802), vacuum cup (808) is fixed with clamping device (807), the top of vacuum cup (808) is provided with vacuum generator, lateral driver device (809) is fixedly connected with the one end of L-shaped baffle plate (801) away from support frame (101).
5. a kind of electronic technique of fin, it is characterised in that：Comprise the following steps：
S1, debugging：The rotating speed of rotating disk (4) is adjusted operation rotating disk speed regulator (14) first, using aobvious control touch-screen (13) to nut feed mechanism (6), nut glue applying mechanism (7), vacuum material grabbing mechanism (8), the operating rate of metal-oxide-semiconductor automatic glue dispensing mechanism (9) and testing agency (10) is adjusted, synchronize the rotating speed of itself and rotating disk (4), then dispenser (3) is made to drive rotating disk (4) to carry out backwards rotation using floor push, so that a U-shaped Double-station clamp (5) in six U-shaped Double-station clamps (5) is moved to the lower section of nut feed mechanism (6)；
S2, nut is put automatically：Shaken by nut vibrating disc, the nut in it is set to be respectively enterd by discharging opening in two conveying passages (602), by the port of export output of two conveying passages (602), nut is set to enter in code material device (603), in two nut standing grooves of the U-shaped Double-station clamp (5) being individually positioned in nut by code material device (603) below nut feed mechanism (6), then rotating disk (4) drives the U-shaped Double-station clamp (5) of placing nut to turn to the lower section of nut glue applying mechanism (7)；
S3, from dynamic point nut glue：Nut glue applying mechanism (7) promotes carrying tablet (19) in the enterprising line slip of slide rail by pusher (20), fixed cover (21) is set to drive two rubber gun (22) inclination movements, so that the pipette tips of rubber gun (22) are alignd with the nut in U-shaped Double-station clamp (5), then dispensing is carried out to the nut in U-shaped Double-station clamp (5), pusher (20) drives rubber gun (22) to be resetted after the completion of dispensing, so as to obtain the nut after dispensing, and rotating disk (4) drive U-shaped Double-station clamp (5) turns to the lower section of vacuum material grabbing mechanism (8)；
S4, metal-oxide-semiconductor is put automatically：Vacuum material grabbing mechanism (8) is shaken by two metal-oxide-semiconductor vibrating discs (803), metal-oxide-semiconductor is set to be moved to L-shaped baffle plate (801) side by blanking channel (804), then braked by zigzag tread patterns part (806), make the vacuum cup (808) on clamping device (807) mobile and the metal-oxide-semiconductor on MOS blanking pipes is gripped, and MOS pipes are promoted to the position of U-shaped Double-station clamp (5) phase level, then lateral driver device (809) transverse shifting clamping device (807) and vacuum cup (808), so that metal-oxide-semiconductor is placed on the nut after dispensing, after placement is finished, rotating disk (4) drives the U-shaped Double-station clamp (5) for placing metal-oxide-semiconductor to be moved to metal-oxide-semiconductor automatic glue dispensing mechanism (9) and carries out dispensing；
S5, from dynamic point metal-oxide-semiconductor glue：According to S3 identical manufacturing procedures, so as to obtain the metal-oxide-semiconductor after dispensing；
S6, radiating mortice lock screw：The fin of same size is selected, and fin is placed into corresponding U-shaped Double-station clamp (5), then carrying out screw using screw screw device (12) is screwed, and product is removed；
S7, detection are checked：When U-shaped Double-station clamp (5) is moved to below testing agency (10), the standing groove of U-shaped Double-station clamp (5) is detected by testing agency (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610191018.3A CN107234429B (en) | 2016-03-29 | 2016-03-29 | Electric device and process for radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610191018.3A CN107234429B (en) | 2016-03-29 | 2016-03-29 | Electric device and process for radiating fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107234429A true CN107234429A (en) | 2017-10-10 |
| CN107234429B CN107234429B (en) | 2020-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610191018.3A Active CN107234429B (en) | 2016-03-29 | 2016-03-29 | Electric device and process for radiating fin |
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| CN (1) | CN107234429B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109933171A (en) * | 2019-03-18 | 2019-06-25 | 刘亚茹 | A kind of computer power supply structure |
| CN109967302A (en) * | 2017-12-28 | 2019-07-05 | 深圳市赢合技术有限公司 | A kind of rotary spot gluing equipment and its dispensing method |
| CN110919340A (en) * | 2019-12-10 | 2020-03-27 | 扬州智通自动化设备有限公司 | Semiconductor and radiating fin assembling equipment |
| CN111318880A (en) * | 2020-04-07 | 2020-06-23 | 许昌学院 | Full-automatic equipment of intelligence valve body |
| CN112008404A (en) * | 2020-10-22 | 2020-12-01 | 广东河谷流体科技有限公司 | Full-automatic assembly equipment of two-way ball of oil mass distributor |
| CN113458660A (en) * | 2021-05-20 | 2021-10-01 | 昆山小为云智能科技有限公司 | Fin welding feed mechanism |
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| CN109967302A (en) * | 2017-12-28 | 2019-07-05 | 深圳市赢合技术有限公司 | A kind of rotary spot gluing equipment and its dispensing method |
| CN109967302B (en) * | 2017-12-28 | 2023-10-24 | 惠州市赢合智能技术有限公司 | Rotary dispensing equipment and dispensing method thereof |
| CN109933171A (en) * | 2019-03-18 | 2019-06-25 | 刘亚茹 | A kind of computer power supply structure |
| CN109933171B (en) * | 2019-03-18 | 2024-05-17 | 永光鑫润(北京)电子有限责任公司 | Computer power supply structure |
| CN110919340A (en) * | 2019-12-10 | 2020-03-27 | 扬州智通自动化设备有限公司 | Semiconductor and radiating fin assembling equipment |
| CN110919340B (en) * | 2019-12-10 | 2021-02-12 | 扬州智通自动化设备有限公司 | Semiconductor and radiating fin assembling equipment |
| CN111318880A (en) * | 2020-04-07 | 2020-06-23 | 许昌学院 | Full-automatic equipment of intelligence valve body |
| CN112008404A (en) * | 2020-10-22 | 2020-12-01 | 广东河谷流体科技有限公司 | Full-automatic assembly equipment of two-way ball of oil mass distributor |
| CN113458660A (en) * | 2021-05-20 | 2021-10-01 | 昆山小为云智能科技有限公司 | Fin welding feed mechanism |
| CN113458660B (en) * | 2021-05-20 | 2023-07-07 | 昆山小为云智能科技有限公司 | Radiating fin welding feeding mechanism |
| CN113782316A (en) * | 2021-10-12 | 2021-12-10 | 内蒙古东方变压器有限责任公司 | Transformer with porous heat radiation structure |
| CN113782316B (en) * | 2021-10-12 | 2022-07-05 | 内蒙古东方变压器有限责任公司 | Transformer with porous heat radiation structure |
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Denomination of invention: An electric device for heat sink and its process Effective date of registration: 20220316 Granted publication date: 20200331 Pledgee: Guangdong Shunde Rural Commercial Bank Co.,Ltd. Nansha branch of Guangdong pilot Free Trade Zone Pledgor: GUANGDONG STIGER ELECTRONIC CO.,LTD. Registration number: Y2022440000035 |
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Date of cancellation: 20230726 Granted publication date: 20200331 Pledgee: Guangdong Shunde Rural Commercial Bank Co.,Ltd. Nansha branch of Guangdong pilot Free Trade Zone Pledgor: GUANGDONG STIGER ELECTRONIC CO.,LTD. Registration number: Y2022440000035 |