CN107225501A - A kind of device of band sample polishing - Google Patents
A kind of device of band sample polishing Download PDFInfo
- Publication number
- CN107225501A CN107225501A CN201710400732.3A CN201710400732A CN107225501A CN 107225501 A CN107225501 A CN 107225501A CN 201710400732 A CN201710400732 A CN 201710400732A CN 107225501 A CN107225501 A CN 107225501A
- Authority
- CN
- China
- Prior art keywords
- sample
- reference block
- pedestal
- reference plane
- alignment surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Include the invention provides a kind of device of band sample polishing：Pedestal, sample is located on the pedestal, and the pedestal at least includes the first reference plane, and corresponding first reference plane of sample exposes the first machined surface；First reference block, first reference block is located on pedestal, and first reference block includes the first alignment surface, and first reference block can be moved along the direction of vertical first alignment surface, and sample is abutted in first alignment surface；Second reference block；Second reference block is located on pedestal, and second reference block includes the second alignment surface, and second reference block can be moved along the direction of vertical second alignment surface, and sample is abutted in second alignment surface；Compressing unit, the position for fixing sample, the first reference block and the second reference block.By the first calibration block and the second calibration block two faces of sample are accurately positioned, it is ensured that flatness and size after band sample processing so that the polishing size of band sample can be precisely controlled.
Description
Technical field
The present invention relates to the field of sample sanding apparatus, the device polished in particular to a kind of band sample.
Background technology
In scientific research and industrial development, it is often necessary to make the band sample of standard, for various performance tests.Example
Such as, it is necessary to band sample come test resistance rate, Seebeck coefficient in thermoelectric material research and development.In material mechanical performance test, need
Three-point bending or four-point bending intensity are tested with band sample.If specimen size and required standard size disparity compared with
Greatly, then test result error is very big.It is therefore desirable to develop a kind of mechanical device of convenient polishing standard shape sample, improve real
Test efficiency of research and development.Present inventor's research finds that prior art lacks the device of strict management and control band sample processing dimension,
Efficiency and yields that not only prepared by reduction sample, are also easy to because the experimental result of the low influence sample of specimen size accuracy is accurate
True property.
The content of the invention
The invention provides a kind of device of band sample polishing, it is intended to improves existing band sample preparation scale error big
The problem of.
What the present invention was realized in：
A kind of device of band sample polishing, including：
Pedestal, sample is located on the pedestal, and the pedestal at least includes the first reference plane, corresponding first base of sample
Quasi- face exposes the first machined surface；
First reference block, first reference block is located on pedestal, and first reference block includes the first alignment surface, described
First reference block can be moved along the direction of vertical first alignment surface, and sample is abutted in first alignment surface；
Second reference block；Second reference block is located on pedestal, and second reference block includes the second alignment surface, described
Second reference block can be moved along the direction of vertical second alignment surface, and sample is abutted in second alignment surface；
Compressing unit, the position for fixing sample, the first reference block and the second reference block.
Further, in preferred embodiments of the present invention, the pedestal includes the first reference plane and the second reference plane, examination
Sample corresponding first reference plane, second reference plane expose the first machined surface and the second machined surface respectively.
Further, in preferred embodiments of the present invention, the pedestal is L-shaped structure.
Further, in preferred embodiments of the present invention, the compressing unit holds down assembly including first, and described first
Hold down assembly including pressure strip and locking member, the locking member is located on first reference block, the locking member and the pressure
Tight plate connection, compacted position of the pressure strip along locking direction is adjustable, and the pressure strip is compressed on sample top surface.
Further, in preferred embodiments of the present invention, opened up on the pedestal on raised limiting section, the limiting section
Limited location groove, second reference block is located in the stopper slot, and second reference block can be moved along the stopper slot.
Further, in preferred embodiments of the present invention, the pedestal is located at described provided with reference plane, sample is placed
Reference plane is placed, the bottom surface of the stopper slot is concordant with the placement reference plane；Put with described the bottom surface of second reference block
Put reference plane laminating the second alignment surface of institute vertical with the placement reference plane.
Further, in preferred embodiments of the present invention, the bottom surface of first reference block and the placement reference plane
Laminating, first alignment surface is vertical with the placement reference plane.
Further, in preferred embodiments of the present invention, the pedestal or first reference block or second base
Quasi- block is provided with scale.
Further, in preferred embodiments of the present invention, first reference plane institute relative with second reference plane
State placement reference plane vertical.
Further, in preferred embodiments of the present invention, the material hard that the pedestal is used is more than the hardness of sample.
The beneficial effects of the invention are as follows：The device that the band sample obtained by above-mentioned design is polished, in use, passing through the
One calibration block enables two faces of sample to be accurately positioned with the second calibration block, it is ensured that the flatness after band sample processing
With size so that the polishing size of band sample can be precisely controlled.The size for improving band sample is accurate so that sample meets
The requirement of experiment such as resistivity measurement, Seebeck coefficient test, bending strength.The present invention has simple in construction, reliability high, is easy to
The advantage that sample makes.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme of embodiment of the present invention, it will use below required in embodiment
Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore be not to be seen as
It is the restriction to scope, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root
Other related accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the embodiment of the present invention 1, knot during device the first machined surface of processing of band sample polishing under the first visual angle
Structure schematic diagram；
Fig. 2 is the embodiment of the present invention 1, knot during device the first machined surface of processing of band sample polishing under the second visual angle
Structure schematic diagram；
Fig. 3 is the top view of the device of the polishing of band sample shown in Fig. 2；
Fig. 4 is the embodiment of the present invention 1, knot during device the second machined surface of processing of band sample polishing under the first visual angle
Structure schematic diagram；
Fig. 5 is the embodiment of the present invention 1, knot during device the second machined surface of processing of band sample polishing under the second visual angle
Structure schematic diagram；
Fig. 6 is the top view of the device of the polishing of band sample shown in Fig. 5；
Fig. 7 is the embodiment of the present invention 2, structural representation of the device that band sample is polished under the first visual angle；
Fig. 8 is the embodiment of the present invention 2, structural representation of the device that band sample is polished under the second visual angle；
Icon：
Embodiment 1：Pedestal 1 '；Determine groove 11 '；First reference plane 12 '；First reference block 2 '；First alignment surface 21 '；Second
Reference block 3 '；Compressing unit 4 '；First fixture 41 '；Second fixture 42 '；Sample 5；First machined surface 51；Second machined surface
52；
Embodiment 2：Pedestal 1 "；First reference plane 11 "；Second reference plane 12 "；First reference block 2 "；First alignment surface
21”；Second reference block 3 "；Second alignment surface 31 "；Compressing unit 4 "；First holds down assembly 41 "；Locking member 411 "；Compress piece
412”；Compressing member 42 "；Fixedly connected part 43 "；Sample 5；First machined surface 51；Second machined surface 52.
Embodiment
To make the purpose, technical scheme and advantage of embodiment of the present invention clearer, below in conjunction with present invention implementation
Accompanying drawing in mode, the technical scheme in embodiment of the present invention is clearly and completely described, it is clear that described reality
The mode of applying is a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ability
The every other embodiment that domain those of ordinary skill is obtained under the premise of creative work is not made, belongs to the present invention
The scope of protection.Therefore, the detailed description of embodiments of the present invention below to providing in the accompanying drawings, which is not intended to limit, wants
The scope of the present invention of protection is sought, but is merely representative of the selected embodiment of the present invention.Based on the embodiment in the present invention,
The every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, belongs to this
Invent the scope of protection.
In the description of the invention, it is to be understood that term " " center ", " length ", " width ", " on ", " under ",
The orientation or position relationship of the instruction such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than indicate or dark
Specific orientation must be had, with specific azimuth configuration and operation by showing the equipment or element of meaning, therefore it is not intended that right
The limitation of the present invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect；Can be joined directly together, can also be indirectly connected to by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Embodiment 1, referring to figs. 1 to shown in 3, a kind of device of band sample polishing includes pedestal 1 ' and compressing unit 4 '.
Sample 5 is located on the pedestal 1 ', and compressing unit 4 ' is sticked for fixing sample 5, the opposite face of the first machined surface 51 of sample 5
On the second reference block 3 ', the second machined surface 52 of sample 5 or the opposite face of the second machined surface are sticked in pedestal 1 ' so that examination
First machined surface 51 of sample 5 can protrude the first reference plane 12 ' and be processed.Stop processing when being ground to the first reference plane 12 ', protect
Demonstrate,prove the planarization that sample 5 is processed.
Shown in reference picture 4 to 6, a kind of device of band sample polishing also includes the second reference block 3 '.Sample 5 is located at described
On pedestal 1 ', first reference block 2 ' is located on pedestal 1 ' with second reference block 3 ', and compressing unit 4 ' is used for fixed try
The position of sample 5, the first reference block 2 ' and the second reference block 3 '.Two faces of sample 5 rely on the first reference block 2 ' and respectively
On two reference blocks 3 '.The pedestal 1 ' at least includes the first reference plane 12 ', the corresponding first reference plane 12 ' exposure of sample 5 the
Two machined surfaces 52.So that during processing, it would be desirable to which the amount of grinding stretches out pedestal 1 ', processing is stopped when being ground to the first reference plane 12 ',
Ensure the planarization that sample 5 is processed.
Pass through the use of apparatus above so that six faces of sample 5 can be accurately positioned, it is ensured that band sample 5 is processed
Flatness and size afterwards so that the polishing size of band sample 5 can be precisely controlled.The size for improving band sample 5 is accurate,
So that sample 5 meets the requirement of experiment such as resistivity measurement, Seebeck coefficient test, bending strength.The present invention have it is simple in construction,
Reliability is high, the advantage for being easy to sample 5 to make.
It is preferred that, first reference block 2 ' is located on pedestal 1 ', and first reference block 2 ' includes the first alignment surface
21 ', first reference block 2 ' can be moved along the direction of vertical first alignment surface 21 ', and sample 5 abuts in first calibration
On face 21 '.Second reference block 3 ' is located on pedestal 1 ', and second reference block 3 ' includes the second alignment surface, described second
Reference block 3 ' can be moved along the direction of vertical second alignment surface, and sample 5 is abutted in second alignment surface.Pass through the first school
The high-precision alignment surface of conduct of quasi- face 21 ' and the second alignment surface so that can be accurately positioned when sample 5 is processed, be to obtain
Obtain the important prerequisite of high-precision sample 5.
It is preferred that, some fixing grooves 11 ' are offered on pedestal 1 ', the compressing unit 4 ' includes the first fixture 41 ', institute
The first reference block 2 ' is stated to be fixed on pedestal 1 ' by the first fixture 41 ' and the cooperation of fixing groove 11 '.The compressing unit 4 '
Including the second fixture 42 ', second reference block 3 ' is fixed on pedestal 1 ' by second fixture 42 '.
Embodiment 2, refer to Fig. 7 to 8, the device that a kind of band sample 5 is polished include pedestal 1 ", the first reference block 2 ",
Second reference block 3 " and compressing unit 4 ".Sample 5 is located on the pedestal 1 ", first reference block 2 " and second benchmark
Block 3 " is located on pedestal 1 ", and compressing unit 4 " is used for the position for fixing sample 5, the first reference block 2 " and the second reference block 3 ".Examination
Two faces of sample 5 are relied on the first reference block 2 " and the second reference block 3 " respectively.The pedestal 1 " at least includes the first benchmark
Face 11 ", corresponding first reference plane 11 " of sample 5 exposes the first machined surface 51.So that during processing, it would be desirable to which the amount of grinding is stretched
Go out pedestal 1 ", stop processing when being ground to the first reference plane 11 ", it is ensured that the planarization that sample 5 is processed.
By the first calibration block and the second calibration block two faces of sample 5 are accurately positioned, it is ensured that bar shaped is tried
Flatness and size after the processing of sample 5 so that the polishing size of band sample 5 can be precisely controlled.Improve the chi of band sample 5
It is very little accurate so that sample 5 meets the requirement of experiment such as resistivity measurement, Seebeck coefficient test, bending strength.The present invention has knot
Structure is simple, reliability is high, the advantage for being easy to sample 5 to make.
It is preferred that, first reference block 2 " is located on pedestal 1 ", and first reference block 2 " includes the first alignment surface
21 ", first reference block 2 " can be moved along the direction of vertical first alignment surface 21 ", and sample 5 abuts in first calibration
On face 21 ".Second reference block 3 " is located on pedestal 1 ", and second reference block 3 " includes the second alignment surface 31 ", described the
Two reference blocks 3 " can be moved along the direction of vertical second alignment surface 31 ", and sample 5 is abutted in second alignment surface 31 ".It is logical
Cross the high-precision alignment surface of the conduct of the first alignment surface 21 " and the second alignment surface 31 " so that sample 5 can be accurate when being processed
It is determined that position, is the important prerequisite for obtaining high-precision sample 5.
The pedestal 1 " includes the first reference plane 11 " and the second reference plane 12 ", corresponding first reference plane of sample 5
11 ", second reference plane 12 " exposes the first machined surface 51 and the second machined surface 52 respectively.First machined surface 51 of sample 5
Opposite face is abutted on the first reference block 2 ", and the opposite face of the second machined surface 52 of sample 5 is abutted in the second reference plane 12 ".
It is preferred that, the pedestal 1 " is to set the mounting blocks raised up are convenient to set compressing unit 4 " etc. on L-shaped structure, pedestal 1 ".
It is preferred that, the pedestal 1 " is sticked the placement reference plane provided with reference plane, sample 5 is placed.First base
The bottom surface of quasi- block 2 " is fitted with the placement reference plane, and first alignment surface 21 " is vertical with the placement reference plane.Described
The bottom surface of two reference blocks 3 " with it is described placement reference plane fit institute the second alignment surface 31 " with it is described place reference plane it is vertical.Pass through
Set up high-precision placed side and alignment surface so that the position before sample 5 is processed sets precision high, so as to ensure that sample 5 can
The size of degree of precision.
It is preferred that, the compressing unit 4 " holds down assembly 41 " including first, and described first, which holds down assembly, 41 " includes compression
Plate 412 " and locking member 411 ", the locking member 411 " are located on first reference block 2 ", the locking member 411 " with it is described
Pressure strip 412 " is connected, and compacted position of the pressure strip 412 " along locking direction is adjustable, and the pressure strip 412 " is compressed on examination
The top surface of sample 5.Ensure that sample 5 can be by firm fixation in process, it is to avoid process sample 5 offsets, misplaced, influence examination
The processing dimension accuracy of sample 5.
It is preferred that, described first holds down assembly 41 " also including guide rod, and the both sides of the locking member 411 ", which are respectively equipped with, leads
To bar so that locking member 411 " is steadily moved when pushing the pressure strip 412 " so that pressure strip 412 " suppresses the pressure of sample 5
It is evenly distributed.
It is preferred that, the pressing device also includes fixedly connected part 43 ", and the both sides of the fixedly connected part 43 ", which are provided with, leads
To bar, the fixedly connected part 43 " is located on the mounting blocks.The fixedly connected part 43 " is connected with the first reference block 2 ", institute
Fixedly connected part 43 " is stated such that position of first reference block 2 " on pedestal 1 " is adjustable, and the first reference block 2 " can be fixed and existed
Position on pedestal 1 ".The fixedly connected part 43 " is threadedly coupled with mounting blocks.
It is preferred that, offer stopper slot, second reference block on raised limiting section, the limiting section on the pedestal 1 "
3 " are located in the stopper slot, and second reference block 3 " can be moved along the stopper slot.So that the second reference block 3 " being capable of edge
Parallel to the direction movement of the first reference plane 11 " so that length and width size of the sample 5 along the first reference plane 11 " can be controlled accurately.
It is furthermore preferred that the bottom surface of the stopper slot is concordant with the placement reference plane.The compressing unit 4 " also includes compressing member 42 ",
Position for fixing second reference block 3 ".
It is preferred that, the pedestal 1 " or first reference block 2 " or second reference block 3 " are provided with scale, including
The scale of both direction, the direction that is located at of scale is respectively parallel to the first machined surface 51 and the second machined surface 52.So that sample 5
Two processing dimensions conveniently can be read and control.
It is preferred that, first reference plane 11 " is vertical with the relatively described placement reference plane of second reference plane 12 ".It is logical
The processing of the first machined surface 51 and the second machined surface 52 can be controlled by crossing the setting of the first reference plane 11 " and the second reference plane 12 "
Amount, and then the size of Control Assay 5.It is preferred that, the material hard that the pedestal 1 " is used is more than the hardness of sample 5 so that mill
Stop processing when touching the first reference plane 11 " and the second reference plane 12 " when cutting, will not be because being further worn out pedestal 1 " and shadow
Ring the processing dimension of sample 5.
The preferred embodiment of the present invention is the foregoing is only, is not intended to limit the invention, for this area
For technical staff, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made is any
Modification, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of device of band sample polishing, it is characterised in that including：
Pedestal, sample is located on the pedestal, and the pedestal at least includes the first reference plane, corresponding first reference plane of sample
The first machined surface of exposure；
First reference block, first reference block is located on pedestal, and first reference block includes the first alignment surface, described first
Reference block can be moved along the direction of vertical first alignment surface, and sample is abutted in first alignment surface；
Second reference block；Second reference block is located on pedestal, and second reference block includes the second alignment surface, described second
Reference block can be moved along the direction of vertical second alignment surface, and sample is abutted in second alignment surface；
Compressing unit, the position for fixing sample, the first reference block and the second reference block.
2. the device of band sample polishing according to claim 1, it is characterised in that the pedestal includes the first reference plane
With the second reference plane, sample corresponding first reference plane, second reference plane expose the first machined surface and second and added respectively
Work face.
3. the device of band sample polishing according to claim 1, it is characterised in that the pedestal is L-shaped structure.
4. the device of band sample polishing according to claim 1, it is characterised in that the compressing unit includes the first pressure
Tight component, described first is held down assembly including pressure strip and locking member, and the locking member is located on first reference block, described
Locking member is connected with the pressure strip, and compacted position of the pressure strip along locking direction is adjustable, and the pressure strip is compressed on examination
Sample top surface.
5. the device of band sample polishing according to claim 1, it is characterised in that raised limiting section on the pedestal,
Stopper slot is offered on the limiting section, second reference block is located in the stopper slot, second reference block can be along institute
State stopper slot movement.
6. the device of band sample polishing according to claim 5, it is characterised in that the pedestal is provided with placement benchmark
Face, sample is located at the placement reference plane, and the bottom surface of the stopper slot is concordant with the placement reference plane；Second reference block
Bottom surface with it is described placement reference plane fit institute the second alignment surface with it is described place reference plane it is vertical.
7. the device of band sample according to claim 6 polishing, it is characterised in that the bottom surface of first reference block with
The placement reference plane laminating, first alignment surface is vertical with the placement reference plane.
8. the device of band sample polishing according to claim 6, it is characterised in that the pedestal or first benchmark
Block or second reference block are provided with scale.
9. the device of band sample according to claim 6 polishing, it is characterised in that first reference plane and described the
The relatively described placement reference plane of two reference planes is vertical.
10. the device of band sample polishing according to claim 9, it is characterised in that the material that the pedestal is used is hard
Hardness of the degree more than sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400732.3A CN107225501A (en) | 2017-05-31 | 2017-05-31 | A kind of device of band sample polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400732.3A CN107225501A (en) | 2017-05-31 | 2017-05-31 | A kind of device of band sample polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107225501A true CN107225501A (en) | 2017-10-03 |
Family
ID=59933938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710400732.3A Pending CN107225501A (en) | 2017-05-31 | 2017-05-31 | A kind of device of band sample polishing |
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| Country | Link |
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| CN (1) | CN107225501A (en) |
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| CN109702647A (en) * | 2019-01-09 | 2019-05-03 | 西北工业大学 | A kind of simple special-shaped piece fixture and clamping means |
| CN110605467A (en) * | 2019-09-20 | 2019-12-24 | 中国科学院地质与地球物理研究所 | Ion cutting calibration device, calibration method and ion cutting device |
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Application publication date: 20171003 |
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| RJ01 | Rejection of invention patent application after publication |