CN107222983A - The pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module - Google Patents
The pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module Download PDFInfo
- Publication number
- CN107222983A CN107222983A CN201710434377.1A CN201710434377A CN107222983A CN 107222983 A CN107222983 A CN 107222983A CN 201710434377 A CN201710434377 A CN 201710434377A CN 107222983 A CN107222983 A CN 107222983A
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- Prior art keywords
- aln ceramic
- embedded
- pcb board
- core plates
- radiation module
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The present invention discloses the pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module, and method includes step：A, windowing processing is carried out to FR4 core plates and PP pieces；B, FR4 core plates, PP pieces, FR4 core plates carried out in order it is pre- folded；C, the windowing position that AlN ceramic block is put into FR4 core plates and PP pieces；D, pressed according to steel plate, aluminium flake, resistance glue mould release membrance, pcb board, resistance glue mould release membrance, aluminium flake, steel plate order.The present invention solve it is existing bury in copper technology, surface can not make the technical problem of figure；The cost of manufacture of the pcb board with heat sinking function is reduced simultaneously.
Description
Technical field
The present invention relates to the pcb board and system in PCB manufactures field, more particularly to a kind of embedded AlN ceramic insulating radiation module
Make method.
Background technology
AlN is the new material that developed recently gets up, and it has, and high temperature resistant, anticorrosive, thermal conductivity be good, thermal coefficient of expansion is low
The advantages of, it is the encapsulation of integrated circuit substrate material and electronic component while also having very high thermal shock resistance and electrical insulating property
Material, while being also one of candidate material of high-temperature structural components.
Current printed circuit board (PCB) in the market, the PCB types with heat dissipation design mainly have copper base, aluminium base, ceramic base
What plate and part radiated buries copper billet circuit board.The big cost of metal consumption of metal substrate is high.Ceramic substrate is expensive, and machine adds
Work drills and big into profile difficulty, it is impossible to the numerical control device processing commonly used using circuit-board industry, using laser drill and need to cut
Cut.Bury copper billet and can realize and be directly embedded to size design good radiating module in plate, can solve well big on multi-layer PCB board
Figure can not be made on the problem of power semiconductor locally radiates, but the conductive energy of copper billet, copper billet, if it is desired to insulation module
With making figure, then need to bury in the circuit board in completely, while circuit board appearance need to use FR4 materials, can expire by this design
Foot is insulated and makes graphics request, but radiating effect is had a greatly reduced quality, and it is more to take circuit board space.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of embedded AlN ceramic insulating radiation mould
The pcb board and preparation method of block, it is intended to the problems such as solving existing radiating pcb board cost height, be inconvenient to make figure.
Technical scheme is as follows：
A kind of PCB plate production method of embedded AlN ceramic insulating radiation module, wherein, including step：
A, windowing processing is carried out to FR4 core plates and PP pieces；
B, FR4 core plates, PP pieces, FR4 core plates carried out in order it is pre- folded；
C, the windowing position that AlN ceramic block is put into FR4 core plates and PP pieces；
D, pressed according to steel plate, aluminium flake, resistance glue mould release membrance, pcb board, resistance glue mould release membrance, aluminium flake, steel plate order.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, the windowing of FR4 core plates and PP pieces
Spot size is more unilateral than AlN ceramic block big 25 ~ 300 μm.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, also wrapped after the step D
Include：
E, the pcb board after pressing drilled and copper-coating.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, also wrapped after the step E
Include：
F, pcb board through pad pasting, exposure, development, etching process produced into L1 and L4 layer patterns.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, also wrapped after the step F
Include：
G, pcb board is dipped into except in titanium liquid medicine.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, in the step G, pass through leaching
Bubble processing, removes the thick titanium layers of 100 ~ 200 nm of AlN ceramic block bottom.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, also wrapped after the step G
Include：
H, pcb board carries out to anti-welding, word, surface treatment, forming processes successively, form final pcb board finished product.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, the AlN ceramic block and FR4
Core plate uniform thickness.
The PCB plate production method of described embedded AlN ceramic insulating radiation module, wherein, also wrapped before the step A
Include：
The positioning hole of windowing is got out on FR4 core plates and PP pieces using X-RAY machines.
A kind of pcb board, wherein, it is made of the PCB plate production method described in as above any one.
Beneficial effect：The present invention solve it is existing bury in copper technology, surface can not make the technical problem of figure；Drop simultaneously
The cost of manufacture of the low pcb board with heat sinking function.
Brief description of the drawings
Fig. 1 is a kind of flow of the PCB plate production method preferred embodiment of embedded AlN ceramic insulating radiation module of the present invention
Figure.
Fig. 2 is the windowing portion structure schematic diagram in the present invention.
Fig. 3 for the present invention in AlN ceramic block structural representation.
Fig. 4 is the pre- stack structure schematic diagram in the present invention.
Fig. 5 is the pressing structure schematic diagram in the present invention.
Embodiment
The present invention provides the pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module, to make the mesh of the present invention
, technical scheme and effect it is clearer, clear and definite, the present invention is described in more detail below.It should be appreciated that described herein
Specific embodiment only to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is preferably real for a kind of PCB plate production method of embedded AlN ceramic insulating radiation module of the present invention
The flow chart of example is applied, as illustrated, it includes step：
S1, windowing processing is carried out to FR4 core plates and PP pieces；
S2, FR4 core plates, PP pieces, FR4 core plates carried out in order it is pre- folded；
S3, the windowing position that AlN ceramic block is put into FR4 core plates and PP pieces；
S4, pressed according to steel plate, aluminium flake, resistance glue mould release membrance, pcb board, resistance glue mould release membrance, aluminium flake, steel plate order.
In the present invention, AlN ceramic block is embedded in pcb board（That is AlN ceramic insulating radiation module）, such pcb board just has
For heat sinking function, while AlN ceramic block surface has insulation effect, metallic pattern can be made, so taking pcb board space
It is few, it is adapted to the localized heat transfer application of high power small size.The pcb board processing and fabricating of the present invention is simple, reduces cost of manufacture, and
Figure can be made on AlN ceramic block surface, PCB space is taken small.
Specifically, in step sl, windowing processing first is carried out to FR4 core plates and PP pieces.
Wherein windowing processing refers to produce windowing position on FR4 core plates and PP pieces, to be embedded in AlN ceramic block.And
And the windowing position of FR4 core plates and PP pieces needs correspondence, so as to which AlN ceramic block is correctly installed into windowing position.
Further, as shown in Fig. 2 the size of windowing position 1 of FR4 core plates and PP pieces it is more unilateral than AlN ceramic block 30 it is big by 25 ~
300 μm, that is to say, that by taking width as an example, the width at the windowing position 1 of FR4 core plates and PP pieces is bigger than the width of AlN ceramic block 30
50 ~ 600 μm, so that AlN ceramic block 30 has enough embedded spaces.
To ensure the combination reliability of embedded AlN ceramic block 30 and FR4 core plates, FR4 core plates and PP pieces open a window the four of position 1
Individual angle is preferably provided to arc-shaped, and R angles are 0.8mm.
Further, the AlN ceramic block 30 and FR4 core plate uniform thickness.That is, the AlN ceramic block 30 and FR4 core plates
Thickness it is identical.In addition, the layers of copper on its two sides of AlN ceramic block 30 and FR4 core plates and the copper layer thickness phase on FR4 core plates two sides
Together., just being consistent property so during the processing such as graphic making is subsequently carried out.
Described AlN ceramic block 30, its structure is as shown in figure 3, it includes successively：Layers of copper 12, titanium layer 11, aln layer
10th, titanium layer 11, layers of copper 12.That is, the two sides of AlN ceramic block 30 is layers of copper 12, and thickness is identical, and the center portion thereof is divided into nitrogen
Change aluminium lamination 10.
Wherein, the AlN ceramic block 30 is preferably DPC type ceramic blocks, the DPC（Direct copper plating）Type ceramic block, it is fitted
Together in the radiating scene of the pcb board in the present invention, with perfect heat-dissipating, the advantages of low manufacture cost.
And FR4 core plates（It is two-sided）Its structure then includes successively：First layers of copper, PP, the second layers of copper, the first layers of copper therein and
Second copper layer thickness is identical, and corresponding identical with the two sides copper layer thickness of AlN ceramic block 30.The FR4 core plates have high Tg（Glass
Glass temperature）, specifically, Tg >=170 DEG C, it has enough stability.
It can first carry out inner figure making to described FR4 core plates, i.e., by above-mentioned FR4 core plates according to design parameter, through applying
The flows such as film, exposure, development, etching produce L2, L3 layer pattern.L1, L4 layers of copper are protected in inner figure manufacturing process
Layer, it is to avoid L1, L4 layers of layers of copper are etched during etching.
PP pieces in the present invention refer to the PP pieces that gel content is more than 68%；It can effectively combine two pieces of FR4 core plates, bonding
Power is strong.
Further, also include before the step S1：
The positioning hole of windowing is got out on FR4 core plates and PP pieces using X-RAY machines.
FR4 core plates and PP pieces can be positioned using the positioning hole, so that convenient carry out follow-up pressing, it is to avoid
In bonding processes, each layer positioning is inaccurate.
In the step S2, as shown in figure 4, FR4 core plates 20, PP pieces, FR4 core plates 20 are carried out in order pre- folded.
In the present invention, conventional copper foil+PP lay-up methods are not used, but folded using two FR4 core plate combination PP pieces
Close.Because using conventional lay-up method（Copper foil, PP, FR4 core plate, PP, copper foil）, it is necessary to copper foil is opened a window, and copper foil is very
It is thin（Thickness is only 12 ~ 35 μm）, copper foil wrinkle are easily caused in the process of windowing, and copper foil is also easily slided in bonding processes
It is dynamic to cause off normal.And use the core plate lay-up method of the present invention（FR4 core plate+PP piece+FR4 core plates）It can solve the above problems.
In the step S3, due to having carried out windowing processing on FR4 core plates and PP pieces before, so this step can
AlN ceramic block 30 is embedded into the windowing position of FR4 core plates and PP pieces.
In the step S4, as shown in figure 5, according to steel plate 33, aluminium flake 32, resistance glue mould release membrance 31, pcb board 34, resistance glue
Mould release membrance 31, aluminium flake 32, the order of steel plate 33 are pressed.Pcb board 34 therein, which refers in step S3, embedded in AlN ceramic block
30 FR4 core plates and the combining structure of PP pieces.
Resistance glue mould release membrance 31 therein refers to that resistant to elevated temperatures resin stops mould release membrance, is overflowed available for barrier resin, it is to avoid
Pollute plate face.
In addition, after pressing, further preferably with 800 ~ 1200 mesh（Such as 1000 mesh）Sand paper pcb board is polished,
To polish off the glue that AlN ceramic block and the unnecessary overflow in FR4 plates junction go out.
Further, also include after the step S4：
S5, the pcb board after pressing drilled and copper-coating.
Further, also include after the step S5：
S6, pcb board through pad pasting, exposure, development, etching process produced into L1 and L4 layer patterns.
I.e., in step s 6, it is to carry out outer graphics making, is specifically according to design parameter, through patch by above-mentioned pcb board
The flows such as film, exposure, development, etching produce L1, L4 layer pattern.
Further, also include after the step S6：
S7, pcb board is dipped into except in titanium liquid medicine.
Pcb board is dipped into except in titanium liquid medicine by this step, and it is to remove the titanium layer of AlN ceramic block bottom.
It is preferred that, in the step S7, by immersion treatment, remove AlN ceramic block bottom（That is upper and lower surface）100 ~
Titanium layer thick 200 nm, to avoid its residual from causing short circuit.
Soak time in the present invention is preferably remained between 5 ~ 20s, so as to remove the nm titaniums of AlN ceramic block 100~200
Layer, it is to avoid because the residual of titanium causes short circuit.The etch-rate for referring to selective etching titanium, suppression copper except titanium liquid medicine
Chemical grinding liquid, its main component is the mixture of hydrogen peroxide and inorganic acid.Specifically, by mass percentage, it is described
Except titanium liquid medicine contains：10 ~ 19% hydrogen peroxide, 4 ~ 25% acid ammonium fluorides（Ammonium acid fluoride and fluoram）, less than 10% sulfuric acid, remain
Remaining part is divided into water.
Further, also include after the step S7：
S8, pcb board carries out to anti-welding, word, surface treatment, forming processes successively, form final pcb board finished product.
It is described in detail below by a specific embodiment come the method to the present invention.
Step 1：Sawing sheet：From a kind of two-sided FR4 core plates, the PP pieces of high Tg (Tg >=170 DEG C), cut according to design size
Cut；From a kind of DPC types AlN ceramic block, the thickness of ceramic block is consistent with FR4 core thickness, copper thickness and the FR4 core plates of ceramic block
Copper is thick consistent, size 7mm × 7mm.
Step 2：Inner figure makes：By above-mentioned FR4 core plates according to design parameter, through film, exposure, development, etching etc.
Flow produces L2, L3 layer pattern.Need to protect L1, L4 layers of layers of copper in inner figure manufacturing process, it is to avoid L1, L4 layers during etching
Layers of copper is etched.
Step 3：X-RAY bores target：Go out the positioning hole of FR-4 core plates and PP piece windowings using X-RAY machine drills.
Step 4：FR4 core plates and the windowing of PP pieces：Above-mentioned FR4 core plates and PP pieces are gone out to need to be embedded in AlN potteries using gong machine gong
The profile of porcelain block.The AlN ceramic block buried in FR4 core plates and PP pieces design window size ratio is unilateral big 75 μm.To ensure embedded AlN
Four angles of the combination reliability of ceramic block and FR4 core plates, FR4 core plates and the windowing of PP pieces are designed to arcuation, and R angles are 0.8mm.
Step 5：Pressing：Above-mentioned FR4 core plates is pre- folded according to FR4 core plates, PP pieces, FR4 core plates order, then by AlN ceramic
Block is put into FR4 core plates and PP pieces windowing position.Pre- poststack, it is release according still further to steel plate, aluminium flake, resistance glue mould release membrance, pcb board, resistance glue
Film, aluminium flake, steel plate order are put into press and pressed.AlN ceramic block is polished off with the sand paper of 1000 mesh after pressing hardened with FR4
The glue that unnecessary overflow goes out at conjunction.To make gummosis more abundant, it is ensured that windowing gap is filled up, and the pressure ratio normal pressures of pressing are big
30psi。
The parameter of pressing is as shown in following table one：
Table one
| Duan Xu | 1 | 2 | 3 | 4 | 5 | 6 |
| Temperature (DEG C) | 140 | 160 | 180 | 200 | 200 | 160 |
| Time (min) | 10 | 10 | 10 | 10 | 135 | 10 |
| Pressure (psi) | 100 | 150 | 380 | 380 | 380 | 2000 |
Specific pressing formula is as follows：First paragraph：140 DEG C are risen to from normal temperature, heating-up time 10min, pressure rises to from normal pressure
100psi；Second segment：160 DEG C are risen to from 140 DEG C, heating-up time 10min, pressure rises to 150psi from 100psi；3rd section：From
160 DEG C rise to 180 DEG C, and heating-up time 10min, pressure rises to 380psi from 150psi；4th section：200 DEG C are risen to from 180 DEG C,
Heating-up time 10min, pressure 380psi；5th section：200 DEG C of constant temperature keep 135min, pressure 380psi；6th section：From 200
DEG C 160 DEG C are down to, temperature fall time 10min, pressure is down to 200psi from 380psi.
Step 6：By the pcb board after above-mentioned pressing according to design parameter through drilling, copper-coating.
Step 7：Outer graphics make：Above-mentioned pcb board is according to design parameter, through flows such as pad pasting, exposure, development, etchings
Produce L1, L4 layer pattern.After etching, pcb board is dipped into except in titanium liquid medicine, soak time keeps 10s, AlN ceramic is removed
The nm of block bottom 150 titanium layer, it is to avoid because the residual of titanium causes short circuit.
Step 8：By above-mentioned pcb board through anti-welding, word, surface treatment, shaping, final pcb board finished product is formed.
The present invention also provides a kind of pcb board, and it uses PCB plate production method as described above to be made.
In summary, the present invention solve it is existing bury in copper technology, surface can not make the technical problem of figure；Drop simultaneously
The cost of manufacture of the low pcb board with heat sinking function.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (10)
1. a kind of PCB plate production method of embedded AlN ceramic insulating radiation module, it is characterised in that including step：
A, windowing processing is carried out to FR4 core plates and PP pieces；
B, FR4 core plates, PP pieces, FR4 core plates carried out in order it is pre- folded；
C, the windowing position that AlN ceramic block is put into FR4 core plates and PP pieces；
D, pressed according to steel plate, aluminium flake, resistance glue mould release membrance, pcb board, resistance glue mould release membrance, aluminium flake, steel plate order.
2. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, it is characterised in that
The windowing spot size of FR4 core plates and PP pieces is more unilateral than AlN ceramic block big 25 ~ 300 μm.
3. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, it is characterised in that institute
Stating also includes after step D：
E, the pcb board after pressing drilled and copper-coating.
4. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 3, it is characterised in that institute
Stating also includes after step E：
F, pcb board through pad pasting, exposure, development, etching process produced into L1 and L4 layer patterns.
5. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 4, it is characterised in that institute
Stating also includes after step F：
G, pcb board is dipped into except in titanium liquid medicine.
6. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 5, it is characterised in that institute
State in step G, by immersion treatment, remove the thick titanium layers of 100 ~ 200 nm of AlN ceramic block bottom.
7. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 5, it is characterised in that institute
Stating also includes after step G：
H, pcb board carries out to anti-welding, word, surface treatment, forming processes successively, form final pcb board finished product.
8. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, it is characterised in that institute
State AlN ceramic block and FR4 core plate uniform thickness.
9. the PCB plate production method of embedded AlN ceramic insulating radiation module according to claim 1, it is characterised in that institute
Also include before stating step A：
The positioning hole of windowing is got out on FR4 core plates and PP pieces using X-RAY machines.
10. a kind of pcb board, it is characterised in that be made of the PCB plate production method as described in any one of claim 1 ~ 9.
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| CN107708315A (en) * | 2017-10-31 | 2018-02-16 | 江苏贺鸿电子有限公司 | A kind of ceramic embedded radiating circuit plate and preparation method thereof |
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