CN107217246A - A kind of electroless copper copper salt solution and preparation method thereof - Google Patents
A kind of electroless copper copper salt solution and preparation method thereof Download PDFInfo
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- CN107217246A CN107217246A CN201710439346.5A CN201710439346A CN107217246A CN 107217246 A CN107217246 A CN 107217246A CN 201710439346 A CN201710439346 A CN 201710439346A CN 107217246 A CN107217246 A CN 107217246A
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- copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Abstract
The invention discloses a kind of electroless copper copper salt solution and preparation method thereof, chemical copper plating solution is made up of following mass parts raw materials：The L of water 1000, the 260kg of copper sulphate 250, the 40kg of sulfuric acid 20, catalase agent nickel sulfate 3.2 3.8kg, the 30kg of citric acid 25,0.05 ~ 0.08kg of stabilizer, stabilizer is HAS.A kind of preparation method of electroless copper copper salt solution, is comprised the following steps that：1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；2）Sulfuric acid is added, is stirred 30 minutes；3）Nickel sulfate is added, is stirred 30 minutes；4）Citric acid is added, then stirring and dissolving is thorough；5）Stabilizer is added, is stirred 30 minutes.The present invention has mantoquita purity and concentration in the chemical bronze plating liquid being made high, the advantage of the deposition velocity stabilization of heavy copper.
Description
Technical field
The present invention relates to a kind of electroless copper copper salt solution and preparation method thereof.
Background technology
Metallic copper has the comprehensive physical chemical property such as excellent electric conductivity, thermal conductivity and solderability, is widely used to
The fields such as Aeronautics and Astronautics, petrochemical industry, machinery, electronics, computer, automobile, medical treatment.During electroless copper is circuit board fabrication
A kind of technique, is generally also named heavy copper or hole（PTH）It is a kind of their catalytic redox reaction, reduction (negative electrode) reaction：
CuL2+ + 2e- → Cu + L；Aoxidize (anode) reaction：R → O + 2e-.Electroless copper is with catalytic activity
On surface, copper ion reduction precipitation is made by the effect of reducing agent：Treatment with activating agent is used first, is made on insulating substrate adsorption
One layer of active particle generally be Metal Palladium particle, copper ion is reduced on these active Metal Palladium particles first,
And the metallic copper nucleus that these are reduced turns into the Catalytic Layer of copper ion in itself, the reduction reaction of copper is set to continue new at these
Carried out on copper nucleating surface.Copper sulphate produced as electroless copper in main salt, be to provide the main of the metal that needs plate out
Raw material.Mantoquita content has a certain impact to deposition velocity in chemical copper plating solution.Influence of the mantoquita concentration to coating performance is not
Greatly, the impurity but in mantoquita may be produced a very large impact to coating, therefore requirement of the chemical bronze plating liquid to mantoquita purity is higher.
The content of the invention
Goal of the invention：The invention aims to solve deficiency of the prior art to make full use of there is provided one kind
Raw material, improve a kind of electroless copper copper salt solution of mantoquita purity and concentration and preparation method thereof in chemical bronze plating liquid.
Technical scheme：A kind of electroless copper copper salt solution of the present invention, chemical copper plating solution is made up of following mass parts raw materials：
Water 1000 L, copper sulphate 250-260kg, sulfuric acid 20-40kg, catalase agent nickel sulfate 3.2-3.8kg, citric acid 25-30kg are stable
0.05 ~ 0.08kg of agent.
A kind of preparation method of electroless copper copper salt solution, is comprised the following steps that：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
Beneficial effect：
The addition of sulfuric acid, adds the solubility of copper sulphate；Nickel sulfate is catalase agent, increases the solubility conduct simultaneously of copper sulphate
The plating point of copper ion；Citric acid is weak acid, further increases the solubility of copper sulphate；The addition of stabilizer HAS, rises
The effect of stable copper ion is arrived.The present invention can make full use of raw material, improve mantoquita purity and concentration in chemical bronze plating liquid,
Ductility can be obtained during copper facing well and has electroless copper compared with stably depositing speed, sedimentation rate is more steady, the stabilization of plating solution
Property is preferable.
Embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book understands other advantages and effect of the present invention easily.
Embodiment 1,
Raw material：1000 L water, copper sulphate 250kg, sulfuric acid 20kg, catalase agent nickel sulfate 3.2kg, citric acid 25kg, HAS
0.05kg。
Preparation method is as follows：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
Embodiment 2,
Raw material：1000 L water, copper sulphate 260kg, sulfuric acid 20kg, catalase agent nickel sulfate 3.2kg, citric acid 25kg, HAS
0.05kg。
Preparation method is as follows：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
Embodiment 3,
Raw material：1000 L water, copper sulphate 256kg, sulfuric acid 22.2kg, catalase agent nickel sulfate 3.6kg, citric acid 28kg, sulfuric acid hydroxyl
Amine 0.06kg.
Preparation method is as follows：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
Embodiment 4,
Raw material：1000 L water, copper sulphate 255kg, sulfuric acid 40kg, catalase agent nickel sulfate 3.8kg, citric acid 30kg, HAS
0.08kg。
Preparation method is as follows：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
Embodiment 5,
Raw material：1000 L water, copper sulphate 255kg, sulfuric acid 20kg, catalase agent nickel sulfate 3.2kg, citric acid 25kg, HAS
0.05kg。
Preparation method is as follows：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
Embodiment 6,
Raw material：1000 L water, copper sulphate 255kg, sulfuric acid 40kg, catalase agent nickel sulfate 3.4kg, citric acid 25kg, HAS
0.06kg。
Preparation method is as follows：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
Table 1 is the deposition rate table measured by detection embodiment 1-6.
Table 1
As shown in Table 1, the deposition velocity of the heavy copper in the present invention is relatively low and stably, and the overall stability of solution is good.
Mantoquita purity and concentration are high in the chemical copper plating solution being made up of embodiment 1-6, have again compared with stably depositing speed,
The ductility for the copper plate being finally made is good, copper plate surface compact.Plating piece is after continuous four cycle periods, and coating does not rise
Skin, non-foaming, flawless.
Above-mentioned embodiment, technical concept and architectural feature only to illustrate the invention, it is therefore intended that allow and be familiar with this
The stakeholder of item technology can implement according to this, but above content is not intended to limit protection scope of the present invention, every according to this hair
Any equivalent change or modification that bright Spirit Essence is made, all should fall under the scope of the present invention.
Claims (4)
1. a kind of electroless copper copper salt solution, it is characterised in that electroless copper copper salt solution is made up of following mass parts raw materials：Water
1000 L, copper sulphate 250-260kg, sulfuric acid 20-40kg, nickel sulfate 3.2-3.8kg, citric acid 25-30kg, stabilizer 0.05 ~
0.08kg。
2. the preparation method of a kind of electroless copper copper salt solution according to claim 1, it is characterised in that specific steps are such as
Under：
1）Copper sulphate is added into 1000L water, copper sulphate is incorporated into half an hour in water；
2）Sulfuric acid is added, is stirred 30 minutes；
3）Nickel sulfate is added, is stirred 30 minutes；
4）Citric acid is added, then stirring and dissolving is thorough；
5）Stabilizer is added, is stirred 30 minutes.
3. a kind of electroless copper copper salt solution according to claim 1, it is characterised in that the stabilizer is sulfuric acid hydroxyl
Amine.
4. a kind of electroless copper copper salt solution according to claim 1, it is characterised in that the nickel sulfate is catalase agent.
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| CN201710439346.5A CN107217246A (en) | 2017-06-12 | 2017-06-12 | A kind of electroless copper copper salt solution and preparation method thereof |
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| CN201710439346.5A CN107217246A (en) | 2017-06-12 | 2017-06-12 | A kind of electroless copper copper salt solution and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684554A (en) * | 2008-09-23 | 2010-03-31 | 比亚迪股份有限公司 | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
| CN102203319A (en) * | 2008-11-12 | 2011-09-28 | 朗姆研究公司 | Plating solutions for electroless deposition of ruthernium |
-
2017
- 2017-06-12 CN CN201710439346.5A patent/CN107217246A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684554A (en) * | 2008-09-23 | 2010-03-31 | 比亚迪股份有限公司 | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof |
| CN102203319A (en) * | 2008-11-12 | 2011-09-28 | 朗姆研究公司 | Plating solutions for electroless deposition of ruthernium |
| CN102191491A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Chemical copper-plating solution and chemical copper-plating method |
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Application publication date: 20170929 |