CN107210205B - Composite sheet for forming resin film, and method for producing chip with resin film - Google Patents
Composite sheet for forming resin film, and method for producing chip with resin film Download PDFInfo
- Publication number
- CN107210205B CN107210205B CN201680008033.8A CN201680008033A CN107210205B CN 107210205 B CN107210205 B CN 107210205B CN 201680008033 A CN201680008033 A CN 201680008033A CN 107210205 B CN107210205 B CN 107210205B
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- Prior art keywords
- resin film
- forming
- film
- sheet
- mass
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- 229920005989 resin Polymers 0.000 title claims abstract description 329
- 239000011347 resin Substances 0.000 title claims abstract description 328
- 239000002131 composite material Substances 0.000 title claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 66
- 239000010703 silicon Substances 0.000 claims abstract description 66
- 239000000853 adhesive Substances 0.000 claims description 51
- 230000001070 adhesive effect Effects 0.000 claims description 51
- 239000012790 adhesive layer Substances 0.000 claims description 34
- 239000010410 layer Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 28
- 230000001681 protective effect Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 26
- 229920001187 thermosetting polymer Polymers 0.000 claims description 26
- 229920000642 polymer Polymers 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 24
- 239000002313 adhesive film Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000010408 film Substances 0.000 description 439
- 206010040844 Skin exfoliation Diseases 0.000 description 89
- 150000001875 compounds Chemical class 0.000 description 55
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 49
- 229920000058 polyacrylate Polymers 0.000 description 43
- -1 polysiloxane Polymers 0.000 description 39
- 239000000178 monomer Substances 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 29
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 28
- 238000000034 method Methods 0.000 description 28
- 239000004593 Epoxy Substances 0.000 description 27
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 25
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 23
- 238000001723 curing Methods 0.000 description 23
- 125000000217 alkyl group Chemical group 0.000 description 21
- 238000005259 measurement Methods 0.000 description 19
- 239000007787 solid Substances 0.000 description 19
- 239000003795 chemical substances by application Substances 0.000 description 17
- 239000003431 cross linking reagent Substances 0.000 description 17
- 125000003700 epoxy group Chemical group 0.000 description 16
- 125000000524 functional group Chemical group 0.000 description 16
- 239000011256 inorganic filler Substances 0.000 description 15
- 229910003475 inorganic filler Inorganic materials 0.000 description 15
- 239000004925 Acrylic resin Substances 0.000 description 14
- 229920000178 Acrylic resin Polymers 0.000 description 14
- 239000002585 base Substances 0.000 description 14
- 239000004743 Polypropylene Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000007822 coupling agent Substances 0.000 description 13
- 229920001155 polypropylene Polymers 0.000 description 13
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 11
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 9
- 239000000654 additive Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 239000003999 initiator Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 229920006243 acrylic copolymer Polymers 0.000 description 8
- 239000003086 colorant Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 7
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 6
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000013007 heat curing Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 239000004480 active ingredient Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920006287 phenoxy resin Polymers 0.000 description 3
- 239000013034 phenoxy resin Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical compound CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
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- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
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- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
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- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- SJEYSFABYSGQBG-UHFFFAOYSA-M Patent blue Chemical compound [Na+].C1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)S([O-])(=O)=O)S([O-])(=O)=O)=C1C=CC(=[N+](CC)CC)C=C1 SJEYSFABYSGQBG-UHFFFAOYSA-M 0.000 description 1
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- 239000000428 dust Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
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- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
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- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000985 reactive dye Substances 0.000 description 1
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- 238000007788 roughening Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
Abstract
The present invention provides a composite sheet for forming a resin film, which has a structure in which a film for forming a resin film capable of forming a resin film is directly laminated on a support sheet, and satisfies the following requirements (I) and (II). Essential element (I): a peeling force (α 1) required for peeling the film for forming a resin film from the silicon wafer, which is measured under a peeling condition (x) of a stretching speed of 300 mm/min and a stretching angle of 180 DEG in an environment of 23 ℃, is 0.05 to 10.0N/25mm after the surface (α) of the film for forming a resin film to be bonded to the silicon wafer is bonded to the silicon wafer; essential element (II): a peeling force (β 1) measured under the peeling condition (x) required to peel the support sheet from the surface (β) of the resin film-forming film directly laminated on the support sheet is a value equal to or greater than a peeling force (α 1).
Description
Technical Field
The present invention relates to a composite sheet for forming a resin film, and a method for producing a chip with a resin film using the composite sheet for forming a resin film.
Background
In recent years, a mounting method called a so-called flip-chip (face down) method has been used to manufacture a semiconductor device. In the flip chip system, a semiconductor chip (hereinafter, also simply referred to as "chip") having electrodes such as bumps is mounted on a circuit surface of the semiconductor chip, and the electrodes of the chip are bonded to a substrate. Therefore, the surface of the chip opposite to the side bonded to the substrate (hereinafter, also referred to as "the back surface of the chip") may be peeled off.
A resin film made of an organic material may be formed on the back surface of the chip having undergone the peeling, and the chip may be incorporated in a semiconductor device as a chip with a resin film. The resin film may be provided with a function as a protective film for preventing cracks from occurring after the dicing step or the packaging, or a function as an adhesive film for bonding the obtained chip to a pad portion or another member such as another semiconductor chip.
Generally, the chip with a resin film is produced by forming a coating film by applying a solution of a composition containing a resin to the back surface of a wafer by spin coating or the like, drying and curing the coating film to form a resin film, and dicing the resulting wafer with a resin film.
Further, a curable resin film-forming sheet is attached to the back surface of the wafer, and the resin film is obtained by curing the resin film-forming sheet by irradiation with energy rays or heating before and after dicing the wafer, whereby a wafer with a resin film and a chip with a resin film can be manufactured.
As a material for forming a resin film on the back surface of such a chip or the back surface of a wafer, various films for forming a resin film have been proposed.
For example, patent document 1 discloses a film for protecting a chip having a structure in which an energy ray curable protective film forming layer is sandwiched by 2 peeling sheets, the energy ray curable protective film forming layer including: a polymer component containing an acrylic copolymer, an energy ray-curable component, a dye or pigment, an inorganic filler, and a photopolymerization initiator.
According to the description of patent document 1, the chip protection film can form a protective film having good laser marking visibility, hardness, and adhesion to a wafer by irradiation with energy rays, and can simplify the process compared with a conventional chip protection film.
Patent document 2 discloses a dicing tape-integrated wafer back surface protective film including a dicing tape having a base material and an adhesive layer, and a wafer back surface protective film colored and having a predetermined elastic modulus on the adhesive layer of the dicing tape.
According to the description of patent document 2, the wafer back surface protective film has good holding force with the semiconductor wafer in the dicing step of the semiconductor wafer.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2009-138026
Patent document 2: japanese patent application laid-open No. 2010-199543
Disclosure of Invention
Problems to be solved by the invention
However, when the protective films described in patent documents 1 and 2 are attached to the wafer, the protective film attached to the wafer may be misaligned or attached to the wafer so as to include foreign matter in the wafer in a state where foreign matter is attached to the wafer. In such a case, the protective film may need to be peeled off (reattached) from the wafer.
However, in many cases, it is difficult to completely remove the protective film temporarily attached to the wafer without causing residue on the wafer.
In particular, in the protective films disclosed in patent documents 1 and 2, if the protective film is temporarily attached to the wafer for the purpose of improving the adhesion between the protective film and the wafer at the time of attachment and the holding force between the protective film and the wafer after attachment, it is extremely difficult to perform re-peeling because the adhesion between the protective film and the wafer is high.
That is, if the protective film temporarily attached to the wafer is forcibly peeled off, the wafer is broken by the applied force, or a part of the protective film remains on the wafer even if the protective film is peeled off, and the wafer cannot be reused.
In patent documents 1 and 2, the protective films described therein have been studied from the viewpoint of adhesion to the wafer at the time of bonding and holding force between the protective films and the wafer after bonding, but there has been no study on removability of the protective film temporarily bonded to the wafer.
The purpose of the present invention is to provide a composite sheet for forming a resin film which has excellent removability and can be peeled off even after being stuck on a silicon wafer, and a method for producing a chip with a resin film using the composite sheet for forming a resin film.
Means for solving the problems
The present inventors have found that the above problems can be solved by adjusting the peeling force required to peel the film for forming a resin film from a silicon wafer as an adherend and the peeling force required to peel the film for forming a resin film from a support sheet, in a composite sheet for forming a resin film having a structure in which the film for forming a resin film is directly laminated on the support sheet, and have completed the present invention.
Namely, the present invention provides the following [1] to [9 ].
[1] A composite sheet for forming a resin film, which has a structure in which a film for forming a resin film capable of forming a resin film is directly laminated on a support sheet and satisfies the following requirements (I) and (II),
essential element (I): a peeling force (alpha 1) of 0.05 to 10.0N/25mm, which is required for peeling the film for forming a resin film from the silicon wafer, measured under a peeling condition (x) of a stretching speed of 300 mm/min and a stretching angle of 180 DEG in an environment of 23 ℃ after the surface (alpha) of the film for forming a resin film to be adhered to the silicon wafer is adhered to the silicon wafer;
essential element (II): a peeling force (β 1) measured under the peeling condition (x) required to peel the support sheet from the surface (β) of the resin film-forming film directly laminated on the support sheet is a value equal to or greater than a peeling force (α 1).
[2] The composite sheet for resin film formation according to [1], which further satisfies the following requirement (III),
requirement (III): when a resin film is formed from the resin film forming film, the peel force (β 2) required to peel the support sheet from the surface (β') of the resin film directly laminated on the support sheet is 0.02 to 5.0N/25mm, measured under the peel condition (x).
[3] The composite sheet for forming a resin film according to [1] or [2], wherein the peel force (. beta.1) is 0.05 to 20.0N/25 mm.
[4] The composite sheet for forming a resin film according to any one of [1] to [3], wherein the support sheet is a sheet composed of only a base material.
[5] The composite sheet for forming a resin film according to any one of [1] to [3], wherein the support sheet is an adhesive sheet having an adhesive layer on a substrate,
the composite sheet for forming a resin film has a structure in which the adhesive layer of the adhesive sheet and the surface (. beta.) of the film for forming a resin film are directly laminated.
[6] The composite sheet for forming a resin film according to [5], wherein the pressure-sensitive adhesive layer is a layer formed from a pressure-sensitive adhesive composition containing an energy ray-curable resin.
[7] The composite sheet for forming a resin film according to any one of [1] to [6], wherein the film for forming a resin film comprises a polymer component (A) and a curable component (B).
[8] The composite sheet for forming a resin film according to any one of [1] to [7], wherein the film for forming a resin film is a material for forming a protective film or an adhesive film.
[9] A method for producing a chip with a resin film, comprising the following steps (1) to (4),
step (1): a step of attaching the composite sheet for forming a resin film according to any one of claims 1 to 8 to the back surface of a workpiece;
step (2): a step of cutting the workpiece;
step (3): forming a resin film from the resin film-forming film;
step (4): and (3) picking up the cut workpiece obtained in the step (2) to obtain a chip.
ADVANTAGEOUS EFFECTS OF INVENTION
The composite sheet for forming a resin film of the present invention has excellent removability, can be peeled off even after being stuck to a silicon wafer, and can reuse the peeled silicon wafer. Therefore, the method for producing a chip with a resin film using the composite sheet for forming a resin film of the present invention is advantageous from the viewpoint of productivity and economy.
Drawings
Fig. 1 is a cross-sectional view of a composite sheet for forming a resin film according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a structure in which a composite sheet for forming a resin film according to an embodiment of the present invention is bonded to a silicon wafer.
Fig. 3 is a cross-sectional view showing a structure in forming a resin film on a silicon wafer using the composite sheet for forming a resin film according to one embodiment of the present invention.
Description of the symbols
1a, 1b, 1c, 1d composite sheet (composite sheet) for resin film formation
10 supporting sheet
20 film for forming resin film
21 surface (alpha)
22 surface (beta)
30 resin film
31 surface (alpha')
32 surface (beta')
40 jig adhesive layer
50 slide glass
100 silicon wafer
Detailed Description
In the present specification, for example, when the term "(meth) acrylate" is used, both "acrylate" and "methacrylate" are indicated, and other similar terms are also used.
The "energy ray" refers to, for example, ultraviolet rays, electron beams, and the like, and preferably ultraviolet rays.
[ constitution of composite sheet for Forming resin film ]
Fig. 1 is a sectional view of a composite sheet for forming a resin film according to an embodiment of the present invention.
As also shown in fig. 1, the composite sheet for forming a resin film (hereinafter, also simply referred to as "composite sheet") of the present invention has a structure in which a resin film-forming film capable of forming a resin layer is directly laminated on a support sheet.
The form of the composite sheet of the present invention is not particularly limited, and may be, for example, a long tape form, a single-leaf label form, or the like.
As a composite sheet according to an embodiment of the present invention, a composite sheet 1a having a structure in which a film 20 for forming a resin film is directly laminated on the surface of a support sheet 10 is exemplified as shown in fig. 1 (a).
As the shape of the film 20 for forming a resin film of the composite sheet according to the embodiment of the present invention, the following shape is preferable: the shape of the silicon wafer can be substantially the same as that of the silicon wafer to be adhered or can include the shape of the silicon wafer.
In the composite sheet 1a of fig. 1(a), the support sheet 10 and the resin film forming film 20 have substantially the same shape, but a composite sheet 1b may be used in which the shape of the resin film forming film 20 is smaller than the shape of the support sheet 10 as shown in fig. 1 (b).
As a composite sheet according to an embodiment of the present invention, a composite sheet 1c having an annular jig adhesive layer 40 as shown in fig. 1(c) can be mentioned.
The annular jig bonding layer 40 is provided for the purpose of improving the bonding force with respect to a jig such as an annular frame when bonding to the jig, and may be formed of a double-sided adhesive sheet having a base material (core material) or an adhesive.
In the composite sheet 1c shown in fig. 1(c), the jig bonding layer 40 is provided on the surface (α)21 of the resin film forming film 20, but as a composite sheet according to an embodiment of the present invention, a configuration may be adopted in which the jig bonding layer 40 is provided on the surface of the support sheet 10 of the composite sheet 1b as shown in fig. 1 (b).
For example, the exposed surface (α)21 of the film 20 for forming a resin film, which is provided in the composite sheet 1a shown in fig. 1(a), is a bonding surface to a silicon wafer to be bonded.
Therefore, in order to prevent the adhesion of foreign matter, damage, and the like on the surface (α)21, a composite sheet 1d in which a carrier sheet 50 is further laminated on the surface (α)21 of the film 20 for forming a resin film as shown in fig. 1(d) may be formed, and the composite sheet 1d of the carrier sheet 50 can be peeled off when it is stuck to a silicon wafer.
The composite sheet 1d shown in fig. 1(d) has a structure in which a carrier sheet 50 is provided on the surface (α)21 of the resin film-forming film 20 included in the composite sheet 1a shown in fig. 1 (a). The carrier sheet 50 is provided to prevent dirt or the like from adhering to the surface (α)21 of the film 20 for forming a resin film during storage, and is removed when the composite sheet 1d is attached to a silicon wafer.
The carrier sheet 50 of the composite sheet 1d shown in fig. 1(d) includes a sheet made of a carrier sheet substrate such as a resin film, and is preferably a sheet obtained by subjecting the surface of the carrier sheet substrate such as a resin film to a peeling treatment.
Similarly to the structure of the composite sheet 1d, the composite sheet 1b shown in fig. 1(b) may be further provided with a carrier sheet so as to cover the surface (α)21 and the surface of the support sheet 10, and the composite sheet 1c shown in fig. 1(c) may be provided with a carrier sheet so as to cover the surface (α)21 and the surface of the jig bonding layer 40.
Here, the support sheet included in the composite sheet according to one embodiment of the present invention may be a sheet composed of only a substrate, or may be an adhesive sheet having an adhesive layer on a substrate.
When the adhesive sheet is used as a support sheet, the adhesive layer of the adhesive sheet is directly laminated on the surface (β)22 of the resin film-forming film 20.
The support sheet used in one embodiment of the present invention may be a sheet made of a base material having a surface subjected to a peeling treatment. In the composite sheet obtained using a sheet made of a substrate having a surface subjected to a peeling treatment as a support sheet, the surface subjected to a peeling treatment of the substrate and the surface (β)22 of the film 20 for forming a resin film are directly laminated.
[ peeling forces (. alpha.1), (. beta.1), (. beta.2) of composite sheet for resin film formation ]
The composite sheet for forming a resin film of the present invention is required to satisfy the following requirements (I) and (II).
Condition (I): after the surface (alpha) of the film for forming a resin film to be bonded to a silicon wafer is bonded to the silicon wafer, the peeling force (alpha 1) required for peeling the film for forming a resin film from the silicon wafer is 0.05 to 10.0N/25mm, which is measured under peeling conditions (x) of a stretching speed of 300 mm/min and a stretching angle of 180 DEG in an environment of 23 ℃.
Essential element (II): a peeling force (β 1) measured under the peeling condition (x) required to peel the support sheet from the surface (β) of the resin film-forming film directly laminated on the support sheet is a value equal to or greater than a peeling force (α 1).
In the present specification, "peeling force (α 1)" and "peeling force (β 1)" defined in the above-mentioned conditions (I) and (II) indicate values measured by the conditions and methods described in examples.
Fig. 2 is a cross-sectional view showing a structure in which the composite sheet for forming a resin film according to one embodiment of the present invention is bonded to a silicon wafer.
As shown in fig. 2, the "peeling force (α 1)" defined in the requirement (I) is defined as the peeling force of the boundary surface α 1 between the silicon wafer 100 and the surface (α)21 of the film 20 for forming a resin film on the side to be bonded to the silicon wafer.
In the present invention, the peeling force (. alpha.1) is required to be 0.05 to 10.0N/25 mm.
For example, in the conventional resin film-forming films as disclosed in patent documents 1 and 2, the material design for increasing the value of the peeling force (α 1) is performed in many cases because the film is provided for the purpose of improving the adhesion to a silicon wafer and the holding property.
However, when the peeling force (. alpha.1) exceeds 10.0N/25mm, it is actually difficult to re-peel the film for forming a resin film temporarily stuck to the silicon wafer. That is, in such a case, if the film for forming a resin film attached to the silicon wafer is to be forcibly peeled off, it is considered that the film for forming a resin film remaining on the silicon wafer or the silicon wafer is damaged, and the silicon wafer cannot be reused.
Therefore, in order to obtain a composite sheet which is excellent in removability and can be peeled off even after being stuck to a silicon wafer, the above-mentioned peeling force (. alpha.1) is adjusted to 10.0N/25mm or less.
On the other hand, when the above-mentioned peeling force (. alpha.1) is less than 0.05N/25mm, the composite sheet tends to be easily lifted or peeled particularly at the end portion after being bonded to the silicon wafer.
From the above viewpoint, in one embodiment of the present invention, the peeling force (. alpha.1) is preferably 0.06 to 9.5N/25mm, more preferably 0.07 to 9.2N/25mm, still more preferably 0.1 to 9.0N/25mm, yet more preferably 0.2 to 8.0N/25mm, yet more preferably 0.5 to 6.0N/25mm, yet still more preferably 0.5 to 4.0N/25mm, and particularly preferably 0.5 to 3.0N/25 mm.
In one embodiment of the present invention, examples of the method for adjusting the peeling force (α 1) include: a method of appropriately selecting and adjusting the types and contents of the polymer component, the curable component, the inorganic filler, the additive, and the like contained in the film for forming a resin film. The specific method of adjusting the peeling force (α 1) can be adjusted by appropriately considering the matters described in the items of the respective components described later.
The "peeling force (β 1)" defined in the requirement (II) is, for example, the peeling force of the boundary surface β 1 between the surface (β)22 of the resin film forming film 20 directly laminated on the support sheet 10 and the support sheet 10, as shown in fig. 2.
In the case where the adhesive sheet is used as a support sheet, the "peel force (β 1)" defines the peel force at the boundary surface between the surface (β) of the film for forming a resin film and the adhesive layer of the adhesive sheet used as a support sheet.
In the present invention, the peeling force (β 1) needs to be a value equal to or greater than the peeling force (α 1).
If the peeling force (. beta.1) is smaller than the peeling force (. alpha.1), the composite sheet bonded to the silicon wafer is peeled off again, and the whole or part of the film for forming the resin film remains on the silicon wafer, so that the silicon wafer cannot be reused.
From the viewpoint of further improving the re-peelability of the composite sheet, the difference [ (β 1) - (α 1) ] between the peeling force (β 1) and the peeling force (α 1) is preferably 0.01N/25mm or more, more preferably 0.1N/25mm or more, still more preferably 0.15N/25mm or more, still more preferably 0.2N/25mm or more, still more preferably 0.5N/25mm or more, and particularly preferably 1.0N/25mm or more.
The difference [ β 1- α 1] between the peeling force (. beta.1) and the peeling force (. alpha.1) is preferably 20N/25mm or less, more preferably 12N/25mm or less, but from the viewpoint of improving the pickup property at the time of picking up the silicon wafer obtained by cutting, it is more preferably 8.0N/25mm or less, still more preferably 6.0N/25mm or less, still more preferably 4.0N/25mm or less, and still more preferably 2.5N/25mm or less.
In one embodiment of the present invention, the peeling force (. beta.1) is preferably 0.05 to 20.0N/25mm, more preferably 0.2 to 18.0N/25mm, still more preferably 0.5 to 16.0N/25mm, and still more preferably 1.0 to 14.0N/25 mm.
When the peel force (. beta.1) is 0.05N/25mm or more, separation between the film for forming a resin film and the support sheet at the boundary surface (. beta.1) can be prevented when the composite sheet bonded to the silicon wafer is peeled again.
On the other hand, if the peeling force (. beta.1) is 20.0N/25mm or less, the pickup property at the time of picking up the silicon wafer obtained by cutting can be improved.
In one embodiment of the present invention, examples of the method for adjusting the peeling force (β 1) include: the kind and content of each component described above contained in the film for forming a resin film, and the kind of the support sheet used (including the kind of the resin film to be a base material, the kind and amount of the resin and the additive constituting the release layer, and the kind and amount of the resin and the additive constituting the adhesive layer) are appropriately selected and adjusted.
The specific method of adjusting the peeling force (β 1) can be adjusted by appropriately considering the matters described in the items of each component described later.
In addition, the composite sheet according to an embodiment of the present invention preferably further satisfies the following requirement (III).
Requirement (III): when a resin film is formed from the resin film forming film, the peel force (β 2) required to peel the support sheet from the surface (β') of the resin film directly laminated on the support sheet is 0.02 to 5.0N/25mm, measured under the peel condition (x).
In the present specification, "peel force (β 2)" defined in the above-mentioned requirement (III) represents a value measured under the conditions and methods described in the examples.
Fig. 3 is a cross-sectional view showing a structure when a resin film is formed on a silicon wafer using the composite sheet for forming a resin film according to one embodiment of the present invention.
The "peel force (β 2)" specified in the requirement (III) is, for example, the peel force of the boundary surface β 2 between the surface (β') 32 of the resin film 30 formed of the resin film forming film and the support sheet 10, as shown in fig. 3.
In the case where the pressure-sensitive adhesive sheet is used as a support sheet, the "peel force (β 2)" defines the peel force at the boundary surface between the surface (β') of the resin film and the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet used as a support sheet.
When the peeling force (. beta.2) is 0.02N/25mm or more, the silicon wafer obtained by dicing has a certain degree of holding force with respect to the chip when the chip is obtained by picking up the silicon wafer, and therefore, the phenomenon that the chip is scattered immediately before the picking up can be suppressed.
On the other hand, if the peeling force (. beta.2) is 5.0N/25mm or less, the pickup property at the time of picking up the silicon wafer obtained by cutting can be improved.
From the above viewpoint, in one embodiment of the present invention, the peeling force (. beta.2) is preferably 0.03 to 4.0N/25mm, more preferably 0.05 to 2.5N/25mm, still more preferably 0.10 to 2.0N/25mm, and still more preferably 0.15 to 1.5N/25 mm.
On the other hand, the peeling force (α 2) of the boundary surface α 2 between the silicon wafer 100 and the surface (α') 31 of the resin film 30 formed of the resin film for forming a resin film and the silicon wafer on the lamination side is not particularly limited, but is preferably a value at least larger than the peeling force (α 1) and the peeling force (β 2).
In one embodiment of the present invention, the method for adjusting the peeling force (β 2) is not particularly limited, and the same method as the above-described peeling force (β 1) can be used.
In the case of using the pressure-sensitive adhesive sheet as the support sheet, it is preferable to use a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing an energy ray-curable resin. The adhesive force of the pressure-sensitive adhesive layer is easily reduced by irradiation with energy rays, and the peel force (. beta.2) is adjusted to the above range.
[ layers constituting the composite sheet for Forming a resin film ]
Hereinafter, each layer constituting the composite sheet for forming a resin film according to one embodiment of the present invention will be described.
< film for Forming resin film >
The film for forming a resin film included in the composite sheet according to one embodiment of the present invention may be any film as long as the peeling forces (α 1) and (β 1) are within the above ranges, but is preferably a film for forming a resin film including the polymer component (a) and the curable component (B).
The resin film-forming film may further contain 1 or more selected from the group consisting of the inorganic filler (C), the colorant (D), the coupling agent (E), and the general-purpose additive (F) in addition to the components (a) and (B) within a range not to impair the effects of the present invention.
The following describes the components (a) to (F) contained in the film for forming a resin film.
The values of the peeling forces (α 1), (β 1), and (β 2) can be adjusted by appropriately combining the following preferences among the respective components.
[ Polymer component (A) ]
In the present specification, the "polymer component" refers to a compound having a weight average molecular weight (Mw) of 2 ten thousand or more and at least 1 repeating unit.
By incorporating the polymer component (a) into the resin film-forming film used in one embodiment of the present invention, flexibility and film-forming properties can be imparted to the film, and sheet property retention can be improved.
From the above viewpoint, the weight average molecular weight (Mw) of the polymer component (a) is preferably 2 ten thousand or more, more preferably 2 to 300 ten thousand, further preferably 5 to 200 ten thousand, and further preferably 10 to 150 ten thousand.
In the present specification, the weight average molecular weight (Mw) of the polymer component or the like is a value measured by Gel Permeation Chromatography (GPC) and converted to standard polystyrene, specifically, a value measured by the method described in examples.
The content of the polymer component (a) is preferably 5 to 50 mass%, more preferably 8 to 40 mass%, further preferably 10 to 35 mass%, and further preferably 15 to 30 mass% with respect to the total mass (100 mass%) of the resin film-forming film.
In the present specification, for example, the above-mentioned "content of the component (a) based on the total mass (100 mass%) of the resin film-forming film" is synonymous with "content of the component (a) based on the total mass (100 mass%) of the active ingredient in the composition as the material for forming the resin film-forming film", and the same applies to the content of other components described below.
That is, when the content of each component is defined, the term "relative to the total mass (100 mass%) of the resin film-forming film" may be replaced with the term "relative to the total mass (100 mass%) of the active ingredient of the composition as the material for forming the resin film-forming film".
Further, the above-mentioned "active ingredient" means an ingredient other than a substance such as a solvent which does not directly or indirectly affect the reaction and the physical properties of the formed sheet in the composition, and specifically means an ingredient other than a solvent such as water and an organic solvent contained in the composition.
The polymer component (a) preferably contains the acrylic polymer (a1), but may contain a non-acrylic polymer (a2) such as a polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, rubber-based polymer, or the like other than the acrylic polymer (a 1).
These polymer components may be used alone or in combination of 2 or more.
The content of the acrylic polymer (a1) is preferably 50 to 100% by mass, more preferably 60 to 100% by mass, even more preferably 70 to 100% by mass, and even more preferably 80 to 100% by mass, based on the total mass (100% by mass) of the polymer component (a) contained in the film for forming a resin film used in one embodiment of the present invention.
(acrylic Polymer (A1))
From the viewpoint of imparting flexibility and film-forming properties to the resin film-forming film, the weight average molecular weight (Mw) of the acrylic polymer (a1) is preferably from 2 to 300 million, more preferably from 10 to 150 million, even more preferably from 15 to 120 million, and even more preferably from 25 to 100 million.
From the viewpoint of adjusting the peeling forces (. alpha.1), (. beta.1) and (. beta.2) to the above ranges, the glass transition temperature (Tg) of the acrylic polymer (A1) is preferably-40 ℃ or higher, more preferably-20 to 50 ℃, still more preferably-10 to 30 ℃, and still more preferably 0 to 20 ℃.
In the present specification, the value of the glass transition temperature (Tg) of an acrylic polymer or the like is calculated as an absolute temperature by the following formula (1)Glass transition temperature (Tg) represented by (unit: K)K) Converted to temperature in degrees celsius (unit: c.) value.
[ mathematical formula 1]
[ in the above formula (1), W1、W2、W3、W4Denotes the mass fraction (% by mass) of the monomer component constituting the resin component, Tg1、Tg2、Tg3、Tg4The glass transition temperature (unit: K) of the homopolymer of each monomer component constituting the resin component.]
The acrylic polymer (a1) includes a polymer containing an alkyl (meth) acrylate as a main component, and specifically, is preferably an acrylic polymer having a structural unit (a1) derived from an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, and is more preferably an acrylic copolymer having a structural unit (a1) and a structural unit (a2) other than the structural unit (a1) from the viewpoint of adjusting the peeling forces (α 1), (β 1), and (β 2) to the above ranges.
The acrylic polymer (a1) may be used alone or in combination of 2 or more.
When the acrylic polymer (a1) is a copolymer, the form of the copolymer may be any of a block copolymer, a random copolymer, an alternating copolymer, and a graft copolymer.
From the viewpoint of imparting flexibility and film-forming properties to the resin film-forming film, the alkyl group of the alkyl (meth) acrylate constituting the structural unit (a1) preferably has 1 to 18 carbon atoms, more preferably 1 to 12 carbon atoms, and still more preferably 1 to 8 carbon atoms.
Examples of the alkyl (meth) acrylate include: methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, and the like.
These alkyl (meth) acrylates may be used alone or in combination of 2 or more.
Among these, alkyl (meth) acrylates having an alkyl group having 1 to 3 carbon atoms are preferable, and methyl (meth) acrylate is more preferable.
The content of the structural unit (a1-1) derived from an alkyl (meth) acrylate having an alkyl group with 1 to 3 carbon atoms in the acrylic polymer (A1) is preferably 5 to 98% by mass, more preferably 10 to 95% by mass, and still more preferably 20 to 90% by mass, based on the total structural units (100% by mass) of the acrylic polymer (A1).
From the viewpoint of adjusting the peeling forces (α 1), (β 1), and (β 2) to the above ranges, the acrylic polymer (a1) used in one embodiment of the present invention is preferably a copolymer having both a structural unit (a1-1) derived from an alkyl (meth) acrylate having an alkyl group with 1 to 3 carbon atoms and a structural unit (a1-2) derived from an alkyl (meth) acrylate having an alkyl group with 4 to 18 carbon atoms (preferably 4 to 12, and more preferably 4 to 8).
The content ratio of the structural unit (a1-1) to the structural unit (a1-2) [ (a1-1)/(a1-2) ], is preferably 1/99 to 99/1, more preferably 10/90 to 90/10, and still more preferably 15/85 to 85/15.
The content of the structural unit (a1) in the acrylic polymer (a1) is preferably 50 to 100 mass%, more preferably 60 to 99 mass%, and still more preferably 70 to 95 mass% with respect to the total structural units (100 mass%) of the acrylic polymer (a 1).
The acrylic polymer (a1) may have a structural unit (a2) derived from another monomer than the above-mentioned structural unit (a1) within a range not to impair the effects of the present invention.
Examples of the monomer constituting the structural unit (a2) include: functional group-containing monomers having functional groups such as hydroxyl group-containing monomers, carboxyl group-containing monomers, and epoxy group-containing monomers; vinyl ester monomers such as vinyl acetate and vinyl propionate; olefin monomers such as ethylene, propylene and isobutylene; aromatic vinyl monomers such as styrene, methylstyrene, and vinyltoluene; diene monomers such as butadiene and isoprene; nitrile monomers such as (meth) acrylonitrile, and the like.
Examples of the hydroxyl group-containing monomer include: hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate; unsaturated alcohols such as vinyl alcohol and allyl alcohol.
Of these, 2-hydroxyethyl (meth) acrylate is preferred.
Examples of the carboxyl group-containing monomer include: (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid, and the like.
Examples of the epoxy group-containing monomer include: epoxy group-containing (meth) acrylates such as glycidyl (meth) acrylate, β -methylglycidyl (meth) acrylate, (3, 4-epoxycyclohexyl) methyl (meth) acrylate, and 3-epoxycyclo-2-hydroxypropyl (meth) acrylate; non-acrylic epoxy group-containing monomers such as glycidyl crotonate and allyl glycidyl ether; and so on.
The acrylic polymer having a Mw of 2 ten thousand or more, which has a structural unit derived from an epoxy group-containing monomer, has thermosetting properties, but is not the curable component (B) but a component included in the concept of the polymer component (a).
From the viewpoint of adjusting the peeling forces (α 1), (β 1), and (β 2) to the above ranges, the acrylic polymer (a1) used in one embodiment of the present invention is preferably a copolymer having both the structural unit (a1) and the structural unit (a2-1) derived from a hydroxyl group-containing monomer.
The content of the structural unit (a2-1) derived from the hydroxyl group-containing monomer in the acrylic polymer (A1) is preferably 1 to 40% by mass, more preferably 2 to 30% by mass, and still more preferably 5 to 25% by mass, based on the total structural units (100% by mass) of the acrylic polymer (A1).
In particular, from the viewpoint of adjusting the peeling force (α 1) to the above range, the acrylic polymer (a1) used in one embodiment of the present invention is preferably a copolymer having both the structural unit (a1) and the structural unit (a2-2) derived from a nitrile monomer.
The content of the nitrile monomer-derived structural unit (a2-2) in the acrylic polymer (a1) is preferably 1 to 40 mass%, more preferably 2 to 35 mass%, and still more preferably 5 to 30 mass% with respect to the total structural units (100 mass%) of the acrylic polymer (a 1).
If the content of the structural unit derived from the epoxy group-containing monomer in the acrylic polymer (a1) increases, the adhesion between the film for forming a resin film and the silicon wafer to be obtained tends to increase, and the value of the peeling force (α 1) tends to increase. Therefore, in one embodiment of the present invention, the smaller the content of the structural unit derived from the epoxy group-containing monomer in the acrylic polymer (a1), the more preferable.
The content of the structural unit derived from the epoxy group-containing monomer in the acrylic polymer (a1) is preferably 0 to 4 mass%, more preferably 0 to 3 mass%, further preferably 0 to 2 mass%, and further preferably 0 mass%, based on the total structural units (100 mass%) of the acrylic polymer (a 1).
In addition, when an epoxy thermosetting component is used as the curable component (B) described later, since a carboxyl group reacts with an epoxy group in the epoxy thermosetting component, it is preferable that the content of the structural unit derived from the carboxyl group-containing monomer in the acrylic polymer (a1) is small.
When the epoxy thermosetting component is used as the curable component (B), the content of the structural unit derived from the carboxyl group-containing monomer is preferably 0 to 10% by mass, more preferably 0 to 5% by mass, even more preferably 0 to 2% by mass, and even more preferably 0% by mass, based on the total structural units (100% by mass) of the acrylic polymer (a 1).
The content of the structural unit (a2) in the acrylic polymer (a1) is preferably 1 to 40 mass%, more preferably 2 to 35 mass%, and still more preferably 5 to 30 mass% with respect to the total structural units (100 mass%) of the acrylic polymer (a 1).
(non-acrylic Polymer (A2))
The film for forming a resin film used in the present invention may contain, if necessary, a non-acrylic polymer (a2) as a polymer component having Mw of 2 ten thousand or more other than the acrylic polymer (a 1).
Examples of the non-acrylic polymer (a2) include: polyesters, phenoxy resins, polycarbonates, polyethers, polyurethanes, polysiloxanes, rubber-based polymers, and the like.
These non-acrylic polymers (A2) may be used alone or in combination of 2 or more.
The phenoxy resin having an epoxy group and an Mw of 2 ten thousand or more has thermosetting properties, but is not the curable component (B) but a component contained in the non-acrylic polymer (a 2).
The weight average molecular weight (Mw) of the non-acrylic polymer (a2) is preferably 2 ten thousand or more, more preferably 2 to 10 ten thousand, and still more preferably 2 to 8 ten thousand.
[ curable component (B) ]
The curable component (B) is a component that functions to cure the resin film-forming film to form a hard resin film.
The resin film-forming film used in the present invention preferably contains at least one of a thermosetting component (B1) and an energy ray-curable component (B2) as the curable component (B), and more preferably contains a thermosetting component (B1) from the viewpoint of suppressing coloring of a resin film formed from the resin film-forming film, from the viewpoint of sufficiently proceeding a curing reaction, and from the viewpoint of reducing costs.
The thermosetting component (B1) preferably contains a compound having at least a functional group which reacts by heating, and more preferably contains a compound having an epoxy group (B11).
The energy ray-curable component (B2) preferably contains a compound (B21) having a polymerizable functional group that reacts upon irradiation with energy rays.
The functional groups of these curable components react with each other to form a three-dimensional network structure, thereby achieving curing.
(thermosetting component (B1))
As the thermosetting component (B1), an epoxy thermosetting component is preferable.
As the epoxy thermosetting component, it is preferable to use a compound (B11) having an epoxy group in combination with a thermosetting agent (B12).
The compound having an epoxy group (B11) and the thermosetting agent (B12) are compounds having a weight average molecular weight (Mw) of less than 2 ten thousand and are components different from the polymer component (a).
The polymer component (A) contains a compound having an epoxy group and a thermosetting agent, the compound having a weight average molecular weight (Mw) of 2 ten thousand or more.
Examples of the compound (B11) having an epoxy group (hereinafter also referred to as "epoxy compound (B11)") include: and epoxy compounds having 2 or more functional groups in the molecule, such as polyfunctional epoxy resins, bisphenol a diglycidyl ethers and hydrogenated products thereof, novolak-type epoxy resins such as o-cresol novolak-type epoxy resins, dicyclopentadiene-type epoxy resins, biphenyl-type epoxy resins, bisphenol a-type epoxy resins, bisphenol F-type epoxy resins, and phenylene skeleton-type epoxy resins.
These epoxy compounds (B11) may be used alone or in combination of 2 or more.
The weight average molecular weight (Mw) of the epoxy compound (B11) is less than 20,000, but is preferably 10,000 or less, more preferably 100 to 10,000, from the viewpoints of suppressing the viscosity of a composition for forming a film for forming a resin film, improving the workability, and the like, when used in combination with the component (a).
In particular, from the viewpoint of adjusting the peeling force (α 1) to the above range, it is preferable that the epoxy compound (B11) is contained in a composition as a material for forming a film for forming a resin film, in combination with an epoxy compound that is liquid at 25 ℃.
The content ratio of the liquid epoxy compound to the solid epoxy compound [ liquid epoxy compound/solid epoxy compound ] contained in the composition is preferably 5/95 to 95/5, more preferably 10/90 to 90/10, further preferably 20/80 to 80/20, and further preferably 30/70 to 70/30, from the viewpoint of adjusting the peeling force (α 1) to the above range.
The following tendency is present: the larger the proportion of the liquid epoxy compound, the larger the value of the peeling force (. alpha.1), and the larger the proportion of the solid epoxy compound, the smaller the value of the peeling force (. alpha.1).
The content of the epoxy compound (B11) is preferably 1 to 500 parts by mass, more preferably 3 to 300 parts by mass, still more preferably 10 to 150 parts by mass, and still more preferably 20 to 120 parts by mass, based on 100 parts by mass of the component (a).
(Heat-curing agent (B12))
The thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11).
As the thermal curing agent, a compound having 2 or more functional groups capable of reacting with an epoxy group in 1 molecule is preferable.
Examples of the functional group include: phenolic hydroxyl, alcoholic hydroxyl, amino, carboxyl, and acid anhydride. Among these functional groups, a phenolic hydroxyl group, an amino group, or an acid anhydride is preferable, a phenolic hydroxyl group and an amino group are more preferable, and an amino group is further preferable.
Examples of the phenol-based thermosetting agent having a phenol group include: a polyfunctional phenol resin, a bisphenol resin, a novolak-type phenol resin, a dicyclopentadiene-type phenol resin, a XYLOK-type phenol resin, an aralkyl-type phenol resin, or the like.
Examples of the amine-based heat-curing agent having an amino group include: dicyandiamide (DICY) and the like.
These heat-curing agents (B12) may be used alone or in combination of 2 or more.
The content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass, based on 100 parts by mass of the epoxy compound (B11).
(curing Accelerator (B13))
In order to adjust the rate of heat curing of the resin film-forming film, a curing accelerator (B13) may be used. The curing accelerator (B13) is preferably used in combination with the epoxy compound (B11) as the thermosetting component (B1).
Examples of the curing accelerator (B13) include: tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4, 5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine; tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylboron ester.
These curing accelerators (B13) may be used alone or in combination of 2 or more.
The content of the curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 6 parts by mass, and even more preferably 0.3 to 4 parts by mass, based on 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12), from the viewpoints of improving the adhesiveness of a resin film formed from a resin film-forming film and improving the reliability of a chip with a resin film manufactured using a composite sheet.
(energy ray-curable component (B2))
As the energy ray-curable component (B2), a compound (B21) having a polymerizable functional group which reacts by irradiation with an energy ray may be used alone, but it is preferable to use a compound (B21) in combination with a photopolymerization initiator (B22).
(Compound (B21) having functional group that reacts when irradiated with energy ray.)
The compound (B21) having a polymerizable functional group that reacts by irradiation with an energy ray (hereinafter also referred to as "energy ray-reactive compound (B21)") may be any compound as long as it has a polymerizable functional group such as a (meth) acryloyl group or a vinyl group, and examples thereof include: trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, oligoester (meth) acrylate, urethane (meth) acrylate oligomer, epoxy (meth) acrylate, polyether (meth) acrylate, itaconic acid oligomer, and the like.
These energy line-reactive compounds (B21) may be used alone or in combination of 2 or more.
The energy ray-reactive compound (B21) is a compound having a weight average molecular weight (Mw) of less than 2 ten thousand, and is a component different from the polymer component (a).
The energy ray-reactive compound having a weight average molecular weight (Mw) of 2 ten thousand or more is contained in the polymer component (a).
The energy ray-reactive compound (B21) has a weight-average molecular weight (Mw) of less than 20,000, preferably 100 to 15,000, more preferably 300 to 10,000.
The content of the energy ray-reactive compound (B21) is preferably 1 to 1500 parts by mass, more preferably 3 to 1200 parts by mass, per 100 parts by mass of the component (a).
(photopolymerization initiator (B22))
By using the energy ray-reactive compound (B21) in combination with the photopolymerization initiator (B22), the polymerization/curing time can be shortened, and the resin film-forming film can be cured even when the amount of light irradiation is reduced.
Examples of the photopolymerization initiator (B22) include: benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds, peroxide compounds, and the like.
More specific examples of the photopolymerization initiator include: 1-hydroxycyclohexyl phenyl ketone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, bibenzyl, butanedione, β -chloroanthraquinone, 2,4, 6-trimethylbenzyldiphenyl phosphine oxide, and the like.
These photopolymerization initiators may be used alone or in combination of 2 or more.
The content of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, per 100 parts by mass of the energy ray-reactive compound (B21), from the viewpoint of sufficiently proceeding the curing reaction of the resin film-forming film and suppressing the generation of residues.
The content of the curable component (B) is preferably 5 to 50 mass%, more preferably 8 to 40 mass%, even more preferably 10 to 30 mass%, and even more preferably 12 to 25 mass% with respect to the total mass (100 mass%) of the resin film-forming film.
The content of the curable component (B) is the total content of the thermosetting component (B1) containing the epoxy compound (B11), the thermosetting agent (B12) and the curing accelerator (B13) and the energy ray curable component (B2) containing the energy ray reactive compound (B21) and the photopolymerization initiator (B22).
[ inorganic Filler (C) ]
The film for forming a resin film used in one embodiment of the present invention preferably further contains an inorganic filler (C).
By containing the inorganic filler (C), the thermal expansion coefficient of the resin film formed of the resin film-forming film can be adjusted to an appropriate range, and the thermal expansion coefficient of the chip with the resin film can be optimized, whereby the reliability of the semiconductor device in which the chip is incorporated can be improved. In addition, the moisture absorption rate of the resin film formed of the resin film forming film can be reduced.
Examples of the inorganic filler (C) include: powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and the like, beads obtained by spheroidizing these materials, single crystal fibers, glass fibers, and the like.
These inorganic fillers (C) may be used alone or in combination of 2 or more.
Among these inorganic fillers, silica and alumina are preferable.
The inorganic filler (C) preferably has an average particle diameter of 0.01 to 50 μm, more preferably 0.05 to 30 μm, and still more preferably 0.1 to 10 μm.
In the present invention, the average particle diameter of the inorganic filler (C) is a value measured using a laser diffraction scattering particle size distribution measuring apparatus, and is a volume median diameter (D)50)。
The content of the inorganic filler (C) is preferably 15 to 80 mass%, more preferably 20 to 75 mass%, even more preferably 30 to 70 mass%, even more preferably 40 to 65 mass%, and particularly preferably 45 to 60 mass% with respect to the total mass (100 mass%) of the resin film-forming film.
The larger the content of the inorganic filler in the film for forming a resin film, the smaller the values of the peeling forces (α 1) and (β 1) (particularly, the value of the peeling force (β 1)) tend to be.
[ colorant (D) ]
The film for forming a resin film used in one embodiment of the present invention preferably further contains a colorant (D).
By incorporating the colorant (D) into the film for forming a resin film, when the semiconductor chip having the resin film formed from the film for forming a resin film is incorporated into a device, infrared rays and the like generated from surrounding devices can be shielded, and thus malfunction of the semiconductor chip can be prevented.
As the colorant (D), organic or inorganic pigments and dyes can be used.
As the dye, any of acid dyes, reactive dyes, direct dyes, disperse dyes, cationic dyes, and the like can be used, for example.
The pigment is not particularly limited, and may be appropriately selected from known pigments.
Among these, a black pigment is preferable from the viewpoint of having good shielding properties against electromagnetic waves and infrared rays and further improving the visibility by the laser marking method.
Examples of the black pigment include: carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like, but carbon black is preferable from the viewpoint of improving the reliability of the semiconductor chip.
These colorants (D) may be used alone or in combination of 2 or more.
The content of the colorant (D) is preferably 0.01 to 30% by mass, more preferably 0.05 to 25% by mass, even more preferably 0.1 to 15% by mass, and even more preferably 0.15 to 5% by mass, based on the total mass (100% by mass) of the resin film-forming film.
[ coupling agent (E) ]
The film for forming a resin film used in one embodiment of the present invention preferably further contains a coupling agent (E).
By containing the coupling agent (E), the water resistance of the resin film formed of the resin film forming film can be improved without deteriorating the heat resistance.
The coupling agent (E) is preferably a compound that reacts with the functional groups of the components (a) and (B), and more preferably a silane coupling agent.
Examples of the silane coupling agent include: gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropylmethyldiethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, gamma- (methacryloxypropyl) trimethoxysilane, gamma-aminopropyltrimethoxysilane, N-6- (aminoethyl) -gamma-aminopropylmethyldiethoxysilane, N-phenyl-gamma-aminopropyltrimethoxysilane, gamma-ureidopropyltriethoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfide, beta-3, 4-epoxycyclohexyl) ethyltrimethoxysilane, gamma-glycidoxypropyl-trimethoxysilane, gamma-aminopropyltriethoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma-mercaptopropylmethyldimethoxysilane, gamma-glycidoxypropyl-trimethoxysilane, beta-3-glycidoxypropyl, Methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane and the like.
These coupling agents (E) may be used alone or in combination of 2 or more.
As the coupling agent (E), an oligomer type coupling agent is preferable.
The molecular weight of the coupling agent (E) which also includes an oligomer-type coupling agent is preferably 100 to 15000, more preferably 150 to 10000, still more preferably 200 to 5000, still more preferably 250 to 3000, and yet still more preferably 350 to 2000.
It is considered that the inclusion of the coupling agent (E) improves the adhesiveness and cohesiveness by bonding to the polymer component (a) in the film for forming a resin film, the surface of the silicon wafer as an adherend, and the surface of the inorganic filler (C) optionally contained in the sheet for forming a resin film, and therefore the value of the peeling force (α 1) also increases.
Therefore, from the viewpoint of adjusting the peeling forces (α 1), (β 1), and (β 2) to the above ranges, particularly from the viewpoint of adjusting the peeling force (α 1), it is preferable that the content of the coupling agent (E) is small.
From the above viewpoint, the content of the coupling agent (E) is preferably 0.01 to 4% by mass, more preferably 0.05 to 2% by mass, even more preferably 0.10 to 1.5% by mass, and even more preferably 0.15 to 1% by mass, based on the total mass (100% by mass) of the resin film-forming film.
[ general additive (F) ]
The film for forming a resin film used in one embodiment of the present invention may contain, in addition to the above components, a general-purpose additive (F) as needed within a range not to impair the effects of the present invention.
Examples of the general-purpose additive (F) include: crosslinking agent, leveling agent, plasticizer, antistatic agent, antioxidant, ion trapping agent, getter, chain transfer agent and the like.
The content of each of these general-purpose additives (F) is preferably 0 to 10 mass%, more preferably 0 to 5 mass%, and still more preferably 0 to 2 mass% with respect to the total mass (100 mass%) of the resin film-forming film.
< method for producing film for forming resin film >
The method for producing the film for forming a resin film according to one embodiment of the present invention is not particularly limited, and the film can be produced by a known method.
For example, after preparing a resin film-forming composition containing the above components, an organic solvent is appropriately added and diluted to obtain a solution of the resin film-forming composition. Then, a solution of the composition for forming a resin film is applied to the support sheets 10 and 10' shown in fig. 1 by a known coating method to form a coating film, and the coating film is dried to form a film for forming a resin film.
As the organic solvent used for preparing the solution of the composition for forming a resin film, for example: toluene, ethyl acetate, methyl ethyl ketone, and the like.
The solid content concentration of the solution of the resin film-forming composition when the organic solvent is blended is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, and still more preferably 30 to 65% by mass.
Examples of the coating method include: spin coating, spray coating, bar coating, knife coating, roll coating, knife coating, die coating, gravure coating, and the like.
The film for forming a resin film may have a single-layer structure or a multilayer structure having 2 or more layers.
In the case of producing a resin film-forming film having a multilayer structure of 2 or more layers, for example, a resin film-forming film having a multilayer structure can be produced by coating a solution of a resin film-forming composition on 2 or more support sheets to form coating films, laminating the coating films, and drying the laminated films.
The thickness of the film for forming a resin film included in the composite sheet according to one embodiment of the present invention may be set as appropriate depending on the application, and is preferably 3 to 300 μm, more preferably 5 to 250 μm, and still more preferably 7 to 200 μm. When the resin film-forming film has a multilayer structure, the total thickness thereof is preferably within the above range.
< support sheet >
The support sheet used in one embodiment of the present invention includes a sheet composed only of a substrate and an adhesive sheet having an adhesive layer on a substrate.
The support sheet included in the composite sheet according to one embodiment of the present invention is a sheet that functions as a release sheet for preventing dust or the like from adhering to the surface of the resin film forming sheet, a dicing sheet for protecting the surface of the resin film forming sheet in a dicing step or the like, or the like.
The thickness of the support sheet may be appropriately selected depending on the application, but is preferably 10 to 500 μm, more preferably 20 to 350 μm, and still more preferably 30 to 200 μm, from the viewpoint of imparting sufficient flexibility to the composite sheet and improving adhesiveness to a silicon wafer.
The thickness of the support sheet includes not only the thickness of the base material constituting the support sheet but also the thickness of the layer or the film when the adhesive layer is provided.
(substrate)
The substrate constituting the support sheet is preferably a resin film.
Examples of the resin film include: polyethylene films such as Low Density Polyethylene (LDPE) films and Linear Low Density Polyethylene (LLDPE) films, ethylene-propylene copolymer films, polypropylene films, polybutylene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyethylene terephthalate films, polyethylene naphthalate films, polybutylene terephthalate films, polyurethane films, ethylene-vinyl acetate copolymer films, ionomer resin films, ethylene- (meth) acrylic acid copolymer films, ethylene- (meth) acrylate copolymer films, polystyrene films, polycarbonate films, polyimide films, fluororesin films, and the like.
The substrate used in one embodiment of the present invention may be a single-layer film composed of 1 kind of resin film, or may be a laminated film obtained by laminating 2 or more kinds of resin films.
In one embodiment of the present invention, a sheet obtained by subjecting the surface of the above-described base material such as a resin film to surface treatment may be used as the support sheet.
These resin films may also be crosslinked films.
Further, a sheet obtained by coloring these resin films, a sheet obtained by printing, or the like can be used.
The resin film may be a film obtained by forming a sheet of a thermoplastic resin by extrusion molding, a stretched film, or a film obtained by forming a curable resin into a thin film by a predetermined method and curing the thin film to form a sheet.
Among these resin films, a substrate including a polypropylene film is preferable from the viewpoint of excellent heat resistance, expansion suitability due to appropriate flexibility, and easiness in maintaining pickup suitability.
The structure of the substrate including the polypropylene film may be a single-layer structure composed of only the polypropylene film, or a multi-layer structure composed of the polypropylene film and another resin film.
When the film for forming a resin film is thermosetting, the resin film constituting the base material has heat resistance, and thus damage to the base material due to heat can be suppressed, and occurrence of defects in the manufacturing process of a semiconductor device can be suppressed.
When a sheet composed of only a base material is used as the support sheet, the surface tension of the surface of the base material in contact with the surface (β) of the film for forming a resin film is preferably 20 to 50mN/m, more preferably 23 to 45mN/m, and still more preferably 25 to 40mN/m, from the viewpoint of adjusting the peeling force (β 1) to the above range.
The thickness of the base material constituting the support sheet is preferably 10 to 500 μm, more preferably 15 to 300 μm, and still more preferably 20 to 200 μm.
(adhesive sheet)
As the adhesive sheet used as the support sheet in one embodiment of the present invention, an adhesive sheet having an adhesive layer formed of an adhesive on a substrate such as the above-mentioned resin film can be mentioned.
The pressure-sensitive adhesive used as a material for forming the pressure-sensitive adhesive layer may be a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin, and the pressure-sensitive adhesive composition may further contain the above-mentioned general-purpose additives such as a crosslinking agent and a tackifier.
As the adhesive resin, when the structure of the resin is focused, for example, an acrylic resin, a urethane resin, a rubber resin, a silicone resin, a vinyl ether resin, and the like are cited, and when the function of the resin is focused, for example, an energy ray curable adhesive is cited.
In one embodiment of the present invention, a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing an energy ray-curable resin is preferred from the viewpoint of adjusting the peel force (β 2) to the above range and from the viewpoint of improving the pickup property.
The energy ray-curable resin may be any resin having a polymerizable group such as a (meth) acryloyl group or a vinyl group, and is preferably an adhesive resin having a polymerizable group.
From the viewpoint of adjusting the peel forces (β 1) and (β 2) to the above ranges, a pressure-sensitive adhesive containing an acrylic resin is preferred.
The acrylic resin is preferably an acrylic polymer having a structural unit (x1) derived from an alkyl (meth) acrylate, and more preferably an acrylic copolymer having a structural unit (x1) and a structural unit (x2) derived from a functional group-containing monomer.
The alkyl group of the alkyl (meth) acrylate has preferably 1 to 18 carbon atoms, more preferably 1 to 12 carbon atoms, and still more preferably 1 to 8 carbon atoms.
Examples of the alkyl (meth) acrylate include those same as the alkyl (meth) acrylate constituting the structural unit (a 1).
The alkyl (meth) acrylate may be used alone or in combination of 2 or more.
The content of the structural unit (x1) is usually 50 to 100 mass%, preferably 50 to 99.9 mass%, more preferably 60 to 99 mass%, and still more preferably 70 to 95 mass% based on the total structural units (100 mass%) of the acrylic polymer.
Examples of the functional group-containing monomer include: examples of the monomer include the same monomers as those exemplified as the monomer constituting the structural unit (a 2).
These monomers may be used alone or in combination of 2 or more.
The content of the structural unit (x2) is usually 0 to 40% by mass, preferably 0.1 to 40% by mass, more preferably 1 to 30% by mass, and still more preferably 5 to 20% by mass, based on the total structural units (100% by mass) of the acrylic polymer.
The acrylic resin used in one embodiment of the present invention may be an energy ray-curable acrylic resin obtained by further reacting an acrylic copolymer having the structural units (x1) and (x2) with a compound having an energy ray-polymerizable group.
The compound having an energy ray-polymerizable group may be any compound having a polymerizable group such as a (meth) acryloyl group or a vinyl group.
When a pressure-sensitive adhesive containing an acrylic resin is used, it is preferable to contain a crosslinking agent in addition to the acrylic resin, from the viewpoint of adjusting the peel forces (β 1) and (β 2) to the above ranges.
Examples of the crosslinking agent include: isocyanate crosslinking agents, imine crosslinking agents, epoxy crosslinking agents, oxazoline crosslinking agents, carbodiimide crosslinking agents, and the like, and isocyanate crosslinking agents are preferable from the viewpoint of adjusting the peeling forces (β 1) and (β 2) to the above ranges.
The content of the crosslinking agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, even more preferably 0.5 to 10 parts by mass, and even more preferably 1 to 8 parts by mass, based on the total mass (100 parts by mass) of the acrylic resin contained in the adhesive.
A support sheet made of a substrate subjected to a release treatment can be obtained by applying an adhesive to the resin film as a substrate by a known coating method and drying the formed coating film to form a release film.
The binder may be prepared in the form of a solution or an emulsion by further adding a diluting solvent.
In order to strengthen the adhesion between the resin film as a substrate and the adhesive layer, the surface of the resin film on which the adhesive layer is to be provided may be subjected to a roughening treatment by sandblasting, solvent treatment, or the like, as necessary; oxidation treatment such as corona discharge treatment, electron beam irradiation, plasma treatment, ozone treatment, ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment; and priming treatment.
The surface tension of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is preferably 20 to 50mN/m, more preferably 23 to 45mN/m, and still more preferably 25 to 40mN/m, from the viewpoint of adjusting the peel force (. beta.1) to the above range.
The thickness of the adhesive layer is preferably 1 to 100 μm, more preferably 2 to 80 μm, and particularly preferably 3 to 50 μm.
< jig adhesion layer >
The jig adhesion layer may be formed of a double-sided adhesive sheet having a base material (core material) or an adhesive.
The substrate (core material) includes a resin film that can be used as the substrate, and is preferably a polypropylene film or a polyvinyl chloride film.
The adhesive may be the same adhesive as that used as a material for forming the adhesive layer of the adhesive sheet.
The thickness of the jig bonding layer is preferably 1 to 200 μm, more preferably 5 to 100 μm, and further preferably 10 to 70 μm.
< slide glass >
The carrier sheet is not particularly limited as long as it is a material that can be peeled off in use, and examples thereof include a resin film that can be used as the above-mentioned base material, a sheet obtained by applying a peeling treatment to the surface of the resin film, and the like.
The thickness of the carrier sheet is not particularly limited, but is preferably 1 to 200. mu.m, more preferably 5 to 150. mu.m, and still more preferably 10 to 100. mu.m.
[ use of composite sheet for Forming resin film ]
The composite sheet according to one embodiment of the present invention can be attached to the back surface of a work such as a semiconductor wafer for a chip or a semiconductor chip of a flip chip system to form a resin film on the work. The resin film has a function as a protective film for protecting the back surface of a work such as a semiconductor wafer or a semiconductor chip. For example, in the case of being attached to a semiconductor wafer, the resin film has a function of reinforcing the wafer, and thus can prevent breakage of the wafer and the like.
The composite sheet according to one embodiment of the present invention can also be provided with a function as an adhesive film by a resin film formed of the resin film forming film. The adhesive film is generally attached to the back surface of a semiconductor wafer or the like, and is cut into individual chips through a dicing step, and then placed (soldered) on a predetermined portion to be attached of a substrate or the like, and is used for adhesion and fixation of the semiconductor chips through a thermosetting step.
The composite sheet according to one embodiment of the present invention can be used as a sheet for fixing a workpiece such as a semiconductor wafer when dicing with a blade or laser cutting, and can simplify the manufacturing process of a semiconductor device without separately attaching a dicing sheet for dicing.
In the so-called dbg (dicing before grinding) method (a method of forming a groove deeper than the thickness of a chip to be obtained from the circuit surface side of a semiconductor wafer and thinning the groove at least from the back surface side of the semiconductor wafer to obtain a chip group), the composite sheet of the present invention may be used and may be used by being bonded to a chip group that has been singulated.
[ method for producing chip with resin film ]
Hereinafter, an example of a method for manufacturing a chip with a resin film using the composite sheet according to one embodiment of the present invention will be described.
For example, as a method for manufacturing a chip with a resin film according to an embodiment of the present invention, a method by blade dicing having the following steps (1) to (4) can be mentioned.
Step (1): step of attaching the composite sheet for forming a resin film according to one embodiment of the present invention to the back surface of a workpiece
Step (2): process for cutting workpiece
Step (3): forming a resin film from a film for forming a resin film
Step (4): a step of picking up the cut workpiece obtained in the step (2) to obtain a chip
In the method for manufacturing a chip with a resin film according to an embodiment of the present invention, the order of steps (2) to (4) after step (1) is not limited, and may be, for example, "steps (1), (2), (3), and (4)", or "steps (1), (3), (2), and (4)", or "steps (1), (2), (4), and (3)".
< step (1) >
The step (1) is a step of attaching a film for forming a resin film of the composite sheet according to one embodiment of the present invention to the back surface of a workpiece such as a silicon wafer.
The workpiece used in this step may be a silicon wafer, or a compound semiconductor wafer of gallium, arsenic, or the like. The semiconductor wafer may be formed with a circuit on its surface and appropriately ground on its back surface to have a thickness of about 50 to 500 μm.
Here, since the composite sheet of the present invention is excellent in removability, when the work and the composite sheet are not smoothly attached to each other in this step, the composite sheet can be reattached. That is, even if the film for forming a resin film of the composite sheet is temporarily attached to the back surface of the workpiece, the composite sheet can be completely peeled off from the workpiece. Since residues of the film for forming a resin film are less likely to be generated on the surface of the work from which the composite sheet has been peeled, the work can be reused.
< step (2) >
The step (2) is a step of cutting the workpiece together with the circuit formed on the surface thereof to process the chip.
The work to be cut in this step may be a work with a resin film-forming film obtained through step (1), or may be a work with a resin film obtained through step (3) after step (1).
The workpiece may be cut by a known method.
Here, when this step is performed after step (1), a cut workpiece with a resin film-forming film is obtained, and a resin film is formed from the resin film-forming film in step (3) thereafter, whereby a cut workpiece with a resin film can be obtained.
On the other hand, when the step (3) is performed after the step (1), the cut resin film-attached workpiece is obtained by cutting the resin film-attached workpiece in this step.
< step (3) >
The step (3) is a step of forming a resin film from the resin film forming film of the composite sheet stuck to the workpiece.
The resin film is usually formed by curing a film for forming a resin film, but if the film itself for forming a resin film has a function of a protective film or an adhesive film, an uncured film for forming a resin film may be used as it is as a resin film.
The resin film to be formed may be a film that is completely cured or a film that is partially cured, but is preferably a film that is completely cured.
The curing of the film for forming a resin film may be performed by any of thermal curing and curing by irradiation of energy rays, depending on the type of the curable component contained in the film for forming a resin film.
The conditions for the thermosetting are preferably 100 to 150 ℃ and 1 to 3 hours.
The conditions for curing by irradiation with energy rays may be set appropriately according to the type of energy ray used. For example, when ultraviolet light is used, the illuminance is preferably 170 to 250mw/cm2The light quantity is 600 to 1000mJ/cm2。
< step (4) >
The step (4) is a step of picking up the cut workpiece obtained in the step (2) by a general-purpose mechanism such as a collet (collet) to obtain a chip. Through this step, a singulated chip can be obtained.
When the resin film is formed by curing the resin film-forming film in step (3), if the value of the peeling force (β 2) required to peel the support sheet from the surface (β') of the resin film is within the above range, the pickup adaptability is good, and the productivity of the chip with the resin film can be improved.
The value of the peeling force required to peel the support sheet from the surface of the uncured resin film-forming film is also preferably in the same range as the above-mentioned peeling force (β 2).
In the case of using a composite sheet in which an uncured film for forming a resin film and an adhesive sheet as a support sheet are laminated, the adhesive sheet preferably has an adhesive layer formed from an adhesive composition containing an energy ray-curable resin.
If the psa sheet has such a psa layer, good pickup properties can be obtained by irradiating the psa layer with energy rays before the pickup operation in this step to reduce the adhesive strength of the psa layer. It is considered that by thus irradiating energy rays, the value of the peeling force required to peel the adhesive sheet from the surface of the uncured resin film-forming film can be easily adjusted to the same range as the peeling force (β 2) described above.
The chip with a resin film obtained through the above steps can be flip-chip mounted on a substrate or the like to manufacture a semiconductor device. In addition, in the case of a chip with a resin film in which the resin film functions as an adhesive film, the semiconductor device can be manufactured by bonding the resin film to a pad portion or another member (chip mounting portion) such as another semiconductor chip.
Examples
In the following description, the weight average molecular weight (Mw) and the glass transition temperature (Tg) of each component are values measured or calculated by the methods shown below.
< weight average molecular weight (Mw) >
The measurement was performed under the following conditions using a gel permeation chromatography apparatus (product name "HLC-8220 GPC" manufactured by Tosoh corporation), and the value measured in terms of standard polystyrene was used.
(measurement conditions)
Column chromatography: "TSK guard column HXL-H", "TSK gel GMHXL (. times.2)" "TSK gel G2000 HXL" (all manufactured by Tosoh Co., Ltd.)
Column temperature: 40 deg.C
Developing solvent: tetrahydrofuran (THF)
Flow rate: 1.0mL/min
< glass transition temperature (Tg) >
The value calculated by the above formula (1) was used.
Examples 1 to 9 and comparative example 1
Each component of the kind and the blending amount (effective component ratio) shown in table 1 was mixed and diluted with methyl ethyl ketone to prepare a solution of the resin film forming composition of the resin film forming film having a solid content concentration of 61 mass%.
Then, a solution of the composition for forming a resin film was applied to the surface of a carrier sheet (trade name "SP-PET 3811", manufactured by Lindcuke Co., Ltd., thickness: 38 μm) having a surface subjected to a peeling treatment, and the carrier sheet was dried at 120 ℃ for 2 minutes. Then, a film for forming a resin film having a thickness of 25 μm was formed on the carrier sheet, and a laminate (1) comprising the carrier sheet and the film for forming a resin film was prepared.
Then, any of the support sheets (I) to (VII) shown in table 1 was bonded to the resin film-forming film of the laminate (1), and a laminate (2) in which the support sheet, the resin film-forming film, and the carrier sheet were sequentially laminated was produced.
When the support sheets (I), (II), (IV) to (VII) are used, the resin film-forming film and the pressure-sensitive adhesive layers of the support sheets are directly laminated to produce the laminate (2).
Details of each component described in table 1 used for preparing the resin film-forming compositions of examples and comparative examples are as follows.
< Polymer component >
[ A-1 ]: AN acrylic copolymer (Mw 85 ten thousand, Tg 12 ℃) composed of Ethyl Acrylate (EA), n-Butyl Acrylate (BA) and Acrylonitrile (AN).
(A-2): an acrylic copolymer formed from Methyl Acrylate (MA) and 2-hydroxyethyl acrylate (HEA) (MA/HEA: 85/15 (mass%), Mw: 37 ten thousand, Tg: 6 ℃).
(A-3): an acrylic copolymer formed from Methyl Acrylate (MA), n-Butyl Acrylate (BA), 2-hydroxyethyl acrylate (HEA) and Glycidyl Methacrylate (GMA) (MA/BA/HEA/GMA-70/10/15/5 (mass%), Mw-80 ten thousand, Tg-1 ℃).
< curable Components >
(B-1): bisphenol A epoxy resin (trade name "jER 828" manufactured by Mitsubishi chemical corporation, liquid at 25 ℃ C., and equivalent to epoxy compound (B11)).
(B-2): bisphenol A epoxy resin (trade name "JeR 1055" manufactured by Mitsubishi chemical corporation, solid at 25 ℃ C., and corresponding to epoxy compound (B11)).
(B-3): a dicyclopentadiene type epoxy resin (a compound produced by DIC having a trade name of "Epiclon HP-7200 HH" and a solid state at 25 ℃ C., which corresponds to the oxygen compound (B11)).
(B-4): an amine-based curing agent (a compound manufactured by ADEKA, trade name "Adeka Hardener 3636 AS" and corresponding to the heat-curing agent (B12)).
(B-5): a curing accelerator (a compound manufactured by Shikoku Kabushiki Kaisha, trade name "Curezol 2 PHZ", corresponding to curing accelerator (B13)).
< inorganic Filler >
(C-1): silica filler (product name "SC 2050 MA" manufactured by Admatechs corporation).
< coloring agent >
(D-1): carbon black (trade name "# MA 650", manufactured by Mitsubishi chemical corporation).
< silane coupling agent >
[ E-1 ]: a silane coupling agent (trade name "A-1110" manufactured by Nippon Unicar Co., Ltd.).
The details of the support sheet described in table 1 used in examples and comparative examples are as follows.
Support sheet (I):
and an adhesive sheet having an adhesive layer formed of an adhesive (i) and having a thickness of 90 μm on one surface of an 80 μm polypropylene film (manufactured by mitsubishi resin corporation) (the surface tension of the adhesive layer is 30 mN/m).
This adhesive (i) contains 100 parts by mass (solid content) of an acrylic resin composed of 2-ethylhexyl acrylate (2EHA), Methyl Methacrylate (MMA), and 2-hydroxyethyl acrylate (HEA) (2 EHA/MMA/HEA: 60/30/10 (mass%), Mw: 50 ten thousand) and 10 parts by mass (solid content) of a 3-functional xylylene diisocyanate-based crosslinking agent (product name "Takenate D110N" manufactured by Mitsui Takeda Chemical corporation).
Support sheet (II):
and an adhesive sheet having an adhesive layer formed of an adhesive (ii) and having a thickness of 90 μm on one surface of an 80 μm polypropylene film (manufactured by mitsubishi resin corporation) (the surface tension of the adhesive layer is 33 mN/m).
The adhesive (ii) contains 100 parts by mass (solid content) of an acrylic resin composed of 2-ethylhexyl acrylate (2EHA), Methyl Methacrylate (MMA), and 2-hydroxyethyl acrylate (HEA) (2 EHA/MMA/HEA: 60/30/10 (mass%), Mw: 50 ten thousand) and 5 parts by mass (solid content ratio) of a 3-functional xylylene diisocyanate-based crosslinking agent (Mitsui Takeda Chemical, product name "Takenate D110N").
Support sheet (III):
a support sheet was composed of only a polypropylene film (35 mN/m surface tension, manufactured by Mitsubishi resin Co., Ltd.) having a thickness of 80 μm.
Support sheet (IV):
an adhesive sheet having an adhesive layer of 90 μm thickness formed of an energy ray-curable adhesive (iii) on one surface of an 80 μm-thick polypropylene film (manufactured by Mitsubishi resin corporation).
The energy ray-curable adhesive (iii) comprises: an energy ray-curable acrylic copolymer (weight average molecular weight: 60 ten thousand) 100 parts by mass (solid content) obtained by further reacting a prepolymer (2EHA/VAc/HEA ═ 40/40/20 (mass%)) obtained by copolymerizing 40 parts by mass of 2-ethylhexyl acrylate (2EHA), 40 parts by mass of vinyl acetate (VAc) and 20 parts by mass of 2-hydroxyethyl acrylate (HEA) with 21.4 parts by mass of 2-isocyanatoethyl methacrylate (the amount of isocyanato group in 2-isocyanatoethyl methacrylate is 80 mol% relative to 100 mol% of hydroxyl group in HEA); and 5 parts by mass (solid content) of a 3-functional xylylene diisocyanate-based crosslinking agent (product name "Takenate D110N" manufactured by Mitsui Takeda Chemical corporation).
Support sheet (V):
and an adhesive sheet having an adhesive layer with a thickness of 10 μm formed by an adhesive (iv) on one surface of an 80 μm polypropylene film (manufactured by mitsubishi resin corporation) (the surface tension of the adhesive layer is 33 mN/m).
The adhesive (iv) contains 100 parts by mass (solid content) of an acrylic resin composed of Butyl Acrylate (BA), Methyl Acrylate (MA) and 2-hydroxyethyl acrylate (HEA) (BA/MA/HEA 60/30/10 (mass%), Mw 80 ten thousand) and 1 part by mass (solid content) of a 3-functional xylylene diisocyanate-based crosslinking agent (product name "Takenate D110N", manufactured by Mitsui Takeda Chemical corporation).
Support sheet (VI):
and an adhesive sheet having an adhesive layer of 10 μm thickness formed of an adhesive (v) on one surface of an 80 μm thick polypropylene film (manufactured by mitsubishi resin corporation) (surface tension of the adhesive layer is 29 mN/m).
This adhesive (v) contained 100 parts by mass (solid content) of an acrylic resin composed of 2-ethylhexyl acrylate (2EHA), Methyl Methacrylate (MMA) and 2-hydroxyethyl acrylate (HEA) (2 EHA/MMA/HEA: 50/40/10 (mass%), Mw: 80 ten thousand) and 10 parts by mass (solid content) of a 3-functional xylylene diisocyanate-based crosslinking agent (product name "Takenate D110N" manufactured by Mitsui Takeda Chemical corporation).
Support sheet (VII):
an adhesive sheet having an adhesive layer of 10 μm thickness formed of an adhesive (vi) on one surface of an 80 μm thick polypropylene film (manufactured by mitsubishi resin corporation) (surface tension of the adhesive layer is 33 mN/m).
The adhesive (vi) contains 100 parts by mass (solid content) of an acrylic resin composed of Butyl Acrylate (BA), Methyl Acrylate (MA) and 2-hydroxyethyl acrylate (HEA) (BA/MA/HEA 60/30/10 (mass%), Mw 80 ten thousand) and 2 parts by mass (solid content) of a 3-functional xylylene diisocyanate-based crosslinking agent (product name "Takenate D110N", manufactured by Mitsui Takeda Chemical corporation).
The peel forces (α 1), (β 1), and (β 2) were measured by the following methods using the laminates (1) and (2) prepared in examples and comparative examples. Further, using the laminate (2), the evaluation of the re-peelability to the silicon wafer was performed by the following method. These results are shown in table 1.
< measurement of peeling force (. alpha.1) >
An adhesive tape (product name "PET 25 PLShin" manufactured by ledebacae corporation, an adhesive sheet having an adhesive layer of 20 μm thickness containing an acrylic resin on a PET film of 25 μm thickness) as a backing tape was attached to the exposed surface of the resin film forming film of the laminate (1), and cut into a size of 25mm in width × 150mm in length to prepare a test sample.
The slide glass of the test sample was removed, and the surface of the exposed film for forming a resin film was stuck to the surface of a silicon wafer (diameter: 6 inches, thickness: 500 μm) subjected to dry polishing using a laminator (product name: LAMIPACKER LPD3214, manufactured by Fuji Co., Ltd.), and the slide glass was allowed to stand for 30 minutes.
After standing, a tensile test was carried out at a peeling angle of 180 degrees, a measurement temperature of 23 degrees and a tensile speed of 300 mm/min using a precision universal tester (product name "Autograph AG-IS" manufactured by Shimadzu corporation), and the load when the above-mentioned backing tape and the test sample were peeled off together from the silicon wafer was measured.
The measurement length was set to 100mm, and the first 10mm and the last 10mm of the measurement were removed from the effective values. The maximum value among the obtained measurement values was defined as the peel force (. alpha.1) and is shown in Table 1.
< measurement of peeling force (. beta.1) >
The laminate (2) was cut into a size of 25mm in width by 150mm in length, and the carrier sheet was removed to obtain a sample in which the surface of the film for forming a resin film was exposed.
The support plate made of polymethyl methacrylate and the exposed surface of the film for forming a resin film of the test sample were bonded via a double-sided tape (a double-sided tape having adhesive layers of 10 μm thickness made of an acrylic adhesive on both sides of a substrate of 25 μm thickness made of polyethylene terephthalate), and left to stand for 30 minutes.
The double-sided tape is a tape having an adhesive force capable of fixing the support plate and the film for forming a resin film in a tensile test.
After standing still, a tensile test was carried out at a peel angle of 180 °, a measurement temperature of 23 ℃ and a tensile speed of 300 mm/min using a precision universal tester (product name "Autograph AG-IS" manufactured by Shimadzu corporation), and the load when any of the support sheets (I) to (IV) was peeled from the surface (. beta.) of the film for forming a resin film was measured.
The measurement length was set to 100mm, and the first 10mm and the last 10mm of the measurement were removed from the effective values. The minimum value among the obtained measurement values was set as the peeling force (β 1) and is shown in table 1.
< measurement of peeling force (. beta.2) >
The laminate (2) was cut into a size of 25mm in width by 150mm in length, and the carrier sheet was removed to obtain a sample in which the surface of the film for forming a resin film was exposed.
The exposed surface of the film for forming a resin film was bonded to the surface of a silicon wafer (diameter: 6 inches, thickness: 500 μm) subjected to dry polishing using a laminator (product name "LAMIPACKER LPD 3214" manufactured by Fuji Co., Ltd.), and the resultant was allowed to stand for 30 minutes.
After standing still, the resin film-forming film was cured by heating at 130 ℃ for 2 hours to form a resin film, and the load when the support sheets (I) to (IV) were peeled from the surface (β') of the resin film was measured in the same manner as the measurement of the peeling force (β 1).
In example 4, after the resin film was formed, an ultraviolet ray (illuminance: 220 mW/cm) was irradiated using a UV irradiation apparatus (product name "RAD 2000 m/8" manufactured by Linekuk Co., Ltd.)2Light quantity: 190mJ/cm2) Thereafter, the above measurement was performed.
The measurement length was set to 100mm, and the first 10mm and the last 10mm of the measurement were removed from the effective values. The minimum value among the obtained measurement values was defined as the peel force (. beta.2) and is shown in Table 1.
< evaluation of removability from a silicon wafer >
The laminate (2) was cut into a size of 25mm in width by 150mm in length, and the carrier sheet was removed to obtain a sample in which the surface (. beta.) of the film for forming a resin film was exposed.
The exposed surface of the film for forming a resin film was bonded to the surface of a silicon wafer (diameter: 6 inches, thickness: 500 μm) subjected to dry polishing using a laminator (product name "LAMIPACKER LPD 3214" manufactured by Fuji Co., Ltd.), and the resultant was allowed to stand for 30 minutes.
After standing, the test sample (the support sheet and the film for forming a resin film) was peeled from the silicon wafer at a peeling angle of 180 degrees, a measurement temperature of 23 degrees, and a stretching speed of 300 mm/min using a precision universal tester (product name "Autograph AG-IS" manufactured by Shimadzu corporation), and a part of the surface of the silicon wafer on which the film for forming a resin film was adhered was visually observed. On the basis of this, the removability from the silicon wafer was evaluated according to the following criteria.
"A +": the surface of the silicon wafer was not observed with the deposit of the film for forming a resin film.
"A": the surface of the silicon wafer was not observed with any deposit having a diameter of 5mm or more of the film for forming a resin film, and a deposit having a diameter of less than 5mm was rarely observed, but was sufficiently removed with alcohol or the like.
"B": the surface of the silicon wafer was not observed with any deposit having a diameter of 10mm or more of the film for forming a resin film, and a few deposits having a diameter of less than 10mm were observed, but were sufficiently removed with alcohol or the like.
C: the surface of the silicon wafer was observed to have a deposit with a diameter of 10mm or more of the film for forming the resin film, and was difficult to remove with alcohol or the like.
As is clear from table 1, the films for forming a resin film produced in examples 1 to 9, which are one embodiment of the present invention, are superior in re-peelability to the film for forming a resin film of comparative example 1.
Industrial applicability
The composite sheet for forming a resin film according to one embodiment of the present invention is suitable as a material for forming a protective film for protecting the back surface of a semiconductor chip, or a material for forming an adhesive film capable of adhering to a pad portion or other portions.
Claims (8)
1. A composite sheet for forming a resin film, which has a structure in which a film for forming a resin film capable of forming a resin film is directly laminated on a support sheet, and which satisfies the following requirements (I) and (II):
essential element (I): a peeling force (alpha 1) required for peeling the film for forming a resin film from the silicon wafer, which is measured under a peeling condition (x) of a stretching speed of 300 mm/min and a stretching angle of 180 DEG in an environment of 23 ℃, is 0.05 to 10.0N/25mm after the surface (alpha) of the film for forming a resin film to be adhered to the silicon wafer is adhered to the silicon wafer;
essential element (II): a peeling force (β 1) measured under the peeling condition (x) required for peeling the support sheet from the surface (β) of the resin film forming film directly laminated on the support sheet is a value of not less than a peeling force (α 1), and a difference [ β 1- α 1] between the peeling force (β 1) and the peeling force (α 1) is not less than 0.01N/25mm,
the film for forming a resin film contains a polymer component (A) and a thermosetting component (B1).
2. The composite sheet for forming a resin film according to claim 1, which further satisfies the following requirement (III),
requirement (III): when a resin film is formed from the resin film-forming film, the peel force (β 2) required to peel the support sheet from the surface (β') of the resin film on the side directly laminated with the support sheet, measured under the peel condition (x), is 0.02 to 5.0N/25 mm.
3. The composite sheet for forming resin film according to claim 1 or 2, wherein the peel force (β 1) is 0.05 to 20.0N/25 mm.
4. The composite sheet for forming resin film according to any one of claims 1 to 3, wherein the support sheet is a sheet composed of only a base material.
5. The composite sheet for forming resin film according to any one of claims 1 to 3, wherein the support sheet is an adhesive sheet having an adhesive layer on a substrate,
the composite sheet for forming a resin film has a structure in which the adhesive layer of the adhesive sheet and the surface (. beta.) of the film for forming a resin film are directly laminated.
6. The composite sheet for forming resin film according to claim 5, wherein the adhesive layer is a layer formed from an adhesive composition containing an energy ray-curable resin.
7. The composite sheet for forming resin film according to any one of claims 1 to 6, wherein the film for forming resin film is a material for forming a protective film or an adhesive film.
8. A method for producing a chip with a resin film, comprising the following steps (1) to (4),
step (1): a step of attaching the composite sheet for forming a resin film according to any one of claims 1 to 7 to the back surface of a workpiece;
step (2): a step of cutting the workpiece;
step (3): forming a resin film from the resin film-forming film;
step (4): and (3) picking up the cut workpiece obtained in the step (2) to obtain a chip.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2015021479 | 2015-02-05 | ||
| JP2015-021479 | 2015-02-05 | ||
| PCT/JP2016/053259 WO2016125835A1 (en) | 2015-02-05 | 2016-02-03 | Resin-film forming composite sheet, and method of manufacturing chip having resin film |
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| CN107210205A CN107210205A (en) | 2017-09-26 |
| CN107210205B true CN107210205B (en) | 2021-06-15 |
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| KR (1) | KR102594777B1 (en) |
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| JP6658648B2 (en) * | 2017-03-28 | 2020-03-04 | 味の素株式会社 | Photosensitive resin composition |
| WO2019082963A1 (en) * | 2017-10-27 | 2019-05-02 | リンテック株式会社 | Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip |
| KR101936873B1 (en) * | 2018-03-23 | 2019-01-11 | (주)엠티아이 | Adhesive Tape for Wafer Level Back Side and Preparation Methods Thereof |
| KR102576309B1 (en) * | 2018-03-30 | 2023-09-07 | 린텍 가부시키가이샤 | Laminate for curing prevention of curing encapsulation body, and manufacturing method of curing encapsulation body |
| JP2022153305A (en) * | 2021-03-29 | 2022-10-12 | リンテック株式会社 | Dicing bonding sheet and method for manufacturing semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010056328A (en) * | 2008-08-28 | 2010-03-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
| CN102161869A (en) * | 2009-12-24 | 2011-08-24 | 日东电工株式会社 | Dicing tape-integrated film for semiconductor back surface |
| JP2011228637A (en) * | 2010-03-30 | 2011-11-10 | Furukawa Electric Co Ltd:The | Chip protecting film |
| CN104040696A (en) * | 2011-12-26 | 2014-09-10 | 琳得科株式会社 | Dicing sheet with protective film-forming layer, and method for producing chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009138026A (en) | 2007-12-03 | 2009-06-25 | Furukawa Electric Co Ltd:The | Energy ray-curable chip protecting film |
| JP5805367B2 (en) | 2009-01-30 | 2015-11-04 | 日東電工株式会社 | Dicing tape integrated wafer back surface protection film |
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2016
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- 2016-02-03 CN CN201680008033.8A patent/CN107210205B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010056328A (en) * | 2008-08-28 | 2010-03-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
| CN102161869A (en) * | 2009-12-24 | 2011-08-24 | 日东电工株式会社 | Dicing tape-integrated film for semiconductor back surface |
| JP2011228637A (en) * | 2010-03-30 | 2011-11-10 | Furukawa Electric Co Ltd:The | Chip protecting film |
| CN104040696A (en) * | 2011-12-26 | 2014-09-10 | 琳得科株式会社 | Dicing sheet with protective film-forming layer, and method for producing chip |
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| KR20170115048A (en) | 2017-10-16 |
| WO2016125835A1 (en) | 2016-08-11 |
| JP6423458B2 (en) | 2018-11-14 |
| TWI689412B (en) | 2020-04-01 |
| SG11201706309VA (en) | 2017-09-28 |
| TW201702072A (en) | 2017-01-16 |
| KR102594777B1 (en) | 2023-10-26 |
| JPWO2016125835A1 (en) | 2017-11-16 |
| CN107210205A (en) | 2017-09-26 |
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