CN107203666B - A kind of prediction technique and system of BGA thermal fatigue life of solder joint - Google Patents
A kind of prediction technique and system of BGA thermal fatigue life of solder joint Download PDFInfo
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- CN107203666B CN107203666B CN201710365258.5A CN201710365258A CN107203666B CN 107203666 B CN107203666 B CN 107203666B CN 201710365258 A CN201710365258 A CN 201710365258A CN 107203666 B CN107203666 B CN 107203666B
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- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
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Abstract
The embodiment of the present invention provides the prediction technique and system of a kind of BGA thermal fatigue life of solder joint, the described method includes: obtaining the plastic strain ranges of the BGA solder joint, overall strain range and total strain energy, wherein, total strain energy refers to the potential energy that the BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load；According to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life prediction model, predict the cycle to failure of the BGA solder joint.The system executes the above method.The prediction technique and system of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention, the service life of BGA solder joint can easier, be quickly predicted for the heat fatigue problem caused by temperature cycles, versatility is improved, therefore there is preferable engineering application value.
Description
Technical field
The present embodiments relate to solder joint detection technique fields, and in particular to a kind of prediction of BGA thermal fatigue life of solder joint
Method and system.
Background technique
Electronic product endures the severe environmental conditions such as high temperature, temperature cycles, vibration, impact, high humidity to the fullest extent in use
It influences, the welded ball array of electronic product is easily caused to encapsulate (Ball Grid Array, hereinafter referred to as BGA) solder joint failure.
Currently, the factor for carrying out the method consideration of life forecast to BGA solder joint is more and analysis mechanisms are complicated, lead
Cause versatility not strong.During realizing the embodiment of the present invention, inventor's discovery: the main reason for BGA solder joint failure is temperature
The low-cycle thermal fatigue that degree circulation causes.
Therefore, it how for the low-cycle thermal fatigue caused by temperature cycles, predicts the service life of BGA solder joint, becomes urgently
It must solve the problems, such as.
Summary of the invention
In view of the problems of the existing technology, the embodiment of the present invention provides a kind of prediction side of BGA thermal fatigue life of solder joint
Method and system.
In a first aspect, the embodiment of the present invention provides a kind of prediction technique of BGA thermal fatigue life of solder joint, the method packet
It includes:
Obtain the plastic strain ranges, overall strain range and total strain energy of the BGA solder joint, wherein total strain energy refers to
The BGA solder joint is stored in the potential energy in the BGA solder joint under the effect of heat fatigue load because of deformation；
According to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life prediction mould
Type predicts the cycle to failure of the BGA solder joint.
Second aspect, the embodiment of the invention provides a kind of forecasting system of BGA thermal fatigue life of solder joint, the system packet
It includes:
Module is obtained, for obtaining the BGA solder joint plastic strain ranges, overall strain range and total strain energy, wherein total
Strain energy refers to the potential energy that the BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load；
Prediction module, for according to the plastic strain ranges, the overall strain range, the total strain energy and heat fatigue
The prediction model in service life predicts the cycle to failure of the BGA solder joint.
The third aspect, the embodiment of the present invention provide the forecasting system of another kind BGA thermal fatigue life of solder joint, comprising: processing
Device, memory and bus, wherein
The processor and the memory complete mutual communication by the bus；
The memory is stored with the program instruction that can be executed by the processor, and the processor calls described program to refer to
Order is able to carry out following method:
Obtain the plastic strain ranges, overall strain range and total strain energy of the BGA solder joint, wherein total strain energy refers to
The BGA solder joint is stored in the potential energy in the BGA solder joint under the effect of heat fatigue load because of deformation；
According to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life prediction mould
Type predicts the cycle to failure of the BGA solder joint.
Fourth aspect, the embodiment of the present invention provide a kind of non-transient computer readable storage medium, comprising:
The non-transient computer readable storage medium stores computer instruction, and the computer instruction makes the computer
Execute following method:
Obtain the plastic strain ranges, overall strain range and total strain energy of the BGA solder joint, wherein total strain energy refers to
The BGA solder joint is stored in the potential energy in the BGA solder joint under the effect of heat fatigue load because of deformation；
According to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life prediction mould
Type predicts the cycle to failure of the BGA solder joint.
The prediction technique and system of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention, draw for by temperature cycles
The heat fatigue problem of hair can easier, quickly predict the service life of BGA solder joint, improve versatility, therefore have
There is preferable engineering application value.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the prediction technique flow diagram of BGA of embodiment of the present invention thermal fatigue life of solder joint；
Fig. 2 is temperature cycling load information drawing under BGA solder joint normal running conditions；
Fig. 3 is the fitted figure using the matlab 8 groups of data obtained according to emulation and accelerated test；
Fig. 4 is the sample design figure of the BGA solder joint；
Fig. 5 is the temperature cycling load information drawing under the conditions of two groups of accelerated tests of BGA solder joint；
Fig. 6 is the forecasting system structural schematic diagram of BGA of embodiment of the present invention thermal fatigue life of solder joint；
Fig. 7 is system entity structural schematic diagram provided in an embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
Fig. 1 is the prediction technique flow diagram of BGA of embodiment of the present invention thermal fatigue life of solder joint, as shown in Figure 1, this hair
A kind of prediction technique for BGA thermal fatigue life of solder joint that bright embodiment provides, comprising the following steps:
S1: the plastic strain ranges, overall strain range and total strain energy of the BGA solder joint are obtained, wherein total strain energy is
Refer to the potential energy that the BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load.
Specifically, system obtains the plastic strain ranges, overall strain range and total strain energy of the BGA solder joint, wherein total
Strain energy refers to the potential energy that the BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load.It needs
Illustrate: BGA solder joint generates heat fatigue under Thermal cycling conditions, and heat fatigue load does work to BGA solder joint, so as to cause
It deforms inside BGA solder joint, leads to that entropy increasing occurs inside BGA solder joint unit mass, and external work can be anti-by strain energy
It reflects, which is the potential energy being stored in BGA solder joint in the form of strain and stress, and entropy increasing includes the increasing of reversible entropy and can not
Inverse entropy increases, and according to plastoelasticity, there are as follows between the irreversible entropy increasing of BGA solder joint and plastic strain ranges, total strain energy
Relational expression:
Wherein, SuFor the irreversible entropy of unit quality, η2For the conversion ratio that irreversible entropy increases, η is that the irreversible entropy of strain energy increases
Conversion ratio, η1For the entropy conversion ratio of strain energy, WtFor strain energy, ρ is BGA solder joint density, and T is BGA solder joint absolute temperature, and s is single
Position massic entropy.
According to plastoelasticity, plastic deformation can make the damage for causing to restore completely inside BGA solder joint, i.e., can not
Inverse entropy increases to be had between conversion ratio η and plastic strain rangesRelationship, wherein Δ εpFor plastic strain ranges,
ΔεtFor overall strain range, m is material constant.Above-mentioned relation is updated to above-mentioned formula (1), obtains relational expression:
Start time is recycled at the time of the generation fatigue rupture of BGA solder joint from BGA solder joint, and BGA welding material is accumulated not
Reversible entropy increasing is a definite value, is indicated with Const.Formula (2) both sides are integrated, and enable it for definite value, further according to segmentation principle,
By its abbreviation at the form summed as follows:
Wherein: Δ sui(i=1,2 ... Nf) increase for the irreversible entropy of i-th of temperature cycles of BGA solder joint, Δ Wti(i=1,
2,…Nf) be i-th of temperature cycles strain energy, Δ εpi(i=1,2 ... Nf) be i-th of temperature cycles plastic strain model
It encloses, Δ εti(i=1,2 ... Nf) be i-th of temperature cycles overall strain range, NfIt, can be with for the cycle to failure of BGA solder joint
Understand are as follows: fatigue rupture moment temperature cycle times experienced are occurring for BGA solder joint.
The plastic strain ranges during the entire temperature cycles of BGA solder joint, overall strain range can be approximately considered and always answered
The prediction model of the thermal fatigue life based on energy can be obtained into constant by becoming are as follows:
Wherein, Δ εpFor plastic strain ranges, Δ εtFor overall strain range, Δ WtFor total strain energy, m is the material of BGA solder joint
Expect that constant, Const are that the irreversible entropy of accumulation increases numerical value, is constant, NfFor the cycle to failure of BGA solder joint.
S2: according to the prediction of the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life
Model predicts the cycle to failure of the BGA solder joint.
Specifically, system is according to the plastic strain ranges, the overall strain range, the total strain energy and heat fatigue longevity
The prediction model of life predicts the cycle to failure of the BGA solder joint.It should be understood that the prediction model of the thermal fatigue life
It needs to be fitted previously according to a certain number of sample datas to obtain the numerical value of model parameter Const and m, this sample data packet
Include plastic strain ranges Δ εp, overall strain range delta εt, total strain energy Δ WtAnd solder joint failure recurring number Nf, determine Const
With after the numerical value of m to get arrive complete BGA thermal fatigue life of solder joint prediction model.Further according to plastic strain ranges, overall strain model
It encloses, total strain energy, predicts the cycle to failure N of BGA solder jointf, Fig. 2 is that temperature cycles carry under BGA solder joint normal running conditions
Lotus information drawing, as shown in Fig. 2, the following Fig. 2 of temperature cycling load is BGA solder joint normal work under BGA solder joint normal running conditions
Under the conditions of temperature cycling load information drawing:
Temperature range under BGA solder joint normal running conditions is set as 20 DEG C~70 DEG C, the time of a circulation is
120min, it may be assumed that begun to ramp up from 20 DEG C of temperature, reach 70 DEG C through 50min, continued 10min, reach 20 DEG C using 50min, hold
Continuous 10min, the above-mentioned course of work are a circulation；It is repeated in above-mentioned On The Cycle Working Process, is broken when fatigue has occurred in BGA solder joint
Bad, the cycle-index completed at this time is exactly Nf, NfThe referred to as cycle to failure of BGA solder joint, therefore NfIt can be used for characterizing
BGA thermal fatigue life of solder joint.
The prediction technique of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention, for the heat caused by temperature cycles
Fatigue problem can easier, quickly predict the service life of BGA solder joint, improve versatility, therefore have preferable
Engineering application value.
On the basis of the above embodiments, the prediction model of the thermal fatigue life are as follows:
Wherein, NfFor the cycle to failure of the BGA solder joint；Const is the BGA solder joint from temperature cycles start time
Irreversible entropy to the buildup of material for the BGA solder joint that the fatigue rupture moment occurs increases, and the Const is constant；M is the BGA
The material constant of solder joint；ΔεpFor plastic strain ranges；ΔεtFor overall strain range；ΔWtFor total strain energy.
Specifically, the prediction model of the thermal fatigue life in system are as follows:
Wherein, NfFor the cycle to failure of the BGA solder joint；Const is the BGA solder joint from temperature cycles start time
Irreversible entropy to the buildup of material for the BGA solder joint that the fatigue rupture moment occurs increases, and the Const is constant；M is the BGA
The material constant of solder joint；ΔεpFor plastic strain ranges；ΔεtFor overall strain range；ΔWtFor total strain energy.SpecificallyObtaining step can refer to above-described embodiment, details are not described herein again.
The prediction technique of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention passes through the prediction mould of thermal fatigue life
Type can easier, quickly predict the service life of BGA solder joint for the heat fatigue problem caused by temperature cycles.
On the basis of the above embodiments, the method also includes:
Before the prediction model using the thermal fatigue life, it is total to obtain multiple groups plastic strain ranges sample value, multiple groups
The cycle to failure of range of strain sample value, multiple groups total strain energy sample value and corresponding BGA solder joint.
Specifically, system before the prediction model using the thermal fatigue life, obtains multiple groups plastic strain ranges sample
This value, multiple groups overall strain range sample value, multiple groups total strain energy sample value and corresponding BGA solder joint cycle to failure.
More strain energy sample parameter value group is selected, can make the prediction model of thermal fatigue life that there is more accurately prediction effect
Fruit.
By the multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups overall strain
The cycle to failure of energy sample value and corresponding BGA solder joint substitutes intoIn, and it is fitted institute
State multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups total strain energy sample value and
The cycle to failure of corresponding BGA solder joint, to determine the numerical value of Const and m.
Specifically, system is by the multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, described
The cycle to failure of multiple groups total strain energy sample value and corresponding BGA solder joint substitutes into
In, and it is fitted the multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups total strain energy
The cycle to failure of sample value and corresponding BGA solder joint, to determine the numerical value of Const and m.Table 1 is to utilize accelerated test
The data table related obtained with emulation, (Δ WpFor plastic energy, Δ WeFor elastic strain energy, Δ WtFor total strain energy, Δ εp
For plastic strain ranges, Δ εeFor elastic strain range, Δ εtFor overall strain range, NfIt is recycled for the failure of the BGA solder joint
Number) Fig. 3 is the fitted figure of 8 groups of data obtained using matlab according to emulation and accelerated test, 8 groups of data as shown in Table 1
With the function of matlab fitting, the numerical value of Const and m, specific Const=6.903 × 10 can be determined-6, m=8.075 obtains
To the prediction model for the thermal fatigue life for determining Const and m numerical value are as follows:
Table 1
The prediction technique of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention, by advance to thermal fatigue life
Prediction model is trained, to determine the numerical value of Const and m, so that the prediction effect of the prediction model of thermal fatigue life is more
Accurately.
Specifically, obtaining multiple groups plastic strain ranges sample value, multiple groups overall strain range sample value, multiple groups total strain energy sample
The step of cycle to failure of this value and corresponding BGA solder joint, may is that
Designing BGA solder joint encapsulation sample, (this encapsulation sample is mainly by printed board, lower copper packing, solder joint, upper copper packing and substrate in batch
At and being designed to daisy chain structure, be denoted as T1, T2, T3 respectively from outside to inside) two groups of accelerated test temperature cycling load conditions,
It is as shown in Figure 5:
Under high accelerated test stress, temperature rises to 100 DEG C since 25 DEG C of room temperature in 75 minutes, keeps the temperature 10 points
Then clock is cooled fast to -60 DEG C in 160 minutes, keep the temperature 10 minutes, 25 DEG C of room temperature are then raised in 85 minutes, is one
The temperature cycles in a period.
Under low accelerated test stress, temperature rises to 80 DEG C since 25 DEG C of room temperature in 55 minutes, keeps the temperature 10 minutes,
Then it is cooled fast to -40 DEG C in 120 minutes, keeps the temperature 10 minutes, 25 DEG C of room temperature is then raised in 65 minutes, is a week
The temperature cycles of phase.
There are two sample U1 and U2 under high accelerated test stress, there are two sample U3 and U4 under low accelerated test stress,
It is denoted as the BGA solder joint of T1, T2, T3 on each sample respectively from outside to inside, i.e., shares six groups of test datas under a kind of stress.
Then BGA solder joint encapsulation sample is placed in temperature cycling test case, carries out the thermal cycling test in multiple periods,
Failure cycle-index corresponding to four groups of BGA solder joints that fatigue rupture occurs at first is taken under every kind of proof stress, is recorded in such as table 2
Shown under high stress under BGA solder joint failure cycle-index and low stress as shown in table 3 in BGA solder joint failure cycle-index.
Table 2
Table 3
With continued reference to Fig. 2, and according to Norris-Landzberg model, calculate under BGA solder joint encapsulation two groups of stress of sample
Accelerate the accelerated factor of thermal cycling test.
(1) high stress temperature cycles and temperature cycles accelerated factor under normal running conditions:
AF is accelerated factor, NUFor the failure cycle-index of BGA solder joint under normal running conditions, NATo accelerate thermal cycle examination
The failure cycle-index of BGA solder joint under the conditions of testing.ΔTAFor the temperature change model of BGA solder joint under the conditions of acceleration thermal cycling test
It encloses, Δ TUFor the range of temperature of BGA solder joint under actual operating conditions, fUFor the thermal cycle of BGA solder joint under actual operating conditions
Frequency, fAFor the thermal cycling frequencies of BGA solder joint under the conditions of accelerated test, a is thermal cycling frequencies index, and value is that -1/3, b is temperature
Spend range of DO index, value 2, EaFor activation energy, value 0.42eV, k are Boltzmann constant, and value isTKUFor the maximum temperature of BGA solder joint under actual operating conditions, TKAFor the BGA weldering under the conditions of accelerated test
The maximum temperature of point.
(2) low stress temperature cycles and temperature cycles accelerated factor under actual operating conditions:
Each variable declaration can refer to above situation, repeat no more.
BGA solder joint thermal fatigue failure loop-around data under high and low stress is extrapolated under actual operating conditions, reality is obtained
The failure cycle-index of BGA solder joint under operating condition.It is described as follows by taking U1_T1BGA solder joint in table 2 as an example:
According to Nf=AF*N 'f=45.403*182=8263 obtains the failure cycle-index of the serial number 2 corresponded in table 4,
Other BGA solder joint data repeat no more.The failure cycle-index for successively obtaining whole BGA solder joints, obtains reality as shown in table 4
Whole BGA solder joint failure cycle-index under operating condition.
Table 4
| Serial number | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
| 6151 | 8263 | 13484 | 21339 | 23986 | 25416 | 37884 | 74506 |
The finite element model of BGA solder joint, including chip, BT basal plate, copper are established out in finite element analysis software ANSYS
Pad, PCB substrate and SnPb solder joint.Temperature under BGA package sample normal running conditions is set in finite element analysis software ANSYS
Pulsating stress is spent, the period of temperature range and each thermal cycle period including thermal cycle, each thermal cycle week
The period of phase includes the soaking time section and heating temperature fall time section of high/low temperature, and carries out thermal cycle to the finite element model
Emulation.
After the completion of emulation, corresponding plastic strain ranges sample value, overall strain model in BGA solder joint finite element model are extracted
Sample value, total strain energy sample value are enclosed, and is recorded.
Fig. 6 is the forecasting system structural schematic diagram of BGA of embodiment of the present invention thermal fatigue life of solder joint, as shown in fig. 6, this hair
Bright embodiment provides a kind of forecasting system of BGA thermal fatigue life of solder joint, including obtains module 1 and prediction module 2, in which:
Obtain plastic strain ranges, overall strain range and total strain energy that module 1 is used to obtain the BGA solder joint, wherein
Total strain energy refers to the potential energy that the BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load；In advance
Module 2 is surveyed for the prediction according to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life
Model predicts the cycle to failure of the BGA solder joint.
Specifically, obtaining plastic strain ranges, overall strain range and overall strain that module 1 is used to obtain the BGA solder joint
It can, wherein total strain energy refers to that the BGA solder joint is stored in the BGA solder joint under the effect of heat fatigue load because of deformation
Potential energy, obtain module 1 and plastic strain ranges, overall strain range and total strain energy be sent to prediction module 2, prediction module 2
For according to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life prediction model, in advance
Survey the cycle to failure of the BGA solder joint.
The forecasting system of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention, for the heat caused by temperature cycles
Fatigue problem can easier, quickly predict the service life of BGA solder joint, improve versatility, therefore have preferable
Engineering application value.
On the basis of the above embodiments, the prediction model of the thermal fatigue life are as follows:
Wherein, NfFor the cycle to failure of the BGA solder joint；Const is the BGA solder joint from temperature cycles start time
Irreversible entropy to the buildup of material for the BGA solder joint that the fatigue rupture moment occurs increases, and the Const is constant；M is the BGA
The material constant of solder joint；ΔεpFor plastic strain ranges；ΔεtFor overall strain range；ΔWtFor total strain energy.
Specifically, the prediction model of the thermal fatigue life in system are as follows:
Wherein, NfFor the cycle to failure of the BGA solder joint；Const is the BGA solder joint from temperature cycles start time
Irreversible entropy to the buildup of material for the BGA solder joint that the fatigue rupture moment occurs increases, and the Const is constant；M is the BGA
The material constant of solder joint；ΔεpFor plastic strain ranges；ΔεtFor overall strain range；ΔWtFor total strain energy.
The forecasting system of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention passes through the prediction mould of thermal fatigue life
Type can easier, quickly predict the service life of BGA solder joint for the heat fatigue problem caused by temperature cycles.
On the basis of the above embodiments, the system also includes training modules, are specifically used for:
Before the prediction model using the thermal fatigue life, it is total to obtain multiple groups plastic strain ranges sample value, multiple groups
The cycle to failure of range of strain sample value, multiple groups total strain energy sample value and corresponding BGA solder joint；
By the multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups overall strain
The cycle to failure of energy sample value and corresponding BGA solder joint substitutes into
In, and it is total to be fitted the multiple groups plastic strain ranges sample value, the multiple groups
The cycle to failure of range of strain sample value, the multiple groups total strain energy sample value and corresponding BGA solder joint, with determination
The numerical value of Const and m.
Specifically, training module is specifically used for:
Before the prediction model using the thermal fatigue life, it is total to obtain multiple groups plastic strain ranges sample value, multiple groups
The cycle to failure of range of strain sample value, multiple groups total strain energy sample value and corresponding BGA solder joint；
By the multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups overall strain
The cycle to failure of energy sample value and corresponding BGA solder joint substitutes into
In, and it is total to be fitted the multiple groups plastic strain ranges sample value, the multiple groups
The cycle to failure of range of strain sample value, the multiple groups total strain energy sample value and corresponding BGA solder joint, with determination
The numerical value of Const and m.
The forecasting system of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention, by advance to thermal fatigue life
Prediction model is trained, to determine the numerical value of Const and m, so that the prediction effect of the prediction model of thermal fatigue life is more
Accurately.
The forecasting system of BGA thermal fatigue life of solder joint provided in an embodiment of the present invention specifically can be used for executing above-mentioned each side
The process flow of method embodiment, details are not described herein for function, is referred to the detailed description of above method embodiment.
Fig. 7 is system entity structural schematic diagram provided in an embodiment of the present invention, as shown in fig. 7, the system comprises: processing
Device (processor) 701, memory (memory) 702 and bus 703；
Wherein, the processor 701, memory 702 complete mutual communication by bus 703；
The processor 701 is used to call the program instruction in the memory 702, to execute above-mentioned each method embodiment
Provided method, for example, the plastic strain ranges, overall strain range and total strain energy of the BGA solder joint are obtained,
In, total strain energy refers to the gesture that the BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load
Energy；According to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life prediction model, in advance
Survey the cycle to failure of the BGA solder joint.
The present embodiment discloses a kind of computer program product, and the computer program product includes being stored in non-transient calculating
Computer program on machine readable storage medium storing program for executing, the computer program include program instruction, when described program instruction is calculated
When machine executes, computer is able to carry out method provided by above-mentioned each method embodiment, for example, obtains the BGA solder joint
Plastic strain ranges, overall strain range and total strain energy, wherein total strain energy refers to the BGA solder joint in heat fatigue load
The potential energy being stored under effect because of deformation in the BGA solder joint；According to the plastic strain ranges, the overall strain range,
The prediction model of the total strain energy and thermal fatigue life predicts the cycle to failure of the BGA solder joint.
The present embodiment provides a kind of non-transient computer readable storage medium, the non-transient computer readable storage medium
Computer instruction is stored, the computer instruction makes the computer execute method provided by above-mentioned each method embodiment, example
Plastic strain ranges, overall strain range and the total strain energy of BGA solder joint as described in including: acquisition, wherein total strain energy refers to institute
State the potential energy that BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load；According to the plastic strain
Range, the overall strain range, the total strain energy and thermal fatigue life prediction model, predict the failure of the BGA solder joint
Recurring number.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above method embodiment can pass through
The relevant hardware of program instruction is completed, and program above-mentioned can be stored in a computer readable storage medium, the program
When being executed, step including the steps of the foregoing method embodiments is executed；And storage medium above-mentioned includes: ROM, RAM, magnetic disk or light
The various media that can store program code such as disk.
The embodiments such as system described above are only schematical, wherein the unit as illustrated by the separation member
It may or may not be physically separated, component shown as a unit may or may not be physics list
Member, it can it is in one place, or may be distributed over multiple network units.It can be selected according to the actual needs
In some or all of the modules achieve the purpose of the solution of this embodiment.Those of ordinary skill in the art are not paying creativeness
Labour in the case where, it can understand and implement.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
It realizes by means of software and necessary general hardware platform, naturally it is also possible to pass through hardware.Based on this understanding, on
Stating technical solution, substantially the part that contributes to existing technology can be embodied in the form of software products in other words, should
Computer software product may be stored in a computer readable storage medium, such as ROM/RAM, magnetic disk, CD, including several fingers
It enables and using so that a computer equipment (can be personal computer, server or the network equipment etc.) executes each implementation
Method described in certain parts of example or embodiment.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the embodiment of the present invention, rather than it is right
It is limited；Although the embodiment of the present invention is described in detail referring to foregoing embodiments, the ordinary skill of this field
Personnel are it is understood that it is still possible to modify the technical solutions described in the foregoing embodiments, or to part
Or all technical features are equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution
The range of each embodiment technical solution of the embodiment of the present invention.
Claims (6)
1. a kind of prediction technique of BGA thermal fatigue life of solder joint characterized by comprising
Obtain the plastic strain ranges, overall strain range and total strain energy of the BGA solder joint, wherein total strain energy refers to described
BGA solder joint is stored in the potential energy in the BGA solder joint under the effect of heat fatigue load because of deformation；
According to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life prediction model, in advance
Survey the cycle to failure of the BGA solder joint；
The prediction model of the thermal fatigue life are as follows:
Wherein, NfFor the cycle to failure of the BGA solder joint；Const is the BGA solder joint from temperature cycles start time to hair
The irreversible entropy of the buildup of material of the BGA solder joint at raw fatigue rupture moment increases, and the Const is constant；M is the BGA solder joint
Material constant；ΔεpFor plastic strain ranges；ΔεtFor overall strain range；ΔWtFor total strain energy.
2. the method according to claim 1, wherein the method also includes:
Before the prediction model using the thermal fatigue life, multiple groups plastic strain ranges sample value, multiple groups overall strain are obtained
The cycle to failure of range sample value, multiple groups total strain energy sample value and corresponding BGA solder joint；
By the multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups total strain energy sample
The cycle to failure of this value and corresponding BGA solder joint substitutes intoIn, and be fitted described more
Group plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups total strain energy sample value and opposite
The cycle to failure for the BGA solder joint answered, to determine the numerical value of Const and m.
3. a kind of forecasting system of BGA thermal fatigue life of solder joint characterized by comprising
Module is obtained, for obtaining the BGA solder joint plastic strain ranges, overall strain range and total strain energy, wherein overall strain
It can refer to the potential energy that the BGA solder joint is stored in the BGA solder joint because of deformation under the effect of heat fatigue load；
Prediction module, for according to the plastic strain ranges, the overall strain range, the total strain energy and thermal fatigue life
Prediction model, predict the cycle to failure of the BGA solder joint；
The prediction model of the thermal fatigue life are as follows:
Wherein, NfFor the cycle to failure of the BGA solder joint；Const is the BGA solder joint from temperature cycles start time to hair
The irreversible entropy of the buildup of material of the BGA solder joint at raw fatigue rupture moment increases, and the Const is constant；M is the BGA solder joint
Material constant；ΔεpFor plastic strain ranges；ΔεtFor overall strain range；ΔWtFor total strain energy.
4. system according to claim 3, which is characterized in that the system also includes training modules, are specifically used for:
Before the prediction model using the thermal fatigue life, multiple groups plastic strain ranges sample value, multiple groups overall strain are obtained
The cycle to failure of range sample value, multiple groups total strain energy sample value and corresponding BGA solder joint；
By the multiple groups plastic strain ranges sample value, the multiple groups overall strain range sample value, the multiple groups total strain energy sample
The cycle to failure of this value and corresponding BGA solder joint substitutes into
In, and it is fitted the multiple groups plastic strain ranges sample value, the multiple groups overall strain model
Enclose the cycle to failure of sample value, the multiple groups total strain energy sample value and corresponding BGA solder joint, with determine Const and
The numerical value of m.
5. a kind of forecasting system of BGA thermal fatigue life of solder joint characterized by comprising processor, memory and bus,
In,
The processor and the memory complete mutual communication by the bus；
The memory is stored with the program instruction that can be executed by the processor, and the processor calls described program to instruct energy
Enough methods executed as described in claim 1 to 2 is any.
6. a kind of non-transient computer readable storage medium, which is characterized in that the non-transient computer readable storage medium is deposited
Computer instruction is stored up, the computer instruction makes the computer execute the method as described in claim 1 to 2 is any.
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| CN109684680A (en) * | 2018-12-05 | 2019-04-26 | 天津津航计算技术研究所 | A kind of soldered ball optimization method of BGA device |
| CN109655683B (en) * | 2018-12-13 | 2021-07-20 | 广州广电计量检测股份有限公司 | Thermal fatigue life acceleration test method for automobile electronic product |
| CN110414087B (en) * | 2019-07-10 | 2023-01-24 | 北京华安中泰检测技术有限公司 | Electronic product service life evaluation method under multi-stress coupling effect |
| CN115688486B (en) * | 2022-12-29 | 2023-04-18 | 潍柴动力股份有限公司 | Thermal fatigue life assessment method and device |
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