CN107201185A - A kind of pure glued membrane of heat cure - Google Patents
A kind of pure glued membrane of heat cure Download PDFInfo
- Publication number
- CN107201185A CN107201185A CN201710590608.8A CN201710590608A CN107201185A CN 107201185 A CN107201185 A CN 107201185A CN 201710590608 A CN201710590608 A CN 201710590608A CN 107201185 A CN107201185 A CN 107201185A
- Authority
- CN
- China
- Prior art keywords
- glued membrane
- heat cure
- pure glued
- modified layer
- epoxy binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
Abstract
The invention discloses a kind of pure glued membrane of heat cure, including mould release membrance, epoxy binder modified layer is coated on described mould release membrance, described epoxy binder modified layer another side pressing there are release liners, and described epoxy binder modified layer includes following parts by weight of component：10~20 parts of epoxy resin, 10~20 parts of BMI, 30~40 parts of polyphenylene oxide, 40~60 parts of toughener.The present invention can be reduced applied to the pure glued membrane of the heat cure of flexible printed wiring board, and it is applied on the flexible printed wiring board of high-frequency high-speed electronic apparatus.The dielectric constant of the pure glued membrane of the present invention is 2.4~2.8, and dielectric loss value is 0.003~0.008, while cohesive force can reach more than 1.2kgf/cm.
Description
【Technical field】
The present invention relates to a kind of pure glued membrane of heat cure.
【Background technology】
Information technology is developed rapidly now, all kinds of consumer electronicses with high speed information processing function oneself be daily life
In indispensable key component, the wireless telecommunications of military domain application and wide frequency technology are also rapid to civilian consumer electronics field
Transfer.Exactly consumer electronics market is to the higher reliability technology of electronic product, faster information transmission speed and miniaturization, many work(
The demand energetically of energyization etc..In recent years, developing rapidly with electronics industry, information processing and Information Communication high speed, to material
Expect the requirement of high frequency characteristics, more and more higher.Therefore, the low-k and low-dielectric loss value in flexible printed wiring board are applied
The pure glued membrane of heat cure demand it is more and more.
In order to realize flexibility and high cohesive force, what the existing pure glued membrane of heat cure was typically modified using nbr carboxyl terminal
Epoxy adhesive, the dielectric constant and dielectric loss value of nbr carboxyl terminal is all larger.Much study now in end carboxyl fourth
Polytetrafluoroethylene (PTFE), polyphenylene oxide, polyimides etc. is added in the epoxy adhesive that nitrile rubber is modified to reduce dielectric constant, but have plus
Work technique is poor, poor compatibility, and cohesive force is small and the shortcomings of high cost, while dielectric loss value can not be reduced.It is unable to reach low
The performance requirement of dielectric constant and low-dielectric loss value.
【The content of the invention】
The purpose of the present invention is to overcome the deficiencies in the prior art there is provided a kind of low-k and the heat of low-dielectric loss value
Solidify pure glued membrane, and with high cohesive force and high-fire resistance.
The present invention to achieve the above object, using following technical scheme：
A kind of pure glued membrane of heat cure, it is characterised in that including mould release membrance, coats modified epoxy gluing on described mould release membrance
Oxidant layer, described epoxy binder modified layer another side pressing has release liners, and described epoxy binder modified layer includes following
Parts by weight of component：
Epoxy resin of the present invention selects dicyclopentadiene novolac epoxy resin, and the water absorption rate of this structural epoxy resins is low,
Dielectric properties are stable.
The dielectric constant of BMI is 3.1~3.2 in the present invention, and dielectric loss value is 0.0007~0.012.
Polyphenylene oxide in the present invention selects the low-molecular polyphenylene ether copolymer containing hydroxyl, is soluble in epoxy resin and normal
With solvent, dielectric constant is 2.4~2.5, and dielectric loss value is 0.0004~0.0008.
Toughener in the present invention selects the polybutadiene rubber of grafted maleic anhydride group, and its dielectric constant is 2.3~
2.4, dielectric loss value is 0.005~0.007.
Can also add curing accelerator in epoxy binder modified used in the epoxy binder modified layer of the present invention, it is anti-
The compositions such as oxidant, they stir mixing in organic solvent together, and the adhesive that solid content is 30~60%, You Jirong is made
Agent can be butanone, acetone, isopropanol, ethanol, preferentially from butanone, acetone, and these solvents can be used alone, and can also mix
Conjunction is used.
The thickness of epoxy binder modified layer in the present invention is 5~50um, preferably 10~30um.
The present invention is modified for the flexibility for realizing high-fire resistance, high adhesion, low-k and low-dielectric loss value
Epoxy adhesive.From polyphenylene oxide solidification dicyclopentadiene novolac epoxy resin and bimaleimide resin with hydroxyl,
Polyphenylene oxide with hydroxyl can not only reduce the dielectric properties of resin but also can be with toughened resin.BMI can drop
The dielectric constant and dielectric loss value of low system, while both compoundings can reduce reaction temperature, with excellent processability.But
It is that they are all containing a large amount of rigid radical fragility are big, bonding force is low.By adding toughener polybutadiene rubber toughness reinforcing and carrying
High adhesion, polybutadiene rubber is a kind of polybutadiene rubber of grafted maleic anhydride group, the Malaysia of polybutadiene rubber
Anhydride group has good compatibility with polyphenylene oxide reaction with system.The present invention passes through the polyphenylene oxide of reactivity and gathering for grafting
Butadiene rubber solves consistency problem, while reducing the dielectric constant and dielectric loss value of epoxy systems, invents flexibility
Low-dielectric can adhesive applications in the pure glued membrane of heat cure.
Beneficial effects of the present invention are as follows：
The present invention can be reduced applied to the pure glued membrane of the heat cure of flexible printed wiring board, and it is applied to high-frequency high-speed electronics
On the flexible printed wiring board of electrical equipment.The dielectric constant of the pure glued membrane of the present invention is 2.4~2.8, dielectric loss value is 0.003~
0.008, while cohesive force can reach more than 1.2kgf/cm.
【Embodiment】
A kind of pure glued membrane of heat cure of the present invention, successively including mould release membrance, be coated in it is epoxy binder modified on mould release membrance
Layer and release liners, wherein epoxy binder modified layer includes following necessary component：Epoxy resin, BMI, polyphenylene oxide,
Toughener.Epoxy binder modified composition includes above-mentioned necessary component, can also contain some inessential components, and such as solidification promotees
Enter the compositions such as agent, antioxidant, they stir together mixing in organic solvent, be made solid content for 30~60% it is gluing
Agent, organic solvent can be butanone, acetone, isopropanol, ethanol, and preferentially from butanone, acetone, these solvents can individually make
With can also be used in mixed way.
It is applied in epoxy binder modified on mould release membrance, scribbles epoxy binder modified mould release membrance by baking oven 120
~180 DEG C of dry 100~500S, then press the compound at 50~100 DEG C with release liners, be made pure glued membrane 30~
Solidify afterwards at 80 DEG C.Finally give the pure glued membrane of semi-cured state.
Further more detailed description is done to the present invention with reference to specific embodiment.
Table 1：Epoxy binder modified each component parts by weight
The preparation method of embodiment 1 is：
Each component is mixed in the ratio of each embodiment in table 1, quantitative butanone stirring is added, changing for 40% solid content is made
Property epoxy adhesive, by it is above-mentioned it is epoxy binder modified be coated on mould release membrance, then in 120~160 DEG C of dry 100~300S,
Then the compound is pressed at 50~100 DEG C with release liners, the pure glued membrane of heat cure is made in solidification, thickness at 30~80 DEG C
It is 12 μm after drying.
The preparation method be the same as Example 1 of embodiment 2~4.
The preparation method be the same as Example 1 of comparative example 1~3.
Its characteristic is detected to the pure glued membrane of heat cure prepared by embodiment 1~3 and comparative example 1~3, as a result as shown in table 2.
Table 2：
As can be seen from Table 2, the pure glued membrane of heat cure of the invention, dielectric constant can reach less than 2.8, dielectric loss value
Less than 0.008 can be reached, and with high-fire resistance and high cohesive force, the soft printing of high-frequency high-speed electronic apparatus can be met
Circuit board performance requirement.
Claims (5)
1. a kind of pure glued membrane of heat cure, it is characterised in that：Including mould release membrance, coated on described mould release membrance epoxy binder modified
Layer, described epoxy binder modified layer another side pressing has release liners, and described epoxy binder modified layer includes following heavy
Measure part component：
2. the pure glued membrane of a kind of heat cure according to claim 1, it is characterised in that the dielectric of the pure glued membrane of heat cure is normal
Number is 2.4~2.8, and dielectric loss value is 0.003~0.008.
3. the pure glued membrane of a kind of heat cure according to claim 1, it is characterised in that described polyphenylene oxide is low molecule amount
Polyphenylene ether copolymer with hydroxyl, its dielectric constant is 2.4~2.5, and dielectric loss value is 0.0004~0.0008.
4. the pure glued membrane of a kind of heat cure according to claim 1, it is characterised in that described toughener is to be grafted with Malaysia
The polybutadiene rubber of anhydride group, dielectric constant is 2.3~2.4, and dielectric loss value is 0.005~0.007.
5. the pure glued membrane of a kind of heat cure according to claim 1, it is characterised in that described epoxy binder modified layer
Thickness is 5~50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590608.8A CN107201185A (en) | 2017-07-19 | 2017-07-19 | A kind of pure glued membrane of heat cure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590608.8A CN107201185A (en) | 2017-07-19 | 2017-07-19 | A kind of pure glued membrane of heat cure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107201185A true CN107201185A (en) | 2017-09-26 |
Family
ID=59911904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710590608.8A Pending CN107201185A (en) | 2017-07-19 | 2017-07-19 | A kind of pure glued membrane of heat cure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107201185A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982489A (en) * | 2019-10-16 | 2020-04-10 | 山东金鼎电子材料有限公司 | High-frequency glue and high-frequency flexible copper clad laminate applying same |
| CN112637745A (en) * | 2020-12-30 | 2021-04-09 | 歌尔股份有限公司 | Centering support piece, machining process of centering support piece, loudspeaker and electronic terminal |
| CN113861929A (en) * | 2021-09-22 | 2021-12-31 | 广东东溢新材料科技有限公司 | Adhesive, preparation method thereof, low dielectric loss pure adhesive film applying adhesive and manufacturing process thereof |
| CN114248456A (en) * | 2021-12-21 | 2022-03-29 | 苏州东福来机电科技有限公司 | Processing technology of low dielectric structure adhesive film |
| KR20220049920A (en) * | 2020-10-15 | 2022-04-22 | 주식회사 신아티앤씨 | Low dielectric resin composite |
| CN115505341A (en) * | 2022-07-28 | 2022-12-23 | 广东东溢新材料科技有限公司 | Pure epoxy adhesive film and preparation method and application thereof |
Citations (2)
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|---|---|---|---|---|
| CN102115569A (en) * | 2009-12-31 | 2011-07-06 | 财团法人工业技术研究院 | Dielectric material composition and circuit substrate |
| CN103965606A (en) * | 2013-02-04 | 2014-08-06 | 联茂电子股份有限公司 | Low dielectric material |
-
2017
- 2017-07-19 CN CN201710590608.8A patent/CN107201185A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102115569A (en) * | 2009-12-31 | 2011-07-06 | 财团法人工业技术研究院 | Dielectric material composition and circuit substrate |
| CN103965606A (en) * | 2013-02-04 | 2014-08-06 | 联茂电子股份有限公司 | Low dielectric material |
Non-Patent Citations (4)
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| 严灏景: "《纤维材料学导论》", 31 December 1990, 纺织工业出版社 * |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110982489A (en) * | 2019-10-16 | 2020-04-10 | 山东金鼎电子材料有限公司 | High-frequency glue and high-frequency flexible copper clad laminate applying same |
| KR20220049920A (en) * | 2020-10-15 | 2022-04-22 | 주식회사 신아티앤씨 | Low dielectric resin composite |
| KR102420710B1 (en) * | 2020-10-15 | 2022-07-18 | 주식회사 신아티앤씨 | Low dielectric resin composite |
| CN112637745A (en) * | 2020-12-30 | 2021-04-09 | 歌尔股份有限公司 | Centering support piece, machining process of centering support piece, loudspeaker and electronic terminal |
| CN113861929A (en) * | 2021-09-22 | 2021-12-31 | 广东东溢新材料科技有限公司 | Adhesive, preparation method thereof, low dielectric loss pure adhesive film applying adhesive and manufacturing process thereof |
| CN114248456A (en) * | 2021-12-21 | 2022-03-29 | 苏州东福来机电科技有限公司 | Processing technology of low dielectric structure adhesive film |
| CN114248456B (en) * | 2021-12-21 | 2024-04-05 | 苏州东福来机电科技有限公司 | Processing technology of low-dielectric-structure adhesive film |
| CN115505341A (en) * | 2022-07-28 | 2022-12-23 | 广东东溢新材料科技有限公司 | Pure epoxy adhesive film and preparation method and application thereof |
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| CB02 | Change of applicant information |
Address after: 528400 No. 22 Changsheng Road, South District, Zhongshan, Guangdong Applicant after: Guangdong Dongyi new Mstar Technology Ltd Address before: 528400 No. 22 Changsheng Road, South District, Zhongshan, Guangdong Applicant before: Zhongshan Dongyi High-tech Material Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170926 |
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| RJ01 | Rejection of invention patent application after publication |