CN107182171A - The seal protection structure and its encapsulating method of a kind of BGA device - Google Patents
The seal protection structure and its encapsulating method of a kind of BGA device Download PDFInfo
- Publication number
- CN107182171A CN107182171A CN201710424323.7A CN201710424323A CN107182171A CN 107182171 A CN107182171 A CN 107182171A CN 201710424323 A CN201710424323 A CN 201710424323A CN 107182171 A CN107182171 A CN 107182171A
- Authority
- CN
- China
- Prior art keywords
- bga device
- diaphragm seal
- circuit board
- prefabricated
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004224 protection Effects 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000012530 fluid Substances 0.000 claims abstract description 50
- 239000000565 sealant Substances 0.000 claims abstract description 50
- 238000007789 sealing Methods 0.000 claims abstract description 28
- 238000007711 solidification Methods 0.000 claims abstract description 8
- 230000008023 solidification Effects 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- 229920000260 silastic Polymers 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 5
- 230000009979 protective mechanism Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The seal protection structure and its encapsulating method of a kind of BGA device, are related to the protective process technology field of aerospace electron electric product, including：Prefabricated diaphragm seal, fluid sealant, BGA device and printed circuit board；The prefabricated diaphragm seal is arranged at the gap between BGA device surrounding and printed circuit board, the top surface contact of the bottom surface of prefabricated diaphragm seal and printed circuit board, the contacts side surfaces of prefabricated diaphragm seal side along its length and BGA device；The fluid sealant is coated on prefabricated diaphragm seal, for being tightly connected prefabricated diaphragm seal and BGA device and printed circuit board；First through hole is provided with the prefabricated sealing plate, first through hole is used for the second through hole that position corresponding with first through hole on the pressure on balanced seal interface both sides, the fluid sealant after solidification is provided with connection.
Description
Technical field
The present invention relates to the protective process technology field of aerospace electron electric product, specially a kind of BGA (Ball Grid
Array, welded ball array encapsulation) device seal protection structure and its encapsulating method.
Background technology
With the development of scientific and technological level, the integrated level more and more higher of circuit board.Welded ball array device and spy on circuit board
Different device, all suffers from the trend of microminaturization, in order to adapt to this demand for development, and some advanced High Density Packaging Technologies should
Transport and give birth to, BGA package technology is exactly one of them.The device of BGA package has the spies such as small volume, integrated level height, good reliability
Point, is widely used in the every field of industry and daily life.BGA device is weldingly connected with circuit board by Surface Mount.Due to device
Part solder joint is more, during actual use, often occurs due to short circuit phenomenon caused by moisture, scolding tin slag, and extraneous
Solder joint phenomenon of rupture caused by vibration, pressure change, causes the failure of device, causes serious consequence.In space technology field,
Because device Service Environment is more severe, the failure phenomenon of BGA device becomes apparent.Aviation with BGA device after being welded,
Need to carry out hectic fever test, result of the test finds that the crash rate of BGA device is about 10%.And be due to mostly the reason for fail
Short circuit problem caused by the fifth wheels such as the steam or brazing metal of residual is arranged at BGA device bottom, it is therefore necessary to which BGA device is entered
The processing of row sealing protection, reduces component failure probability of happening.
At present, the usual way of BGA device sealing protection is that encapsulation or glue dispensing and packaging are filled to BGA device bottom.
Both approaches can falling, distorting, vibrate etc. to provide and protect well for product, but glue dispensing and packaging can not be to BGA device
The protection effect that internal moisture, the intrusion of steam have been played, does not have anti-to the fifth wheel produced in printing part production process yet
Shield is acted on；The method of filling encapsulation can have preferable protective action to moisture, steam and fifth wheel, but become in extreme temperature
During change, macromolecule sizing material and other positions of filling are more easy to occur coefficient of thermal expansion mismatch, cause local stress too high, cause
BGA solder joint failures.In addition, the sealing protection of BGA device is when space industry is applied, also the factors such as vacuum environment are examined
Consider.In vacuum, there is pressure difference in BGA device seal interface, so as to cause major injury to device.
The content of the invention
For problems of the prior art, the present invention provides seal protection structure and its sealing of a kind of BGA device
Method, has the advantages that cost is low, processing method is simple, good reliability.
The present invention is to be achieved through the following technical solutions：
A kind of seal protection structure of BGA device, including：Prefabricated diaphragm seal (1), fluid sealant, BGA device and printed circuit
Plate；
The prefabricated diaphragm seal is arranged at the gap between BGA device surrounding and printed circuit board, prefabricated diaphragm seal
The contacts side surfaces of the top surface contact of bottom surface and printed circuit board, prefabricated diaphragm seal side along its length and BGA device；
The fluid sealant is coated on prefabricated diaphragm seal, for being tightly connected prefabricated diaphragm seal and BGA device and printing
Circuit board；
First through hole is provided with the prefabricated sealing plate, first through hole is used for the pressure on balanced seal interface both sides, Gu
The position corresponding with first through hole is provided with the second through hole of connection on fluid sealant after change.
It is preferred that, the thickness of the prefabricated diaphragm seal is 0.3-0.7mm, the length of prefabricated diaphragm seal and the side of BGA device
Length is identical；The top surface of prefabricated diaphragm seal is higher than the bottom surface of BGA device, less than 1/2 position of BGA device short transverse.
It is preferred that, the fluid sealant is coated on the angle that prefabricated diaphragm seal top surface and BGA device side are formed, and
The angle that prefabricated diaphragm seal lateral surface and printed circuit plate top surface are formed；To the formation cladding sealing of prefabricated diaphragm seal.
It is preferred that, it is coated on the top surface of the fluid sealant for the angle that prefabricated diaphragm seal top surface and BGA device side are formed
Higher than 1/2 position of BGA device short transverse, and not higher than BGA device top surface；
The bottom for being coated on the fluid sealant for the angle that prefabricated diaphragm seal lateral surface and printed circuit plate top surface are formed is thick
Spend for 1-2mm；
The prefabricated sealing strip and fluid sealant are made up of GD414 silicon rubber.
It is preferred that, the first through hole is that the width on prefabricated sealing plate is 2-3mm openings, and the second through hole is close for solidification
In sealing with first through hole width identical opening.
It is preferred that, in addition to solder joint, solder joint is located between BGA device and printed circuit board, for connecting BGA device and print
Circuit board processed.
A kind of encapsulating method of BGA device, based on the seal protection structure of any BGA device of the present invention, including
Following steps：
Step 1, prefabricated diaphragm seal is placed at the gap of BGA device surrounding, makes bottom surface and the printing of prefabricated diaphragm seal
The contacts side surfaces of the top surface contact of circuit board, prefabricated diaphragm seal side along its length and BGA device；
Step 2, fluid sealant is coated on the angle that prefabricated diaphragm seal top surface and BGA device side are formed, and in advance
The angle that diaphragm seal lateral surface and printed circuit plate top surface processed are formed, so that prefabricated diaphragm seal is coated in fluid sealant；
Step 3, after sealing glue solidifying, first through hole is opened on prefabricated diaphragm seal, it is relative with first through hole on fluid sealant
The second through hole is opened in the position answered, and first through hole and the second through hole are used for the pressure on balanced seal interface both sides.
It is preferred that, also include before step 1, prepare prefabricated diaphragm seal, including：
Silastic material is uniformly applied on deimpurity polyester film, it is the pre- of 0.3-0.7mm that thickness, which is made,
Thin slice processed；
The prefabricated thin slice is cut into length identical with needing the sealed BGA device length of side, highly more than BGA device bottom
Face and the distance of printed circuit plate top surface, 1/2 position and the distance of printed circuit plate top surface less than BGA device short transverse.
It is preferred that, also include before step 1, pretreatment printed circuit board and BGA device；Clean printed circuit board and
After BGA device, printed circuit board and BGA device are placed in 45-55 DEG C of drying room, 4 to 6 hours are incubated, to dry printing
Circuit board and BGA device.
It is preferred that, in addition to the step of whether fluid sealant solidifies examined；If fluid sealant is uncured, place 1 to 2 hour after
After continuous solidification, examine again until reaching solidifying requirements.
Compared with prior art, the present invention has following beneficial technique effect：
By fluid sealant prefabricated diaphragm seal is tightly connected with BGA device, printed circuit board, it is to avoid pass through glue dispensing and packaging
When, it is impossible to the protection effect that the intrusion to BGA device inside moisture, steam has been played, to what is produced in printing part production process
Not the problem of fifth wheel does not have protective action yet；Avoid simultaneously by filling during encapsulation, in extreme changes of temperature, filling
With other positions coefficient of thermal expansion mismatch easily occurs for macromolecule sizing material, causes local stress too high, causes asking for BGA solder joint failures
Topic；And by setting first through hole on prefabricated diaphragm seal, the second through hole is set on fluid sealant, it is ensured that seal interface two
The pressure balance of side；
Further, because the top surface for the fluid sealant for being coated on prefabricated diaphragm seal and BGA device contact position is higher than BGA device
1/2 position of short transverse, and not higher than BGA device top surface, both ensure that sealed reliability, while not influenceing BGA again
The normal of device is used.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of BGA device sealing structure provided in an embodiment of the present invention；
Fig. 2 is a kind of partial enlarged drawing of BGA device sealing structure provided in an embodiment of the present invention.
In figure：1st, prefabricated sealing strip, 2, fluid sealant, 3, BGA device, 4, solder joint, 5, printed circuit board.
Embodiment
With reference to specific embodiment, the present invention is described in further detail, it is described be explanation of the invention and
It is not to limit.
As shown in figure 1, a kind of sealing structure of BGA device provided in an embodiment of the present invention, including：It is prefabricated diaphragm seal 1, close
Sealing 2, BGA device 3 and printed circuit board 5；
Prefabricated diaphragm seal 1 is arranged at the gap between the surrounding of BGA device 3 and printed circuit board 5, prefabricated diaphragm seal 1
The top surface 5 of bottom surface and printed circuit board is contacted, and the side 3 of prefabricated diaphragm seal 1 side along its length and BGA device is contacted；
Fluid sealant 2 is coated on prefabricated diaphragm seal 1, for being tightly connected prefabricated diaphragm seal 1 and BGA device 3 and printing
Circuit board 5；
First through hole is provided with prefabricated sealing plate 1, first through hole is used for the pressure on balanced seal interface both sides, after solidification
Fluid sealant 2 on the position corresponding with first through hole be provided with the second through hole of connection.
BGA device 3 and printed circuit board 5 are connected by solder joint 4, and seal protection structure provided by the present invention ensure that
Steadiness and avoid in the presence of a harsh environment because steam, moisture etc. cause solder joint 4 to be corroded that pad 4 is connected, so that weldering
Connect failure.
When BGA device 3 and printed circuit board 5 are used for space industry, if BGA device 3 and printed circuit board 5 are prefabricated
Diaphragm seal 1 and fluid sealant 2 are fully sealed, and because the pressure in space and atmospheric pressure are inconsistent, can cause the side pressure of seal interface two
Power is different, so as to influence the use of BGA device 3 and printed circuit board 5, therefore through hole is set on prefabricated sealing plate 1, by this
Through hole realizes the pressure balance of seal interface both sides.
It should be noted that the outside being previously mentioned in embodiments of the present invention is the side away from the center of BGA device 3.
Optionally, the thickness of prefabricated diaphragm seal is 0.3-0.7mm, the length of prefabricated diaphragm seal 1 and the length of side of BGA device 3
It is identical；
The top surface of prefabricated diaphragm seal 1 is higher than the bottom surface of BGA device 3, less than 1/2 position of the short transverse of BGA device 3.
Wherein, the material of prefabricated diaphragm seal 1 and fluid sealant 2 can be silicon rubber, it is preferred that due to GD414 silicon rubber
High-temperature behavior and cryogenic property are excellent, it is adaptable under the adverse circumstances of high temperature or low temperature, therefore can be made from GD414 silicon rubber
For prefabricated diaphragm seal 1 and the material of fluid sealant 2.
Optionally, fluid sealant 2 is coated on the angle that the prefabricated top surface of diaphragm seal 1 and the side of BGA device 3 are formed, and
The angle that prefabricated diaphragm seal lateral surface 1 and printed circuit board 5 top surface is formed；To the formation cladding sealing of prefabricated diaphragm seal 1.
As shown in Fig. 2 being coated on the fluid sealant 2 for the angle that the prefabricated top surface of diaphragm seal 1 and the side of BGA device 3 are formed
Top surface be higher than 1/2 position of the short transverse of BGA device 3, and the not higher than top surface of BGA device 3；
It is coated on the bottom of the fluid sealant 2 for the angle that prefabricated diaphragm seal lateral surface 1 and the top surface of printed circuit board 5 are formed
Thickness is 1-2mm.
It is preferred that, the first through hole being arranged on prefabricated sealing plate 1 is that the width on prefabricated sealing plate 1 is 2-3mm openings.
Certainly, in actual applications, the through hole being arranged on prefabricated sealing plate 1 can also be the logical of manhole or other shapes
Hole, the embodiment of the present invention is not especially limited to this.The shape for the second through hole being arranged on fluid sealant 2 can be with first through hole
It is identical, can also be different with the shape of first through hole.
When assembling the BGA device seal protection structure, prefabricated diaphragm seal 1 is close to by BGA according to the length of side of BGA device 3
At the surrounding gap of device 3, per one, side, every joint should not retain unnecessary ridge.Fluid sealant 2 is loaded into syringe.
Fluid sealant 2 is coated with a circle along the surrounding of BGA device 3 is close to syringe, syringe needle direction and the angle of printed circuit board 5 during coating
It is greater than 45 °, the body of BGA device 3 is connected by fluid sealant 2 with printed circuit board 5, good seal, no crack, 1mm≤glue is wide
≤2mm., need to be firmly uniform during gluing, and syringe needle should not contact printed circuit board 5, be coated on prefabricated diaphragm seal 1 and BGA device 3
The top surface of the fluid sealant 2 of contact position is higher than 1/2 position of the short transverse of BGA device 3, and the not higher than top surface of BGA device 3.
Optionally, when fluid sealant 2 solidifies, by the horizontal positioned of printed circuit board 5, cold curing more than four hours.
Wherein, also include before the BGA device seal protection structure is assembled：Prepare prefabricated diaphragm seal 1；
Preparing prefabricated diaphragm seal 1 includes：Silastic material is uniformly applied on deimpurity polyester film, is made
Thickness is 0.3-0.7mm prefabricated thin slice；
Prefabricated thin slice is cut into length identical with needing the sealed length of side of BGA device 3, highly more than BGA device bottom surface 3
With the distance of the top surface of printed circuit board 5,1/2 position and the distance of the top surface of printed circuit board 5 less than the short transverse of BGA device 3.
Optionally, it can also be implemented by the following steps when preparing prefabricated diaphragm seal 1：
Sealedly the size of BGA device 3 makes the making mould of prefabricated diaphragm seal 1 as needed；
It will be uniformly applied in making mould for preparing the material of prefabricated diaphragm seal, thickness be made for 0.3-0.7mm
Prefabricated sealing plate 1.
Pretreatment printed circuit board 5 and BGA device 3 are also needed to before the BGA device seal protection structure is assembled；Cleaning
After printed circuit board 5 and BGA device 3, printed circuit board 5 and BGA device 3 are placed in 45-55 DEG C of drying room, insulation 4 to 6
Hour, to dry printed circuit board 5 and BGA device 3
Wherein, when drying printed circuit board and BGA device, printing part is placed in 45-55 DEG C of drying room, insulation 4 to 6
Hour.Printed circuit board 5 and BGA device 3 are pre-processed, is in order to remove the impurity on printed circuit board 5 and BGA device 3, to protect
Demonstrate,prove the sealing of connection.
Optionally, the encapsulating method of BGA device provided in an embodiment of the present invention, in addition to examine whether fluid sealant 2 solidifies
The step of；If fluid sealant 2 is uncured, places after continuing within 1 to 2 hour to solidify, examine again until reaching solidifying requirements.
Wherein it is possible to be observed by range estimation or using 4-10 times of magnifying glass, whether observation sizing material solidifies well, surface
Smooth, solidfied material is highly higher than the 1/2 of BGA device body height, less than edge on BGA device body.
The solidfied material on the side of BGA device four can be pressed by using bamboo stick, checks whether it feels like jelly, tacky, if there is the situation
Then explanation solidification is insufficient, places 1~2 and as a child it was checked again, completed until fluid sealant 2 solidifies.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (10)
1. a kind of seal protection structure of BGA device, it is characterised in that including：Prefabricated diaphragm seal (1), fluid sealant (2), BGA devices
Part (3) and printed circuit board (5)；
The prefabricated diaphragm seal (1) is arranged at the gap between BGA device (3) surrounding and printed circuit board (5), prefabricated sealing
Top surface (5) contact of the bottom surface of piece (1) and printed circuit board, prefabricated diaphragm seal (1) side along its length and BGA device
(3) are contacted sideways；
The fluid sealant (2) is coated on prefabricated diaphragm seal (1), for being tightly connected prefabricated diaphragm seal (1) and BGA device (3)
And printed circuit board (5)；
First through hole is provided with the prefabricated sealing plate (1), first through hole is used for the pressure on balanced seal interface both sides, solidification
The position corresponding with first through hole is provided with the second through hole of connection on fluid sealant (2) afterwards.
2. the seal protection structure of BGA device as claimed in claim 1, it is characterised in that the thickness of the prefabricated diaphragm seal (1)
Spend for 0.3-0.7mm, the length of prefabricated diaphragm seal (1) is identical with the length of side of BGA device (3)；The top surface of prefabricated diaphragm seal (1) is high
Bottom surface in BGA device (3), less than 1/2 position of BGA device (3) short transverse.
3. the seal protection structure of BGA device as claimed in claim 1, it is characterised in that the fluid sealant (2) is coated on pre-
The angle that diaphragm seal (1) top surface processed and BGA device (3) side are formed, and prefabricated diaphragm seal lateral surface (1) and printing electricity
The angle that road plate (5) top surface is formed；To prefabricated diaphragm seal (1) formation cladding sealing.
4. the seal protection structure of BGA device as claimed in claim 3, it is characterised in that be coated on prefabricated diaphragm seal (1) top
The top surface of the fluid sealant (2) for the angle that face and BGA device (3) side are formed is higher than the 1/2 of BGA device (3) short transverse
Position, and not higher than BGA device (3) top surface；
It is coated on the bottom of the fluid sealant (2) for the angle that prefabricated diaphragm seal lateral surface (1) and printed circuit board (5) top surface are formed
Portion's thickness is 1-2mm；
The prefabricated sealing strip (1) and fluid sealant (2) are made up of GD414 silicon rubber.
5. the seal protection structure of BGA device as claimed in claim 1, it is characterised in that the first through hole is precast
Width on shrouding (1) is 2-3mm openings, the second through hole on the fluid sealant (2) of solidification with first through hole width identical
Opening.
6. the seal protection structure of BGA device as claimed in claim 1, it is characterised in that also including solder joint (4), solder joint (4)
Between BGA device (3) and printed circuit board (5), for connecting BGA device (3) and printed circuit board (5).
7. a kind of encapsulating method of BGA device, it is characterised in that based on the close of any BGA device described in claim 1 to 6
Protection structure is sealed, is comprised the following steps：
Step 1, prefabricated diaphragm seal (1) is placed at the gap of BGA device (3) surrounding, make prefabricated diaphragm seal (1) bottom surface and
The contacts side surfaces of the top surface contact of printed circuit board (5), prefabricated diaphragm seal (1) side along its length and BGA device (3)；
Step 2, fluid sealant (2) is coated on the angle that prefabricated diaphragm seal (1) top surface and BGA device (3) side are formed, with
And the angle that prefabricated diaphragm seal lateral surface (1) and printed circuit board (5) top surface are formed, so that prefabricated diaphragm seal (1) is wrapped
Overlay in fluid sealant (2)；
Step 3, after fluid sealant (2) solidification, first through hole is opened on prefabricated diaphragm seal (1), on fluid sealant (2) and first through hole
The second through hole is opened in corresponding position, and first through hole and the second through hole are used for the pressure on balanced seal interface both sides.
8. a kind of encapsulating method of BGA device as claimed in claim 7, it is characterised in that also include before step 1, makes
Standby prefabricated diaphragm seal (1), including：
Silastic material is uniformly applied on deimpurity polyester film, it is the prefabricated thin of 0.3-0.7mm that thickness, which is made,
Piece；
The prefabricated thin slice is cut into length identical with needing sealed BGA device (3) length of side, highly more than BGA device bottom
Face (3) and the distance of printed circuit board (5) top surface, less than 1/2 position and printed circuit board (5) of BGA device (3) short transverse
The distance of top surface.
9. a kind of encapsulating method of BGA device as claimed in claim 7, it is characterised in that also include before step 1, in advance
Handle printed circuit board (5) and BGA device (3)；Clean after printed circuit board (5) and BGA device (3), by printed circuit board (5)
It is placed on BGA device (3) in 45-55 DEG C of drying room, 4 to 6 hours is incubated, to dry printed circuit board (5) and BGA device
(3)。
10. a kind of encapsulating method of BGA device as claimed in claim 7, it is characterised in that also including examining fluid sealant (2)
The step of whether solidifying；If fluid sealant (2) is uncured, place after continuing within 1 to 2 hour to solidify, examine again until reaching solid
Change and require.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710424323.7A CN107182171B (en) | 2017-06-07 | 2017-06-07 | A kind of seal protection structure and its encapsulating method of BGA device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710424323.7A CN107182171B (en) | 2017-06-07 | 2017-06-07 | A kind of seal protection structure and its encapsulating method of BGA device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107182171A true CN107182171A (en) | 2017-09-19 |
| CN107182171B CN107182171B (en) | 2019-02-22 |
Family
ID=59835310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710424323.7A Active CN107182171B (en) | 2017-06-07 | 2017-06-07 | A kind of seal protection structure and its encapsulating method of BGA device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107182171B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037974A (en) * | 2018-06-26 | 2018-12-18 | 中国电子科技集团公司第二十九研究所 | A kind of contact wide band radio-frequency interconnecting method and structure |
| CN110072347A (en) * | 2019-04-09 | 2019-07-30 | 南昌嘉研科技有限公司 | A kind of safeguard structure and its processing method of chip bga |
| WO2023160683A1 (en) * | 2022-02-25 | 2023-08-31 | 浙江三花汽车零部件有限公司 | Electric pump and manufacturing method for electric pump |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010027876A1 (en) * | 2000-03-24 | 2001-10-11 | Matsushita Electric Industrial Co., Ltd. | Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same |
| US20020102767A1 (en) * | 2001-01-31 | 2002-08-01 | Sturcken Keith K. | Ball grid array (BGA) to column grid array (CGA) conversion process |
| CN203387594U (en) * | 2013-08-15 | 2014-01-08 | 福州鑫图光电有限公司 | Refrigeration sealing structure for embedded-type camera system |
| CN104937027A (en) * | 2013-01-23 | 2015-09-23 | 汉高知识产权控股有限责任公司 | Underfill composition and packaging process using the same |
| CN105957837A (en) * | 2016-04-28 | 2016-09-21 | 清华大学 | Packaging structure used for three-dimensional system level packaging and packaging method |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
-
2017
- 2017-06-07 CN CN201710424323.7A patent/CN107182171B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010027876A1 (en) * | 2000-03-24 | 2001-10-11 | Matsushita Electric Industrial Co., Ltd. | Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same |
| US20020102767A1 (en) * | 2001-01-31 | 2002-08-01 | Sturcken Keith K. | Ball grid array (BGA) to column grid array (CGA) conversion process |
| CN104937027A (en) * | 2013-01-23 | 2015-09-23 | 汉高知识产权控股有限责任公司 | Underfill composition and packaging process using the same |
| CN203387594U (en) * | 2013-08-15 | 2014-01-08 | 福州鑫图光电有限公司 | Refrigeration sealing structure for embedded-type camera system |
| CN105957837A (en) * | 2016-04-28 | 2016-09-21 | 清华大学 | Packaging structure used for three-dimensional system level packaging and packaging method |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037974A (en) * | 2018-06-26 | 2018-12-18 | 中国电子科技集团公司第二十九研究所 | A kind of contact wide band radio-frequency interconnecting method and structure |
| CN110072347A (en) * | 2019-04-09 | 2019-07-30 | 南昌嘉研科技有限公司 | A kind of safeguard structure and its processing method of chip bga |
| WO2023160683A1 (en) * | 2022-02-25 | 2023-08-31 | 浙江三花汽车零部件有限公司 | Electric pump and manufacturing method for electric pump |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107182171B (en) | 2019-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6455354B1 (en) | Method of fabricating tape attachment chip-on-board assemblies | |
| CN107182171A (en) | The seal protection structure and its encapsulating method of a kind of BGA device | |
| KR101328551B1 (en) | Semiconductor devices | |
| CN100468715C (en) | Connection structure for connecting semiconductor element and wiring board, and semiconductor device | |
| JP5168091B2 (en) | Method for manufacturing thermal flow sensor and thermal flow sensor | |
| CN111965387B (en) | High-reliability acceleration sensor for motor train unit and preparation method thereof | |
| KR20000067849A (en) | Semiconductor device and manufacturing method thereof | |
| US8106486B2 (en) | Electronic apparatus with an electrical conductor in the form of a liquid and an electrical insulator with a light-curing property | |
| WO2020238773A1 (en) | Package structure and mobile terminal | |
| JP6365360B2 (en) | Electronic device and manufacturing method thereof | |
| US7830023B2 (en) | Resin molded semiconductor device | |
| TW200303077A (en) | Semiconductor device and its manufacturing method | |
| US8105871B2 (en) | Semiconductor device and manufacturing method of the same | |
| JP2607877B2 (en) | Method for manufacturing resin-reinforced LSI mounting structure | |
| CN208904000U (en) | Integrated circuit package body | |
| JP2009188392A (en) | Semiconductor device and method of manufacturing semiconductor device | |
| JP2012049419A (en) | Module and method for manufacturing the same | |
| CN218827058U (en) | Device packaging structure and die structure for preparing same | |
| JPS6124255A (en) | Structure for semiconductor package | |
| CN116435201B (en) | Plastic packaging method and device packaging structure | |
| JPH0590448A (en) | Hybrid integrated circuit | |
| CN219394806U (en) | Wafer level packaging structure and module, circuit board and electronic equipment thereof | |
| JP3990814B2 (en) | Electronic component manufacturing method and electronic component manufacturing apparatus | |
| JPH04290245A (en) | Thermal-stress measuring element of semiconductor device | |
| JP3014873B2 (en) | Method for manufacturing semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221226 Address after: 451161 Tower C, Xinggang Building, No. 16, Huhang Road, Zhengzhou Airport Economic Comprehensive Experimental Zone, Zhengzhou City, Henan Province Patentee after: Zhengzhou Xinghang Technology Co.,Ltd. Address before: No. 198, Taibai South Road, Yanta District, Xi'an City, Shaanxi Province Patentee before: XI'AN MICROELECTRONICS TECHNOLOGY INSTITUTE |
|
| TR01 | Transfer of patent right |