CN107177167B - Heat-dissipating resin composition for LED substrate and preparation method thereof - Google Patents
Heat-dissipating resin composition for LED substrate and preparation method thereof Download PDFInfo
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- CN107177167B CN107177167B CN201710481319.4A CN201710481319A CN107177167B CN 107177167 B CN107177167 B CN 107177167B CN 201710481319 A CN201710481319 A CN 201710481319A CN 107177167 B CN107177167 B CN 107177167B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The present invention relates to a kind of heat-dissipating resin composition for LED substrate, including epoxy resin A, metallo-organic compound MOF and curing agent.In the present invention, MOF materials are introduced into the resin for making to be used in the present invention after solidification process, are formed further with the higher order structure of sequence.According to the present invention, it is possible to provide have the heat-dissipating resin composition for being capable of providing the radiator structure with excellent heat dissipation performance.
Description
Technical field
The present invention relates to heat-dissipating resin composition, and in particular, to a kind of heat-conductive characteristic it is excellent be used for LED substrate
Heat-dissipating resin composition and preparation method thereof.
Background technology
Light emitting diode (LightEmittingDiode, abbreviation LED) is born so far, has been realized in true color and highlights
Degreeization, and the white light LEDs produced on the basis of blue/purple LED.LED element due to the small-sized, long-life, save electrically aspect
It is excellent, and it is used as the light sources such as display lamp, oneself is through in automotive lighting, decorative lighting, mobile phone flashlight, big-and-middle size display screen light
Source module is used widely.
It is in surface actual load type LED component, the i.e. metal such as aluminium by the way of mostly when for such light source
The LED element of more than 2 is configured on the basal substrate (the real equipment used substrates of LED) of manufacture and is set around each LED element makes light
Reflex to the reflector of prescribed direction.For existing LED light effect is horizontal, the 70%~80% of inputing power is transformed into
Can not be by the heat of radiation release, and LED chip is small-sized, if heat dissipation is bad, can raise chip temperature, draw
Play uneven thermal stress distribution, the reduction of chip light emitting efficiency, the decline of fluorescent powder lasing efficiency.Technical comparing is ripe currently on the market
For power type LED chip size all between 1mm × 1mm-2.5mm × 2.5mm, size seldom causes its power density very big, heat
Capacity very little, caused temperature rise are obvious.
Existing certain researcher pays close attention to the research and development of LED Heat dissipation compositions in the prior art.Such as：
CN201210308430 discloses a kind of preparation method of the heat radiation coating for LED light, prepares by weight percentage
Following components, 30~60% water-base resin, 20% Versamid, 10~20% carbon nanotubes, 1~5% silicon
The aluminium powder of alkane coupling agent KH 550,5~40%, 10% rare earth oxide, 13% silicon nitride, the third of 15~20%
Ketone, 1~2% curing agent, 2~5% dust-proofing agent and smooth agent mixture and 3~5% phenol.
CN201280023426.8 discloses a kind of curability Heat dissipation composition, it contains：(A) it is esterified (a) polyisocyanic acid
Poly- ammonia with carboxyl obtained by the dihydroxy compounds reaction of compound, (b) polycarbonate glycol compound, (c) with carboxyl
Ester resin；(B) epoxy resin；(C) inorganic filler (wherein, not including barium sulfate and titanium oxide), inorganic filler (C's) contains
Rate is 50~96 mass %.As inorganic filler (C), preferably and with the boron nitride of flat and aluminium oxide, the nitridation of particle shape
Aluminium or boron nitride.
CN201410050688.4 discloses a kind of long oil alkyd LED heat radiation coatings, by the raw material of following parts by weight
It is made：Ludox 20-25, long oil alkyd 50-60, talcum powder 12-15, cobalt naphthenate 5-6, dimethylbenzene 10-15,2,6-
Three-level butyl -4- methylphenols 0.6-1, titanate coupling agent NDZ-101 0.5-0.9, nano-chitosan 6-8, nano-sized carbon 2-5,
α-Al2O3 micro mists 6-9, ethyl acetate 18-22, coalescents 3-4.
CN201480036182.6 discloses a kind of resin combination, it includes：Epoxy monomer；Phenolic resin, it is wrapped
Containing the compound with the construction unit represented by logical formula (I)；And filler；The filler is surveyed using laser diffractometry
In fixed particle diameter distribution, at least with 4 wave crests, and the wave crest be present in 0.01 μm less than 1 μm, more than 1 μm and
In each scope less than 10 μm, more than 10 μm and less than 50 μm and more than 20 μm and less than 100 μm, wherein, be present in 10 μm with
Wave crest in upper and less than 50 μm of scope contains aluminium oxide particles, is present in more than 20 μm and less than 100 μm of scope
Wave crest contains boron nitride particles, leads in formula (I), R1Represent alkyl, aryl or aralkyl；R2And R3Separately represent that hydrogen is former
Son, alkyl, aryl or aralkyl；M represents 0~2 number, and n represents 1~7 number；When m is 2,2 R1 can be identical, can also
It is different.
However, the existing research preparation process on Heat dissipation composition is complicated, radiating efficiency is not high.
The operating temperature of LED chip is more low better.However, in practical applications in order to obtain the LED of high brightness, on the one hand
The input power of chip can be improved, on the other hand can increase packaging density, but both approaches will cause LED chip work
It is obviously improved as temperature, the heat management of LED has become the severe challenge of its development, and there is an urgent need to excellent cooling measure to solve
The heat dissipation problem of LED.
The content of the invention
The present invention is in view of the foregoing, there is provided a kind of heat-dissipating resin composition for LED substrate and preparation method thereof,
The obtained heat-dissipating resin composition thermal conductivity factor for LED substrate is high, can preferably solve LED heat dissipation problems.
The inventors of the present invention by studying, analyse in depth repeatedly it turns out that, pass through the epoxy resin of specific structure and gold
Belong to combination of organic compounds, show excellent heat-conductive characteristic, this should have benefited from the orientation of the epoxy resin of specific structure
Property it is high, and when metallo-organic compound cures it form facilitation caused by well-regulated orderly, higher order structure,
Thus the present invention is completed
That is, the present invention provides following heat-dissipating resin composition for LED substrate and preparation method thereof.
Present invention firstly provides a kind of heat-dissipating resin composition for LED substrate, including the ring with formula (I) structure
Oxygen Resin A, metallo-organic compound MOF and curing agent,
Wherein, R, R being connected with N ' each stands alone as the alkyl of C1-C8, and following structures in compound A come from asphalt mixtures modified by epoxy resin
Fat CYD-128
It is further preferred that metallo-organic compound MOF is MOF-74, MOF-5, such as Mn-MOF-74, Co-MOF-74,
Zn-MOF-5、Ni-MOF-5。
It is further preferred that the containing ratio of metallo-organic compound MOF is 20-50 mass %, preferably 25-40 mass, more
It is preferred that 30 mass %.
It is further preferred that the containing ratio of the epoxy resin is 45 to 70wt%.
It is further preferred that the curing agent is 4,4- diaminodiphenylmethane (methylene dianiline), containing ratio for 5 to
10wt%.
It is further preferred that R, R for being connected with N ' straight chained alkyl of C1-C8 is each stood alone as, such as the straight chain of C2, C4, C6
Alkyl.
It is further preferred that n is 3,5,10,15.
The present invention further provides a kind of preparation method of the heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.1-1.2, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by vacuum distillation
Product is washed with distilled water, and is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, and R, R being connected with N ' each stands alone as the alkane of C1-C8
Base, reacts 2-3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 10-15min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), epoxy resin A is scattered in water or organic solvent, adds MOF, curing agent, mixes 10-20min, system
It is standby to obtain the heat-dissipating resin composition for LED substrate.
It is further preferred that metallo-organic compound MOF is MOF-74, MOF-5, such as Mn-MOF-74, Co-MOF-74,
Zn-MOF-5、Ni-MOF-5。
It is further preferred that the containing ratio of metallo-organic compound MOF is 20-50 mass %, preferably 25-40 mass, more
It is preferred that 30 mass %.
It is further preferred that the containing ratio of the epoxy resin is 45 to 70wt%.
It is further preferred that the curing agent is 4,4- diaminodiphenylmethane (methylene dianiline), containing ratio for 5 to
10wt%.
It is further preferred that R, R for being connected with N ' straight chained alkyl of C1-C8 is each stood alone as, such as the straight chain of C2, C4, C6
Alkyl.
Composition according to the present invention can further add various conventional additives, for example, selected from dispersant, leveling agent,
At least one of dispersion stabilizer, pH adjusting agent, antiprecipitant, surfactant, wetting agent and thickener additive.
Use for the heat-dissipating resin composition of the present invention, is coated on pending surface, and 120-140 DEG C solid
Change 10-30min, obtain required thickness such as 10-50 μm.
The heat-dissipating resin composition of the present invention, the resin of contained specific structure is that a kind of high molecular is orderly, deep
The polymer network of molecule cross-link is spent, monomer there is corresponding mesomorphic structure, have liquid crystal liquid crystal property, while saved after curing
Its liquid crystal liquid crystal property.In the present invention, MOF materials are introduced into the resin for making to be used in the present invention after solidification process, further shape
Into orderly higher order structure.The presence of this structure, dramatically improves the free path of phonon so that it has relatively high
Thermal conductivity.
Beneficial effect
According to the present invention, it is possible to provide have the thermal diffusivity resin group for being capable of providing the radiator structure with excellent heat dissipation performance
Compound.By using the heat-dissipating resin composition, the heat for making to produce from the light emitting diode is in LED head lamp week
Effect eradiation is with, without setting the machinery radiating structure of such as fan, so as to suppress the increase of temperature, and because
This, the LED head lamp can have the improved service life.
Embodiment
The present invention is described below in more detail to contribute to the understanding of the present invention.
It should be appreciated that the term or word that use in the specification and in the claims are not construed as having
The implication limited in dictionary, and be interpreted as on the basis of following principle having and its implication one in the context of the present invention
The implication of cause：The concept of term can be limited suitably by inventor for the best illustration to the present invention.
Embodiment 1
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.2, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C2 alkyl, C4 straight chains
Alkyl, reacts 2min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 10min, be cooled to room temperature, first
It is dried in vacuo after benzene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 60 mass % is dispersed in water, and adds Mn-MOF-74,10 matter of 30 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Embodiment 2
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.2, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C3 straight chained alkyls, C6
Straight chained alkyl, reacts 3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 13min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 70 mass % is dispersed in water, and adds Co-MOF-74,10 matter of 20 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Embodiment 3
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.1, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C4 straight chained alkyls, C6
Straight chained alkyl, reacts 3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 15min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 60 mass % is dispersed in water, and adds Zn-MOF-5,10 matter of 30 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Embodiment 4
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.1, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C8 straight chained alkyls, C6
Straight chained alkyl, reacts 3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 15min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 60 mass % is dispersed in water, and adds Ni-MOF-5,10 matter of 30 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Comparative example 1
Mn-MOF-74 is not added with being different only in that for embodiment 1.
Embodiment 5
The heat-dissipating resin composition of embodiment 1-4, comparative example 1 are applied on LED housings, 130 DEG C of curing 20min, obtain
To 40 μm of products of thickness, accelerated aging test is carried out under the conditions of 80 DEG C and 300W ultraviolet light irradiations, test result is as follows
Table 1：
1 degradation result of table
| Ageing-resistant time h | Thermal conductivity factor W/ (m DEG C) | |
| Embodiment 1 | 6000 | 320 |
| Embodiment 2 | 5980 | 305 |
| Embodiment 3 | 6210 | 300 |
| Embodiment 4 | 6080 | 290 |
| Comparative example 1 | 4000 | 220 |
As it can be seen that in the present invention, MOF materials are introduced into the resin for making to be used in the present invention after solidification process, into one
Step forms orderly higher order structure.The presence of this structure, dramatically improves the free path of phonon so that it is with phase
To high thermal conductivity.
The preferred embodiment for the present invention is the foregoing described, so it is not limited to the present invention.Those skilled in the art couple
Embodiment disclosed herein can carry out improvement and the change without departing from scope and spirit.
Claims (1)
1. a kind of heat-dissipating resin composition for LED substrate, including epoxy resin A, the metal with formula (I) structure are organic
Compound MOF and curing agent,
Wherein, R, R being connected with N ' each stands alone as the alkyl of C1-C8, and following structures in compound A come from epoxy resin
CYD-128
The containing ratio of the epoxy resin is 45 to 60wt%；
The curing agent is 4,4- diaminodiphenylmethane (methylene dianiline), and containing ratio is 5 to 10wt%；
N is 3,5,10,15；
The containing ratio of the metallo-organic compound MOF is 20-30wt%.
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| CN109370158A (en) * | 2018-10-26 | 2019-02-22 | 杭州如墨科技有限公司 | A kind of preparation method of LED lamp cup heat sink material |
| CN115210287A (en) * | 2020-03-31 | 2022-10-18 | 纳美仕有限公司 | Epoxy amine adduct, curing catalyst, resin composition, sealing material, adhesive, and cured product |
| CN114015199B (en) * | 2021-11-30 | 2023-09-15 | 安徽理工大学 | Wear-resistant epoxy resin composite material and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007284680A (en) * | 2006-04-18 | 2007-11-01 | Dongjin Semichem Co Ltd | Photocurable resin composition with excellent thermal conductivity |
| WO2011040415A1 (en) * | 2009-09-29 | 2011-04-07 | 日立化成工業株式会社 | Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
| WO2013177850A1 (en) * | 2012-05-31 | 2013-12-05 | 金发科技股份有限公司 | Resin composition with laser direct structuring function, preparation method thereof, and application of resin composition |
| CN106218192A (en) * | 2016-07-27 | 2016-12-14 | 重庆德凯实业股份有限公司 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
| CN106280274A (en) * | 2016-08-10 | 2017-01-04 | 袁春华 | A kind of preparation method of high thermally conductive LED fin |
-
2017
- 2017-06-22 CN CN201710481319.4A patent/CN107177167B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007284680A (en) * | 2006-04-18 | 2007-11-01 | Dongjin Semichem Co Ltd | Photocurable resin composition with excellent thermal conductivity |
| WO2011040415A1 (en) * | 2009-09-29 | 2011-04-07 | 日立化成工業株式会社 | Multilayer resin sheet and method for producing same, method for producing multilayer resin sheet cured product, and highly thermally conductive resin sheet laminate and method for producing same |
| WO2013177850A1 (en) * | 2012-05-31 | 2013-12-05 | 金发科技股份有限公司 | Resin composition with laser direct structuring function, preparation method thereof, and application of resin composition |
| CN106218192A (en) * | 2016-07-27 | 2016-12-14 | 重庆德凯实业股份有限公司 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
| CN106280274A (en) * | 2016-08-10 | 2017-01-04 | 袁春华 | A kind of preparation method of high thermally conductive LED fin |
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