CN107172816B - Method and system for creating DIP type part package - Google Patents
Method and system for creating DIP type part package Download PDFInfo
- Publication number
- CN107172816B CN107172816B CN201710469976.7A CN201710469976A CN107172816B CN 107172816 B CN107172816 B CN 107172816B CN 201710469976 A CN201710469976 A CN 201710469976A CN 107172816 B CN107172816 B CN 107172816B
- Authority
- CN
- China
- Prior art keywords
- dip
- package
- area
- pin
- placing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000005476 soldering Methods 0.000 claims abstract description 26
- 238000013461 design Methods 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000012827 research and development Methods 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000004904 shortening Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses a method of creating a DIP part package, the method comprising: placing the DIP type part on a printed circuit board model, setting a part limiting area in the package by taking a pin of the DIP type part as a center, setting a forbidden part rule facing a design of manufacturing in the part limiting area, and placing an SMD type part on the printed circuit board model according to the forbidden part rule; the method can avoid the problem of poor soldering caused by too short distance between parts from the origin, thereby improving the working efficiency, shortening the research and development period and enhancing the competitiveness of the storage product; the application also discloses a system for creating a DIP part package, which has the above beneficial effects.
Description
Technical Field
The present invention relates to printed circuit board manufacturing, and more particularly, to a method and system for creating a DIP type part package.
Background
The printed circuit board is also called PCB circuit board, which is a provider of electrical connection of electronic components. The design of the printed circuit board is mainly a layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.
With the improvement of the performance of storage products and the reduction of the product volume, the density of the PCB board is increased, and almost all storage main boards adopt a double-sided process. In the prior art, the DIP type part is welded by wave soldering, because the DIP type part and the SMD type part (surface mounted device) of the printed circuit board (as shown in fig. 1) with double-sided process are respectively placed on the upper surface and the lower surface, the pin of the DIP type part needs to be welded on the same plane with the SMD type part, when wave soldering is carried out, the carrier of the SMD type part can shield a part of the surrounding area, and the shielded area can not contact soldering tin. Therefore, when the pin distance between the SMD type component and the DIP type component is too close, the pin of the DIP type component is in the shielding region, which may cause poor soldering.
Therefore, how to solve the poor soldering of the DIP type parts of the printed circuit board is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The application aims to provide a method and a system for creating a DIP type part package, and the problem of poor soldering of the DIP type part of a printed circuit board is solved.
To solve the above technical problem, the present application provides a method and a system for creating a DIP type part package, the method comprising:
placing the DIP type part on a printed circuit board model;
setting a part limiting area in the package by taking the pin of the DIP type part as a center;
placing forbidden parts of a design facing manufacturing in the part limiting area regularly;
placing SMD type parts on the printed circuit board model according to the forbidden part rule.
Optionally, the step of setting a part limitation area in the package by centering on the pin of the DIP-type part includes:
determining the position relation between the connection line of the DIP type part and the SMD type part and the direction of the flow plate;
and setting the part limiting area in the package by taking the pin of the DIP type part as a center according to the position relation, wherein the flow plate direction is the movement direction of the printed circuit board model during wave soldering.
Optionally, when the position relationship is parallel, the setting the part limit region in the package centering on the pin of the DIP type part includes:
and establishing a closed loop by taking the pin as a center and expanding 160 mils outwards, and setting an area surrounded by the loop in the package as the part limiting area.
Optionally, when the positional relationship is vertical, the setting the part confinement region in the package centering on the pin of the DIP type part includes:
and expanding 100mil to establish a closed loop line by taking the pin as the center, and setting an area surrounded by the loop line as the part limiting area in the package.
The present application further provides a system for creating a DIP-type part package, the system comprising:
the DIP placing module is used for placing the DIP type part on a printed circuit board model;
a part limit region setting module for setting a part limit region in the package with a pin of the DIP type part as a center;
the forbidden part rule setting module is used for regularly setting forbidden parts facing the design of manufacture in the part limiting area;
and the SMD placing module is used for placing SMD type parts on the printed circuit board model according to the forbidden part rule.
Optionally, the part limitation region setting module includes:
the position relation judging unit is used for determining the position relation between a connection line of the DIP type part and the SMD type part and the direction of the flow plate;
and a part limit area setting unit configured to set the part limit area in the package with the pin of the DIP type part as a center according to the positional relationship, wherein a direction of the flow plate is a movement direction of the printed circuit board model during wave soldering.
Optionally, the part limitation area setting unit includes:
and the parallel limiting area setting subunit is used for establishing a closed loop by taking the pin as a center and expanding the pin by 160 mils when the position relations are parallel, and setting an area surrounded by the loop in the package as the part limiting area.
Optionally, the part limitation area setting unit includes:
and the vertical limiting area setting subunit is used for establishing a closed loop by taking the pin as a center and expanding 100 mils outwards when the position relationship is vertical, and setting an area surrounded by the loop in the package as the part limiting area.
The invention provides a method for packaging a DIP type part, which comprises the following steps of placing the DIP type part on a printed circuit board model; setting a part limiting area in the package by taking the pin of the DIP type part as a center, and setting a forbidden part rule facing to the design of manufacturing in the part limiting area; placing SMD type parts on the printed circuit board model according to the forbidden part rule.
The method sets a restricted area layer by taking the pin of DIP type parts as the center, the SMD type parts are placed outside the restricted area layer without causing poor soldering, the rule of forbidding the parts is set in the restricted area layer, and if the SMD type parts are placed in the area, the non-restricted area layer is selected. When SMD type part is placed outside the restricted area surface of layer, SMD type part has just kept safe distance with DIP type part, has avoided the bad problem of soldering tin because of the distance is too near between the part from the source to improve work efficiency, shorten research and development cycle, strengthen the competitiveness of storage product. The application also provides a system for creating the DIP type part package, which has the beneficial effects and is not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present application, the drawings needed for the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
FIG. 1 is a schematic view of a part undergoing wave soldering;
fig. 2 is a schematic diagram of a hardware environment in which a method for creating a DIP component package according to an embodiment of the present disclosure is located;
fig. 3 is a flowchart of a method for creating a DIP component package according to an embodiment of the present disclosure;
fig. 4 is a flow chart of another method of creating a DIP component package according to an embodiment of the present application;
fig. 5 is a flow chart of another method for creating a DIP component package according to an embodiment of the present application;
fig. 6 is a schematic view showing placement of the SMD type parts when the connection line between the DIP type parts and the SMD type parts shown in fig. 5 is perpendicular to or parallel to the flow plate direction;
fig. 7 is a schematic view showing the arrangement of the component restriction regions when the connection line between the DIP type component and the SMD type component shown in fig. 5 is perpendicular to or parallel to the flow plate direction;
fig. 8 is a schematic structural diagram of a system for creating a DIP component package according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The method and the system for creating the DIP type part package can be applied to the following hardware scenes:
referring to fig. 2, fig. 2 is a schematic diagram of a hardware environment in which a method for creating a DIP type component package provided in the present application is located, and the hardware environment includes a printed circuit board package center 101 and a printed circuit board manufacturing center 102.
The pcb package center 101 is a device for assembling the user ic into a chip final product, such as: the computer or the like to which the Altium Desinger or the protel99se is mounted is not particularly limited as long as it can package the printed circuit board according to a schematic diagram. The printed circuit board manufacturing center 102 is used for manufacturing the packaged printed circuit board in an actual product, wherein wave soldering is performed on the printed circuit board, and circuit parts are connected according to the wiring mode of the printed circuit board.
Referring to fig. 3, fig. 3 is a flowchart illustrating a method for creating a DIP type component package according to an embodiment of the present disclosure. The method comprises the following steps:
step S201: placing the DIP type part on a printed circuit board model;
the steps are carried out in computer software, and due to the fact that other parts are arranged on the printed circuit board model, when the DIP type parts are placed, the parts on the printed circuit board model are uniformly distributed as far as possible, and the problem that one part is too compact and the other part is too sparse is solved. DIP (Dual In-line Package), which is called Dual In-line Package, has two rows of pins, and is required to be inserted into a chip socket having a DIP structure, or may be directly inserted into a circuit board having the same number of solder holes and geometric arrangement for soldering. Since the DIP type parts have pins, soldering of the pins is performed on the back surface of the board surface of the printed circuit board on which the DIP type parts are placed.
Step S202: setting a part limiting area in the package by taking a pin of the DIP type part as a center;
wherein the part limit area (Lead _ Bot _ Smd) is an area where placement of the SMD type part is prohibited. Because the DIP type part has two rows of pins, each pin is used as the center to define a range, and the union of all ranges is taken as a part limiting area, so that the welding of the pins of the DIP type part is not influenced when the SMD type part is placed outside the part limiting area. Of course, any shape can be used to define the range, but for convenience of design and manufacture, a circular range can be defined by taking the pin as a center, and a union of all the circular ranges is set as a part limiting area. It can be understood that, because the intersection of the circle and the circle is a narrow triangle-like region which is a union of all the circle ranges, the region can be used for placing other parts theoretically, but the other parts occupy a certain area and cannot be placed in a narrow region in actual manufacturing, so that the part limiting region can be optimized to be in a smoother shape.
Step S203: placing forbidden parts of a design facing manufacturing in the part limiting area regularly;
design for manufacturing (DFM) refers to a product Design that needs to meet the requirements of product manufacturing and has good manufacturability, so that the product can be manufactured with the lowest cost, the shortest time and the highest quality.
The Rule of forbidden components (Rule) is a Rule that placement of components is forbidden in a designated area when designing a printed circuit board model, and a safe distance is kept between the Rule and a pin of a DIP type component when placing an SMD type component due to limitation of the Rule of forbidden components, thereby fundamentally solving the problem of poor soldering.
In this embodiment, the design for manufacturing refers to the design of a printed circuit board model, and on the basis of the design, a rule for prohibiting component placement may be set in a certain region of the printed circuit board model, so that the region becomes a component-restricted region, i.e., an SMD type component cannot be placed in the region.
Step S204: placing SMD type parts on the printed circuit board model according to a part forbidden rule;
since the DIP type part is placed first and then the forbidden part rule is set, the forbidden part rule does not limit the placement of the DIP type part. When the SMD type component is placed, the placement position of the SMD type component is limited by the placement prohibition component rule, that is, the SMD type component cannot be placed in the region where the placement prohibition component rule is set, that is, the SMD type component must be placed outside the component restriction region where the placement prohibition component rule is set. The SMD type component can be placed in any area outside the component restriction area, but it is sufficient that the SMD type component is placed in a suitable position near the component restriction area in consideration of the wiring problem and the requirement of uniformity of the circuit board components, and the placement position of the SMD type component is not otherwise limited herein.
Referring now to fig. 4, fig. 4 is a flow chart of another method for creating a DIP component package according to an embodiment of the present application.
In this embodiment, based on the above embodiment, the size of the component restriction area is determined according to the positional relationship between the connection line between the DIP type component and the SMD type component and the direction of the flow plate, and the placement position of the SMD component is determined.
The specific steps may include:
step S301: the DIP type part was placed on a printed circuit board model.
Step S302: setting the part limiting area in the package by taking the pin of the DIP type part as a center according to the position relation of the connection line of the DIP type part and the SMD type part and the direction of a flow plate;
the printed circuit board is welded in the wave-soldering machine by wave-soldering, and the moving direction is called as the flow plate direction. It should be noted that the flow plate direction is not perpendicular to the solder ejection direction, but an obtuse angle is formed between the flow plate direction and the solder ejection direction, which may cause shielding between circuit components, and poor soldering may occur.
Of course, in the process of flowing the flow plate, the shielding condition between the circuit parts is caused by two factors, namely the distance between the parts on one hand and the position relationship between the connecting line between the parts and the direction of the flow plate on the other hand. Wherein, DIP type part and SMD part are placed on same printed circuit board, and the two is not at the coplanar, but the pin and the SMD type part of DIP type part are on the coplanar, and the wave-soldering in this step is to welding the pin of DIP type part, therefore, shelters from that the SMD type part actually produced in the wave-soldering shelters from the pin of DIP type part. It is understood that the connection between the DIP type part and the SMD type part in this step is actually a connection between the center of the lead of the DIP type part and the center of the SMD type part.
It can be understood that when the connecting line between the circuit parts is parallel to the flow plate direction, the shielding area between the circuit parts is the largest; when the connecting line between the circuit parts is vertical to the direction of the flow plate, the shielding area between the circuit parts is the minimum; when the connecting line between the circuit parts is not parallel or perpendicular to the flow plate direction, the shielding area between the circuit parts is between the maximum shielding area and the minimum shielding area, the shielding area at the moment can be obtained through geometric calculation or experimental data, the calculation method of the shielding area is not limited, and the part limiting area can be defined according to the maximum shielding area when specific data are uncertain.
Step S303: and regularly arranging forbidden parts to the manufactured design in the part limiting area.
Step S304: placing SMD type parts on the printed circuit board model according to the forbidden part rule.
Referring to fig. 5, fig. 5 is a flowchart illustrating another method for creating a DIP component package according to an embodiment of the present disclosure. In this embodiment, on the basis of the above embodiment, when the connection line between the DIP type component and the SMD type component is parallel to the direction of the flow plate, the size of the component restriction area is determined, and the placement position of the SMD component is further determined.
The specific steps may include:
step S401: the DIP type part was placed on a printed circuit board model.
Step S402: when the DIP type part and the SMD type part are connected in a direction parallel to the flow plate, 160mil outward expansion is conducted by taking the pin as the center to establish a closed loop, and the area surrounded by the loop is set as the part limiting area in the package.
This step is substantially the same as the step S302, and is not described herein again.
Step S403: placing forbidden parts of a design facing manufacturing in the part limiting area regularly;
step S404: placing SMD type parts on the printed circuit board model according to the forbidden part rule.
The embodiment of the application also provides a method for creating the DIP part package. In this embodiment, based on the above embodiment, when the DIP type component is perpendicular to the SMD type component connection line and the flow plate direction, the size of the component limitation area is determined, and the placement position of the SMD component is further determined.
Referring to fig. 6 and 7, fig. 6 is a schematic diagram showing placement of the SMD type component when the connection line between the DIP type component and the SMD type component is perpendicular to or parallel to the flow plate direction; fig. 7 is a schematic diagram showing the arrangement of the component restriction regions when the connection line between the DIP type component and the SMD type component is perpendicular or parallel to the direction of the flow plate.
Since the embodiment of the system part corresponds to the embodiment of the method part, the embodiment of the system part is described with reference to the embodiment of the method part, and is not repeated here.
Referring to fig. 8, fig. 8 is a schematic structural diagram of a system for creating a DIP type component package according to the present application, where the system may include:
a DIP placement module 100 for placing the DIP type part on a printed circuit board model;
a part limit region setting module 200 for setting a part limit region in the package centering on a pin of the DIP type part,
a forbidden part rule setting module 300, which sets the design forbidden part rule facing the manufacturing in the part limitation area;
an SMD placing module 400 for placing SMD type parts on the printed circuit board according to the Rule of Rule (forbidden parts Rule);
in addition, in another system for creating a DIP type component package provided in the embodiment of the present application, a method for defining a component limitation area is provided, so that the problem of poor soldering is more effectively avoided.
Further, the parts limitation area setting module 200 includes:
a position relation determining unit 210, configured to determine a position relation between a connection line between the DIP type component and the SMD type component and a direction of the flow plate;
the component limitation region setting unit 220 sets the component limitation region in the package with the pin of the DIP type component as a center according to the position relationship, wherein the flow plate direction is a movement direction of the printed circuit board during wave soldering.
In addition, the embodiment of the application also provides a system for creating a DIP type part package, and the method for defining the part limiting area is specified under two special conditions, so that the problem of poor soldering is effectively avoided.
Further, the part limit region setting unit 220 includes:
and a parallel restriction region setting subunit 221, configured to, when the position relationships are parallel, establish a closed loop by taking the pin as a center and expanding by 160 mils, and set an area surrounded by the loop in the package as the part restriction region.
Further, the part limit region setting unit 220 includes:
and a parallel confinement region setting subunit 222, configured to, when the position relationship is vertical, set up a closed loop line by taking the pin as a center and expanding by 100 mils, and set an area surrounded by the loop line as the part confinement region in the package.
A method and system for creating a DIP type part package provided by the present application is described in detail above. The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (8)
1. A method of creating a DIP-type part package, the method comprising:
placing the DIP type part on a printed circuit board model;
setting a part limiting area in the package by taking the pin of the DIP type part as a center; the part limiting area is formed by taking a union of all ranges and defining a range by taking each pin of the DIP type part as a center, so that the welding of the pins of the DIP type part is not influenced when the SMD type part is placed outside the part limiting area;
placing forbidden parts of a design facing manufacturing in the part limiting area regularly; the rule for forbidding placing parts is a rule for forbidding placing parts in a specified area when a printed circuit board model is designed;
placing SMD type parts on the printed circuit board model according to the forbidden part rule.
2. The method of claim 1, wherein placing a part confinement region in the package centered around the pin of the DIP-type part comprises:
determining the position relation between the connection line of the DIP type part and the SMD type part and the direction of the flow plate;
and setting the part limiting area in the package by taking the pin of the DIP type part as a center according to the position relation, wherein the flow plate direction is the movement direction of the printed circuit board during wave soldering.
3. The method of claim 2, wherein when the positional relationship is parallel, placing the part confinement region in the package centered around the pins of the DIP-type part comprises:
and establishing a closed loop by taking the pin as a center and expanding 160 mils outwards, and setting an area surrounded by the loop in the package as the part limiting area.
4. The method of claim 2, wherein when the positional relationship is vertical, placing the part confinement region in the package centered on the pin of the DIP-type part comprises:
and expanding 100mil to establish a closed loop line by taking the pin as the center, and setting an area surrounded by the loop line as the part limiting area in the package.
5. A system for creating a DIP-type part package, the system comprising:
the DIP placing module is used for placing the DIP type part on a printed circuit board model;
a part limit region setting module for setting a part limit region in the package with a pin of the DIP type part as a center; the part limiting area is formed by taking a union of all ranges and defining a range by taking each pin of the DIP type part as a center, so that the welding of the pins of the DIP type part is not influenced when the SMD type part is placed outside the part limiting area;
the forbidden part rule setting module is used for regularly setting forbidden parts facing the design of manufacture in the part limiting area; the rule for forbidding placing parts is a rule for forbidding placing parts in a specified area when a printed circuit board model is designed;
and the SMD placing module is used for placing SMD type parts on the printed circuit board model according to the forbidden part rule.
6. The system of claim 5, wherein the parts limit zone setup module comprises:
the position relation judging unit is used for determining the position relation between a connecting line of the DIP type part and the SMD type part and the direction of the flow plate;
and a part limit area setting unit configured to set the part limit area in the package with the pin of the DIP type part as a center according to the positional relationship, wherein a direction of the flow plate is a movement direction of the printed circuit board when performing wave soldering.
7. The system of claim 6, wherein the part limit area setting unit comprises:
and the parallel limiting area setting subunit is used for establishing a closed loop by taking the pin as a center and expanding the pin by 160 mils when the position relations are parallel, and setting an area surrounded by the loop in the package as the part limiting area.
8. The system of claim 6, wherein the part limit area setting unit comprises:
and the vertical limiting area setting subunit is used for establishing a closed loop by taking the pin as a center and expanding 100 mils outwards when the position relationship is vertical, and setting an area surrounded by the loop in the package as the part limiting area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710469976.7A CN107172816B (en) | 2017-06-20 | 2017-06-20 | Method and system for creating DIP type part package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710469976.7A CN107172816B (en) | 2017-06-20 | 2017-06-20 | Method and system for creating DIP type part package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107172816A CN107172816A (en) | 2017-09-15 |
| CN107172816B true CN107172816B (en) | 2020-03-06 |
Family
ID=59818961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710469976.7A Active CN107172816B (en) | 2017-06-20 | 2017-06-20 | Method and system for creating DIP type part package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107172816B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN101582094A (en) * | 2008-05-14 | 2009-11-18 | 英业达股份有限公司 | Through hole arrangement system and through hole arrangement method |
| CN104681458A (en) * | 2013-11-27 | 2015-06-03 | 广东美的制冷设备有限公司 | Double-row pin integrated circuit chip encapsulation structure and encapsulation design method |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
-
2017
- 2017-06-20 CN CN201710469976.7A patent/CN107172816B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1620228A (en) * | 2003-11-21 | 2005-05-25 | 华为技术有限公司 | Method of realizing local crest welding and printed circuit board |
| CN101582094A (en) * | 2008-05-14 | 2009-11-18 | 英业达股份有限公司 | Through hole arrangement system and through hole arrangement method |
| CN104681458A (en) * | 2013-11-27 | 2015-06-03 | 广东美的制冷设备有限公司 | Double-row pin integrated circuit chip encapsulation structure and encapsulation design method |
| CN106852020A (en) * | 2017-02-21 | 2017-06-13 | 郑州云海信息技术有限公司 | A kind of manufacture method of raising PCBA production efficiencys |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107172816A (en) | 2017-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9312237B2 (en) | Integrated circuit package with spatially varied solder resist opening dimension | |
| US9629241B2 (en) | Printed circuit board, ball grid array package and wiring method of printed circuit board | |
| CN102543765B (en) | Method for designing bonding pad of surface mounted component, bonding pad structure and printing circuit board | |
| EP3641510B1 (en) | Systems and methods for providing a high speed interconnect system with reduced crosstalk | |
| EP2624668A1 (en) | Integrated module, integrated system board, and electronic device | |
| CN107197595B (en) | Printed circuit board and welding design thereof | |
| CN107172816B (en) | Method and system for creating DIP type part package | |
| US8787033B2 (en) | Electronic component and electronic device | |
| WO2021135360A1 (en) | Printed circuit board and manufacturing method therefor, and terminal | |
| US8633398B2 (en) | Circuit board contact pads | |
| US20190150334A1 (en) | Fine pitch component placement on printed circuit boards | |
| CN110519918B (en) | Circuit board and electronic equipment | |
| CN110377978B (en) | Method and system for placing 0402 resistor under BGA package in PCB design | |
| CN114118003A (en) | Method and device for detecting tin on wave-soldering part | |
| US7180171B1 (en) | Single IC packaging solution for multi chip modules | |
| CN114189987A (en) | PCB and manufacturing method thereof | |
| CN102291974B (en) | Cutting side positioning type welding structure and method for preventing pins from shifting | |
| CN110933866A (en) | PCB device welding method and device | |
| CN109740231A (en) | A kind of SMT precision positioning calculation method and Related product | |
| CN220106939U (en) | Connecting device and electronic equipment | |
| CN111246669B (en) | Design method of LPDDR substrate, LPDDR substrate and electronic equipment | |
| US9159697B2 (en) | Method for forming voids of structure | |
| CN107960010B (en) | Printed circuit board and welding design thereof | |
| CN117835522A (en) | Encryption circuit board, sealing-added plate and packaging module detection method | |
| CN203707113U (en) | Chip being capable of raising welding passing rate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |