CN107146652A - A kind of copper electrocondution slurry and its production and use - Google Patents
A kind of copper electrocondution slurry and its production and use Download PDFInfo
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- CN107146652A CN107146652A CN201710283245.3A CN201710283245A CN107146652A CN 107146652 A CN107146652 A CN 107146652A CN 201710283245 A CN201710283245 A CN 201710283245A CN 107146652 A CN107146652 A CN 107146652A
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- copper
- electrocondution slurry
- slurry
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
Abstract
The present invention provides a kind of copper electrocondution slurry, the following raw material components of copper electrocondution slurry and weight/mass percentage composition：It is coated with 65 ~ 90wt% of Micron Copper Powder of Nanometer Copper bisque；0.1 ~ 5wt% of dispersant；Solvent 9 ~ 34%.A kind of copper electrocondution slurry of the present invention uses Micron Copper Powder as host conductive filler, cheap, and bulk density is high, and electronics conduction efficiency is high；Micron Copper Powder Surface coating has one layer of Nanometer Copper, and Nanometer Copper is uniformly dispersed, it is easy to sinter；By directly carrying out light sintering after silk-screen printing, technique is simple and suitable for large-scale production；Line resistance after sintering is low, and bending resistance is high；By adding stabilizer in system, the reductive copper oxide in sintering process reduces the content of cupric oxide in copper cash, obtains the conducting wire of suboxides copper content.
Description
Technical field
The present invention relates to a kind of electric slurry, more particularly to a kind of flashing light based on nanometer copper clad micron copper sinters electricity
Sub- slurry.
Background technology
It is the focus direction studied at present to prepare conductive copper paste instead of conductive silver paste using Nanometer Copper, in particular with flashing light
The technology of Nanometer Copper slurry is sintered, copper conductive traces can be obtained on thermo-responsive base material.Flashing light sintering is a kind of novel electron
Slurry sintering technology, it is that solidification sintering is carried out to nano material slurry using the pulsed light of wide spectrum, high-energy and is printed
The physical property of brush electronic device, its principle is mainly high-energy photon and interacted with nano particle so that nanoparticle absorbance
Mutually aggregation fusion, forms functional membranes after energy.Flashing light sintering Nanometer Copper slurry prepares the extensive of conducting wire technology
Using still having many deficiencies：1) nano-particle is easily aoxidized, and electric slurry is difficult to stable preservation；Need strict control sintering
Condition,；2) cause the contact point in circuit many using nano-particle, be unfavorable for preparing the conducting wire of low-resistivity；3) it is simple
Higher using the manufacturing cost of copper nano-particle, the superiority of effectiveness compared to silver powder is not notable.And use Micron Copper Powder to carry out
Sintering, because the fusing point of copper powder is higher, can only realize local fusing, degree of fusion is small, the adhesion between particle between particle
It is weak, cause sintering after circuit bending resistance it is poor, wear no resistance.
The content of the invention
The shortcoming of prior art, nanometer copper clad micron is based on it is an object of the invention to provide one kind in view of the above
The flashing light sintering electric slurry of copper, for solving flashing light sintering in the prior art, electric slurry conductance is low and not resistant to bending asks
Topic.
In order to achieve the above objects and other related objects, the application is achieved by the following technical solution.
The present invention provides a kind of copper electrocondution slurry, and the copper electrocondution slurry includes following raw material components and weight percent contains
Amount：
It is coated with 65~90wt% of Micron Copper Powder of Nanometer Copper bisque
0.1~5wt% of dispersant
Solvent 9~34%.
Preferably, the weight percentage of the Micron Copper Powder for being coated with Nanometer Copper bisque is 70~85wt%.It is more excellent
Selection of land, the weight percentage of the Micron Copper Powder for being coated with Nanometer Copper bisque is 77~82wt%.
Preferably, the weight percentage of solvent is 10~30wt%.It is highly preferred that the weight percentage of solvent is 14
~19wt%.
Preferably, the weight percentage of dispersant is 0.8~2.5wt%.
Preferably, the weight percentage of solvent is 14~19wt%.
There is more research in the technology of micron particles Surface coating nanostructured, nanometer copper clad micron copper can lead to
Cross the electronation mantoquita preparation on micron copper surface.Chen Qingchun exists《It is prepared by the hydro-thermal of special appearance Micron Copper Powder》One literary middle finger
Go out, by the use of D- sorbs (sugar) alcohol as reducing agent, using anhydrous cupric sulfate as copper source, using hydro-thermal method can synthetic surface have Asia
The polyhedral structure copper powder of micron particles cladding.Number of patent application 200810025661.4 discloses one kind and contains Nano grade table
The micrometer silver-copper granule of face structure, silver powder, silver-coated copper powder or silver-copper mixed powder is scattered in a solvent, then use reproducibility
Compound makes silver salt be reduced to nano-silver powder, and is deposited on the stromal surface, finally refilters, dries, obtains containing nanometer
The micrometer silver-copper granule of rank surface texture.It can realize that copper nanoparticle coats the preparation of Micron Copper Powder by chemical reduction method,
As one of which implementation method, in the mixed liquor that Micron Copper Powder is dispersed in second alcohol and water, high-speed stirred, and according to mol ratio
1:2 add mantoquita (copper nitrate, copper sulphate) and sodium hydroxide, and the aqueous ascorbic acid of equimolar amounts, stirring is then added dropwise
30min, is added dropwise hydrazine hydrate until solution blackening or kermesinus, stops stirring, centrifuge and obtained with ethanol washing and filtering
The Micron Copper Powder of nanometer copper clad.
Preferably, the thickness of the Nanometer Copper bisque is 10~300nm.
Preferably, the raw material components of the copper electrocondution slurry include the adhesive no more than 5wt%, and described adhesive is selected from
Acrylic resin, polyurethane, hydroxyethyl cellulose, hydroxypropyl cellulose, hydroxyethyl hydroxypropyl base cellulose, gelatin, Arab tree
One or more in glue, peregal, polyethylene glycol, polyvinyl alcohol.Preferably, the acrylic resin is that can be dissolved in water
Water-based acrylic resin, the polyurethane is can be dissolved in the aqueous polyurethane of water.It is highly preferred that the copper electrocondution slurry
Raw material components include the adhesive no more than 2.5wt%.It is highly preferred that the raw material components of the copper electrocondution slurry include (0.8~
2.5) wt% adhesive.
Preferably, the raw material components of the copper electrocondution slurry include the stabilizer no more than 3wt%, and the stabilizer is hydroxyl
One kind in guanidine-acetic acid, lactic acid, citric acid, malic acid, glucose, glycine, ascorbic acid, glutaraldehyde, binary amine stabiliser
Or it is a variety of.Preferably, the raw material components of the copper electrocondution slurry include 1~2.5wt% stabilizer.
Preferably, the particle diameter of the Micron Copper Powder is 0.5~3 μm.Preferably, the particle diameter of the Micron Copper Powder is 0.8~3
μm.The copper powder can select spherical, polyhedron, dendroid, sheet or other irregular shapes, and preferably multi-plane shape is near
Spherical copper powder, the i.e. subsphaeroidal particle with more planar profile, particle are mainly made up of the crystal grain of large-size, grain development
It is more perfect.
Dispersant can improve the oxidation resistance of copper powder in Copper Powder Surface formation organic coating.Preferably, it is described scattered
Agent is selected from polyvinylpyrrolidone, cetyl trimethylammonium bromide, polyethylene glycol, MEA, diethanol amine, three ethanol
One or more in amine, straight chained alkyl ether, hexylamine, octylame and 2-amino-2-methyl-1-propanol..
The solvent can be the mixed solvent of single solvent or low boiling point solvent and high boiling solvent.It is preferred that
Ground, the boiling point of the solvent is 100~300 DEG C.Preferably, the solvent be selected from water, propane diols, isopropanol, diethylene glycol (DEG), three is sweet
Alcohol, diethylene glycol methyl ether, terpinol, glycol monoethyl ether, ethylene glycol monoethyl ether, diglycol, ethylene glycol, glycerine, DBE
With the one or more in DPM.
Present invention also offers the preparation method of copper electrocondution slurry, comprise the steps of：
By the well mixed acquisition slurry of each raw material components, add slurry into discharging after three-roll grinder milled processed and obtain copper
Electrocondution slurry.
The invention also discloses the purposes of the copper electrocondution slurry, the electrocondution slurry is used to form RFID tag,
The conductive material of the electrode of sensor, printed circuit board (PCB), touch-screen, solar cell or PDP.
The invention also discloses a kind of forming method of conducting wire, the conducting wire is conductive using copper as described above
Slurry forms pattern on thermo-responsive base material, dries and is obtained through the sintering that glistens.Preferably, by silk-screen printing, intaglio printing,
The mode of flexographic printing, ink jet printing, dip-coating or spraying is in paper, PET, and pattern is formed on the thermo-responsive base material such as PC or PI.More
Preferably, drying temperature is 80~150 DEG C.Preferably, drying time is no more than 60min.Preferably, flash of light sintering energy is 5
~15J/cm2。
The invention also discloses a kind of conducting wire, prepared by method described above.
Scattered uniformity between nano-particle and micro particles is a big problem, nano-particle due to surface-active compared with
Height, easily reunites, it is difficult in the gap being dispersed between Micron Copper Powder particle during scattered.Reunite simultaneously
Volume contraction occurs in sintering process for part so that occurs larger space between Micron Copper Powder, is unfavorable for circuit on the contrary and leads
The raising of electrical property.Dispersing uniformity is poor, can cause the unstable of circuit consistency and electric conductivity.
Based on Micron Copper Powder, while the technology for adding nano-particle preparation copper electrocondution slurry is expected to combine both excellent
Gesture：Micro particles volume contraction in sintering process is small, and internal crystal structure is perfect, electric transmission efficiency high, and nano-particle
On the one hand the space between micro particles can be filled, another aspect sintering temperature is low, it is easy to fusion recrystallization, can be with after sintering
Micro particles are closely connected, so as to obtain high conductivity, conducting wire resistant to bending.
A kind of copper electrocondution slurry of the present invention, with advantages below：
1. using Micron Copper Powder as host conductive filler, cheap, bulk density is high, and electronics conduction efficiency is high；
2. Micron Copper Powder Surface coating has one layer of Nanometer Copper, Nanometer Copper is uniformly dispersed, it is easy to sinter；
3. directly carrying out light sintering after printing, technique is simple and suitable for large-scale production.
4. the line resistance after sintering is low, bending resistance is high.
5. by adding stabilizer in system, the reductive copper oxide in sintering process reduces cupric oxide in copper cash
Content, obtains the conducting wire of suboxides copper content.
Brief description of the drawings
Fig. 1 is shown as being coated with the Micron Copper Powder scanning electron microscopic picture of Nanometer Copper bisque.
Embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book understands other advantages and effect of the present invention easily.
Before the specific embodiment of the invention is further described, it should be appreciated that protection scope of the present invention is not limited to down
State specific specific embodiment；It is also understood that the term used in the embodiment of the present invention is specific specific in order to describe
Embodiment, the protection domain being not intended to be limiting of the invention.The test method of unreceipted actual conditions in the following example,
Generally according to normal condition, or according to the condition proposed by each manufacturer.
When embodiment provides number range, it should be appreciated that except non-invention is otherwise noted, two ends of each number range
Any one numerical value can select between point and two end points.Unless otherwise defined, in the present invention all technologies for using and
Scientific terminology is identical with the meaning that those skilled in the art of the present technique are generally understood that.Except the specific method used in embodiment, equipment,
Outside material, according to those skilled in the art to the grasp of prior art and the record of the present invention, it can also use and this
Any method, equipment and the material of the similar or equivalent prior art of method, equipment described in inventive embodiments, material come real
The existing present invention.
Embodiment 1
Ethylene glycol ethyl ether is weighed respectively, and then diethylene glycol (DEG), glycerine 2.5g, 3.5g, 1g addition beaker weighs PVP 0.4g,
Aqueous polyurethane emulsion (resin content is 35wt% aqueous dispersions) 1.14g, ascorbic acid 0.5g, uses magnetic stirrer
60min, obtains homogeneous solution.Weighing a nanometer copper clad Micron Copper Powder, (average grain diameter 1um is coated with the micron of Nanometer Copper bisque
Copper powder) 40g, it is added step-wise in above-mentioned solution, stirs simultaneously, finally gives the copper slurry of certain viscosity.Gained copper slurry is existed
Scattered 10min is mixed on three-roll grinder, uniform copper slurry is obtained.
Using the mode of silk-screen printing by the printing of copper slurry on a pet film, track is had a lot of social connections 1mm, long 150mm (long 40mm, it is wide
7mm coil pattern), 100 DEG C of baking 20min of baking oven carry out flash of light sintering, pulse width 2ms, three arteries and veins using xenon flash lamp
Punching, sintering energy 7J/cm2, test resistance is 2.2 Ω, and equivalent sheet resistance is 14.6m Ω/, according to ASTM D3359 standard testings
Sample adhesive force reaches 5B grades.Sample one end is fixed, one end 90-degree bent, 10 times repeatedly, measure resistance for 3.4 Ω.
Comparative example 1
Micron Copper Powder is selected in the present embodiment, its is uncoated Nanometer Copper bisque.
Ethylene glycol ethyl ether is weighed respectively, and then diethylene glycol (DEG), glycerine 2.5g, 3.5g, 1g addition beaker weighs PVP 0.4g,
Aqueous polyurethane emulsion (resin content is 35wt% aqueous dispersions) 1.14g, ascorbic acid 0.5g, uses magnetic stirrer
60min, obtains homogeneous solution.Micron Copper Powder (1 μm of the average grain diameter) 40g for not being coated with Nanometer Copper bisque is weighed, is progressively added
Enter into above-mentioned solution, stir simultaneously, finally give the copper slurry of certain viscosity.Gained copper slurry is mixed on three-roll grinder
Scattered 10min, obtains uniform copper slurry.
Using the mode of silk-screen printing by the printing of copper slurry on a pet film, track is had a lot of social connections 1mm, long 150mm (long 40mm, it is wide
7mm coil pattern), 100 DEG C of baking 20min of baking oven carry out flash of light sintering, pulse width 2ms, three arteries and veins using xenon flash lamp
Punching, sintering energy 8J/cm2, test resistance is 3.3 Ω, and equivalent sheet resistance is 22m Ω/, according to ASTM D3359 standard testing samples
Product adhesive force reaches 5B grades.Sample one end is fixed, one end 90-degree bent, 5 times repeatedly, measure resistance for 130 Ω, it is further curved
Folding can cause its non-conductive.Can clearly it be found very much by above-mentioned contrast, the circuit bending resistance in comparative example 1 is poor.
Embodiment 2
Ethylene glycol ethyl ether is weighed respectively, and then diethylene glycol (DEG), glycerine 3.5g, 3.5g, 1g addition beaker weighs PVP 0.6g,
Aqueous polyurethane emulsion (resin content is 35wt% aqueous dispersions) 2.4g, ascorbic acid 1.2g, uses magnetic stirrer
60min, obtains homogeneous solution.Nanometer copper clad Micron Copper Powder (average grain diameter 1um) 50g is weighed, above-mentioned solution is added step-wise to
In, stir simultaneously, finally give the copper slurry of certain viscosity.Gained copper slurry is mixed into scattered 20min on three-roll grinder, obtained
To uniform copper slurry.
Using the mode of silk-screen printing by the printing of copper slurry on a pet film, track is had a lot of social connections 1mm, long 150mm (long 40mm, it is wide
7mm coil pattern), 100 DEG C of baking 20min of baking oven carry out flash of light sintering, pulse width 2ms, three arteries and veins using xenon flash lamp
Punching, sintering energy 7J/cm2, test resistance is 3.5 Ω, and equivalent sheet resistance is 23.3m Ω/, according to ASTM D3359 standard testings
Sample adhesive force reaches 4B grades.Sample one end is fixed, one end 90-degree bent, 10 times repeatedly, measure resistance for 9.0 Ω.
Embodiment 3
Glycol monoethyl ether is weighed respectively, and propane diols, glycerine 4g, 4g, 4g add beaker, then weigh PVP 1g, aqueous
Polyaminoester emulsion (resin content is 35wt% aqueous dispersions) 3g, glucose 2g, uses magnetic stirrer 60min, obtains
Homogeneous solution.A nanometer copper clad Micron Copper Powder (1 μm of average grain diameter) 65g is weighed, is added step-wise in above-mentioned solution, stirs simultaneously
Mix, finally give the copper slurry of certain viscosity.Gained copper slurry is mixed into scattered 20min on three-roll grinder, obtains uniform
Copper is starched.
Copper slurry is printed on plain copying paper using the mode of silk-screen printing, track is had a lot of social connections 1mm, long 150mm is (long
40mm, wide 7mm coil pattern), 90 DEG C of baking oven baking 30min carry out flash of light sintering using xenon flash lamp, pulse width 2ms,
Two pulses, sintering energy 10J/cm2, test resistance is 5.2 Ω, and equivalent sheet resistance is 34.6m Ω/, according to ASTM D3359
Standardized test specimen adhesive force reaches 4B grades.Sample one end is fixed, one end 90-degree bent, 10 times repeatedly, it is 18 to measure resistance
Ω。
Embodiment 4
Diethylene glycol methyl ether is weighed respectively, and diethylene glycol (DEG) 6g, 6g add beaker, then weigh PVP 1.5g, ascorbic acid 0.8g,
Magnetic stirrer 60min is used, homogeneous solution is obtained.Weigh nanometer copper clad Micron Copper Powder (an average grain diameter 1um, polyhedron
Nearly chondritic) 50g, it is added step-wise in above-mentioned solution, stirs simultaneously, finally gives the copper slurry of certain viscosity.By gained
Copper slurry mixes scattered 20min on three-roll grinder, obtains uniform copper slurry.
Copper slurry is printed on plain copying paper using the mode of silk-screen printing, track is had a lot of social connections 1mm, long 150mm is (long
40mm, wide 7mm coil pattern), 120 DEG C of baking 25min of baking oven carry out flash of light sintering, pulse width using xenon flash lamp
2ms, three pulses, sintering energy 9J/cm2, test resistance is 3.0 Ω, and equivalent sheet resistance is 20.0m Ω/, according to ASTM
D3359 standardized test specimen adhesive force reaches 5B grades.Sample one end is fixed, one end 90-degree bent, 10 times repeatedly, measure resistance
For 3.8 Ω.
Embodiment 5
Ethylene glycol ethyl ether is weighed respectively, and diethylene glycol (DEG), diethanol amine 3g, 3g, 3g add beaker, then weigh polyvinyl pyrrole
Alkanone 1g, polyvinyl alcohol 1.5g, ascorbic acid 1g, use magnetic stirrer 60min, obtain homogeneous solution.Weigh Nanometer Copper
Micron Copper Powder (1 μm of average grain diameter) 50g is coated, is added step-wise in above-mentioned solution, stirs simultaneously, has finally given certain viscosity
Copper slurry.Gained copper slurry is mixed into scattered 20min on three-roll grinder, uniform copper slurry is obtained.
Using the mode of silk-screen printing by the printing of copper slurry on a pet film, track is had a lot of social connections 1mm, long 150mm (long 40mm, it is wide
7mm coil pattern), 80 DEG C of baking 40min of baking oven carry out flash of light sintering, pulse width 2ms, two arteries and veins using xenon flash lamp
Punching, sintering energy 10J/cm2, test resistance is 5.5 Ω, and equivalent sheet resistance is 36.6m Ω/, is surveyed according to ASTM D3359 standards
Test agent adhesive force reaches 4B grades.Sample one end is fixed, one end 90-degree bent, 10 times repeatedly, measure resistance for 13 Ω.
Embodiment 6
Ethylene glycol is weighed respectively, and then diethylene glycol (DEG), water 4g, 4g, 4g addition beakers weigh gelatin 2.0g, polyethylene glycol
1.5g, ascorbic acid 1.5g, use magnetic stirrer 120min, obtain homogeneous solution.Weigh a nanometer copper clad Micron Copper Powder
(1 μm of average grain diameter) 66g, is added step-wise in above-mentioned solution, stirs simultaneously, finally gives the copper slurry of certain viscosity.By institute
Obtain copper slurry and scattered 10min is mixed on three-roll grinder, obtain uniform copper slurry.
Copper slurry is printed on plain copying paper using the mode of silk-screen printing, track is had a lot of social connections 1mm, long 150mm is (long
40mm, wide 7mm coil pattern), 120 DEG C of baking 10min of baking oven carry out flash of light sintering, pulse width using xenon flash lamp
2ms, a pulse, sintering energy 10J/cm2, test resistance is 3.6 Ω, and equivalent sheet resistance is 24.0m Ω/, according to ASTM
D3359 standardized test specimen adhesive force reaches 4B grades.Sample one end is fixed, one end 90-degree bent, 10 times repeatedly, measure resistance
For 4.2 Ω.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (10)
1. a kind of copper electrocondution slurry, it is characterised in that the following raw material components of copper electrocondution slurry and weight/mass percentage composition：
It is coated with 65~90wt% of Micron Copper Powder of Nanometer Copper bisque
0.1~5wt% of dispersant
Solvent 9~34%.
2. copper electrocondution slurry according to claim 1, it is characterised in that：The raw material components of the copper electrocondution slurry are included not
Adhesive more than 5wt%, described adhesive be selected from acrylic resin, polyurethane, hydroxyethyl cellulose, hydroxypropyl cellulose,
One or more in hydroxyethyl hydroxypropyl base cellulose, gelatin, gum arabic, peregal, polyethylene glycol, polyvinyl alcohol.
3. copper electrocondution slurry according to claim 1, it is characterised in that：The raw material components of the copper electrocondution slurry are included not
Stabilizer more than 3wt%, the stabilizer is hydroxyacetic acid, and lactic acid, citric acid, malic acid, glucose, glycine is anti-bad
One or more in hematic acid, glutaraldehyde, binary amine stabiliser.
4. copper electrocondution slurry according to claim 1, it is characterised in that：The dispersant is selected from polyvinylpyrrolidone,
Cetyl trimethylammonium bromide, polyethylene glycol, MEA, diethanol amine, triethanolamine, straight chained alkyl ether, hexylamine, octylame
With the one or more in 2-amino-2-methyl-1-propanol.
5. copper electrocondution slurry according to claim 1, it is characterised in that：The particle diameter of the Micron Copper Powder is 0.5~3 μm.
6. copper electrocondution slurry according to claim 1, it is characterised in that：The solvent be selected from water, propane diols, isopropanol,
Diethylene glycol (DEG), triethylene glycol, diethylene glycol methyl ether, terpinol, glycol monoethyl ether, ethylene glycol monoethyl ether, diglycol, second two
One or more in alcohol, glycerine, DBE and DPM.
7. a kind of method for preparing the copper electrocondution slurry as described in any one of claim 1~6, is comprised the steps of：By each raw material
Component is well mixed to obtain slurry, adds slurry into discharging after three-roll grinder milled processed and obtains copper electrocondution slurry.
8. a kind of forming method of conducting wire, it is characterised in that：The conducting wire is used such as any one of claim 1~6
The copper electrocondution slurry forms pattern on thermo-responsive base material, dries and is obtained through the sintering that glistens.
9. a kind of conducting wire, is prepared by claim 8 methods described.
10. it is used to form RFID tag, sensor, printing electricity according to any one of the claim 1~6 copper electrocondution slurry
The purposes of the electrode of road plate, touch-screen, solar cell or PDP.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108399979A (en) * | 2018-04-09 | 2018-08-14 | 太原氦舶新材料有限责任公司 | A kind of highly conductive micro-nano rice flour of modification and preparation method thereof |
| CN109226993A (en) * | 2018-08-30 | 2019-01-18 | 桂林电子科技大学 | A kind of micron of copper-silver paste Heat Conduction Material and preparation method thereof |
| CN111548194A (en) * | 2020-05-29 | 2020-08-18 | 南京凯泰化学科技有限公司 | Preparation method of printed circuit board |
| CN113327721A (en) * | 2021-08-04 | 2021-08-31 | 西安宏星电子浆料科技股份有限公司 | Preparation method of low-temperature cured conductive copper paste |
| CN115642000A (en) * | 2022-12-23 | 2023-01-24 | 西北工业大学 | Preparation method of conductive copper paste capable of being subjected to photon sintering |
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| CN101214547A (en) * | 2008-01-07 | 2008-07-09 | 李伟强 | Micrometer silver-copper granule containing nano level surface structure and preparation and application thereof |
| CN103480838A (en) * | 2013-10-16 | 2014-01-01 | 哈尔滨工业大学 | Preparation method of nano silver-coated copper powder |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101214547A (en) * | 2008-01-07 | 2008-07-09 | 李伟强 | Micrometer silver-copper granule containing nano level surface structure and preparation and application thereof |
| CN103480838A (en) * | 2013-10-16 | 2014-01-01 | 哈尔滨工业大学 | Preparation method of nano silver-coated copper powder |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108399979A (en) * | 2018-04-09 | 2018-08-14 | 太原氦舶新材料有限责任公司 | A kind of highly conductive micro-nano rice flour of modification and preparation method thereof |
| CN109226993A (en) * | 2018-08-30 | 2019-01-18 | 桂林电子科技大学 | A kind of micron of copper-silver paste Heat Conduction Material and preparation method thereof |
| CN111548194A (en) * | 2020-05-29 | 2020-08-18 | 南京凯泰化学科技有限公司 | Preparation method of printed circuit board |
| CN113327721A (en) * | 2021-08-04 | 2021-08-31 | 西安宏星电子浆料科技股份有限公司 | Preparation method of low-temperature cured conductive copper paste |
| CN115642000A (en) * | 2022-12-23 | 2023-01-24 | 西北工业大学 | Preparation method of conductive copper paste capable of being subjected to photon sintering |
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