CN107141778A - A kind of semistor and preparation method thereof - Google Patents
A kind of semistor and preparation method thereof Download PDFInfo
- Publication number
- CN107141778A CN107141778A CN201710315891.3A CN201710315891A CN107141778A CN 107141778 A CN107141778 A CN 107141778A CN 201710315891 A CN201710315891 A CN 201710315891A CN 107141778 A CN107141778 A CN 107141778A
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- China
- Prior art keywords
- semistor
- parts
- antioxidant
- lubricant
- conducting particles
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/028—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/06—Crosslinking by radiation
Abstract
The present invention relates to a kind of semistor, it includes two panels nickel plating copper foil and the laminating polymer sheet between two panels nickel plating copper foil, and the polymer sheet is made by the component of following parts by weight：15~25 high-density polyethylene resin, 25~35 parts of acrylic resins, 40~60 parts of polyamides, 55~60 parts of conducting particles, 80~90 parts of fillers, 1~3 part of silane coupler, 1~3 part of crosslinking agent, 1~3 part of antioxidant, 1~3 part of lubricant.The preparation method of the present invention is simple, easy to operate, and obtained macromolecular PTC thermistor has high temperature resistant, intensity high, and with excellent resistance stability.
Description
Technical field
The present invention relates to a kind of thermistor and preparation method thereof, particularly a kind of semistor and its system
Preparation Method.
Background technology
PTC thermistor is also referred to as semistor, and its resistance value is with semistor sheet
The rise of temperature shows step evolution increase, and temperature is higher, and its resistance value is also bigger.It is multiple containing positive temperature coefficient polymer
The semistor of condensation material is the main semistor of a class, its performance mainly by it is contained just
The positive temperature coefficient property influence of temperature coefficient polymer composite.
The excessively stream that the semistor made by base material of macromolecule resin is widely used in circuit is protected
Shield, the material prepared by conducting particles is added in crystalline resin can show a kind of characteristic of positive temperature coefficient i.e. PTC effects
Should, i.e., at a normal temperature, material shows low-resistance state of value, and when temperature is increased near macromolecule resin fusing point, resistance
Transition mutation is presented in value.The thermistor made according to PTC effects is using in circuit, it is possible to effective guarantor is carried out to circuit
Shield.Under normal conditions, the electric current in circuit is smaller, and the heat for flowing through the electric current generation of thermistor is distributed with outwardly environment
When the heat gone out reaches balance, thermistor is in the state of low resistance.When faulty electric current by when, the heat of generation is remote
More than the heat distributed, so as to cause the rise of the temperature of thermistor.When temperature reaches that the fusing point of macromolecule resin is attached
When near, the resistance of chip jumps, and makes the voltage in circuit is substantially all to be loaded on thermistor, limits the logical of electric current
Cross, so as to protect circuit.After fault current disappearance, the temperature drop of thermistor, and resistance is also decreased to just
Near initial value, circuit returns to normal condition again.But, the polmer PTC elements of present technology reach more than 85 DEG C in temperature
When can not normal work, this be due at present used in high polymer material be mostly high density polyethylene (HDPE), its fusing point only has
130 DEG C or so, so as to limit the application of ptc material.
The content of the invention
There is provided a kind of positive temperature for the deficiency existed present invention aim to address semistor in the prior art
Coefficient resistance is spent, its high temperature resistant, intensity are high, and with excellent resistance stability.
Technical scheme
A kind of semistor, including two panels nickel plating copper foil and laminating gathering between two panels nickel plating copper foil
Compound sheet material, the polymer sheet is made by the component of following parts by weight：15~25 high-density polyethylene resin, 25~35
Part acrylic resin, 40~60 parts of polyamides, 55~60 parts of conducting particles, 80~90 parts of fillers, 1~3 part is silane coupled
Agent, 1~3 part of crosslinking agent, 1~3 part of antioxidant, 1~3 part of lubricant.
The polyamide is in poly-caprylamide, nylon 9, polyhexamethylene sebacamide or polysebacate decamethylenediamineand
Any one.
Any one of the conducting particles in carbon black, graphite or titanium carbide.
The filler is selected from calcium carbonate, silica or talcum powder.
The crosslinking agent is selected from Triallyl isocyanurate or pentaerythritol triacrylate.
The one kind of the antioxidant in antioxidant 1010, irgasfos 168, antioxidant 264.
The lubricant is selected from zinc stearate or calcium stearate.
The method of above-mentioned PTC thermistor, comprises the following steps：
(1) said ratio is pressed, high-density polyethylene resin, acrylic resin, polyamide are added and stirred in banbury
Mixing is mixed, mixing temperature is 160~170 DEG C, adds conducting particles, filler, silane coupler, crosslinking agent, antioxidant and profit
Lubrication prescription, continues well mixed, obtains compound；
(2) after compound being extruded through double screw extruder, granulating, then through compression molding, polymer material sheet is produced；
(3) polymer material sheet is placed between two panels nickel plating copper foil, it is hot-forming after, crosslinking electron beam irradiation, spoke
It is 30~60Mrad according to dosage, is finally heat-treated, produced.
Further, in step (3), heat treatment temperature is 105~115 DEG C, and the time is 6-8h.
Beneficial effects of the present invention are：The preparation method of the present invention is simple, easy to operate, obtained high molecular PTC temperature-sensitive
Resistance has high temperature resistant, intensity high, and with excellent resistance stability.
Embodiment
Following the invention will be further described in conjunction with the embodiments, but is not intended to limit the invention, all the present invention's
Any modifications, equivalent substitutions and improvements made within spirit and principle etc., should be included in the scope of the protection.
Embodiment 1
20 parts of high-density polyethylene resins, 30 parts of acrylic resins, 50 parts of polyhexamethylene sebacamide are added in banbury
Stirring mixing, mixing temperature is 170 DEG C, adds 60 parts of carbon blacks, 80 parts of silica, 2 parts of silane couplers, 2 parts of Ji Wusi
Alcohol triacrylate, 2 parts of irgasfos 168s and 2 parts of zinc stearates, continue well mixed, obtain compound；By compound through twin-screw
After extruder extrusion, granulation, then through compression molding, produce polymer material sheet；Polymer material sheet is placed in two panels plating
Between ambrose alloy paper tinsel, it is hot-forming after, crosslinking electron beam irradiation, irradiation dose is 60Mrad, is finally heat-treated, heat treatment temperature
Spend for 115 DEG C, the time is 6h, is produced.
Experiment is measured：Resistivity is 0.005 Ω cm, PTC intensity 2.15x103, resistance increasing degree after resistance to stream impacts 100 times
(%, 30V, 40A) 289.
Embodiment 2
15 parts of high-density polyethylene resins, 35 parts of acrylic resins, 50 parts of poly-caprylamides are added in banbury and stir mixed
Close, mixing temperature is 165 DEG C, adds 55 parts of titanium carbides, 90 parts of talcum powder, 3 parts of silane couplers, 2 parts of pentaerythrites 3 third
Olefin(e) acid ester, 3 parts of irgasfos 168s and 3 parts of calcium stearates, continue well mixed, obtain compound；By compound through double screw extruder
After extrusion, granulation, then through compression molding, produce polymer material sheet；Polymer material sheet is placed in two panels nickel plating copper foil
Between, it is hot-forming after, crosslinking electron beam irradiation, irradiation dose is 60Mrad, is finally heat-treated, and heat treatment temperature is
110 DEG C, the time is 6h, is produced.
Experiment is measured：Resistivity is 0.005 Ω cm, PTC intensity 2.06x103, resistance increasing degree after resistance to stream impacts 100 times
(%, 30V, 40A) 276.
Claims (8)
1. a kind of semistor, it is characterised in that including two panels nickel plating copper foil and laminating in two panels nickel-clad copper
Polymer sheet between paper tinsel, the polymer sheet is made by the component of following parts by weight：15~25 high density polyethylene (HDPE)
Resin, 25~35 parts of acrylic resins, 40~60 parts of polyamides, 55~60 parts of conducting particles, 80~90 parts of fillers, 1~3
Part silane coupler, 1~3 part of crosslinking agent, 1~3 part of antioxidant, 1~3 part of lubricant；
The polyamide appointing in poly-caprylamide, nylon 9, polyhexamethylene sebacamide or polysebacate decamethylenediamineand
Meaning is a kind of.
2. semistor as claimed in claim 1, it is characterised in that the conducting particles is selected from carbon black, stone
Ink or titanium carbide in any one.
3. semistor as claimed in claim 1, it is characterised in that the filler is selected from calcium carbonate, dioxy
SiClx or talcum powder.
4. semistor as claimed in claim 1, it is characterised in that it is different that the crosslinking agent is selected from triallyl
Cyanurate or pentaerythritol triacrylate.
5. semistor as claimed in claim 1, it is characterised in that the antioxidant is selected from antioxidant
1010th, one kind in irgasfos 168, antioxidant 264.
6. the semistor as described in any one of claim 1 to 5, it is characterised in that the lubricant is selected from hard
Resin acid zinc or calcium stearate.
7. the preparation method of the semistor described in any one of claim 1 to 6, it is characterised in that including with
Lower step：
(1) said ratio is pressed, high-density polyethylene resin, acrylic resin, polyamide are added in banbury and stir mixed
Close, mixing temperature is 160~170 DEG C, adds conducting particles, filler, silane coupler, crosslinking agent, antioxidant and lubricant,
Continue well mixed, obtain compound；
(2) after compound being extruded through double screw extruder, granulating, then through compression molding, polymer material sheet is produced；
(3) polymer material sheet is placed between two panels nickel plating copper foil, it is hot-forming after, crosslinking electron beam irradiation, irradiate agent
Measure as 30~60Mrad, be finally heat-treated, produced.
8. at the preparation method of semistor as claimed in claim 7, it is characterised in that in step (3), heat
It is 105~115 DEG C to manage temperature, and the time is 6-8h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710315891.3A CN107141778A (en) | 2017-05-08 | 2017-05-08 | A kind of semistor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710315891.3A CN107141778A (en) | 2017-05-08 | 2017-05-08 | A kind of semistor and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107141778A true CN107141778A (en) | 2017-09-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710315891.3A Pending CN107141778A (en) | 2017-05-08 | 2017-05-08 | A kind of semistor and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN107141778A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112094449A (en) * | 2020-09-16 | 2020-12-18 | 东莞市竞沃电子科技有限公司 | Curie point adjustable PTC polymer conductive composite material and preparation method thereof |
| CN112420296A (en) * | 2020-12-02 | 2021-02-26 | 句容市双诚电子有限公司 | High-stability voltage-resistant NTC ceramic thermistor and preparation process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1730530A (en) * | 2005-08-04 | 2006-02-08 | 四川大学 | Method for improving high-density polyethylene /carbon ink composite material positive temperature coefficient property |
| CN101597396A (en) * | 2009-07-02 | 2009-12-09 | 浙江华源电热有限公司 | Polymer-based positive temperature coefficient thermistor material |
| CN102176361A (en) * | 2011-02-22 | 2011-09-07 | 深圳市长园维安电子有限公司 | Base materials of PTC (Positive Temperature Coefficient) thermistor, PTC thermistor and preparation method thereof |
| CN102176360A (en) * | 2011-02-22 | 2011-09-07 | 深圳市长园维安电子有限公司 | PTC thermistor and substrate applied therein and manufacturing method thereof |
| CN104867636A (en) * | 2015-06-11 | 2015-08-26 | 郑州轻工业学院 | Positive temperature coefficient thermistor and preparation method thereof |
-
2017
- 2017-05-08 CN CN201710315891.3A patent/CN107141778A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1730530A (en) * | 2005-08-04 | 2006-02-08 | 四川大学 | Method for improving high-density polyethylene /carbon ink composite material positive temperature coefficient property |
| CN101597396A (en) * | 2009-07-02 | 2009-12-09 | 浙江华源电热有限公司 | Polymer-based positive temperature coefficient thermistor material |
| CN102176361A (en) * | 2011-02-22 | 2011-09-07 | 深圳市长园维安电子有限公司 | Base materials of PTC (Positive Temperature Coefficient) thermistor, PTC thermistor and preparation method thereof |
| CN102176360A (en) * | 2011-02-22 | 2011-09-07 | 深圳市长园维安电子有限公司 | PTC thermistor and substrate applied therein and manufacturing method thereof |
| CN104867636A (en) * | 2015-06-11 | 2015-08-26 | 郑州轻工业学院 | Positive temperature coefficient thermistor and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112094449A (en) * | 2020-09-16 | 2020-12-18 | 东莞市竞沃电子科技有限公司 | Curie point adjustable PTC polymer conductive composite material and preparation method thereof |
| CN112420296A (en) * | 2020-12-02 | 2021-02-26 | 句容市双诚电子有限公司 | High-stability voltage-resistant NTC ceramic thermistor and preparation process thereof |
| CN112420296B (en) * | 2020-12-02 | 2022-08-05 | 句容市双诚电子有限公司 | High-stability voltage-resistant NTC ceramic thermistor and preparation process thereof |
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Application publication date: 20170908 |
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