CN107139386A - The housing and its equipment and preparation method of a kind of achievable high leakproofness - Google Patents
The housing and its equipment and preparation method of a kind of achievable high leakproofness Download PDFInfo
- Publication number
- CN107139386A CN107139386A CN201710176296.6A CN201710176296A CN107139386A CN 107139386 A CN107139386 A CN 107139386A CN 201710176296 A CN201710176296 A CN 201710176296A CN 107139386 A CN107139386 A CN 107139386A
- Authority
- CN
- China
- Prior art keywords
- housing
- liquid
- setting position
- state silicon
- silicon gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a kind of housing of achievable high leakproofness and its equipment and preparation method.Wherein, methods described includes：It is molded to form housing using case material；Liquid-state silicon gel is molded on the setting position of the housing, wherein, the setting position is used to be assembled with another housing by the liquid-state silicon gel, forms sealing structure.By the above-mentioned means, high leakproofness between housing can be realized and simple in construction.
Description
Technical field
The present invention relates to manufacture craft field, the housing and its equipment and system of more particularly to a kind of achievable high leakproofness
Make method.
Background technology
At present, with the development of science and technology, increasing electronic apparatus application is in our life.Generally, it is electric
The shell of sub- equipment usually requires good airproof performance, to protect the circuit or other structures of enclosure.
Answered however, the sealing that the shell of existing electronic equipment is realized is substantially barely satisfactory or sealing structure
It is miscellaneous.
The content of the invention
The present invention solves the technical problem of the housing for providing a kind of achievable high leakproofness and its equipment and making
Method, can realize high leakproofness between housing and simple in construction.
In order to solve the above technical problems, one aspect of the present invention is：A kind of achievable high leakproofness is provided
Housing preparation method, including：
It is molded to form housing using case material；
Liquid-state silicon gel is molded on the setting position of the housing, wherein, the setting position is used to pass through the liquid
Silica gel is assembled with another housing, forms sealing structure.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of achievable high sealing is provided
Property housing, including enclosure body and the liquid-state silicon gel that is arranged on the setting position of the enclosure body；Wherein, the setting
Position is used to be assembled with another housing by the liquid-state silicon gel, forms sealing structure.
In order to solve the above technical problems, another technical scheme that the present invention is used is：A kind of electronic equipment is provided, including
Above-mentioned the first housing, the second housing and at least functional circuit being arranged between first housing and the second housing,
First housing passes through liquid-state silicon gel and second shell body formation sealing structure.
Above scheme, be used for and the position that other housings are assembled of housing are provided with liquid-state silicon gel, to pass through the liquid-state silicon
Glue realizes the assembling with other housings, due to liquid-state silicon gel good fluidity, therefore in above-mentioned assembling due to the stress of liquid crystal silica gel
Deformation produces sealing function, and then realizes the high leakproofness between housing and another housing, and liquid-state silicon gel can be tight with housing
Close combination, will not overturn deformation when being combined with other housings.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of housing one of the achievable high leakproofness of the present invention；
Fig. 2 is the structural representation of another embodiment of housing of the achievable high leakproofness of the present invention；
Fig. 3 a are the structural representations of the housing of achievable high leakproofness in a concrete application of the invention；
Fig. 3 b are the Y-Y schematic cross-sections of housing shown in Fig. 3 a；
Fig. 4 is the structural representation of the embodiment of method for producing shell one of the achievable high-sealed of the present invention；
Fig. 5 is the structural representation of the embodiment of electronic equipment one of the present invention.
Embodiment
The present invention is described in detail with embodiment below in conjunction with the accompanying drawings.
For ease of understanding the present invention, first high leakproofness of the present invention is illustrated, high leakproofness refers to the housing and another
Its contact portion has high leakproofness when one housing is assembled.
Referring to Fig. 1, Fig. 1 is the structural representation of the embodiment of housing one of the achievable high leakproofness of the present invention.This implementation
The housing of the housing concretely housing, for example, electronic equipment or other plant equipment of any equipment of example.The housing can be with
A part for the shell of equipment is interpreted as, the complete enclosure for forming the equipment with another housing.
Specifically, the housing 10 includes enclosure body 11 and the liquid-state silicon gel being arranged on the setting position 12 of enclosure body
13, wherein, the enclosure body 11 is groove-like, and the setting position 12 is the position that the groove is contacted with other housings, specifically such as
Lateral wall and/or wall upper surface.The setting position 12 is used to be assembled with another housing by liquid-state silicon gel 13, is formed close
Seal structure.
The sealing structure is that the contact portion of two housings realizes sealing, but it is understood that, so not
Represent between two housings that the inner space that is formed is necessarily sealing space, two housings there may be in itself engraved structure or
Person's non-tight structure.Therefore though the contact portion of two housings is sealing, its inner space is possible to as non-tight space or close
Seal space.
In the present embodiment, the enclosure body 11 is to be molded to be formed by case material, and liquid-state silicon gel 13 is formed at by injection
On the setting position 12 of the enclosure body 11.Because liquid-state silicon gel is molded up again after the formation of enclosure body 11, therefore this hair
The fusing point of the case material of bright selection is higher than the fusing point of the liquid-state silicon gel 13, is higher than for example, the case material is the fusing points such as ebonite
The plastics of liquid-state silicon gel 13, or be metal material.
The setting position 12 of the present embodiment is specially the lateral wall of the enclosure body 11, and specifically, the enclosure body 11 is wrapped
Include bottom 111 and leg portion 112.The wall thickness in the leg portion 112 is d.The setting position 12 is the outside in the leg portion 112, when
So, the outside and upper surface in setting position 12 or the leg portion 112.Further, the bottom 111 can be the leg portion
112 outside provides the platform 111a of certain distance, for support liquid-state silicon gel.
It is understood that the setting position may not be the lateral wall of enclosure body 11, or madial wall.Such as Fig. 2 institutes
Show, the enclosure body 21 includes bottom 211 and leg portion 212.The setting position 22 for the leg portion 212 inner side and at least portion
Divide upper surface, certainly, setting position 22 also can be only the inner side in the leg portion 212.Further, the inner side in the leg portion 212 is set
There is the platform 211a extended inward, for support liquid-state silicon gel.Therefore the present invention is not construed as limiting to the setting position of housing, its
Can be the optional position contacted when being assembled with another housing on housing.
In a concrete application, as shown in Figure 3 a-3b, the housing is specially the procapsid 30 of wrist-watch, the procapsid 30
Setting position 32 is the inside of the procapsid 30 on the interior recess of its lateral wall, the setting position 32 after injection liquid-state silicon gel 33
Assemble after part such as button, display screen, timing circuit, assembled by the back casing of the liquid-state silicon gel 33 and wrist-watch,
Above-mentioned part is housed to form sealing space.
Due to liquid-state silicon gel good fluidity, when the housing of the present embodiment is assembled with another housing, due to liquid crystal silica gel by
Force deformation produces sealing function, and then realizes the high leakproofness between housing and another housing, and liquid-state silicon gel (is such as moulded with housing
Material shell body) it can combine closely, deformation will not be overturn when being combined with other housings.
Referring to Fig. 4, Fig. 4 is the flow signal of the embodiment of preparation method one of the housing of the achievable high leakproofness of the present invention
Figure.In the present embodiment, the preparation method can be used for making above-mentioned housing, specifically include following steps：
S41：It is molded to form housing using case material.
For example, the case material of melting is molded into housing mould, and housing is formed after the demoulding after case material cooling.
Wherein, the fusing point of the case material is higher than the fusing point of liquid-state silicon gel, and concretely the fusing point such as ebonite is higher than the plastics of liquid-state silicon gel,
Or be metal material.
S42：Liquid-state silicon gel is molded on the setting position of the housing, wherein, the setting position is used for by described
Liquid-state silicon gel is assembled with another housing, forms sealing structure.
For example, due to the good fluidity of liquid-state silicon gel, liquid-state silicon gel during for injection carries out limit type or position is fixed, will
The housing is put into mould and the setting position of the mould and the housing forms gap, specifically such as, by the mould with
The housing front sealing (touch and wear), only to form gap between the outward flange of housing and mould, then by the liquid-state silicon
Glue is molded to the gap, and the liquid-state silicon gel is closely combined with the housing.Wherein, the setting position is not limited including this
The lateral wall or madial wall of housing.
Referring to Fig. 5, Fig. 5 is the structural representation of the embodiment of electronic equipment one of the present invention.In the present embodiment, the equipment 50
Including the first housing 51, the second housing 52 and an at least functional circuit 53, first housing 51 by liquid-state silicon gel 513 with
Second housing 52 formation sealing structure, the functional circuit 53 is arranged on the interior of the first housing 51 and the formation of the second housing 52
In portion space 54.The inner space 54 of the present embodiment is sealing space, certainly, in other embodiments, if the first housing 51
Or second housing 52 itself there is the non-tight structures such as hollow out, then the inner space 54 also can non-tight space.
Wherein, the function that the functional circuit be able to need to specifically be realized according to the equipment is configured, for example, the equipment is electronics
Wrist-watch, then its functional circuit is display screen, timing circuit etc.；The equipment is mobile phone, then its functional circuit includes processor, storage
The computer instruction that device and telecommunication circuit etc., the wherein processor are used in run memory, to perform relevant control and place
Reason；In another example, the equipment is LCDs, then its functional circuit includes drive circuit, backlight module etc..
Specifically, first housing makes obtained housing for the housing or the above method in above-described embodiment, in detail
Refer to the associated description of above-described embodiment.
Above scheme, be used for and the position that other housings are assembled of housing are provided with liquid-state silicon gel, to pass through the liquid-state silicon
Glue realizes the assembling with other housings, due to liquid-state silicon gel good fluidity, therefore in above-mentioned assembling due to the stress of liquid crystal silica gel
Deformation produces sealing function, and then realizes the high leakproofness between housing and another housing, and liquid-state silicon gel can be tight with housing
Close combination, will not overturn deformation when being combined with other housings.
Embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this
Equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, is included within the scope of the present invention.
Claims (10)
1. a kind of method for producing shell of achievable high leakproofness, it is characterised in that including：
It is molded to form housing using case material；
Liquid-state silicon gel is molded on the setting position of the housing, wherein, the setting position is used to pass through the liquid-state silicon gel
Assembled with another housing, form sealing structure.
2. preparation method according to claim 1, it is characterised in that described to be molded liquid on the setting position of the housing
State silica gel, including：
The housing is put into mould and the setting position of the mould and the housing forms gap；
The liquid-state silicon gel is molded into the gap.
3. preparation method according to claim 1 or 2, it is characterised in that the fusing point of the case material is higher than the liquid
State silica gel.
4. preparation method according to claim 1 or 2, it is characterised in that the setting position includes the outer of the housing
Side wall or madial wall, the case material are plastics or metal.
5. a kind of housing of achievable high leakproofness, it is characterised in that including enclosure body and be arranged on the enclosure body
Liquid-state silicon gel on setting position；Wherein, the setting position is used to be assembled with another housing by the liquid-state silicon gel,
Form sealing structure.
6. housing according to claim 5, it is characterised in that the enclosure body is to be molded to be formed using case material,
The liquid-state silicon gel is formed on the setting position of the enclosure body by being molded.
7. housing according to claim 6, it is characterised in that the fusing point of the case material is higher than the liquid-state silicon gel.
8. housing according to claim 7, it is characterised in that the case material is plastics or metal.
9. housing according to claim 5, it is characterised in that the setting position includes the lateral wall of the enclosure body
Or madial wall.
10. a kind of electronic equipment, it is characterised in that including the first housing described in any one of claim 5 to 9, the second housing
And at least functional circuit between first housing and the second housing is arranged on, first housing passes through liquid-state silicon gel
With second shell body formation sealing structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710176296.6A CN107139386A (en) | 2017-03-23 | 2017-03-23 | The housing and its equipment and preparation method of a kind of achievable high leakproofness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710176296.6A CN107139386A (en) | 2017-03-23 | 2017-03-23 | The housing and its equipment and preparation method of a kind of achievable high leakproofness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107139386A true CN107139386A (en) | 2017-09-08 |
Family
ID=59783998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710176296.6A Pending CN107139386A (en) | 2017-03-23 | 2017-03-23 | The housing and its equipment and preparation method of a kind of achievable high leakproofness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107139386A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976891A (en) * | 2018-01-17 | 2018-05-01 | 出门问问信息科技有限公司 | A kind of waterproof construction and intelligent watch |
| CN114474562A (en) * | 2020-10-27 | 2022-05-13 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
| CN114995095A (en) * | 2022-05-27 | 2022-09-02 | 潍坊歌尔电子有限公司 | Wearable device |
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| CN103002697A (en) * | 2012-11-08 | 2013-03-27 | 深圳桑菲消费通信有限公司 | Electronic equipment and waterproof sealing structure thereof |
| CN203104989U (en) * | 2013-01-08 | 2013-07-31 | 中国电子科技集团公司第十五研究所 | Hand-held terminal housing having waterproof and shielding functions |
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| CN105658007A (en) * | 2016-04-11 | 2016-06-08 | 联想(北京)有限公司 | Electronic equipment and shell thereof |
| CN206011605U (en) * | 2016-08-30 | 2017-03-15 | 苏州埃博斯电气有限公司 | A kind of sealing structure of liquid silica gel injection |
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2017
- 2017-03-23 CN CN201710176296.6A patent/CN107139386A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103002697A (en) * | 2012-11-08 | 2013-03-27 | 深圳桑菲消费通信有限公司 | Electronic equipment and waterproof sealing structure thereof |
| CN203104989U (en) * | 2013-01-08 | 2013-07-31 | 中国电子科技集团公司第十五研究所 | Hand-held terminal housing having waterproof and shielding functions |
| CN203457449U (en) * | 2013-08-29 | 2014-02-26 | 东莞劲胜精密组件股份有限公司 | Falling-resistant waterproof housing structure of 3C electronic product |
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| CN103929915A (en) * | 2014-04-02 | 2014-07-16 | 东莞劲胜精密组件股份有限公司 | Waterproof metal outer shell of electronic product and manufacturing method thereof |
| CN203942731U (en) * | 2014-04-02 | 2014-11-12 | 东莞劲胜精密组件股份有限公司 | A kind of metal waterproof case of electronic product |
| CN104506674A (en) * | 2014-12-02 | 2015-04-08 | 广东欧珀移动通信有限公司 | Mobile phone sealing structure and terminal |
| CN104905526A (en) * | 2015-04-14 | 2015-09-16 | 深圳市信毅科技有限公司 | Liquid silica gel protective sleeve and production method thereof |
| CN105658007A (en) * | 2016-04-11 | 2016-06-08 | 联想(北京)有限公司 | Electronic equipment and shell thereof |
| CN206011605U (en) * | 2016-08-30 | 2017-03-15 | 苏州埃博斯电气有限公司 | A kind of sealing structure of liquid silica gel injection |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976891A (en) * | 2018-01-17 | 2018-05-01 | 出门问问信息科技有限公司 | A kind of waterproof construction and intelligent watch |
| CN114474562A (en) * | 2020-10-27 | 2022-05-13 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
| CN114995095A (en) * | 2022-05-27 | 2022-09-02 | 潍坊歌尔电子有限公司 | Wearable device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170908 |
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| RJ01 | Rejection of invention patent application after publication |