CN107124824A - The production system of flexible PCB - Google Patents
The production system of flexible PCB Download PDFInfo
- Publication number
- CN107124824A CN107124824A CN201710405448.5A CN201710405448A CN107124824A CN 107124824 A CN107124824 A CN 107124824A CN 201710405448 A CN201710405448 A CN 201710405448A CN 107124824 A CN107124824 A CN 107124824A
- Authority
- CN
- China
- Prior art keywords
- flexible pcb
- robot manipulator
- manipulator structure
- production system
- control system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Arc Welding In General (AREA)
Abstract
The production system of flexible PCB of the present invention is related to board production technical field, its purpose is to provide it is a kind of automate, the production system of the flexible PCB that die cutting accuracy is high, cost is low.The production system of flexible PCB of the present invention includes control system, the first robot manipulator structure, profile laser machine, the second robot manipulator structure, plasma washing equipment, the 3rd robot manipulator structure and automatic circulating plate machine;First robot manipulator structure is connected with control system, for flexible PCB to be cut to be transported into profile laser machine;Profile laser machine is connected with control system, is cut for the profile to flexible PCB to be cut;Second robot manipulator structure is connected with control system, is cleaned for the flexible PCB after cutting to be delivered into plasma washing equipment;3rd robot manipulator structure is connected with control system, for the flexible PCB after cleaning to be delivered into automatic circulating plate machine;Automatic circulating plate machine is connected with control system, for flexible PCB to be carried out into balance.
Description
Technical field
The present invention relates to board production technical field, more particularly to a kind of production system of flexible PCB.
Background technology
FPC wiring boards are also known as FPC, and flexible PCB is made up using polyimides or polyester film of base material
One kind has height reliability, excellent flexible printed circuit, with Distribution density is high, lightweight, thickness of thin, bending property
The characteristics of good.
In current FPC production processes during punch extermal form, to precision more and more higher, such as appearance and size tolerance ± 0.05mm,
Easily there is burr, dimensional accuracy and does not reach requirement etc. in the Product Precision of CPK requirements simultaneously more than 1.67, current production system
Problem;And each item number will mold, cost of labor is also very high;In addition, FPC Automation of Manufacturing Process degree is not high at present,
Labor intensive and cost.
The content of the invention
Based on this, the technical problem to be solved in the present invention is to provide a kind of automation, the flexibility that die cutting accuracy is high, cost is low
The production system of circuit board.
A kind of production system of flexible PCB, including control system, the first robot manipulator structure, profile laser machine, second
Robot manipulator structure, plasma washing equipment, the 3rd robot manipulator structure and automatic circulating plate machine;First robot manipulator structure with it is described
Control system is connected, for flexible PCB to be cut to be transported into profile laser machine;The profile laser machine and the control
System is connected, and is cut for the profile to flexible PCB to be cut;Second robot manipulator structure and the control system
System connection, is cleaned for the flexible PCB after cutting to be delivered into plasma washing equipment;The 3rd manipulator knot
Structure is connected with the control system, for the flexible PCB after cleaning to be delivered into the automatic circulating plate machine;It is described from movable pendulum
Disk machine is connected with the control system, for flexible PCB to be carried out into balance.
In one of the embodiments, first robot manipulator structure include four axis robots and with four shaft mechanical palmistrys
Acetabula device even.
In one of the embodiments, the Acetabula device includes multiple vacuum slots.
In one of the embodiments, second robot manipulator structure and the 3rd robot manipulator structure include four axis robots with
And the magnet suction nozzle being connected with four axis robots.
In one of the embodiments, the profile laser machine 700~900mm/s of sweep speed, curve delay 20~
40us。
In one of the embodiments, the chilling temperature of the plasma washing equipment is 30~40 DEG C, during cleaning treatment
Between 5~10min.
In one of the embodiments, first robot manipulator structure, profile laser machine, the second robot manipulator structure, etc. from
Sub- cleaning device, the 3rd robot manipulator structure and automatic circulating plate machine are sequentially arranged at intervals.
In one of the embodiments, the first robot manipulator structure, profile laser machine, the second robot manipulator structure, plasma are clear
Spacing distance between cleaning device, the 3rd robot manipulator structure and automatic circulating plate machine is 0.5~1m.
In one of the embodiments, the plasma washing equipment be horizontal cleaning device, plasma gas be O2,
CF4 and N2.
The production system of above-mentioned flexible PCB, flexible PCB is cut using radium-shine profile machine-cut, and cutting accuracy is high, can
Ensure appearance and size tolerance and precision;And reduce cost without mold using radium-shine profile machine;After radium-shine profile
Using plasma cleaning process cleaning product margin residual thing, while also functioning to the effect that cleaning plate face improves binding pulling force;Machine
Tool hand has reached that machine replaces manually picking and placeing product, and the full-automatic effect of manual balance is replaced using automatic circulating plate machine.
Brief description of the drawings
Fig. 1 is the schematic diagram of the production system of flexible PCB of the present invention;
Description of reference numerals:
First robot manipulator structure 100;Profile laser machine 200;Second robot manipulator structure 300;Plasma washing equipment 400;
3rd robot manipulator structure 500;Automatic circulating plate machine 600;Control system 700.
Embodiment
Specific embodiments of the present invention are described in detail below with reference to Figure of description, but the present invention can be with
The multitude of different ways for being defined by the claims and covering is implemented.
Reference picture 1, the production system of one embodiment of the present of invention flexible PCB, including control system 700, the first machine
Tool hand structure 100, profile laser machine 200, the second robot manipulator structure 300, plasma washing equipment 400, the 3rd robot manipulator structure
500 and automatic circulating plate machine 600.First robot manipulator structure 100 is connected with control system 700, for by flexible PCB to be cut
It is transported to profile laser machine 200.Profile laser machine 200 is connected with control system 700, for the outer of flexible PCB to be cut
Shape is cut.Second robot manipulator structure 300 is connected with control system 700, for the flexible PCB after cutting to be delivered to
Plasma washing equipment 400 is cleaned.3rd robot manipulator structure 500 is connected with control system 700, for will be soft after cleaning
Property circuit board is delivered to automatic circulating plate machine 600.Automatic circulating plate machine 600 is connected with control system 700, for flexible PCB to be entered
Row balance.
The production system of above-mentioned flexible PCB, flexible PCB is cut using radium-shine profile machine-cut, and cutting accuracy is high, profile
Dimensional tolerance reaches requirement ± 0.05mm, while precision CPK reaches more than 1.67, ensure that appearance and size tolerance and essence
Degree;Plasma cleaning process cleaning product margin residual thing is used after radium-shine profile, while also functioning to cleaning plate face improves binding
The effect of pulling force;Manipulator has reached that machine replaces manually picking and placeing product, and the complete of manual balance is replaced using automatic circulating plate machine 600
Automatic effects, control system 700 is uniformly controlled, and pipelining automaticity is high.
Further, the first robot manipulator structure 100 selects industry mechanical arm, specifically, can include four axis robots with
And the Acetabula device being connected with four axis robots.Acetabula device inhales the whole SET transferred products in area to the setting in radium-shine machine table face
Radium-shine position, laser machine is according to the radium-shine product of corresponding product data.
Further, Acetabula device includes multiple vacuum slots.Multiple vacuum slots ensure the firm suction of whole SET products
Take.When in use, vacuum slot adsorbs whole SET products, is moved to afterwards behind radium-shine machine table face, and vacuum slot, which unclamps, to be carried out
Radium-shine operation.
Second robot manipulator structure 300 and the 3rd robot manipulator structure 500 also select industry mechanical arm, specifically, including four axles
Manipulator and the magnet suction nozzle being connected with four axis robots.Magnet suction nozzle can be with adjusting position, for drawing radium-shine good list
PCS products are put on plasma washing equipment 400.Magnet suction nozzle can be with adsorption flexible circuit board, the second manipulator knot after energization
Structure 300 is drawn radium-shine good single PCS products and is put on the washing station of plasma washing equipment 400, and then magnet suction nozzle is removed, etc.
Ion Cleaning device 400 is cleaned to product.Magnet suction nozzle on 3rd robot manipulator structure 500 will be by plasma cleaning dress
Single PCS products after 400 cleanings are put to be put on automatic circulating plate machine 600.
Further, profile laser machine 200 can use the current radium-shine product of profile Radium art.Cutting times according to
Product type is cut 10-60 times, and 700~900mm/s of sweep speed, electric current 38A curve 20~40us of delay.It is preferred that scanning speed
800mm/s is spent, delay 30us is curved.
Further, using the carbon residue at current plasma cleaning process cleaning product edge, plasma washing equipment 400
Chilling temperature be 30~40 DEG C, preferably 35 DEG C, 5~10min of cleaning treatment time, power 7000W.Gone using plasma cleaning
Dirt, except can effectively remove the carbon residue of outline edge, moreover it is possible to preferably avoid flexible PCB from producing capillarity, while
Play a part of cleaning plate face and carry binding pulling force.In addition, plasma cleaning can also the hydrophily of flexible PCB, repellency, viscous
Knot property, marking, lubricity, wearability etc..
Further, the first robot manipulator structure 100, profile laser machine 200, the second robot manipulator structure 300, plasma are clear
Cleaning device 400, the 3rd robot manipulator structure 500 and automatic circulating plate machine 600 are sequentially arranged at intervals.Can also be according to place and production ring
Border reasonable Arrangement.
Specifically, the first robot manipulator structure 100, profile laser machine 200, the second robot manipulator structure 300, plasma cleaning dress
It is 0.5~1m to put the spacing distance between the 400, the 3rd robot manipulator structure 500 and automatic circulating plate machine 600.
Further, plasma washing equipment 400 is horizontal cleaning device, and plasma gas is O2, CF4 and N2.
Specifically, using horizontal cleaning machine, plasma gas is O2, CF4 and N2, and O2 setup parameters pressure is 80~100MPa, CF4
Setup parameter pressure is 10~20MPa, and N2 setup parameters pressure is 10~20MPa.
The production system course of work of above-mentioned flexible PCB is as follows:
1st, flexible PCB to be cut (whole SET products) will be transported to profile laser machine by the first robot manipulator structure 100
200。
2nd, profile laser machine 200 is under the control of control system 700, to the outer of flexible PCB to be cut (whole SET products)
Shape is cut, and is cut into single PCS products.
3rd, single PCS products are delivered to plasma washing equipment 400 by the second robot manipulator structure 300 successively.
4th, after Ion Cleaning device is cleaned single PCS products, by the 3rd robot manipulator structure 500 by the list after cleaning
PCS products are delivered to automatic circulating plate machine 600.
5th, automatic circulating plate machine 600 packs single PCS products balance.
Whole technological process, which only needs to 2-3 people, can complete operation, not only save manpower, at the same product substantially not with people
Contact, greatly reduces product and the hidden danger such as bad order occurs.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of production system of flexible PCB, it is characterised in that including control system, the first robot manipulator structure, profile radium
Penetrate machine, the second robot manipulator structure, plasma washing equipment, the 3rd robot manipulator structure and automatic circulating plate machine;First manipulator
Structure is connected with the control system, for flexible PCB to be cut to be transported into profile laser machine;The profile laser machine
It is connected, is cut for the profile to flexible PCB to be cut with the control system;Second robot manipulator structure with
The control system connection, is cleaned for the flexible PCB after cutting to be delivered into plasma washing equipment;Described
Three robot manipulator structures are connected with the control system, for the flexible PCB after cleaning to be delivered into the automatic circulating plate machine;
The automatic circulating plate machine is connected with the control system, for flexible PCB to be carried out into balance.
2. the production system of flexible PCB according to claim 1, it is characterised in that the first robot manipulator structure bag
Include four axis robots and the Acetabula device being connected with four axis robots.
3. the production system of flexible PCB according to claim 2, it is characterised in that the Acetabula device includes multiple
Vacuum slot.
4. the production system of flexible PCB according to claim 1, it is characterised in that second robot manipulator structure with
3rd robot manipulator structure includes four axis robots and the magnet suction nozzle being connected with four axis robots.
5. the production system of flexible PCB according to claim 1, it is characterised in that the profile laser machine scanning speed
700~900mm/s is spent, 20~40us of delay is curved.
6. the production system of flexible PCB according to claim 1, it is characterised in that the plasma washing equipment
Chilling temperature is 30~40 DEG C, 5~10min of cleaning treatment time.
7. the production system of flexible PCB according to claim 1, it is characterised in that first robot manipulator structure,
Profile laser machine, the second robot manipulator structure, plasma washing equipment, the 3rd robot manipulator structure and automatic the circulating plate machine row of interval successively
Row.
8. the production system of flexible PCB according to claim 7, it is characterised in that the first robot manipulator structure, profile
Spacing distance between laser machine, the second robot manipulator structure, plasma washing equipment, the 3rd robot manipulator structure and automatic circulating plate machine
For 0.5~1m.
9. the production system of flexible PCB according to claim 1, it is characterised in that the plasma washing equipment is
Horizontal cleaning device, plasma gas is O2, CF4 and N2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710405448.5A CN107124824A (en) | 2017-06-01 | 2017-06-01 | The production system of flexible PCB |
Applications Claiming Priority (1)
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CN201710405448.5A CN107124824A (en) | 2017-06-01 | 2017-06-01 | The production system of flexible PCB |
Publications (1)
Publication Number | Publication Date |
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CN107124824A true CN107124824A (en) | 2017-09-01 |
Family
ID=59730122
Family Applications (1)
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CN201710405448.5A Pending CN107124824A (en) | 2017-06-01 | 2017-06-01 | The production system of flexible PCB |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108568859A (en) * | 2018-04-20 | 2018-09-25 | 上达电子(深圳)股份有限公司 | flexible circuit board processing system and method |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201063972Y (en) * | 2007-05-10 | 2008-05-21 | 张承权 | Automatic punching machine of flexible circuit board |
CN203184943U (en) * | 2012-09-13 | 2013-09-11 | 昆山仁硕机械制造有限公司 | Automatic laser etching wobble plate machine |
CN104955275A (en) * | 2014-03-24 | 2015-09-30 | 机科发展科技股份有限公司 | Multi-station all-in-one machine for flexible printed circuit boards |
CN204867826U (en) * | 2015-08-04 | 2015-12-16 | 深圳市镭恩特自动化技术有限公司 | UV laser cutting machine |
CN105246271A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Island type hard board rigid-flex combination board |
CN106346142A (en) * | 2016-11-02 | 2017-01-25 | 江苏弘信华印电路科技有限公司 | Method for producing single PCS substrate by UV laser cutting |
CN207022288U (en) * | 2017-06-01 | 2018-02-16 | 上达电子(深圳)股份有限公司 | The production system of flexible PCB |
-
2017
- 2017-06-01 CN CN201710405448.5A patent/CN107124824A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201063972Y (en) * | 2007-05-10 | 2008-05-21 | 张承权 | Automatic punching machine of flexible circuit board |
CN203184943U (en) * | 2012-09-13 | 2013-09-11 | 昆山仁硕机械制造有限公司 | Automatic laser etching wobble plate machine |
CN104955275A (en) * | 2014-03-24 | 2015-09-30 | 机科发展科技股份有限公司 | Multi-station all-in-one machine for flexible printed circuit boards |
CN204867826U (en) * | 2015-08-04 | 2015-12-16 | 深圳市镭恩特自动化技术有限公司 | UV laser cutting machine |
CN105246271A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Island type hard board rigid-flex combination board |
CN106346142A (en) * | 2016-11-02 | 2017-01-25 | 江苏弘信华印电路科技有限公司 | Method for producing single PCS substrate by UV laser cutting |
CN207022288U (en) * | 2017-06-01 | 2018-02-16 | 上达电子(深圳)股份有限公司 | The production system of flexible PCB |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108568859A (en) * | 2018-04-20 | 2018-09-25 | 上达电子(深圳)股份有限公司 | flexible circuit board processing system and method |
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Effective date of registration: 20220110 Address after: 435003 No. 91, Sike Avenue East, Jinshan street, Huangshi economic and Technological Development Zone, Huangshi City, Hubei Province Applicant after: LEADER-TECH (HUANGSHI) Inc. Address before: 518000 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. |
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