CN107116279A - Integration system for foam metal phase change temperature control component method - Google Patents
Integration system for foam metal phase change temperature control component method Download PDFInfo
- Publication number
- CN107116279A CN107116279A CN201710405691.7A CN201710405691A CN107116279A CN 107116279 A CN107116279 A CN 107116279A CN 201710405691 A CN201710405691 A CN 201710405691A CN 107116279 A CN107116279 A CN 107116279A
- Authority
- CN
- China
- Prior art keywords
- temperature control
- packaging container
- control component
- phase change
- foam metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Integration system proposed by the present invention for foam metal phase change temperature control component method, aim to provide in a kind of solution phase change temperature control component and there is gap between foam metal and matrix material, the process for the problem of influenceing thermal response rates, the technical scheme is that：Packaging container fixture is prepared according to packaging container appearance and size；The cavity for welding foam metal is pre-machined out in packaging container, then one layer of weld tabs is laid in packaging container inside cavities solder side, and tin is warded off in foam metal contact interface；Foam metal is compressed to cavity size；Packaging container, foam metal and fixture are assembled integral and heated, the phase change temperature control component blank of formation is taken out after cooling out of packaging container fixture；Under isoperibol, liquid state phase change material is poured into phase change temperature control component from packaging container bottom perfusing hole；Finally sealed perfusing hole, and complete the processing of temperature control component profile.
Description
Technical field
The present invention relates to the preparation side of a kind of phase change temperature control component in electronic device thermal control field and its integral forming
Method, belongs to electronic equipment phase change temperature control field.
Background technology
Usual electronic device need to work within the scope of certain temperature, but electronic device can operationally produce certain heat
Amount causes own temperature constantly to raise, if temperature exceedes allowable temperature scope and can reduced because of its electronic device or chip failure
The reliability of system.There is statistical report to point out:Electronic device failure more than half is all as caused by temperature.Result of study table
The temperature of bright electronic component reduces by 1 DEG C in normal working temperature level, and its fault rate can reduce 4%；If 10~20 DEG C of increase,
Then fault rate improves 100%.However, the heat convection method and air blast cooling method of traditional dependence monophasic fluid are difficult to meet
The cooling requirements of many electronic devices, it is therefore necessary to which researching and developing new heat dissipation technology will to have adapted to high heat flux radiating
The occasion asked.
More and more with the species of modern electronic equipment, volume and quality are less and less, the power dissipation density of electronic device
Heat flow density in more and more higher, unit area also more and more higher, the temperature control to electronic equipment proposes higher and higher requirement.
Current electronic device has two developing directions:One is computing high speed；Two be integrated chip, and which results in electronic device
Heating heat flow density constantly increases, and the heat dissipation problem of electronic device turns into the bottleneck that electronics industry develops.Research shows that electronics is set
Standby stability is directly related with operating temperature, and semiconductor devices contact temperature often rises 10 DEG C, and electronic operating failure rate will
Double, temperature often raises 25 DEG C, and crash rate increases 10 times.Such as nearly the 1/2 of total failare is accounted for by thermally-induced failure sum.
On the other hand, the cyclically-varying of temperature can produce heat fatigue phenomenon, and this is due to that the different of various material expand coefficients can exist
Machinery and thermal stress are produced inside electronic component, the destruction of electronic component is can frequently result in, therefore the good heat of electronic equipment is set
The key into system design has been counted, has been particularly important for this Aerospace Electronics System high to reliability requirement.
In order to ensure that electronic equipment and plant equipment effectively and reliably working, usually require that the work within the scope of certain temperature
Make, this just includes normal temperature, low temperature and constant temperature requirement；The uniformity and stability of keeping temperature, to ensure that payload has
Higher structural stability.It is general to use active temperature control means, forced convertion, electrical heating, low temperature system in order to meet these demands
The mode such as cold meets various temperature requirements.Some heat generating components are by conditions such as device structure size, installation sites
Limitation be difficult to transfer heat to cold drawing by heat-conducting mode.In this case it is necessary to study new significantly more efficient
Temperature control technology to carry out thermal control to the electronic equipment of different demands.
With electronic equipment towards miniaturization, highly integrated direction high speed development, the uniqueness that phase change temperature control has
Matter makes it be applied widely in the temperature control of intermittence or the electronic equipment of periodic operation and high speed development.It is used as one kind
Emerging temperature control technology, phase change temperature control is using phase-change material (Phase Change Material, PCM) in a certain specified temp
Under, from low entropy aggregation state change to high entropy state of aggregation material when need to absorb amount of heat and temperature is kept not substantially in transition process
The property of change, and then adjust, temperature control data collection environment temperature controlled, so as to realize the temperature control to electronic equipment..Treat temperature control pair
As the heat of absorption is discharged into environment by phase-change material again during shutdown, be next time the work period be ready.Experiment knot
Fruit shows：Integrated circuit of the temperature of the integrated circuit of temperature control than carrying out temperature control without using phase-change material is carried out with phase-change material
Temperature-averaging is low 7~8 DEG C.
Foreign countries' phase-change temperature control technology is in many high-tech areas at present, and such as Aeronautics and Astronautics, electronics field is answered
With.Divided according to phase-change type, phase-change material can be divided into solution-air phase-change material, gas-solid phase-change material, solid-liquid phase change material and
The type of solid-solid phase transition material four.Solution-air phase-change material is gentle-solid phase change material phase transition process in gas change, meeting
Cause the acute variation of phase-change material volume.Although therefore the latent heat of phase change of this two classes material phase transformation process is very big, in practice
But seldom application.The Volume Changes of solid-solid phase transition material are minimum, but its latent heat of phase change is minimum in four kinds of phase-change material types
, so
Also seldom application in practice.Compared with other three types, the latent heat of phase change of solid-liquid phase change material is moderate, and volume becomes
Change less,
It is the phase-change material type usually used in practice.
Constituted according to chemical composition, phase-change material is divided into organic phase-change material, inorganic phase-change material and complex class phase
Become material.
The screening of phase-change material needs to consider many factors, such as phase transition temperature, energy storage density in actual applications.
Need to consider from the following aspects for selection phase-change material rule:1st, phase transition temperature and destination matches are used；2、
Latent heat of phase change is big；3rd, it is cheap and easy to get；4th, chemical stability is good；5th, the compatibility with storage container is good；6th, heat endurance is good；7th, have
There are good heat transfer and mobile performance；8th, with relatively low vapour pressure etc..Other phase-changing energy storage material should also have nontoxic, nothing
Taste, phase transformation Volume Changes are small, without supercooling or degree of supercooling it is small, without the property such as phase Segregation, nonflammable.Therefore conventional phase transformation
Material mainly has paraffin class, low-melting alloy class and inorganic salts.
Inorganic phase-change material mainly includes crystalline hydrate salt phase-change material, molten salts phase-change material, metal class phase
Become material and other inorganic matters.It is high using the energy storage density for being hydrated salt and molten salts as the salt phase-change material of representative, but should
The major defect of class phase transformation material is:1st, there is surfusion, so-called " supercooling " refer to material condensation to when " condensation point " not
Crystallization, but just start crystallization when arriving the certain temperature of " condensation point " below, while discharging latent heat of phase change so that temperature is fast
Speed rises to condensation point, and this can influence release and absorption of the phase-change material to heat；2nd, there is phenomenon of phase separation, phase separation refers to
When temperature is raised, hydrated salt is not enough to dissolve all non-crystalline solids dehydration salt because melting the discharged crystallization water,
These undissolved salt settlings have arrived container bottom due to gravity, in process of setting, are deposited to the undissolved of bottom
Salt can not be recrystallized because can not be combined with the crystallization water, form the layering of phase, cause the energy storage capacity of phase-change material to drop
Low, causing the service life of phase-changing energy storage material reduces.
Another common used material is metal class phase transformation material in inorganic phase-change material, the metalloid mainly by Sn, Bi,
The ternary alloy three-partalloy and quaternary alloy of the low-melting alloy such as Pb, Cd, In, Ga, Sb element composition, such material phase transformation latent heat are big, lead
Hot good, thermal conductivity factor is typically tens times and hundred times of other phase-changing energy storage materials, no surfusion, and without phase separation
Phenomenon.Test result indicates that, metal class phase transformation material has higher unit volume latent heat of phase change, and phase transformation can be reduced in the application
The use volume of material；Metal class phase transformation material has preferable heat conductivility, can effectively reduce the temperature inside phase-change material
Gradient.But there is liquid metal embrittlement phenomenon, i.e. liquid metal class phase transformation material in solid metal (such as aluminium in metal class phase transformation material
And its alloy) in diffusion caused by solid metal grain boundary decision, so as to cause the corrosion of the packaging container of outside, general performance
Elongation percentage and the contraction percentage of area fall sharply during for failure, actual breaking stress reduction, the even below yield strength of material.The opposing party
Face, the proportion of composing of each low melting point element is larger to the hot material properties affect of phase change materials, and this to screen metal phase change material
Time-consuming for material, cost is high, is not easy in practical engineering application.
Organic phase-change material mainly includes paraffin class phase-change material, fatty acid phase-change material, polyalcohols phase transformation material
Material and other organic matters.Using paraffin class and fatty acid as the organic phase-change material temperature adaptability of representative is good, density is low, single
Position volume phase transformation enthalpy is higher, physical and chemical performance stable, to container non-corrosiveness, divide caused by not being subcooled and separating out
Layer phenomenon, corrosivity is also smaller.But in actual applications, organic phase-change material is asked there is also low thermal conductivity and density are small etc.
Topic.Low thermal conductivity, mainly by adding high thermal conductivity material or being made up using enhanced thermal conduction structure, which increase this kind of compound phase
Become the preparation difficulty of material.In other side organic phase-change material there is also certain deficiency, such as:Organic phase in phase transition process
Become material volume change greatly, it is volatile, easy firing, oxidizable etc..
Generally, phase change temperature control system is main main by phase-change material, enhanced thermal conduction body or heat filling and packaging container etc. three
Part is constituted.The phase-change material for being encapsulated in internal system is the core of whole system, and its effect is to realize function of temperature control, and heat conduction increases
The effect of strong body (metal foam, fin, honeycomb etc.) or heat filling (metal powder, graphite powder etc.) is to improve leading for phase-change material
Thermograde produced in heat energy power, reduction phase transition process etc..The effect of outer enclosure container is to prevent phase-change material in phase transformation
During melt caused by liquid phase be lost in (solid-liquid phase change) or distillation caused by gas phase loss (phase transformation), if without suitable
Container is contained, and phase-change material can be revealed, and cause the temperature control capacity of phase change temperature control component to decline, or even can be to temperature control target part
Damage.Some phase change materials even can corrode packaging container material or volatilization, can cause phase-change energy-storage units energy storage
Temperature control capacity declines, or even electronic device and packaging container can be damaged.In addition, phase-change material is encapsulated in into definite shape
, can also play in sealed container and phase-change material to be accommodated, protect, conducts heat and is easy to the effect such as operation.
Diabatic process inside phase-change material is a Transient Heat Transfer process, and each moment material internal has temperature
Difference, accordingly, it would be desirable to set up low thermal resistance heat dissipation channel in phase-change temperature control device, improves the heat conductivility of phase change temperature control system, drop
Low phase becomes the material internal temperature difference, improves heat storage capacity.There are two kinds at present in the mode for strengthening heat conduction, one kind is in phase-change material
It is implanted into enhanced thermal conduction body, such as metal foam, fin, honeycomb structure type；Another is that heat conduction is filled in phase-change material
Filler such as metal powder, graphite powder etc..Consider quality difficulty of processing and cost, foam metal may be selected and is used as enhanced thermal conduction
Body, while being reinforced heat conduction enhancing effect, is integrally formed making, to reduce heat dissipation channel edge by foam metal with encapsulation aluminium vessel
Journey thermal contact resistance.
Paraffin class phase-change material is as a kind of the most frequently used phase-change material, and its thermal adaptability is good, density is low, unit volume
Phase transformation enthalpy is higher, physical and chemical performance stable, to container non-corrosiveness, but the thermal conductivity factor of generally paraffin is low, thermal conductivity
It is relatively low, thermal response time it is longer and meanwhile have the shortcomings that solid-liquid phase change process easily occur leakage, heat exchange property it is poor.Paraffin is low
Thermal conductivity factor is the biggest obstacle of its application, it is necessary to it is carried out heat conduction reinforced.At present, the method for augmentation of heat transfer mainly uses wing
Piece heat exchange of heat pipe structure and addition highly heat-conductive material, however, these measures can undoubtedly increase the weight and body of heat reservoir equipment
Product.To improve the thermal conductivity of paraffin class phase-change material.Method widely used at present is that bubble is added in organic phase-change material
The enhanced thermal conduction such as foam metal material formation composite phase-change material, then the composite phase-change material is packaged in packaging container, so that
Form phase change temperature control component.But the major defect of which is between foam metal and packaging container many using direct extruding side
Formula, the connection of foam metal and packaging container is realized by interference fit, but this mode is easily held in foam metal with encapsulation
Gap is produced between device contact surface, the thermal response rates of phase change temperature control component are have impact on.
The content of the invention
It is an object of the invention to for existing phase change temperature control component not enough, there is provided a kind of thermal response rates are higher, heat
Response time is shorter, the more preferable integral forming foam metal phase change temperature control electronic device assembly of heat-conducting effect preparation method,
To solve between foam metal and packaging container to exist in prior art phase change temperature control component gap so as to influence thermal response rates
The problem of.
To achieve the above object, a kind of integration system for providing of the present invention for foam metal phase change temperature control component method,
With following technical characteristic：A packaging container fixture is prepared according to the appearance and size of phase change temperature control component first；Hold in encapsulation
The cavity for welding foam metal 3 is pre-machined out in device 4, and in the welding of the cavity and its cover plate 2 for covering cavity
It is pre- silver-plated on face, then lay one layer of weld tabs in the inside cavities solder side of packaging container 4；Packaging container 4 and packaging container are pressed from both sides
Tool is preheated to weld tabs and is completely melt, tin is warded off in the contact interface of foam metal 3；Foam metal 3 is put into the pressure of packaging container fixture
In the compression square-cavity of the lower section of plate 7, cavity size is compressed to；Integrally it is placed in thermal station and heats in company with packaging container fixture；Cooling
The phase change temperature control component blank of formation is taken out out of packaging container fixture afterwards；Under isoperibol, from the perfusion of the bottom of packaging container 4
Liquid state phase change material is poured into phase change temperature control component by mouth；Finally squeezed into after perfusing hole and to be sealed with Laser Welding with stifled pin, and
Complete the processing of phase change temperature control component profile.
Preferably, 2~3mm is in the aperture of the foam metal used, through-hole rate more than 98%.
Preferably, the phase-change material used is paraffin class phase-change material, and foam metal 3 is foam copper.
Preferably, packaging container 4, the cover plate 2 used is made by aluminium.
Preferably, welding manner is used between foam copper and packaging container 4, cover plate 2.
Preferably, packaging container 4, the welding position of cover plate 2 used should be silver-plated in advance.
Preferably, the weld tabs used is SAC class or tin-lead class weld tabs.
Preferably, packaging container 4, cover plate 2 and packaging container the fixture preheating time in thermal station are 15min~40min, phase
The heat time, into 1min~3min, preheats and heating-up temperature is more than weld tabs fusion temperature 20 DEG C after the completion of becoming the assembling of temperature control component
~40 DEG C.
The present invention has the advantages that compared to prior art：
Thermal response rates are high, and thermal response time is short.The present invention using foam metal 3 as enhanced thermal conduction body, by liquid state organics class
Phase-change material is used as enhanced thermal conduction material, foam gold as phase-change material using the foam metal 3 being welded on packaging container 4
Category strengthens the transmission of liquid state organics class phase transformation material hot-fluid in the liquid phase, adds heat flow density, synchronization is had more
Many PCM participate in phase transformation, and more converting heats are stored for latent heat, so that reduction thermograde is reached, the liter of relieving system
Warm speed effect, further increases thermal response rates, compared to the side between foam metal 3 and packaging container 4 using interference fit
Formula, further increases the equivalent thermal conductivity of phase change temperature control component, improves heat transfer property, overcomes metal class phase transformation material easy
The problem of corroding canister, cause the failure of container.Finally by heat experiment to the thermal design side using phase change temperature control system
Case is verified.Experimental result is coincide preferably with Numerical results, and Comparative result maximum deviation is no more than 5%.Experiment
Showing, metal heat-conducting material is added in PCM, cooling effect 15%~40% can be improved, mean temperature can reduce by 15%~
40%, cool time can extend 40%~45%.
Density is big.Foam metal 3 is compressed to the inner chamber body size of packaging container 4 by the present invention, effectively reduces heat sink chi
It is very little, with the characteristics of density is big, thermal conductivity is good, phase transition process is stable, solve foam gold in prior art phase change temperature control component
The problem of category between packaging container 4 with having gap and existing foam metal 3 contact poor defect with packaging container 4, improve
Heat transfer property between foam metal 3 and packaging container 4, improves the thermal response rates of phase change temperature control component.The present invention is adopted
With foam metal combination liquid organic phase-change material, overcome prior art solution-air phase transformation it is gentle-solid phase is adjoint during becoming
There is gas change, the defect of the acute variation of phase-change material volume can be caused, it is to avoid be organic phase-change material low thermal conductivity, close
The small, energy storage capacity of degree is low, can cause the problems such as increase of energy-storage system volume, the manufacture craft difficulty of composite phase-change material increase,
Overcome the shortcoming that single inorganic matter or organic matter phase-change heat-storage material are present, improve again phase-change material application effect or even
Expand its application.
Latent heat of phase change is big.The present invention uses liquid state organics class phase transformation material, and such as paraffin uses weldering as phase-change material
The foam metal 3 on packaging container 4 is connected on as enhanced thermal conduction material, is realized using solid-liquid phase change latent heat to electronic equipment
The heat of absorption/release, overcomes simple organic phase-change material and nothing in temperature control, liquid organic phase-change material fusion process
Density that machine salt phase-change material is present is small, thermal conductivity is relatively low, heat endurance is poor, and thermal response time is longer, have in phase transition process
Machine class phase transformation material volume change greatly, volatile, easy firing, it is oxidizable the shortcomings of, and wax phase change latent heat is higher, crystalline rate
Height, no supercooling and precipitation phenomenon, performance are stable, and nontoxic, nonirritant, non-corrosiveness is cheap.The present invention will contain paraffin class
Liquid phase phase-change material combination foam metal 3 constitute phase-change temperature control device be applied to electronic heating equipment on, packaging container 4,
Thermal contact resistance is reduced using welding manner between cover plate 2 and foam metal 3, heater members surface temperature is extended and rises to and permit
Perhaps the time of temperature upper limit, the temperature control requirement of electronic equipment is met.
Phase change temperature control component of the present invention realizes welding of the foam metal 3 on packaging container 4.
Brief description of the drawings
Fig. 1 is flow chart of the integration system of the present invention for electronic device foam metal phase change temperature control component.
Fig. 2 is the schematic diagram that the present invention assembles foam metal phase change temperature control component by the integration of packaging container fixture.
In figure：Connected firmly on 1 fixture and plate is connected firmly under plate, 2 cover plates, 3 foam metals, 4 packaging containers, 5 guide pillars, 6 fixtures, 7 pressures
Plate, 8 holddown springs, 9 holddown springs are turned round.
Embodiment
The present invention is described in further detail below in conjunction with drawings and examples, but therefore not limited the present invention to
Among described scope of embodiments.
Refering to Fig. 1 and Fig. 2.According to the present invention, packaging container folder is prepared according to the appearance and size of phase change temperature control component first
Tool, is pre-machined out the cavity for welding foam metal 3 in packaging container 4, and in the cavity and the solder side of cover plate 2
Pre- silver-plated, then solder side lays one layer of weld tabs in the cavity of packaging container 4, and packaging container and packaging container fixture are preheated to
Weld tabs is completely melt；Foam metal 3 is compressed to cavity size and the upper and lower contact interface of foam metal 3 is warded off into tin；By foam gold
Category 3, packaging container 4 and cover plate 2 and packaging container fixture assemble integral and are placed on heating in thermal station, after cooling out of fixture
Taking-up forms phase change temperature control component blank；Then under isoperibol, by the bottom perfusing hole of packaging container 4 by liquid phase-change material
Material is poured into phase change temperature control component；Finally stifled pin is squeezed into after perfusing hole and sealed with Laser Welding, and completes phase change temperature control group
The processing of part profile.
The phase change temperature control component of integral forming mainly includes packaging container 4, cover plate 2, the foam being welded on matrix gold
The solid-liquid organic matter class phase transformation material that category 3 and embedding are entered inside foam metal 3, wherein, foam metal 3 can be foam copper,
The foam of some alloys of Al-Si, Al-Si-Mg, Al-Si-Cu and Zn-A1 system, test result indicates that Al-Si-Mg systems alloy
With preferable heat storage capacity, Al-Si-Cu systems alloy has a longer heat accumulation life-span, wherein Al-Si systems alloy foam have compared with
High heat storage capacity, longer service life and preferable economy.Packaging container 4, cover plate 2 can select high heat conduction aluminium alloy system
It is standby, using the various method machine-shapings such as milling, car, brill.After temperature control component blank cooling to be phased, pin is passed through into interference fit
At the perfusing hole for squeezing into temperature control component blank, and reinforce close with Laser Welding at extruding.
The phase change temperature control component most preferred embodiment of the present invention is by packaging container 4, cover plate 2, foam copper 3 with having suitable phase transformation
The paraffin of temperature is constituted.In order to improve its paraffin phase change material heat conductivility, particle diameter can be added in paraffin phase change material is
80 μm, the aluminium powder that mass fraction is 0.5%.As a result show, the heat accumulation time after aluminium powder that adds about shortens 60%.Adopted
Packaging container 4, cover plate 2 are made up of 6063 aluminiums；The density of the foam copper 3 used is 0.2g/cm3, aperture is 2mm,
Porosity is 98%；The phase transition temperature of the paraffin used is 82 DEG C, and thermal conductivity is 0.2W/mK, and phase transformation enthalpy is 220J/
cm3；The weld tabs that is used and tin solder is warded off for tin-silver-copper solder, fusion temperature is 221 DEG C, and thickness is 0.1mm.It will be encapsulated in
Packaging container 4 and its cover plate 2 in packaging container fixture cavity are assembled integrally, are then preheated in 250 DEG C~300 DEG C thermal station
15min~40min, until the weld tabs on packaging container 4 is completely melt；Heat cooling after 1min and take out phase change temperature control component hair
Base, under constant temperature, phase change temperature control component is poured into by liquid solid-liquid organic phase-change material by the bottom of packaging container 4
In blank.Usual packaging container 4, cover plate 2 and packaging container the fixture preheating time in thermal station are 20min, and the heat time is
1min, preheating and heating-up temperature are 250 DEG C.
In the present embodiment, realize as steps described below：
S1, the inner chamber body of packaging container 4 and the welding position of cover plate 2 are silver-plated；
S2, by foam copper 3, packaging container 4, the pickling of cover plate 2 and is dried；
S3, is compressed to the inner chamber body size of packaging container 4, and ward off tin on the upper and lower contact surface of foam copper 3 by foam copper 3；
S4, SAC weld tabs is cut out to corresponding size and the welding position of packaging container 4 is placed on；
S5,20min is preheated in 250 DEG C of thermal station by packaging container 4, cover plate 2, packaging container fixture, until on packaging container 4
Weld tabs is completely melt；
S6, assembles foam copper, packaging container 4, cover plate 2 integral and is fixed with packaging container fixture；
S7,1min is heated in 250 DEG C of thermal station；
S8, takes out phase change temperature control component blank after cooling out of fixture；
S9, under 100 DEG C of constant temperature, phase change temperature control component blank is poured into by liquid paraffin by the bottom of packaging container 4
In；
S10, stifled pin is squeezed into after perfusing hole and sealed with Laser Welding；
S11, completes the processing of phase change temperature control component profile as requested.
Refering to Fig. 2.Packaging container fixture includes：It is fixedly connected on fixture and is connected firmly under plate 1, fixture admittedly by circumferential guide pillar 5
The rectangular box of the composition of yoke plate 6 and the holddown spring being arranged in a matrix by connecting firmly plate 1 on fixture turn round 9, and holddown spring 8 is restrained
Turned round in the holddown spring between 9 annular grooves and the spring base of pressing plate 7.
Claims (10)
1. a kind of integration system is for the method for foam metal phase change temperature control component, with following technical characteristic：First according to phase transformation
The appearance and size of temperature control component prepares a packaging container fixture；It is pre-machined out in packaging container (4) for welding foam
The cavity of metal (3), and it is pre- silver-plated on the solder side of the cavity and its cover plate (2) for covering cavity, then hold in encapsulation
Device (4) inside cavities solder side lays one layer of weld tabs, and packaging container (4) and packaging container fixture are preheated into weld tabs melts completely
Change；In foam metal (3), contact interface wards off tin, and foam metal (3) is put into the compression below the pressing plate of packaging container fixture (7)
In cavity volume, cavity size is compressed to, and packaging container (4), cover plate (2) and packaging container fixture are assembled integral, is placed on
Heated in thermal station；The phase change temperature control component blank of formation is taken out after cooling out of packaging container fixture；Under isoperibol, from envelope
Liquid state phase change material is poured into phase change temperature control component by packaging container (4) bottom perfusing hole；Finally perfusing hole is squeezed into stifled pin
Sealed afterwards with Laser Welding, and complete the processing of phase change temperature control component profile.
2. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Used
Foam metal 3 aperture be 2~3mm, through-hole rate more than 98%.
3. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Phase alternating temperature
Control component is made up of the packaging container (4) and its cover plate (2) of encapsulation foam metal (3).
4. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Encapsulation is held
Device fixture includes：The rectangle frame for being connected firmly on fixture and plate (6) composition being connected firmly under plate (1), fixture is fixedly connected with by circumferential guide pillar (5)
Body and the holddown spring being arranged in a matrix by connecting firmly plate (1) on fixture turn round (9), and holddown spring (8) is constrained on the compression
Spring is turned round between (9) annular groove and pressing plate (7).
5. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Encapsulation is held
Device (4), cover plate (2) and packaging container the fixture preheating time in thermal station are 15min~40min, and phase change temperature control component has been assembled
It is 1min~3min into the rear heat time, preheating and heating-up temperature are more than weld tabs fusion temperature 20 DEG C~40 DEG C.
6. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Foam gold
It is at least one of foam copper, foamed aluminium, Al-Si, Al-Si-Mg, Al-Si-Cu and Zn-A1 system alloy foam to belong to (3).
7. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Solid-liquid
Organic phase-change material is any one or a few the mixture in fatty acid, polyalcohols and paraffin class.
8. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Foam gold
It is connected with each other between category (3), packaging container (4) and cover plate (2) using welding manner.
9. integration system as claimed in claim 3 is for the method for foam metal phase change temperature control component, it is characterised in that：In paraffin
The aluminium powder that particle diameter is 80 μm, mass fraction is 0.5% is added in phase-change material.
10. integration system as claimed in claim 1 is for the method for foam metal phase change temperature control component, it is characterised in that：Will envelope
Packaging container (4) and its cover plate (2) assembling in packaging container fixture cavity is integral, then in 250 DEG C~300 DEG C heat
15min~40min is preheated on platform, until the weld tabs on packaging container (4) is completely melt；Heat cooling after 1min and take out phase alternating temperature
Component blank is controlled, under constant temperature, liquid solid-liquid organic phase-change material is poured into phase transformation by the bottom of packaging container 4
In temperature control component blank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710405691.7A CN107116279A (en) | 2017-06-01 | 2017-06-01 | Integration system for foam metal phase change temperature control component method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710405691.7A CN107116279A (en) | 2017-06-01 | 2017-06-01 | Integration system for foam metal phase change temperature control component method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107116279A true CN107116279A (en) | 2017-09-01 |
Family
ID=59729410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710405691.7A Pending CN107116279A (en) | 2017-06-01 | 2017-06-01 | Integration system for foam metal phase change temperature control component method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107116279A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107840620A (en) * | 2017-11-13 | 2018-03-27 | 张家港市华孚实业有限公司 | Phase change paraffin composite expanded perlite material and preparation method thereof |
| CN107892512A (en) * | 2017-11-13 | 2018-04-10 | 张家港市华孚实业有限公司 | A kind of preparation method of phase change paraffin composite expanded perlite |
| CN109321212A (en) * | 2018-10-28 | 2019-02-12 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of the compound PCM combined phasetransform temperature control component of nanotube |
| CN109759742A (en) * | 2019-03-13 | 2019-05-17 | 重庆理工大学 | A kind of solder and welding method of no soldering flux |
| CN110315161A (en) * | 2019-07-10 | 2019-10-11 | 哈尔滨理工大学 | A kind of High-temperature Packaging Cu3The preparation method of Sn/ foam copper composite-joint |
| CN111574965A (en) * | 2020-03-30 | 2020-08-25 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for pouring phase-change material of phase-change temperature control component of electronic device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201036853Y (en) * | 2007-04-28 | 2008-03-19 | 比亚迪股份有限公司 | Clamp capable of fixing thin type piece |
| CN201107006Y (en) * | 2007-09-28 | 2008-08-27 | 北京航空航天大学 | Foam copper-phase-changing material accumulated energy element and temperature control device using the same |
| CN101408389A (en) * | 2008-11-26 | 2009-04-15 | 北京航空航天大学 | Combined type foamed metal core material and phase-change thermal storage apparatus using the same |
| US20140008042A1 (en) * | 2011-03-23 | 2014-01-09 | Biocision, Llc | Phase change thermal-sink apparatus |
| CN104764350A (en) * | 2014-01-08 | 2015-07-08 | 江苏格业新材料科技有限公司 | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core |
| CN104893674A (en) * | 2015-06-03 | 2015-09-09 | 中国科学院空间应用工程与技术中心 | Foamy carbon/paraffin type phase-change composite material and encapsulation method thereof |
| CN105841532A (en) * | 2015-01-12 | 2016-08-10 | 江苏格业新材料科技有限公司 | Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate |
-
2017
- 2017-06-01 CN CN201710405691.7A patent/CN107116279A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201036853Y (en) * | 2007-04-28 | 2008-03-19 | 比亚迪股份有限公司 | Clamp capable of fixing thin type piece |
| CN201107006Y (en) * | 2007-09-28 | 2008-08-27 | 北京航空航天大学 | Foam copper-phase-changing material accumulated energy element and temperature control device using the same |
| CN101408389A (en) * | 2008-11-26 | 2009-04-15 | 北京航空航天大学 | Combined type foamed metal core material and phase-change thermal storage apparatus using the same |
| US20140008042A1 (en) * | 2011-03-23 | 2014-01-09 | Biocision, Llc | Phase change thermal-sink apparatus |
| CN104764350A (en) * | 2014-01-08 | 2015-07-08 | 江苏格业新材料科技有限公司 | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core |
| CN105841532A (en) * | 2015-01-12 | 2016-08-10 | 江苏格业新材料科技有限公司 | Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate |
| CN104893674A (en) * | 2015-06-03 | 2015-09-09 | 中国科学院空间应用工程与技术中心 | Foamy carbon/paraffin type phase-change composite material and encapsulation method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107840620A (en) * | 2017-11-13 | 2018-03-27 | 张家港市华孚实业有限公司 | Phase change paraffin composite expanded perlite material and preparation method thereof |
| CN107892512A (en) * | 2017-11-13 | 2018-04-10 | 张家港市华孚实业有限公司 | A kind of preparation method of phase change paraffin composite expanded perlite |
| CN109321212A (en) * | 2018-10-28 | 2019-02-12 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of the compound PCM combined phasetransform temperature control component of nanotube |
| CN109759742A (en) * | 2019-03-13 | 2019-05-17 | 重庆理工大学 | A kind of solder and welding method of no soldering flux |
| CN109759742B (en) * | 2019-03-13 | 2024-03-26 | 重庆理工大学 | Solder for soldering flux-free and soldering method |
| CN110315161A (en) * | 2019-07-10 | 2019-10-11 | 哈尔滨理工大学 | A kind of High-temperature Packaging Cu3The preparation method of Sn/ foam copper composite-joint |
| CN110315161B (en) * | 2019-07-10 | 2021-03-26 | 哈尔滨理工大学 | Cu for high-temperature packaging3Preparation method of Sn/foam copper composite joint |
| CN111574965A (en) * | 2020-03-30 | 2020-08-25 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for pouring phase-change material of phase-change temperature control component of electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107116279A (en) | Integration system for foam metal phase change temperature control component method | |
| CN106918259B (en) | Rapid thermal response composite phase-change heat-storage device and preparation method thereof | |
| EP1264343B1 (en) | Apparatus and method for passive phase change thermal management | |
| CN108682664A (en) | A kind of power module and preparation method thereof based on phase-change material | |
| CN104218010B (en) | A kind of metal heat interface material | |
| CN104893674B (en) | A kind of foamy carbon/paraffin class phase change composite material and its method for packing | |
| Muñoz-Sánchez et al. | Encapsulated high temperature PCM as active filler material in a thermocline-based thermal storage system | |
| US20190368822A1 (en) | Cooling Device Having a Heat Pipe and a Latent Heat Store | |
| CN108997980B (en) | Phase change heat conduction material for optical fiber laser, preparation method and application method | |
| CN101578029A (en) | Phase-change temperature control device integrating heat pipe and foam metal core body | |
| US20120061065A1 (en) | Heat-absorbing structural material | |
| CN106052452A (en) | Composite phase-change heat sink based on low-melting-point metal phase-change material | |
| CN112351650A (en) | Design method of missile-borne transient thermal control electronic module composite phase change cold plate | |
| CN109321212A (en) | The preparation method of the compound PCM combined phasetransform temperature control component of nanotube | |
| CN106244114A (en) | A kind of phase-change accumulation energy temperature-controlling system based on mobile foam metal and method | |
| CN107041102A (en) | The heat abstractor of a kind of electronic equipment and device | |
| CN104993184A (en) | Power battery and cooling system thereof | |
| CN114423236B (en) | Preparation method of phase change heat reservoir of electronic equipment | |
| CN103280437B (en) | Soldered ball, the BGA packages comprising soldered ball and heat management enhancement method thereof | |
| CN106785199A (en) | A kind of Li-ion batteries piles power supply heat sinking device | |
| CN111574965A (en) | Method for pouring phase-change material of phase-change temperature control component of electronic device | |
| CN114525431B (en) | Aluminum-based phase-change heat storage alloy composite material and preparation method thereof | |
| CN113207271B (en) | Phase-change energy-storage type radiator | |
| JP6115264B2 (en) | Cold plate | |
| JP6497192B2 (en) | Heat dissipation fin using porous metal, heat sink and module mounted with the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170901 |
|
| WD01 | Invention patent application deemed withdrawn after publication |