CN107104735A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN107104735A CN107104735A CN201710220900.0A CN201710220900A CN107104735A CN 107104735 A CN107104735 A CN 107104735A CN 201710220900 A CN201710220900 A CN 201710220900A CN 107104735 A CN107104735 A CN 107104735A
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- China
- Prior art keywords
- golden finger
- row
- pin
- optical module
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2589—Bidirectional transmission
- H04B10/25891—Transmission components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
The present invention discloses a kind of optical module, including circuit board, the first optical chip, the second optical chip and processor, the same surface of circuit board has first row golden finger and second row golden finger, first power pins of first row golden finger are connected with the first optical chip, the second source pin of second row golden finger is connected with the second optical chip and processor respectively, the bearing of trend of first power pins is overlapped with the bearing of trend of second source pin, and the first power pins are connected with second source pin.When optical module is inserted, power supply shell fragment remains the electrical connection with second source pin so that second source pin remains the power supply state to optical module, can avoid the formation of current surge.
Description
Technical field
The present invention relates to optical communication field, more particularly to a kind of optical module.
Background technology
Optical module is the core devices in optical communication system, and it completes the mutual conversion of photosignal.
A kind of optical module structure schematic diagram that Fig. 1 provides for prior art.As shown in figure 1, optical module include upper shell, under
Housing, optical assembly and circuit board, are connected between optical assembly and circuit board by flexible PCB, and upper shell is wrapped with lower house formation
The cavity of optical assembly and circuit board is wrapped up in, optical assembly one end is the optical interface of optical module, and optical fiber, circuit board one are connected at optical interface
Hold connection external system at the electrical interface for optical module, electrical interface.
Specifically, circuit board surface has processor, optical chip and golden finger, the pin of processor and the pin of optical chip
It is connected respectively with the pin of golden finger.Multiple pins such as ground pin, power pins and data pin are included in golden finger.
In the golden finger slot of the golden finger insertion external system of optical module, have and golden finger pin in golden finger slot
One-to-one contact flat spring, when optical module is combined with external system, in circuit board insertion golden finger slot, contact flat spring folder
Handle circuit board, the pin of shell fragment and golden finger is in electrical contact, wherein, power supply shell fragment is contacted with power pins, data shell fragment with
Data pin is contacted, and ground shell fragment is contacted with ground pin.The power pins that external system passes through golden finger are processor and optical chip
Power supply, data interaction is realized by data pin and processor and optical chip, passes through ground pin and the ground of processor and optical chip
Connection.
Optical module circuit board is partially inserted into external system, and the surface of the circuit board has row's golden finger pin.Optical mode
Block professional standard is made that to the function of golden finger pin and provided one by one, can meet processor and optical chip on optical module
Powered communication requirement, form the matching relationship between a set of golden finger pin, processor and optical chip.
The limitation of board area causes the limited amount of pin in row's golden finger, with optical chip and place in optical module
The increase of device quantity is managed, golden finger needs to arrange more pins.
Fig. 2 is the golden finger pin design diagram that provides in prior art.Due to golden finger pin, processor and light core
There is matching relationship between piece, when newly increasing optical chip, correspondence has newly increased row's golden finger pin.Specifically, first row
Golden finger pin is matched with a set of optical chip, and second row golden finger pin is matched with another set of optical chip.
External system provides first row contact flat spring and second row contact flat spring, the golden finger pin provided with prior art
Matching.
Optical module is first powered in start-up course, then enters row data communication, first row contact flat spring and second row
Contact flat spring has power supply shell fragment and ground shell fragment respectively, and position of the power pins in every row's golden finger is identical, to prevent gold
During finger pin inserts corresponding contact flat spring, non-electrical source pin is contacted with power supply shell fragment, causes device failure.
However, during golden finger pin inserts corresponding contact flat spring, the power pins of second row golden finger pin
First contacted with first row power supply shell fragment, be then turned off contact, then contacted with second row power supply shell fragment, cause second row golden finger
Power supply saltus step to optical module, power supply saltus step causes to undergo upper electricity by the processor and optical chip of second source pin powered, fallen
Electric, upper electricity again process, causes processor to be in power on reset states and can not normally start, or program is lost.
The content of the invention
The embodiment of the present invention provides a kind of optical module, during optical module insertion external system, it is ensured that steady to MCU
Power supply.
In order to realize foregoing invention purpose, the embodiment of the present invention is adopted the following technical scheme that:
The embodiment of the present invention provides a kind of optical module, including circuit board, the first optical chip, the second optical chip and processor, circuit
The same surface of plate has first row golden finger and second row golden finger, the first power pins and the first light of first row golden finger
Chip is connected, and the second source pin of second row golden finger is connected with the second optical chip and processor respectively, the first power pins
Bearing of trend overlapped with the bearing of trend of second source pin, the first power pins are connected with second source pin.
Optical module is needed when working in the cage at insertion system end, the golden hand inserted by the golden finger of circuit board in cage
Refer to slot, to realize that system is powered to the electrical part of optical module.When optical module is inserted, first row contacts bullet in golden finger slot
The power supply shell fragment of piece is contacted with second source pin, with the insertion of optical module, and the power supply shell fragment of first row contact flat spring is from
Two power pins slide to the first power pins, due to the bearing of trend of the bearing of trend and second source pin of the first power pins
Overlap, and the first power pins are connected with the second source pin, and power supply shell fragment is remained and second source pin
Electrical connection so that second source pin remains the power supply state to optical module, with prior art second source pin powered
Saltus step compare, current surge can be avoided the formation of.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be in embodiment or description of the prior art
The required accompanying drawing used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present invention
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Obtain other accompanying drawings.
A kind of optical module structure schematic diagram that Fig. 1 provides for prior art;
Fig. 2 is the golden finger pin design diagram that provides in prior art;
Fig. 3 is second row golden finger insertion golden finger slot schematic diagram in prior art;
Fig. 4 is first row golden finger insertion golden finger slot schematic diagram in prior art;
Fig. 5 is optical module and MCU electrifying timing sequence figures in prior art;
Fig. 6 is a kind of optical module golden finger pin design diagram provided in an embodiment of the present invention;
Fig. 7 is second row golden finger insertion inserting slot construction schematic diagram in the embodiment of the present invention;
Fig. 8 is optical module and MCU electrifying timing sequence figures in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
A kind of optical module structure schematic diagram that Fig. 1 provides for prior art, as shown in figure 1, usually, optical module includes upper
There is optical chip in housing C1, lower house C2, optical assembly CH and circuit board, optical assembly(Laser chip or light detecting chip), electricity
There is the electrical part such as microprocessor M (MCU) on the plate of road
Because the type of optical module product is different, the specific connection form of optical chip and circuit board is different, and optical chip can be with
Put on circuit boards, can also be placed in optical assembly, but optical chip and driving chip are electrically connected with circuit board.
Optical module is needed when working in the cage at insertion system end, specifically, in the golden finger P0 insertion cages of circuit board
Golden finger slot, conductance is entered by circuit board by golden finger, with realize to the electrical parts such as optical chip, driving chip and MCU supply
Electricity.
It is hot plugging between golden finger and golden finger slot provided in an embodiment of the present invention, specifically, golden finger is inserted
Groove is powered, when golden finger is contacted with golden finger slot, the electrical part being connected with golden finger(Such as microprocessor, optical chip, driving
Chip etc.)Electricity will be gone up.
Specifically, one end in circuit board insertion cage has golden finger.Golden finger can directly on the board surface
It is made or stand-alone assembly product, realizes and combine with circuit board.Circuit board, which has, can set the relative of golden finger
In two surfaces, the embodiment of the present invention, first row golden finger and second row golden finger position are in the same side surface of circuit board, with this
Another relative surface of same side surface, can set golden finger, can also be not provided with golden finger.Have on circuit board and lead
The electrical parts such as driving chip and MCU are connected by line, wire with golden finger respectively.
Different according to the electrical signal types of conducting, the pin of golden finger is divided into power pins, signal pins and ground pin.
In specific embodiment, the pin function of golden finger is defined existing professional standard, from the point of view of the evolution process of product, early
Circuit board only has row's golden finger in phase optical module, is included in circuit board apparent surface while arranging a this feelings of row's golden finger
Shape, the arragement direction of golden finger is perpendicular to the length direction of circuit board, and the grafting of pin is oriented parallel to circuit board in golden finger
Length direction.For these golden finger pins, professional standard is made that definition to pin function so that optical chip, MCU and this
One row's golden finger forms the system of a set of cooperation.
When increasing optical chip, it is necessary to increase that pin is matched, due to the pin number limitation that board area is caused,
So that row's golden finger can not provide sufficient amount of pin.
Increase the mode of pin, the technical scheme easily realized is newly increases row's golden finger so that increased optical chip with
Increased golden finger forms the system of another set of cooperation.
Fig. 2 is the golden finger pin design diagram that provides in prior art, as shown in Fig. 2 the golden hand of the row newly increased
There is insulation gap G between finger P1 and original row golden finger P2.Optical module is along during the insertion system end of A directions, and
The signal shell fragment of one row's contact flat spring is contacted with the signal pins of second row golden finger so that signal imports the signal pins, and
For the signal pins, the signal now imported is the signal of mistake, and the signal pins should be with second row contact flat spring
Contact.
Error signal for importing by way of self discharge, it is necessary to be eliminated, and this is accomplished by first row contact flat spring
After being disengaged with second row golden finger, before second row contact flat spring is contacted with second row golden finger, when retaining certain
Between be spaced, allow import error signal second row golden finger pin self discharge.
In order to realize pin self discharge, in corresponding golden finger design, first row golden finger signal pins and second row gold
Need to keep certain insulation gap between finger signal pin, and in the case that insulation gap allows in space as far as possible
Greatly.
The row's golden finger newly increased can be the duplication of this original row's golden finger or on the basis of duplication
The fine setting of pin function is carried out, the row's golden finger newly increased is mainly used in connecting the optical chip newly increased, so possessing basic
Power pins and signal pins.Specifically, first row golden finger P1 has the first power pins 106, second row golden finger P2
With second source pin 107, the first power pins 106 are in same bearing of trend with second source pin 107.
The golden finger for increasing optical module in mode, the embodiment of the present invention according to above-mentioned pin has two row's pins, the second electricity
Source pin 107 compared with the first power pins 106 closer to circuit board edge termination.First row golden finger is used to be the first optical chip
Electric signal is provided, second row golden finger is used to provide electric signal for the second optical chip, specifically, the first power pins 106 and the
One optical chip is connected, and second source pin 107 is connected with the second optical chip.
MCU can be connected by first row golden finger with external system, can also pass through second row golden finger and outside system
System connection.MCU quantity can be one or two or more;When MCU quantity is one, MCU can be supported simultaneously
First optical chip and the operation of the second optical chip, when MCU quantity is two or more, the first MCU supports the operation of the first optical chip, the
Two MCU support the operation of the second optical chip.
The structure of optical module golden finger and the structure of external system are to cooperate.During golden finger slot is external system
The part combined with optical module golden finger, Fig. 3 is second row golden finger insertion golden finger slot schematic diagram in prior art, is such as schemed
Shown in 3, the insertion external system 102 of optical module 101, the surface of optical module circuit board 103 has the first power pins 106 and the second electricity
There is first row contact flat spring 104 and second row contact flat spring 105, in optical module golden finger in source pin 107, golden finger slot
During insertion, A is slided the pin of golden finger to contact flat spring direction in the same direction, when pin is slided at contact flat spring
When complete electric connection,.
It is different according to the signal type that contact flat spring in slot is provided, contact flat spring be divided into power supply shell fragment, signal shell fragment and
Ground shell fragment, it is corresponding with the power pins in golden finger, signal pins and ground pin respectively.The voltage turned on by power pins compared with
Height, and the voltage turned on by signal pins is relatively low.
Golden finger is two rows in optical module, corresponding, and the contact flat spring in golden finger slot is two rows, reaches final knot
During conjunction state, first row contact flat spring 104 is contacted with the first power pins 106, and second row contact flat spring 105 draws with second source
Pin 107 is contacted.Due in contact process, being that A is slided to contact flat spring direction in the same direction from the pin of golden finger, so
Power supply shell fragment in first row contact flat spring 104 can be contacted with the power pins 106 of second source pin 107 and first successively.If
When second source pin 107 is contacted with first row contact flat spring 104, the corresponding pin of second source pin 107 draws for non-power
Pin, then can cause high voltage access voltage devices in, cause device failure, thus the power pins in first row golden finger with
Power pins in second row golden finger are in same bearing of trend so that in sliding process, the electricity in first row golden finger
Source pin 106 passes sequentially through the same contact flat spring in slot with the power pins in second source pin 107.
During golden finger insertion external system, the power supply shell fragment of second source pin first with first row contact flat spring
Contact, with the slip of golden finger, second source pin is separated with the power supply shell fragment of first row contact flat spring, then by first
After sliding time, second source pin is contacted with the power supply shell fragment of second row contact flat spring.
Fig. 4 is first row golden finger insertion golden finger slot schematic diagram in prior art, as shown in figure 4, the first power supply draws
Pin 106 is contacted with first row contact flat spring 104, and second source pin 107 is contacted with second row contact flat spring 105, has been reached most
Whole plugging state.
Sliding relation is relative, it is understood that for first row contact flat spring power supply shell fragment to second source pin direction
Slide, and backward first power pins direction continues to slide.
Optical module is first powered in start-up course, then enters row data communication, first row contact flat spring and second row
Contact flat spring has power supply shell fragment and ground shell fragment respectively, and position of the power pins in every row's golden finger is identical, to prevent gold
During finger pin inserts corresponding contact flat spring, non-electrical source pin is contacted with power supply shell fragment, causes device failure, so
In the embodiment of the present invention, the bearing of trend of the first power pins is overlapped with the bearing of trend of second source pin so that first connects
The power pins for touching shell fragment slip over second source pin and the first power pins successively.
Second source pin experienced electricity, again power down, upper electric three kinds of states.Fig. 5 is optical module and MCU in prior art
Electrifying timing sequence figure.At the t1 moment, by the power supply of second source pin 107, optical module module is started power up, when upper electric, existing
There is technology to open technology using slow, at the t2 moment, optical module voltage reaches after normal voltage vcc, optical module voltage stabilization that MCU is opened
It is electric on beginning;With the slip of golden finger, at the t3 moment, second row golden finger loses with first row contact flat spring and contacted, optical module
And MCU starts power down, at the t4 moment, second row golden finger is contacted with second row contact flat spring, electric on optical module and MCU recoveries.
It is can see from Fig. 4 in MCU voltage sequential, during golden finger insertion golden finger slot, MCU experience
Upper electricity, power down, the process of upper electricity again.
Although prior art have it is slow open technology, but slow from t1 to t2 is opened the time, far smaller than second row golden finger
Slide into the time of second row contact flat spring.
During golden finger insertion external system, the first power pins are slided to first row contact flat spring direction, sliding
The dynamic power pins of process first are constantly in power-down state, until the first power pins and the power supply shell fragment of first row contact flat spring
Contact, power pins are changed into power-up state.
In the embodiment of the present invention, the size of each pin follows industry consensus standard in first row golden finger(Or provide length and width
Number range).
When the first power pins are contacted with the power supply shell fragment of second row contact flat spring, power supply shell fragment is supplied to power pins
Electricity, the optical chip being now connected with power pins, driving chip and the work of MCU power-up initializings, MCU brings into operation initialization journey
Sequence, produces initialization data,
And as the slip of golden finger pin, the first power pins and the power supply shell fragment of first row contact flat spring are disengaged, on
State the unexpected interruption of power-up initializing work;
Slided with the continuation of golden finger pin, the first power pins contact with the power supply shell fragment of first row contact flat spring, with the
Optical chip, driving chip and the MCU of one power pins connection are re-powered again;
Upper electric, lower electricity, again power up in short time, can cause there is current surge in circuit, cause MCU operation troubles,
This process can cause the single-chip microprocessor MCU or other chips that inside modules use, can not be just in power on reset states
Often start, or program is lost, so as to influence optical module normal work.
Fig. 6 a kind of optical module golden finger pin design diagrams provided in an embodiment of the present invention, as shown in fig. 6, of the invention
The optical module that embodiment is provided, its first power pins 106 are connected with second source pin 107, first row golden finger and circuit
The cabling of plate surface is connected, and second row golden finger is connected by via with the cabling of interlayer circuit board.
Fig. 7 is second row golden finger insertion inserting slot construction schematic diagram in the embodiment of the present invention, as shown in fig. 7, in optical module
During insertion, the power supply shell fragment of first row contact flat spring 104 and 107 second source pins in second row golden finger in golden finger slot
Contact, with the insertion of optical module, the power supply shell fragment of first row contact flat spring slides to the first power supply from second source pin 107 and drawn
Pin 106, because the bearing of trend of the first power pins 106 is overlapped with the bearing of trend of second source pin 107, and the first electricity
Source pin 106 is connected with the second source pin 107, and second source pin 107 is remained and the power supply in contact flat spring
Shell fragment is electrically connected so that second source pin remains the power supply state to optical module, with prior art second source pin
The saltus step of power supply is compared, and can avoid the formation of current surge, it is to avoid optical module operation troubles.
Fig. 8 is optical module and MCU electrifying timing sequence figures in the embodiment of the present invention, as shown in figure 8, at the t2 moment, optical module and
After MCU is by electricity on second source pin, power-up state is always maintained at t3, t4 moment.
Finally it should be noted that:The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that:It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic;
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (2)
1. a kind of optical module, it is characterised in that including circuit board, the first optical chip, the second optical chip and processor, the circuit
The same surface of plate has first row golden finger and second row golden finger, the first power pins of the first row golden finger and institute
State the connection of the first optical chip, the second source pin of the second row golden finger respectively with second optical chip and the processing
Device is connected, and the bearing of trend of first power pins is overlapped with the bearing of trend of the second source pin, first electricity
Source pin is connected with the second source pin.
2. optical module as claimed in claim 1, it is characterised in that the first row golden finger is walked with the circuit board surface
Line is connected, and the second row golden finger is connected by via with the cabling of the interlayer circuit board.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910652120.2A CN110299946B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201710220900.0A CN107104735B (en) | 2017-04-06 | 2017-04-06 | A kind of optical module |
CN201910651565.9A CN110299945B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201910652119.XA CN110401485B (en) | 2017-04-06 | 2017-04-06 | Optical module |
US15/857,942 US10788631B2 (en) | 2017-04-06 | 2017-12-29 | Optical module |
US15/857,855 US10257910B2 (en) | 2017-04-06 | 2017-12-29 | Optical module |
US15/857,958 US10390409B2 (en) | 2017-04-06 | 2017-12-29 | Optical module |
US15/857,884 US10271403B2 (en) | 2017-04-06 | 2017-12-29 | Optical module |
US15/857,987 US10440799B2 (en) | 2017-04-06 | 2017-12-29 | Optical module |
US16/297,853 US10575382B2 (en) | 2017-04-06 | 2019-03-11 | Optical module |
Applications Claiming Priority (1)
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CN201710220900.0A CN107104735B (en) | 2017-04-06 | 2017-04-06 | A kind of optical module |
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CN201910652120.2A Division CN110299946B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201910651565.9A Division CN110299945B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201910652119.XA Division CN110401485B (en) | 2017-04-06 | 2017-04-06 | Optical module |
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CN107104735A true CN107104735A (en) | 2017-08-29 |
CN107104735B CN107104735B (en) | 2019-09-03 |
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CN201910651565.9A Active CN110299945B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201710220900.0A Active CN107104735B (en) | 2017-04-06 | 2017-04-06 | A kind of optical module |
CN201910652119.XA Active CN110401485B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201910652120.2A Active CN110299946B (en) | 2017-04-06 | 2017-04-06 | Optical module |
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CN201910651565.9A Active CN110299945B (en) | 2017-04-06 | 2017-04-06 | Optical module |
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CN201910652119.XA Active CN110401485B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201910652120.2A Active CN110299946B (en) | 2017-04-06 | 2017-04-06 | Optical module |
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WO2019185031A1 (en) * | 2018-03-29 | 2019-10-03 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN113328419A (en) * | 2021-07-29 | 2021-08-31 | 深圳市迅特通信技术股份有限公司 | Surge current control circuit of pluggable module and pluggable module |
CN114071865A (en) * | 2020-07-30 | 2022-02-18 | 华为技术有限公司 | Golden finger connector, female end connector and communication equipment |
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CN110729265B (en) * | 2019-10-21 | 2021-08-24 | 青岛海信宽带多媒体技术有限公司 | Optical module and optical network device |
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CN113271150B (en) * | 2021-05-17 | 2022-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN117080779B (en) * | 2023-10-16 | 2024-01-02 | 成都电科星拓科技有限公司 | Memory bar plugging device, method for adapting memory controller to memory bar plugging device and working method |
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Also Published As
Publication number | Publication date |
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CN110299946B (en) | 2022-07-01 |
CN110299946A (en) | 2019-10-01 |
CN110401485A (en) | 2019-11-01 |
CN110401485B (en) | 2021-12-14 |
CN107104735B (en) | 2019-09-03 |
CN110299945A (en) | 2019-10-01 |
CN110299945B (en) | 2022-05-17 |
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