CN107097017B - Low-silver solder and its preparation method and application containing In, Li, Zr and La - Google Patents
Low-silver solder and its preparation method and application containing In, Li, Zr and La Download PDFInfo
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- CN107097017B CN107097017B CN201710263327.1A CN201710263327A CN107097017B CN 107097017 B CN107097017 B CN 107097017B CN 201710263327 A CN201710263327 A CN 201710263327A CN 107097017 B CN107097017 B CN 107097017B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to class of metal materials and field of metallurgy, and in particular to a kind of low-silver solder and its preparation method and application containing In, Li, Zr and La.One kind containing the low-silver solder of In, Li, Zr and La, belongs to middle temperature brazing material, its raw material composition and its weight percent content are as follows: the Li of the In of the P of the Ag of 3%-5%, 6%-8%, 0.05%-2.5%, 0.05%-2.5%, the La of the Zr of 0.005%-0.1%, 0.005%-0.1%, surplus Cu.It smelted, poured using conventional intermediate frequency by design composition proportion using commercially available silver ingot, phosphorus, cathode copper, metal In, metal Li, metal Zr and rare earth La, silk material is arrived by extruding, drawing, medicine core solder can also be obtained by the way that brazing flux is added.Solder of the invention has silver content low, and fusing point is low, and wetability is good, the high feature of intensity, the BCu75PAg of the alternative argentiferous 20% used extensively in refrigeration industry and the BAg25CuZnSn solder of argentiferous 25%.
Description
Technical field
The present invention relates to class of metal materials and field of metallurgy, and in particular to a kind of low-silver solder containing In, Li, Zr and La and
Preparation method and use.
Background technique
The use of the solder containing harmful element cadmium in the industry, especially household electric appliances are limited with stringent both at home and abroad,
Start to be widely used the higher silver solder of argentiferous in industry as substitution.With the increasingly raising of living standard, with air-conditioning, refrigerator
Deng increasing for the electric refrigerator demand of representative, the silver brazing materials demand amount for compressor and refrigeration pipeline is also more next
It is bigger.Currently, compared with copper is generally used silver content with dissimilar materials solderings such as Bundy tubes with copper alloy, copper in the industries such as refrigeration
High solder, such as: the BCu75PAg of argentiferous 20% and the BAg25CuZnSn solder of argentiferous 25%.
For another example, the patent of invention of Publication No. CN106216878A discloses a kind of cadmium-free silver brazing alloy, and chemical component is pressed
Mass percent matches respectively are as follows: silver-colored (Ag) accounts for 33%-the 35% of cadmium-free silver brazing alloy gross mass, and copper (Cu) accounts for cadmium-free silver brazing alloy
34%-the 36% of gross mass, zinc (Zn) account for the 23%-27% of cadmium-free silver brazing alloy gross mass, and tin (Sn) accounts for the total matter of cadmium-free silver brazing alloy
The 0.25%-0.5% of amount, nickel (Ni) account for the 0.2%-1% of cadmium-free silver brazing alloy gross mass, and manganese (Mn) accounts for cadmium-free silver brazing alloy gross mass
0.5%-1.5%.
Although above-mentioned technical solution itself does not use harmful element cadmium (Cd), silver solder is made to have met European Union RoHS
The advantages that requirement of instruction, while strong but also with joint toughness, melts moderate range, wetability and good fillibility.But it is silver-colored
Dosage accounted for one third, it is the important strategy metal of country that silver, which is noble metal, the use of a large amount of high silver solders, not only
The production cost of industrial products is improved, and leads to increased dramatically for silver consumption, national resources inevitably wastes, and can not obtain
It is utilized to reasonable, therefore it is lower to research and develop a kind of amount, but fusing point is low, wetability is good, can substitute high silver solder extensively
P-Cu Brazing Materials have important practical application in industry meaning.
Summary of the invention
The purpose of the present invention is to provide a kind of silver content is low, fusing point is low, and wetability is good, and intensity is high, and brazing property is good, can
Substitute the low-silver solder of the BCu75PAg of argentiferous 20% and the BAg25CuZnSn of argentiferous 25%.In order to achieve the above object, this hair
A kind of bright low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows:
The Ag of 3%-5%,
The P of 6%-8%,
The In of 0.05%-2.5%,
The Li of 0.05%-2.5%,
The Zr of 0.005%-0.1%,
The La of 0.005%-0.1%,
Surplus is Cu.
On the one hand, the present invention adds alloying element In, Li, can significantly reduce the initial fusion temperature of solder, and improve pricker
The wettability and spreading property of material.On the other hand, alloy element Zr can change and refine the tissue of brazing filler metal alloy, and rise
To the effect of inovulant, increase the intensity, toughness of solder, improves the soldering processes performance of solder, but the content of Zr cannot mistake
Height, the content of Zr are more than 1.5%, the fusion temperature of brazing filler metal alloy can be made to increase, hardness increases, cause to be unfavorable for solder into one
Walk machine-shaping.In another aspect, the present invention adds rare-earth elements La, it can reduce the fusion temperature of solder, improve the work of solder
Property, so that the wettability and spreading property of solder are improved, meanwhile, the addition of rare-earth elements La is able to suppress Cu3P brittleness chemical combination
The excessive generation of object phase is able to ascend the plasticity and processing performance of copper-phosphorus alloy solder.
Further, the raw material composition and its weight percent content of the low-silver solder containing In, Li, Zr and La are as follows:
The Ag of 3.5%-4.5%,
The P of 6.5%-7.5%,
The In of 0.1%-0.25%,
The Li of 0.1%-0.25%,
The Zr of 0.005%-0.1%,
The La of 0.005%-0.1%,
Surplus is Cu.
Further, the raw material composition and its weight percent content of the low-silver solder containing In, Li, Zr and La are as follows:
4% Ag,
7.5% P,
0.25% In,
0.25% Li,
0.01% Zr,
0.01% La,
Surplus is Cu.
The present invention also discloses a kind of preparation method of the above-mentioned low-silver solder containing In, Li, Zr and La accordingly, including
Following steps: regarding silver ingot, cathode copper, metal In, metal Zr and rare earth La as raw material according to the ratio, using smelt, pour or
Horizontal casting mode obtains casting rod, then by squeezing, drawing is to get arriving silk material, then silk material is processed into the weldering of required shape
Material.
The present invention also discloses another preparation method of the above-mentioned low-silver solder containing In, Li, Zr and La accordingly, packet
It includes following steps: metal In, metal Li, metal Zr is smelt alloy in advance respectively, be then added in phosphor copper and smelt, pour,
Silk material is obtained by extruding, drawing again, then silk material is processed into the solder of required shape.
Further, in above two preparation method, the solder is in welding rod, welding wire, weld-ring, strip or weld tabs
It is at least one.
On the basis of above-mentioned preparation method, it is preferred that the low-silver solder is prepared as medicine core pricker by the way that brazing flux is added
Material.
The present invention also disclose accordingly the above-mentioned low-silver solder containing In, Li, Zr and La for copper and copper alloy, copper and
The purposes of Bundy tube soldering.Specifically, the Bundy tube is nickel plating Bundy tube or zinc-plated Bundy tube；The mode of soldering is flame
Soldering, furnace brazing or high-frequency induction brazing.
Compared with prior art, the present invention having the following advantages that and effect:
1, noble metal silver content is greatly decreased, than the BCu75PAg of the argentiferous 20% and Bag25CuZnSn of argentiferous 25%
The silver solders such as solder reduce 15% or more silver content, greatly reduce production cost, have saved the dosage of noble metal silver；
2, fusion temperature of the invention is 625 DEG C -705 DEG C, hence it is evident that is lower than part silver solder and common copper-phosphorus brazing alloy, pricker
Brazing temperature can be reduced when weldering, prevent the overheat or burning of base material；
3, solder plasticity of the invention is good, and processing preparation is convenient, is easy to produce in enormous quantities, can be processed into various specifications, ruler
Very little welding rod, welding wire, weld-ring, strip, weld tabs etc. can also obtain medicine core solder by the way that brazing flux is added；
4, the tensile strength of solder is up to 535-585MPa；Soldering its tensile strength of copper sleeve is 250-300MPa, shearing resistance
Intensity is 170-210Mpa, can be widely applied to resistance brazing, the flame of the industries such as refrigeration, machinery, electromechanics, electric appliance, compressor
Soldering and high-frequency induction brazing.
Specific embodiment
In the following, technical solution of the present invention is described in detail by specific embodiment.
Embodiment 1
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 3%Ag, 6%
The Zr of P, 0.05%In, 0.05%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 705 DEG C, solder
Tensile strength are as follows: 540MPa is brazed the tensile strength of copper sleeve are as follows: 255MPa, shearing strength are as follows: 180MPa.
Embodiment 2
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 3%Ag,
The Zr of 6.5%P, 0.1%In, 0.1%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 695 DEG C, solder
Tensile strength are as follows: 545MPa is brazed the tensile strength of copper sleeve are as follows: 250MPa, shearing strength are as follows: 185MPa.
Embodiment 3
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 3%Ag,
The Zr of 6.5%P, 0.05%In, 0.05%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 690 DEG C, solder
Tensile strength are as follows: 548MPa is brazed the tensile strength of copper sleeve are as follows: 266MPa, shearing strength are as follows: 188MPa.
Embodiment 4
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 3.5%Ag,
The Zr of 7%P, 0.05%In, 0.05%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 688 DEG C, solder
Tensile strength are as follows: 550MPa is brazed the tensile strength of copper sleeve are as follows: 270MPa, shearing strength are as follows: 195MPa.
Embodiment 5
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 3.5%Ag,
The Zr of 7%P, 0.25%In, 0.25%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 646 DEG C, solder
Tensile strength are as follows: 535MPa is brazed the tensile strength of copper sleeve are as follows: 250MPa, shearing strength are as follows: 170MPa.
Embodiment 6
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 3.5%Ag,
The Zr of 7.5%P, 0.05%In, 0.1%Li, 0.01%, 0.01% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 677 DEG C, solder
Tensile strength are as follows: 555MPa is brazed the tensile strength of copper sleeve are as follows: 275MPa, shearing strength are as follows: 198MPa.
Embodiment 7
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 4%Ag,
The Zr of 7.5%P, 0.1%In, 0.1%Li, 0.01%, 0.01% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 671 DEG C, solder
Tensile strength are as follows: 560MPa is brazed the tensile strength of copper sleeve are as follows: 281MPa, shearing strength are as follows: 201MPa.
Embodiment 8
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 4%Ag,
The Zr of 7.5%P, 0.25%In, 0.25%Li, 0.01%, 0.01% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 625 DEG C, solder
Tensile strength are as follows: 545MPa is brazed the tensile strength of copper sleeve are as follows: 264MPa, shearing strength are as follows: 183MPa.
Embodiment 9
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 4%Ag, 8%
The Zr of P, 0.1%In, 0.1%Li, 0.01%, 0.01% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 667 DEG C, solder
Tensile strength are as follows: 566MPa is brazed the tensile strength of copper sleeve are as follows: 288MPa, shearing strength are as follows: 204MPa.
Embodiment 10
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 4%Ag, 8%
The Zr of P, 0.15%In, 0.15%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 664 DEG C, solder
Tensile strength are as follows: 568MPa is brazed the tensile strength of copper sleeve are as follows: 298MPa, shearing strength are as follows: 208MPa.
Embodiment 11
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 4%Ag, 8%
The Zr of P, 0.2%In, 0.2%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 650 DEG C, solder
Tensile strength are as follows: 570MPa is brazed the tensile strength of copper sleeve are as follows: 300MPa, shearing strength are as follows: 210MPa.
Embodiment 12
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 4.5%Ag,
The Zr of 8%P, 0.15%In, 0.15%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 655 DEG C, solder
Tensile strength are as follows: 575MPa is brazed the tensile strength of copper sleeve are as follows: 296MPa, shearing strength are as follows: 206MPa.
Embodiment 13
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 4.5%Ag,
The Zr of 8%P, 0.15%In, 0.15%Li, 0.01%, 0.01% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 645 DEG C, solder
Tensile strength are as follows: 570MPa is brazed the tensile strength of copper sleeve are as follows: 294MPa, shearing strength are as follows: 204MPa.
Embodiment 14
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 5%Ag, 8%
The Zr of P, 0.15%In, 0.15%Li, 0.01%, 0.01% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 650 DEG C, solder
Tensile strength are as follows: 578MPa is brazed the tensile strength of copper sleeve are as follows: 294MPa, shearing strength are as follows: 204MPa.
Embodiment 15
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 5%Ag, 8%
The Zr of P, 0.15%In, 0.15%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 648 DEG C, solder
Tensile strength are as follows: 574MPa is brazed the tensile strength of copper sleeve are as follows: 288MPa, shearing strength are as follows: 197MPa.
Embodiment 16
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 5%Ag, 8%
The Zr of P, 0.25%In, 0.25%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 625 DEG C, solder
Tensile strength are as follows: 563MPa is brazed the tensile strength of copper sleeve are as follows: 268MPa, shearing strength are as follows: 178MPa.
Embodiment 17
A kind of low-silver solder containing In, Li, Zr and La, raw material composition and its weight percent content are as follows: 5%Ag, 8%
The Zr of P, 0.25%In, 0.25%Li, 0.005%, 0.005% La, surplus Cu.
" a kind of low-silver solder containing In, Li, Zr and La " that mentioned component matches, fusion temperature are 625 DEG C, solder
Tensile strength are as follows: 563MPa is brazed the tensile strength of copper sleeve are as follows: 268MPa, shearing strength are as follows: 178MPa.
Rationally, production cost is low, cost performance, and brazing filler metal melts temperature is suitable, wetability, mobility for formula design of the invention
Good, soldered fitting any surface finish, high mechanical strength, soldering processes performance is excellent, and quality is stablized, and consistency is good, items soldering property
Energy index is suitable with the BAg25CuZnSn solder of the BCu75PAg of argentiferous 20% and argentiferous 25%.
It should be noted that the various metallic elements occurred in the patent document with the symbol of element instead of, this field skill
Art personnel should be understood as corresponding metallic element, should not do other explanations.For that will explain that direction is fixed, by each member
The corresponding metal name of plain symbol is listed below: Ag (silver), P (phosphorus), In (indium), Li (lithium), Zr (indium), La (lanthanum), Cu (copper).
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (11)
1. a kind of low-silver solder containing In, Li, Zr and La, which is characterized in that its raw material composition and its weight percent content are as follows:
The Li of the In of the P of the Ag of 3.5%-4.5%, 6.5%-7.5%, 0.1%-0.25%, 0.1%-0.25%, 0.005%-
The La of 0.1% Zr, 0.005%-0.1%, surplus Cu.
2. the low-silver solder according to claim 1 containing In, Li, Zr and La, which is characterized in that its raw material composition and its again
Measure degree are as follows: 4% Ag, 7.5% P, 0.25% In, 0.25% Li, 0.01% Zr, 0.01% La,
Surplus is Cu.
3. the preparation method of the described in any item low-silver solders containing In, Li, Zr and La of claim 1~2, which is characterized in that
Include the following steps: to regard silver ingot, cathode copper, metal In, metal Zr and rare earth La as raw material according to the ratio, using smelting, pour
Casting or horizontal casting mode obtain casting rod, are then processed into required shape by extruding, drawing to get to silk material, then by silk material
Solder.
4. the preparation method of the described in any item low-silver solders containing In, Li, Zr and La of claim 1~2, which is characterized in that
Include the following steps: metal In, metal Li, metal Zr being smelt alloy in advance respectively, is then added in phosphor copper and smelts, pour
Casting, then silk material is obtained by extruding, drawing, then silk material is processed into the solder of required shape.
5. the preparation method of the low-silver solder according to claim 3 containing In, Li, Zr and La, which is characterized in that the weldering
Material is at least one of welding rod, welding wire, weld-ring, strip or weld tabs.
6. the preparation method of the low-silver solder according to claim 4 containing In, Li, Zr and La, which is characterized in that the weldering
Material is at least one of welding rod, welding wire, weld-ring, strip or weld tabs.
7. the preparation method of the low-silver solder according to claim 5 containing In, Li, Zr and La, which is characterized in that described
Low-silver solder is prepared as medicine core solder by the way that brazing flux is added.
8. the preparation method of the low-silver solder according to claim 6 containing In, Li, Zr and La, which is characterized in that described
Low-silver solder is prepared as medicine core solder by the way that brazing flux is added.
9. according to claim 1~2 described in any item low-silver solders containing In, Li, Zr and La for copper and copper alloy, copper and
The purposes of Bundy tube soldering.
10. the purposes of the low-silver solder according to claim 9 containing In, Li, Zr and La, which is characterized in that the nation
Enlightening pipe is nickel plating Bundy tube or zinc-plated Bundy tube.
11. the purposes of the low-silver solder according to claim 9 containing In, Li, Zr and La, which is characterized in that the side of soldering
Formula is gas brazing, furnace brazing or high-frequency induction brazing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710263327.1A CN107097017B (en) | 2017-04-20 | 2017-04-20 | Low-silver solder and its preparation method and application containing In, Li, Zr and La |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710263327.1A CN107097017B (en) | 2017-04-20 | 2017-04-20 | Low-silver solder and its preparation method and application containing In, Li, Zr and La |
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| CN107097017A CN107097017A (en) | 2017-08-29 |
| CN107097017B true CN107097017B (en) | 2019-08-13 |
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| CN109048118B (en) * | 2018-08-28 | 2022-01-28 | 广东美的制冷设备有限公司 | Copper brazing filler metal, workpiece, heat exchanger, air conditioner and refrigeration equipment |
| CN114085978A (en) * | 2021-10-15 | 2022-02-25 | 福建捷思金属科技发展有限公司 | Ultrahigh-pressure-resistant copper-iron alloy pipe fitting for refrigeration system and preparation method |
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| CN101003109A (en) * | 2006-12-29 | 2007-07-25 | 哈尔滨工业大学 | Active mesothermal copper base solder, and preparation method |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN102689105A (en) * | 2012-06-11 | 2012-09-26 | 杭州华光焊接新材料股份有限公司 | Indium-containing active copper-based solder |
| CN105965175A (en) * | 2016-05-20 | 2016-09-28 | 浙江新锐焊接科技股份有限公司 | Low-silver brazing filler metal used for high-frequency brazing of four-way valve |
| CN106392234A (en) * | 2016-11-10 | 2017-02-15 | 江苏科技大学 | Medium temperature multicomponent Cu-based solder for brazing copper and steel as well as preparation and brazing methods |
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2017
- 2017-04-20 CN CN201710263327.1A patent/CN107097017B/en not_active Expired - Fee Related
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|---|---|---|---|---|
| CN101003109A (en) * | 2006-12-29 | 2007-07-25 | 哈尔滨工业大学 | Active mesothermal copper base solder, and preparation method |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN102689105A (en) * | 2012-06-11 | 2012-09-26 | 杭州华光焊接新材料股份有限公司 | Indium-containing active copper-based solder |
| CN105965175A (en) * | 2016-05-20 | 2016-09-28 | 浙江新锐焊接科技股份有限公司 | Low-silver brazing filler metal used for high-frequency brazing of four-way valve |
| CN106392234A (en) * | 2016-11-10 | 2017-02-15 | 江苏科技大学 | Medium temperature multicomponent Cu-based solder for brazing copper and steel as well as preparation and brazing methods |
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