CN107094224B - Manufacturing method of camera module and terminal processing equipment - Google Patents
Manufacturing method of camera module and terminal processing equipment Download PDFInfo
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- CN107094224B CN107094224B CN201710276808.6A CN201710276808A CN107094224B CN 107094224 B CN107094224 B CN 107094224B CN 201710276808 A CN201710276808 A CN 201710276808A CN 107094224 B CN107094224 B CN 107094224B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
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- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention provides a manufacturing method of a camera module and terminal processing equipment, comprising the following steps: providing a camera, a flexible circuit board, a co-processing chip and a connector, wherein the co-processing chip and the connector are respectively positioned on the front side and the back side corresponding to the flexible circuit board; the image sensor chip of the camera transmits original image signals to the co-processing chip, and the original image signals are processed by the co-processing chip and then transmitted to the terminal processing equipment through the connector. In the invention, the image signal processing chip receives the processed image, thereby relieving the pressure of the image signal processing chip on image processing and improving the image quality. In addition, the co-processing chip is arranged in the reinforcing plate, so that the increase of the height of the camera module caused by the co-processing chip is avoided, and the performance of the image sensor chip cannot be influenced by the heating of the co-processing chip.
Description
Technical Field
The invention relates to the technical field of camera modules, in particular to a manufacturing method of a camera module and terminal processing equipment.
Background
An Image Signal Processing (ISP) technique is a commonly used technique for camera processing, and is a technique for post-processing Image data output from an Image sensor according to the requirements of human vision. With the continuous improvement of camera pixels, the requirement on image processing capacity in the later period is higher and higher. The low pixel image sensor is provided with an ISP processing unit, and the high pixel image sensor generally adopts a scheme of Raw format output plus platform ISP. But limited by the transmission bandwidth of the camera module and the ISP chip, the high-end image sensor also has a built-in ISP to preprocess and compress the image to alleviate the bandwidth problem and the pressure of the platform ISP.
Referring to fig. 1, a current high-end image sensor generally adopts a stacked design, and a stacked image sensor is formed by stacking an image sensor chip 1 and a chip 2 for ISP processing, so that the chip for ISP processing does not occupy other spaces in a camera module, so as to reduce the area of the whole camera module and form a high-pixel camera module. However, bonding the image sensor chip 1 and the chip 1 for ISP processing results in an increase in the height of the entire camera module and affects the yield of the camera module. In addition, the chip 2 for ISP processing has large power consumption and generates heat seriously, and thermal noise is introduced into an image signal of the camera module.
Disclosure of Invention
The invention aims to provide a manufacturing method of a camera module and terminal processing equipment, which solve the technical problems that the height of the camera module is increased, the yield is influenced and thermal noise is generated due to a chip for ISP processing in the prior art.
In order to solve the above technical problem, the present invention provides a method for manufacturing a camera module, including:
providing a camera, a flexible circuit board, a co-processing chip and a connector, wherein the co-processing chip and the connector are respectively positioned on the front side and the back side corresponding to the flexible circuit board;
the image sensor chip of the camera transmits original image signals to the co-processing chip, and the original image signals are processed by the co-processing chip and then transmitted to the terminal processing equipment through the connector.
Optionally, the camera transmits the original image signal to the co-processing chip, and the co-processing chip caches or processes the original image signal, so that a bandwidth transmitted by the co-processing chip to the terminal processing device through the connector is smaller than a bandwidth transmitted by the image sensor to the co-processing chip.
Optionally, the distance between the co-processing chip and the image sensor chip is greater than or equal to 0.2 mm, so as to reduce image quality degradation caused by heat generation of the co-processing chip on the image sensor chip.
Optionally, a communication protocol between the camera and the co-processing chip is defined to transmit image signals, and the number of pins for transmitting image signals between the camera and the co-processing chip is less than the number of pins for transmitting image signals between the co-processing chip and the connector, so that the wiring complexity of the flexible circuit board is reduced.
Optionally, a communication protocol between the camera and the co-processing chip is defined as a bidirectional transmission protocol, a serial interface for controlling the image sensor chip is omitted, and complexity of wiring of the flexible circuit board is reduced.
Optionally, an adhesive filler is disposed between the co-processing chip and the flexible circuit board, and the co-processing chip and the adhesive filler are used for enhancing strength of the flexible circuit board to support plugging and unplugging of the connector.
Optionally, the co-processing chip is bonded to the flexible circuit board by using a surface mount technology, the solder bumps of the co-processing chip are electrically connected to the flexible circuit board, and the adhesive filler is injected between the co-processing chip and the flexible circuit board.
Optionally, a reinforcing plate is further disposed on the flexible circuit board, the co-processing chip is compatibly disposed inside the reinforcing plate, and the reinforcing plate is used for enhancing the strength of the flexible circuit board to support plugging and unplugging of the connector; the reinforcing plate is also used for reinforcing the heat dissipation of the co-processing chip.
Optionally, the step of compatibly setting the co-processing chip includes: providing a reinforcing plate with a hollow part, wherein the co-processing chip is arranged on the hollow part of the reinforcing plate in an adhesion manner and exposes the solder bumps of the co-processing chip; and arranging the reinforcing plate and the co-processing chip on the flexible circuit board integrally, wherein the solder bumps of the co-processing chip are electrically connected with the flexible circuit board.
Optionally, the step of compatibly setting the co-processing chip includes: providing a reinforcing plate with a hollow part, and bonding the reinforcing plate on the flexible circuit board; and arranging the co-processing chip in the hollow part, wherein the co-processing chip is electrically connected with the flexible circuit board through solder bumps.
Optionally, the step of compatibly setting the co-processing chip includes: providing a reinforcing plate with a concave part, wherein the co-processing chip is arranged in the concave part of the reinforcing plate in an adhesion mode, and the solder convex points of the co-processing chip are exposed; and arranging the reinforcing plate and the co-processing chip on the flexible circuit board integrally, wherein the solder bumps of the co-processing chip are electrically connected with the flexible circuit board.
Correspondingly, the invention also provides a terminal processing device, which comprises: the main board is electrically connected with the connector, and the main board receives an original image signal processed by the co-processing chip through the connector.
Compared with the prior art, the manufacturing method of the camera module and the terminal processing equipment have the following beneficial effects:
the camera module comprises a co-processing chip, wherein the co-processing chip and a connector are respectively arranged on the front surface and the back surface corresponding to the flexible circuit board, the co-processing chip receives an original image signal output by an image sensor chip of the camera, performs ISP processing on the original image signal, and transmits the processed original image signal to an image signal processing chip by the connector, so that the image signal processing chip receives a processed image, the pressure of the image signal processing chip on image processing is relieved, and the image quality is improved.
In addition, the co-processing chip is arranged in the reinforcing plate, so that the increase of the height of the camera module caused by the co-processing chip is avoided, and the performance of the image sensor chip cannot be influenced by the heating of the co-processing chip.
Drawings
FIG. 1 is a schematic diagram of a stacked image sensor in the prior art;
fig. 2 is a schematic structural diagram of a camera module according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a reinforcing plate according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating a structure of a stiffener and a co-processing chip bonded to an auxiliary device according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a chip for bonding a flexible printed circuit board and a co-processing chip according to an embodiment of the invention;
FIG. 6 is a schematic structural diagram of an adhesive stiffener for a flexible printed circuit board according to another embodiment of the present invention;
FIG. 7 is a schematic diagram of a chip for bonding a co-processing chip on a flexible printed circuit board according to another embodiment of the invention;
FIG. 8 is a schematic diagram of a stiffener bonding co-processing chip according to yet another embodiment of the present invention;
FIG. 9 is a schematic diagram of a chip for bonding a co-processing chip to a flexible circuit board according to another embodiment of the invention;
FIG. 10 is a diagram illustrating signal transmission according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of a layout according to an embodiment of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather construed as limited to the embodiments set forth herein.
Next, the present invention is described in detail by using schematic diagrams, and when the embodiments of the present invention are described in detail, the schematic diagrams are only examples for convenience of description, and the scope of the present invention should not be limited herein.
In order to solve the problems in the background art, the invention provides a method for manufacturing a camera module and a terminal processing device, wherein the camera module comprises a co-processing chip, the co-processing chip and a connector are respectively arranged on the front side and the back side corresponding to a flexible circuit board, the co-processing chip receives an original image signal output by an image sensor chip of a camera, performs ISP processing on the original image signal, and transmits the processed original image signal to an image signal processing chip in the terminal processing device through the connector, so that the image signal processing chip receives a processed image, the pressure of the image signal processing chip on image processing is relieved, and the image quality is improved. In addition, the co-processing chip is arranged in the reinforcing plate, so that the increase of the height of the camera module caused by the co-processing chip is avoided, and the performance of the image sensor chip cannot be influenced by the heating of the co-processing chip.
In order to make the above objects, features and advantages of the present invention more comprehensible, a method of manufacturing a camera module according to the present invention is described in detail below with reference to the accompanying drawings.
Referring to fig. 2, the camera module of the present invention includes a camera 10, a flexible circuit board (FPC) 20, a co-processing chip (ISP Bridge) 40, and Connectors (Connectors) 30. The co-processing chip 40 and the connector 30 are respectively located on the front and back sides of the flexible circuit board 20. The camera 10 includes an image sensor chip (not shown in fig. 2) and a metal wire electrically connected to the image sensor chip, wherein the metal wire electrically connects the image sensor chip to the flexible circuit board. The image sensor chip transmits an original image signal to the co-processing chip 40, and the original image signal is processed by the co-processing chip 40, wherein the co-processing chip 40 performs ISP processing on the original image signal, including high dynamic range rendering (HDR), Phase Detection Auto Focus (PDAF), denoising (De-noise), auto white balance, data compression, auto exposure control, dead pixel removal, hue adjustment, and the like. The processed original image signal is then transmitted by the connector 30 to an image signal processing chip (not shown) in the main processor of the terminal processing device, and the image signal processing chip further processes the received image signal. For example, in an embodiment of the present invention, the image sensor chip of the camera 10 transmits the original image signal to the co-processing chip 40, the data of the original image signal is large, the co-processing chip 40 compresses the original image signal first, and the co-processing chip 40 transmits the compressed data to the terminal processing device through the connector 30, so as to improve the data transmission efficiency. The bandwidth of the co-processing chip 40 transmitted to the terminal processing device (not labeled) through the connector 30 is smaller than the bandwidth of the image sensor chip transmitted to the co-processing chip 40.
As shown in fig. 2, the co-processing chip 40 and the image sensor chip of the camera 10 are respectively disposed on the front and back sides of the flexible circuit board 20 at a staggered interval, that is, the co-processing chip 40 and the image sensor chip are not disposed correspondingly, and meanwhile, the heat dissipation of the image sensor chip and the heat dissipation of the co-processing chip are enhanced, so as to improve the heat dissipation performance of the camera module, in an embodiment, the interval between the co-processing chip 40 and the image sensor chip is greater than or equal to 0.2 mm, so as to reduce the image quality degradation caused by the heat generation of the co-processing chip 40 to the image sensor chip.
In addition, the flexible material of the flexible circuit board 20 has low mechanical strength, and in the present invention, an adhesive filler is disposed between the co-processing chip 40 and the flexible circuit board 20, and the adhesive filler can realize adhesion between the co-processing chip 40 and the flexible circuit board 20, and simultaneously, the co-processing chip 40 and the adhesive filler can enhance the mechanical strength of the flexible circuit board 20, so as to support the plugging and unplugging of the connector 30. In this embodiment, the Surface Mount Technology (SMT) is used to bond the co-processing chip 40 to the flexible circuit board 20, the solder bumps of the co-processing chip are electrically connected to the metal traces in the flexible circuit board, and a viscous filler, such as epoxy resin, is injected between the co-processing chip and the flexible circuit board. Of course, the present invention is not limited to the surface mount technology for bonding the co-processing chip 40 and the flexible circuit board 20, and may also be in the form of laser welding, which is not limited by the present invention.
With reference to fig. 2, in order to further increase the mechanical strength of the flexible circuit board, a stiffener 50 is further disposed on the flexible circuit board 20, the co-processing chip 40 is compatibly disposed inside the stiffener 50, and the co-processing chip 40 is electrically connected to the flexible circuit board 20 through solder bumps. The reinforcing plate is used for protecting the co-processing chip and reinforcing the mechanical strength of the flexible circuit board so as to support the plugging and unplugging of the connector. In addition, the reinforcing plate 50 has good heat conductivity and can also be used to enhance the heat dissipation performance of the co-processing chip 40. The compatible setting of the co-processing chip 40 includes the following steps:
first, referring to fig. 3, a reinforcing plate 50 is provided, the reinforcing plate 50 has a hollow portion 51, and in this embodiment, the hollow portion 51 is formed in the reinforcing plate 50 by etching or mechanical notching. Wherein the thickness of the reinforcing plate 50 is 80 μm to 200 μm, for example, 80 μm, 100 μm, 150 μm, 200 μm, etc., and the cut-out hollowed-out portion 51 is 1mm2~50mm2This is a setting according to the size of the co-processing chip.
Next, referring to fig. 4, the co-processing chip 40 is adhered and disposed in the hollow portion 51 of the reinforcing plate 50, and the solder bump 41 of the co-processing chip 40 is exposed, wherein the height of the co-processing chip 40 is 8050 μm to 200 μm, for example, 100 μm, the thickness of the solder bump 41 is 50 μm to 1500 μm, for example, 150 μm, and the co-processing chip 40 and the reinforcing plate 50 are adhered by the adhesive filler 70. Specifically, referring to fig. 4, an auxiliary device 60 is provided, and a surface of the auxiliary device 60 has adhesiveness and can be peeled off by a heat treatment or the like. Firstly, the reinforcing plate 50 is adhered to the auxiliary device 60, then the co-processing chip 40 is arranged in the hollow part 51 and adhered to the auxiliary device 60, the viscous filler 70 is injected into the hollow part 51, so that the reinforcing plate 50 and the co-processing chip 40 are adhered into a whole, and then the auxiliary device 60 is peeled off. The combined height of the co-processing chip 40 and the solder bump 41 of the present embodiment is higher than the height of the reinforcing plate 50, so as to facilitate the electrical connection between the solder bump 41 and the flexible circuit board 20.
In this embodiment, auxiliary device 60 is ultraviolet sticky tape (UV tape), thereby peels off through ultraviolet light processing auxiliary film 60, and the viscidity that ultraviolet light made ultraviolet sticky tape reduces to make ultraviolet light sticky tape take place to drop. Of course, in another embodiment of the present invention, the auxiliary device of the present invention is not limited to the ultraviolet tape, the auxiliary device 60 may be a Blue tape (Blue tape), and the auxiliary film 60 may be mechanically peeled off after the reinforcing plate 50 and the co-processing chip 40 are integrally bonded. In the present invention, it is within the scope of the present invention to be able to be used for bonding a stiffener to a co-processing chip and to be able to be peeled therefrom, for example, polyimide organic polymer, or the like, or by laser ablation or the like.
Referring to fig. 5, the stiffening plate 50 and the co-processing chip 40 are integrally bonded to the flexible circuit board 20, for example, the co-processing chip is connected to the flexible circuit board by SMT, the solder bumps 41 of the co-processing chip 40 are electrically connected to the flexible circuit board 20, and an adhesive filler 70 is injected between the co-processing chip 40 and the flexible circuit board 20 to strengthen the adhesion between the co-processing chip 40 and the flexible circuit board 20. In this embodiment, the reinforcing plate 50 can increase the mechanical strength of the flexible circuit board 20 to support the plugging and unplugging of the connector.
In another embodiment of the present invention, referring to fig. 6, the step of compatibly setting the co-processing chip 40 may further include: providing a reinforcing plate 50 ', wherein the reinforcing plate 50 ' is provided with a hollow part 51 ', and the reinforcing plate 50 ' is bonded to the flexible circuit board 20 by using packaging glue or hot pressing, wherein the thickness of the reinforcing plate 50 ' is 200 μm; next, referring to fig. 7, the co-processing chip 40 is adhered to the hollow portion 51 ', for example, the co-processing chip is connected to the flexible circuit board by laser welding, the co-processing chip 40 is electrically connected to the flexible circuit board 20 by the solder bumps 41, and the adhesive filler 70 is injected into the hollow portion 51 ' to adhere the co-processing chip 40 to the stiffener 50 ' to fix the co-processing chip 40.
In addition, in another embodiment of the present invention, the step of compatibly setting the co-processing chip 40 may further include: first, referring to fig. 8, a reinforcing plate 50 "is provided, wherein the reinforcing plate 50" has a concave portion 52, and in the present embodiment, the thickness of the reinforcing plate 50 "is 80 μm to 200 μm, for example, 80 μm. The recess 52 is formed in the stiffening plate 50 "by mechanical stamping. Then, the co-processing chip 40 is adhered to the concave portion 52 of the stiffener 50 ″ by a packaging adhesive 70 'and the solder bump 41 of the co-processing chip 40 is exposed, the thickness of the packaging adhesive 70' is 10 μm to 20 μm, for example, 10 μm, and the height of the solder bump 41 is 80 μm to 150 μm, for example, 80 μm. Referring to fig. 9, the stiffener 50 ″ and the co-processing chip 40 are integrally bonded to the flexible circuit board 20, for example, the co-processing chip is connected to the flexible circuit board by SMT, and the solder bumps 41 are electrically connected to the flexible circuit board 20. Then, an adhesive filler 70 is injected between the co-processing chip 40 and the flexible circuit board 20 to reinforce the adhesion between the co-processing chip 40 and the flexible circuit board 20.
Referring to fig. 10, the image sensor chip includes a pixel array 11 and a readout circuit module 12 located around the pixel array 11, the pixel array 11 is configured to convert an optical signal into an electrical signal and form an original image signal, and the readout circuit module 12 outputs a power supply signal, a control signal, and the original image signal in the image sensor chip. The readout circuit module 12 transmits the original image signal to the co-processing chip 40 through the metal wiring in the flexible circuit board 20, and the co-processing chip 40 processes the original image signal and transmits the processed original image signal to the connector 30. Also, the readout circuit module 12 directly transmits the power supply signal and the control signal to the connector 20 through metal wiring in the flexible circuit board 20.
In order to reduce the complexity of metal wiring in the flexible circuit board 20, a communication protocol between the camera 10 and the co-processing chip 40 is defined to perform image signal transmission, so that the number of pins for image signal transmission between the camera 10 and the co-processing chip 40 in the flexible circuit board 20 is less than the number of pins for image signal transmission between the co-processing chip 40 and the connector 30. For example, referring to fig. 11, the image sensor chip transmits the original image signal to the co-processing chip 40 based on a CPHY high-speed communication protocol, two groups of pins are arranged between the image sensor chip and the co-processing chip 40, each group of 3 wires includes 6 wires, and the transmission rate is 3Gbps to 8 Gbps. Image signals are transmitted between the co-processing chip 40 and the connector 30 through an MIPI protocol, and four-wire MIPI is arranged between the co-processing chip 40 and the connector 30 and comprises 4 pairs of data wires and a pair of clock wires, and the total number of wires is 10. Meanwhile, 2I 2C wires need to be arranged between the co-processing chip 40 and the connector 30 for controlling signal transmission, so that 12 wires are arranged between the co-processing chip 40 and the connector 30.
In addition, the communication protocol between the camera 10 and the co-processing chip 40 is a bidirectional transmission protocol, a serial interface for controlling the image sensor chip is omitted, and the uplink speed is high, and the downlink speed is low, that is, the speed at which the camera 10 transmits the image signal to the co-processing chip 40 adopts high-speed transmission, and the speed at which the co-processing chip 40 transmits the signal to the camera 10 adopts low-speed transmission, so that the power consumption of the whole camera module is reduced.
It should be noted that, because the distance between the co-processing chip and the camera is greater than the distance between the co-processing chip and the connector, in order to reduce the difficulty of metal wiring between the co-processing chip and the camera in the flexible circuit board, the number of pins for image signal transmission between the camera and the co-processing chip is less than the number of pins for image signal transmission between the co-processing chip 40 and the connector 30, and a serial interface for controlling the image sensor chip between the camera and the co-processing chip is omitted.
Correspondingly, the invention also provides a terminal processing device, which comprises: the mainboard is electrically connected with the connector, the mainboard receives the original image signals processed by the co-processing chip through the connector, and the image signal processing chip on the mainboard receives the processed images, so that the pressure of the image signal processing chip on image processing is relieved, and the image quality is improved.
In summary, the present invention provides a method for manufacturing a camera module and a terminal processing device, where the camera module includes a co-processing chip, the co-processing chip and a connector are respectively disposed on opposite sides of a flexible circuit board, the co-processing chip receives an original image signal output by an image sensor chip of a camera, performs ISP processing on the original image signal, and transmits the processed original image signal to an image signal processing chip via the connector, so that the image signal processing chip receives a processed image, pressure of the image signal processing chip on image processing is relieved, and image quality is improved. In addition, the co-processing chip is arranged in the reinforcing plate, so that the increase of the height of the camera module caused by the co-processing chip is avoided, and the performance of the image sensor chip cannot be influenced by the heating of the co-processing chip.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (11)
1. A manufacturing method of a camera module is characterized by comprising the following steps:
providing a camera, a flexible circuit board, a co-processing chip and a connector, wherein the co-processing chip and the connector are respectively positioned on the front side and the back side corresponding to the flexible circuit board;
the image sensor chip of camera with original image signal transmission extremely the coprocessing chip, original image signal warp after the coprocessing chip is handled again by the connector transmits to terminal processing equipment, the coprocessing chip with the image sensor chip of camera dislocation interval respectively set up in the tow sides of flexible circuit board, just the coprocessing chip with interval more than or equal to 0.2 millimeter between the image sensor chip to reduce the image quality that the coprocessing chip generates heat and causes the image sensor chip and descend.
2. The method of claim 1, wherein the camera transmits an original image signal to the co-processing chip, and the co-processing chip buffers or processes the original image signal, such that a bandwidth of the co-processing chip transmitted to the terminal processing device via the connector is smaller than a bandwidth of the image sensor transmitted to the co-processing chip.
3. The method for manufacturing the camera module according to claim 1, wherein a communication protocol between the camera and the co-processing chip is defined for transmitting image signals, and the number of pins for transmitting image signals between the camera and the co-processing chip is less than that between the co-processing chip and the connector, so that the wiring complexity of a flexible circuit board is reduced.
4. The method for manufacturing the camera module according to claim 3, wherein a communication protocol between the camera and the co-processing chip is defined as a two-way transmission protocol, a serial interface for controlling the image sensor chip is omitted, and the wiring complexity of the flexible circuit board is reduced.
5. The method for manufacturing the camera module according to claim 3, wherein an adhesive filler is provided between the co-processing chip and the flexible circuit board, and the co-processing chip and the adhesive filler are used for enhancing the strength of the flexible circuit board to support the plugging and unplugging of the connector.
6. The method of claim 5, wherein the co-processor chip is bonded to the flexible circuit board using surface mount technology, the solder bumps of the co-processor chip are electrically connected to the flexible circuit board, and the adhesive filler is injected between the co-processor chip and the flexible circuit board.
7. The method for manufacturing the camera module according to claim 1, wherein a stiffener is further disposed on the flexible circuit board, the co-processing chip is compatibly disposed inside the stiffener, and the stiffener is used for enhancing strength of the flexible circuit board to support plugging and unplugging of the connector; the reinforcing plate is also used for reinforcing the heat dissipation of the co-processing chip.
8. The method for manufacturing a camera module according to claim 7, wherein the step of compatibly setting the co-processing chip comprises: providing a reinforcing plate with a hollow part, wherein the co-processing chip is arranged on the hollow part of the reinforcing plate in an adhesion manner and exposes the solder bumps of the co-processing chip; and arranging the reinforcing plate and the co-processing chip on the flexible circuit board integrally, wherein the solder bumps of the co-processing chip are electrically connected with the flexible circuit board.
9. The method for manufacturing a camera module according to claim 7, wherein the step of compatibly setting the co-processing chip comprises: providing a reinforcing plate with a hollow part, and bonding the reinforcing plate on the flexible circuit board; and arranging the co-processing chip in the hollow part, wherein the co-processing chip is electrically connected with the flexible circuit board through solder bumps.
10. The method for manufacturing a camera module according to claim 7, wherein the step of compatibly setting the co-processing chip comprises: providing a reinforcing plate with a concave part, wherein the co-processing chip is arranged in the concave part of the reinforcing plate in an adhesion mode, and the solder convex points of the co-processing chip are exposed; and arranging the reinforcing plate and the co-processing chip on the flexible circuit board integrally, wherein the solder bumps of the co-processing chip are electrically connected with the flexible circuit board.
11. A terminal processing device, comprising: the main board and the camera module formed by the manufacturing method according to any one of claims 1 to 10, wherein the main board is electrically connected to the connector, and the main board receives the original image signal processed by the co-processing chip through the connector.
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| CN111405144A (en) * | 2019-01-02 | 2020-07-10 | 格科微电子（上海）有限公司 | Manufacturing method of camera module and terminal processing equipment |
| CN115835608A (en) * | 2023-02-16 | 2023-03-21 | 深圳市中旭新能源有限公司 | Packaging structure for distributed heat dissipation planning and photovoltaic power optimizer |
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