CN107092286A - A kind of intelligent micro semiconductor high low incubator - Google Patents
A kind of intelligent micro semiconductor high low incubator Download PDFInfo
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- CN107092286A CN107092286A CN201710486497.6A CN201710486497A CN107092286A CN 107092286 A CN107092286 A CN 107092286A CN 201710486497 A CN201710486497 A CN 201710486497A CN 107092286 A CN107092286 A CN 107092286A
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- low temperature
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
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- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention is a kind of intelligent micro semiconductor high low incubator, and its structure includes high-low temperature chamber shell；Wherein, it is equipped with a face of high-low temperature chamber shell on door, the outer surface of door and is fixed with control panel；The outer surface of high-low temperature chamber shell is fixed with circuit module；High-low temperature chamber shell and door formation high/low temperature casing, dividing plate, temp probe are in high-low temperature chamber body；Window is provided with the side wall of high-low temperature chamber shell, window is built with semiconductor chilling plate；The one side of semiconductor chilling plate towards high/low temperature box house is connected by internal heat-conducting block with internal fan；Semiconductor chilling plate is connected towards the one side outside high-low temperature chamber body by outside heat-conducting block with external fan.Advantage：1）Small volume, is suitable for desktop level application；2）Low temperature can be realized, high temperature can also be realized；3）It can be powered using battery；4）Overtemperature alarm can be realized；5）Good energy-conserving effect.
Description
Technical field
The present invention relates to a kind of intelligent micro semiconductor high low incubator, belong to high-low temperature chamber intelligent control technology field.
Background technology
High-low temperature chamber is applied to industrial products high temperature, the reliability test of low temperature, for industrial high/low temperature case and bag
Include using the heating system of Resistant heating, the refrigeration system that is compressed and evaporate to refrigerant and accordingly circuit and
Temperature control system, it is typically heavier, without portability；For some application scenarios, such as to a small amount of easy by temperature shadow
Loud sensor carries out temperature calibration, it is necessary to carry out high/low temperature circulation；After a small amount of chip gold wire bonding, circulated by high/low temperature
Verify bond strength；Epoxy resin carries out the occasions such as hot setting, and a miniature Table top type high-low temperature chamber can meet requirement, and
And occupied ground is small, with higher price advantage；The characteristics of due to minimizing portable, some can also be needed to fix constant temperature
The article of storage is more easily transported；, cannot be larger to refrigerant using volume in order to realize miniature high-low temperature chamber
The refrigeration system of circulation is compressed, semiconductor chilling plate can be used（TEC）Less space is freezed.
The small refrigerator for being currently based on semiconductor chilling plate has obtained wider application, such as car refrigerator, can be right
Several can drink are freezed, and are always worked at low-temperature condition after car refrigerator start, can be carried out the temperature adjustment of small range；
It is of the invention then will using semiconductor chilling plate lead to forward current can freeze, logical reverse current can thermal property processed, that is, use
Same system, can both realize that low temperature can also realize the purpose of high temperature, add corresponding structure design, drive circuit is set
Meter, and intelligent algorithm design, finally realize intelligent micro high-low temperature chamber, are needing the occasion of Mobile portable, can be using electricity
Pond powers.
The content of the invention
Proposed by the present invention is a kind of intelligent micro semiconductor high low incubator, and its purpose aims at empty inside high-low temperature chamber
Between the purpose that can either freeze and can heat, realize the intellectuality and miniaturization of high-low temperature chamber.
The technical solution of the present invention：Intelligent micro semiconductor high low incubator, its structure includes control panel 1, height
Temperature-sensing probe 6 in incubator shell 2, internal fan 3, dividing plate 4, circuit module 5, case, sample power-up wire guide 7, internal heat-conducting block
8, semiconductor chilling plate 9, outside heat-conducting block 10, external fan 11, internal heat-conducting block temperature-sensing probe 12, outside heat-conducting block temperature-sensitive is visited
First 13；Wherein, it is equipped with a face of high-low temperature chamber shell 2 on door, the outer surface of door and is fixed with control panel 1；High-low temperature chamber
The outer surface of shell 2 is fixed with circuit module 5；High-low temperature chamber shell 2 and door formation high/low temperature casing, dividing plate 4, temp probe 6
It is in high-low temperature chamber body；Window is provided with the side wall of high-low temperature chamber shell 2, window is built with semiconductor chilling plate 9, semiconductor
The one of cooling piece 9 is facing to inside high-low temperature chamber body, and the another side of semiconductor chilling plate 9 is towards the outside of high/low temperature casing；Half
The one side of conductor cooling piece 9 towards high/low temperature box house is connected by internal heat-conducting block 8 with internal fan 3；Semiconductor refrigerating
Piece 9 is connected towards the one side outside high-low temperature chamber body by outside heat-conducting block 10 with external fan 11；It is equipped with internal heat-conducting block 8
Internal heat-conducting block temperature-sensing probe 12；Equipped with outside heat-conducting block temperature-sensing probe 13 on outside heat-conducting block 10；Opened on high-low temperature chamber shell 2
There is sample to power up wire guide 7.
Advantages of the present invention：
1）The present invention has small volume, is suitable for desktop level application；
2）The present invention can both realize low temperature using semiconductor chilling plate, can also realize high temperature；
3）The present invention can be powered in the occasion for needing constant temperature to transport using battery；
4）The two sides of semiconductor chilling plate all carries temp probe, and the working condition of monitoring cooling piece, occurs in fin in real time
When abnormal, it is possible to achieve the overtemperature alarm of cooling piece；
5）Temperature adjustment is carried out using pid algorithm, the temperature constant state of single temperature spot can be both realized, can also realize that low temperature is arrived
The temperature scanning of multiple temperature spots between high temperature, can be by PWM regulation reductions when the power of semiconductor chilling plate is smaller
Portion and the rotating speed of external fan, are even switched off inside and outside fan, reach the purpose of energy-conservation.
Brief description of the drawings
Accompanying drawing 1 is the overall structure diagram of intelligent micro semiconductor high low incubator.
Accompanying drawing 2 is the sectional view of intelligent micro semiconductor high low incubator.
Accompanying drawing 3 is the H-bridge circuit schematic diagram that the two-way operation of semiconductor chilling plate 9 is used.
Accompanying drawing 4 is the temperature measurement circuit figure of negative temperature coefficient temperature sensor.
Accompanying drawing 5 is the entire block diagram of the control system of the whole intelligent micro semiconductor high low incubator of 5 pairs of circuit module.
1 is control panel in accompanying drawing, and 2 be high-low temperature chamber shell, and 3 be internal fan, and 4 be dividing plate, and 5 be circuit module, and 6 are
Temperature-sensing probe in case, 7 be sample power-up wire guide, and 8 be internal heat-conducting block, and 9 be semiconductor chilling plate, and 10 be outside heat-conducting block,
11 be external fan, and 12 be internal heat-conducting block temperature-sensing probe, and 13 be outside heat-conducting block temperature-sensing probe.
Embodiment
Compare accompanying drawing 1-2, intelligent micro semiconductor high low incubator, its structure include control panel 1, high-low temperature chamber shell 2,
Temperature-sensing probe 6 in internal fan 3, dividing plate 4, circuit module 5, case, sample power-up wire guide 7, internal heat-conducting block 8, semiconductor system
Cold 9, outside heat-conducting block 10, external fan 11, internal heat-conducting block temperature-sensing probe 12, outside heat-conducting block temperature-sensing probe 13；Wherein,
It is equipped with one face of high-low temperature chamber shell 2 on door, the outer surface of door and is fixed with control panel 1；High-low temperature chamber shell 2 is fixed with
Circuit module 5；High-low temperature chamber shell 2 and door formation high/low temperature casing, dividing plate 4, temp probe 6 are in high-low temperature chamber body；It is high
Be provided with window on the side wall of cryogenic box shell 2, window built with semiconductor chilling plate 9, semiconductor chilling plate 9 one facing to height
Low temperature box house, the another side of semiconductor chilling plate 9 is towards the outside of high/low temperature casing；Semiconductor chilling plate 9 is towards just
The one side of warm box house is connected by internal heat-conducting block 8 with internal fan 3；Semiconductor chilling plate 9 is external towards high-low temperature chamber
The one side in portion is connected by outside heat-conducting block 10 with external fan 11；Equipped with internal heat-conducting block temperature-sensing probe on internal heat-conducting block 8
12；Equipped with outside heat-conducting block temperature-sensing probe 13 on outside heat-conducting block 10；Sample power-up wire guide 7 is provided with high-low temperature chamber shell 2.
The high/low temperature casing has less volume, such as internal volume is adapted to the application of desktop level in 3-5 liters；It is whole
Individual casing is formed using sheet metal process or grinding tool injection molding.
There is interlayer on each side wall of the high-low temperature chamber shell 2, interlayer uses polyurethane or polystyrene foam
Filling, so that reduce heat carries out heat exchange by casing.
The door is filled using polyurethane or polystyrene foam, passed through so as to reduce heat with interlayer, interlayer
Casing carries out heat exchange.
The circuit module 5 includes power unit and control section, is needing the occasion of storage transport, can also increase and fill
Electric battery compartment；Circuit module 5 is preferably fixed to the outer surface of high-low temperature chamber shell 2.
By the control panel 1, user can setting program as needed.
The dividing plate 4 is in the middle part in high-low temperature chamber body, convenient to place test sample.
Temperature-sensing probe 6 is used to detecting the temperature of air in casing in the case, some samples when high/low temperature is tested, it is necessary to
Sample is powered up, so being provided with the hole 7 of wire on casing；Realize that refrigeration or the module of heating are led by internal fan 3, inside
Hot block 8, semiconductor chilling plate 9, outside heat-conducting block 10, external fan 11 are constituted；The internally positioned heat-conducting block 8 of semiconductor chilling plate 9
Between outside heat-conducting block 10；In order to increase between heat transfer, the interface that semiconductor chilling plate 9 is in contact with internal heat-conducting block 8
Scribble and be also coated with heat-conducting silicone grease between heat-conducting silicone grease, the interface that semiconductor chilling plate 9 is in contact with outside heat-conducting block 10；Lead inside
Hot block 8 and outside heat-conducting block 10 all carry comb teeth-shaped structure；In order to monitor the working condition of semiconductor chilling plate 9, internally lead
The mounting hole for installing temp probe is all devised on hot block 8 and outside heat-conducting block 10, it is outside by internal heat-conducting block temperature-sensing probe 12
Heat-conducting block temperature-sensing probe 13 is respectively placed in corresponding mounting hole, and two surfaces inside and outside semiconductor chilling plate 9 can be obtained in real time
Temperature.
The control section of the circuit module 5 includes H-bridge circuit, and H-bridge circuit is connected with semiconductor chilling plate 9；Intelligence is micro-
When type semiconductor high low incubator works：Semiconductor chilling plate 9 needs that refrigerating state can be operated in, and heating shape can be operated in again
State；When the electric current by semiconductor chilling plate 9 turns direction, the inner surface of semiconductor chilling plate 9 and outer surface also can be with
The change of the sense of current, changes into inner surface as chill surface as heating surface and outer surface from inner surface and is used as chill surface and outer
Surface, using this characteristic, using H-bridge circuit, just can meet the demand of high-low temperature chamber application, H-bridge circuit as heating surface
For controlling by the sense of current of semiconductor chilling plate 9, and then control cutting for the heating surface of semiconductor chilling plate 9 and chill surface
Change.
The H-bridge circuit is logical to be constituted or using 4 N-channels using 2 P-channel MOSFET and 2 N-channel MOS FET
MOSFET is constituted；Because P-channel MOSFET is larger relative to N-channel MOS FET internal resistances, for high current, such as：When electric current is in 10A
During the above, in order to reduce heating, it is preferred to use 4 N-channel MOS FET constitute H-bridge circuit.
It is described that first N-channel MOS FET Q1, second N-channel are included by 4 N-channel MOS FET H-bridge circuits constituted
MOSFET Q2, the 3rd N-channel MOS FET Q3, the 4th N-channel MOS FET Q4；Wherein, first N-channel MOS FET Q1
Connect with the 3rd N-channel MOS FET Q3 with a surface of semiconductor chilling plate 9, second N-channel MOS FET Q2 and
Four N-channel MOS FET Q4 connect with another surface of semiconductor chilling plate 9；During specific works：When first N-channel
MOSFET Q1 and the 4th N-channel MOS FET Q4 conducting, second N-channel MOS FET Q2 and the 3rd N-channel MOS FET
When Q3 is closed, semiconductor chilling plate passes through forward current；As first N-channel MOS FET Q1 and the 4th N-channel MOS FET
Q4 is closed, and during second N-channel MOS FET Q2 and the 3rd N-channel MOS FET Q3 conducting, semiconductor chilling plate passes through reverse
Electric current；On the basis of sense of current control is realized, then pass through pulse width modulation（PWM）Regulation is loaded into semiconductor chilling plate
Power on 9, realizes the regulation of refrigeration or heating power；For the first N-channel MOS FET Q1 and second N ditch of upper arm
Road MOSFET Q2, it is necessary to be produced from elevate voltage could be fully on, so typically being entered using special MOSFET driving chips
Row driving, it is preferred to use IR2101 driving chips；
There is the resistance connected with H-bridge circuit the control section of the circuit module 5, and the resistance is current sampling resistor, in such as Fig. 3
Resistance Rs be current sampling resistor, the electric current flowed through on semiconductor chilling plate can be extrapolated by the voltage measured on Rs.
The temperature sensing point of the intelligent micro semiconductor high low incubator is except temperature-sensing probe 6, internal heat-conducting block sense in case
Temperature probe 12, outside heat-conducting block temperature-sensing probe 13, in addition to the ambient temperature probe being placed in circuit module 5, extraneous ring
Border temp probe can use integrated temperature sensor or negative temperature coefficient temperature sensor（NTC）Or electric thermo-couple temperature sensing
Device, such as Fig. 4 are the temperature measurement circuits using negative temperature coefficient temperature sensor.
The block diagram of the control system of the whole intelligent micro semiconductor high low incubator of 5 pairs of circuit module is as shown in figure 5, circuit mould
The control section of block 5 also includes single-chip microcomputer, and single-chip microcomputer obtains temperature in high-low temperature chamber, the inner surface of semiconductor chilling plate 9 and outer
After the parameter such as the temperature on surface, the environment temperature outside case, the electric current for flowing through semiconductor chilling plate, control panel is passed through with reference to user
The parameter of 1 setting, adoption rate integral differential（PID）Algorithm produces PWM ripples, freezes or adds so as to adjust semiconductor chilling plate 9
The regulation of thermal power so that the temperature inside the box can be stablized in design temperature；When the power of semiconductor chilling plate is smaller, such as set
When constant temperature degree and close ambient temperature, can be adjusted by PWM reduces the rotating speed of inside and outside fan, is even switched off interior
Portion and external fan, i.e., reach the purpose of energy-conservation using passive radiating completely.
Embodiment
Intelligent micro semiconductor high low incubator, its structure is by control panel 1, high-low temperature chamber shell 2, internal fan 3, dividing plate
4, circuit module 5, temperature-sensing probe 6 in case, sample power-up wire guide 7, internal heat-conducting block 8, semiconductor chilling plate 9, outside heat conduction
Block 10, external fan 11, internal heat-conducting block temperature-sensing probe 12, outside heat-conducting block temperature-sensing probe 13 is constituted；Wherein, outside high-low temperature chamber
It is equipped with one face of shell 2 on door, the outer surface of door and is fixed with control panel 1；High-low temperature chamber shell 2 is fixed with circuit module 5；
High-low temperature chamber shell 2 and door formation high/low temperature casing, dividing plate 4, temp probe 6 are in high-low temperature chamber body；High-low temperature chamber shell 2
Side wall on be provided with window, window built with semiconductor chilling plate 9, semiconductor chilling plate 9 one facing in high-low temperature chamber body
Portion, the another side of semiconductor chilling plate 9 is towards the outside of high/low temperature casing；Semiconductor chilling plate 9 is towards high/low temperature box house
One side connected by internal heat-conducting block 8 with internal fan 3；Semiconductor chilling plate 9 leads to towards the one side outside high-low temperature chamber body
Outside heat-conducting block 10 is crossed with external fan 11 to connect；Equipped with internal heat-conducting block temperature-sensing probe 12 on internal heat-conducting block 8；Outside heat conduction
Equipped with outside heat-conducting block temperature-sensing probe 13 on block 10；Sample power-up wire guide 7 is provided with high-low temperature chamber shell 2.
The external dimensions of the high/low temperature casing is 20cm × 20cm × 20cm；Whole casing is made of sheet metal process.
There is interlayer with Men Jun on each side wall of the high-low temperature chamber shell 2, interlayer fills have the bubble of heat-blocking action
Foam material, so that reduce heat carries out heat exchange by casing.
The circuit module 5 includes power unit and control section, is needing the occasion of storage transport, can also increase and fill
Electric battery compartment；Circuit module 5 is preferably fixed to the outer surface of high-low temperature chamber shell 2.
By the control panel 1, user can setting program as needed.
The dividing plate 4 is in the middle part in high-low temperature chamber body, convenient to place test sample.
Temperature-sensing probe 6 is used for the temperature for detecting air in casing, the internally positioned heat-conducting block of semiconductor chilling plate 9 in the case
Between 8 and outside heat-conducting block 10；In order to increase between heat transfer, the interface that semiconductor chilling plate 9 is in contact with internal heat-conducting block 8
Scribble and be also coated with heat-conducting silicone grease between heat-conducting silicone grease, the interface that semiconductor chilling plate 9 is in contact with outside heat-conducting block 10；Lead inside
Hot block 8 and outside heat-conducting block 10 all carry comb teeth-shaped structure；In order to monitor the working condition of semiconductor chilling plate 9, internally lead
The mounting hole for installing temp probe is all devised on hot block 8 and outside heat-conducting block 10, it is outside by internal heat-conducting block temperature-sensing probe 12
Heat-conducting block temperature-sensing probe 13 is respectively placed in corresponding mounting hole, and the temperature on two surfaces inside and outside semiconductor chilling plate 9 is obtained in real time
Degree.
The control section of the circuit module 5 includes H-bridge circuit, and H-bridge circuit is connected with semiconductor chilling plate 9；Intelligence is micro-
When type semiconductor high low incubator works：Semiconductor chilling plate 9 needs that refrigerating state can be operated in, and heating shape can be operated in again
State；When the electric current by semiconductor chilling plate 9 turns direction, the inner surface of semiconductor chilling plate 9 and outer surface also can be with
The change of the sense of current, changes into inner surface as chill surface as heating surface and outer surface from inner surface and is used as chill surface and outer
Surface, using this characteristic, using H-bridge circuit, just can meet the demand of high-low temperature chamber application, H-bridge circuit as heating surface
For controlling by the sense of current of semiconductor chilling plate 9, and then control cutting for the heating surface of semiconductor chilling plate 9 and chill surface
Change.
The H-bridge circuit is constituted using model IRF540NS 4 N-channel MOS FET, and driving chip is used
IR2102,；It is described that first N-channel MOS FET Q1, second N-channel are included by 4 N-channel MOS FET H-bridge circuits constituted
MOSFET Q2, the 3rd N-channel MOS FET Q3, the 4th N-channel MOS FET Q4；Wherein, first N-channel MOS FET Q1
Connect with the 3rd N-channel MOS FET Q3 with a surface of semiconductor chilling plate 9, second N-channel MOS FET Q2 and
Four N-channel MOS FET Q4 connect with another surface of semiconductor chilling plate 9；During specific works：When first N-channel
MOSFET Q1 and the 4th N-channel MOS FET Q4 conducting, second N-channel MOS FET Q2 and the 3rd N-channel MOS FET
When Q3 is closed, semiconductor chilling plate passes through forward current；As first N-channel MOS FET Q1 and the 4th N-channel MOS FET
Q4 is closed, and during second N-channel MOS FET Q2 and the 3rd N-channel MOS FET Q3 conducting, semiconductor chilling plate passes through reverse
Electric current；On the basis of sense of current control is realized, then pass through pulse width modulation（PWM）Regulation is loaded into semiconductor chilling plate
Power on 9, realizes the regulation of refrigeration or heating power.
The H-bridge circuit is constituted using model IRF540NS 4 N-channel MOS FET, and driving chip is used
IR2102,4 pins of H-bridge circuit be connected to single-chip microcomputer STM32F103RBT6 TIM1_CH1, TIM1_CH1N, TIM1_CH2 and
TIM1_CH2N pins, single-chip microcomputer carries dead zone function, prevents the upper underarm of H bridges from simultaneously turning on, single-chip microcomputer STM32F103RBT6
Realized using pid algorithm and the temperature of high-low temperature chamber is controlled.
There is the resistance connected with H-bridge circuit the control section of the circuit module 5, and the resistance is current sampling resistor, such as
Resistance Rs in Fig. 3 is current sampling resistor, and the electric current flowed through on semiconductor chilling plate is extrapolated by the voltage measured on Rs.
The temperature sensing point of the intelligent micro semiconductor high low incubator is except temperature-sensing probe 6, internal heat-conducting block sense in case
Temperature probe 12, outside heat-conducting block temperature-sensing probe 13, in addition to the ambient temperature probe being placed in circuit module 5, extraneous ring
Border temp probe uses negative temperature coefficient temperature sensor（NTC）, if Fig. 4 is the survey for the negative temperature coefficient temperature sensor that uses
Circuit temperature；User can set single temperature spot by control panel 1, or multiple temperature spots are scanned.
The block diagram of the control system of the whole intelligent micro semiconductor high low incubator of 5 pairs of circuit module is as shown in figure 5, circuit mould
The control section of block 5 also includes single-chip microcomputer, and single-chip microcomputer obtains temperature in high-low temperature chamber, the inner surface of semiconductor chilling plate 9 and outer
After the parameter such as the temperature on surface, the environment temperature outside case, the electric current for flowing through semiconductor chilling plate, control panel is passed through with reference to user
The parameter of 1 setting, adoption rate integral differential（PID）Algorithm produces PWM ripples, freezes or adds so as to adjust semiconductor chilling plate 9
The regulation of thermal power so that the temperature inside the box can be stablized in design temperature；When the power of semiconductor chilling plate is smaller, such as set
When constant temperature degree and close ambient temperature, can be adjusted by PWM reduces the rotating speed of inside and outside fan, is even switched off interior
Portion and external fan, i.e., reach the purpose of energy-conservation using passive radiating completely.
The internal heat-conducting block 8 and outside heat-conducting block 10 are fitted with 10k Ω NTC temperature detecting resistances, NTC temperature detecting resistances with
10k Ω resistance strings connection 3.3V voltages in circuit module 5；Exported using in the temperature measurement circuit of negative temperature coefficient temperature sensor
Voltage end T1 be connected to single-chip microcomputer STM32F103RBT6 AD pins, single-chip microcomputer can obtain corresponding temperature by look-up table；
Same method is used for the temperature inside the box and case external environment temperature.
Claims (8)
1. intelligent micro semiconductor high low incubator, it is characterized in that including control panel（1）, high-low temperature chamber shell（2）, internal fan
（3）, dividing plate（4）, circuit module（5）, temperature-sensing probe in case（6）, sample power-up wire guide（7）, internal heat-conducting block（8）, partly lead
Body cooling piece（9）, outside heat-conducting block（10）, external fan（11）, internal heat-conducting block temperature-sensing probe（12）, outside heat-conducting block temperature-sensitive
Probe（13）；Wherein, high-low temperature chamber shell（2）A face on door is housed, be fixed with control panel on the outer surface of door（1）；
High-low temperature chamber shell（2）It is fixed with circuit module（5）；High-low temperature chamber shell（2）With door formation high/low temperature casing, dividing plate（4）, temperature
Degree probe（6）It is in high-low temperature chamber body；High-low temperature chamber shell（2）Side wall on be provided with window, window is built with semiconductor system
Cold（9）, semiconductor chilling plate（9）One facing to inside high-low temperature chamber body, semiconductor chilling plate（9）Another side towards high
The outside of low temperature casing；Semiconductor chilling plate（9）Pass through internal heat-conducting block towards the one side of high/low temperature box house（8）With inside
Fan（3）Connect；Semiconductor chilling plate（9）Pass through outside heat-conducting block towards the one side outside high-low temperature chamber body（10）With outside wind
Fan（11）Connect；Internal heat-conducting block（8）It is upper that internal heat-conducting block temperature-sensing probe is housed（12）；Outside heat-conducting block（10）It is upper that outside is housed
Heat-conducting block temperature-sensing probe（13）；High-low temperature chamber shell（2）On be provided with sample power-up wire guide（7）.
2. intelligent micro semiconductor high low incubator according to claim 1, it is characterized in that the high-low temperature chamber shell（2）'s
There is interlayer on the wall of each side, interlayer is filled using polyurethane or polystyrene foam.
3. intelligent micro semiconductor high low incubator according to claim 1, it is characterized in that the door carries interlayer, interlayer is adopted
Filled with polyurethane or polystyrene foam, so that reduce heat carries out heat exchange by casing.
4. intelligent micro semiconductor high low incubator according to claim 1, it is characterized in that the circuit module（5）Including control
Part processed, control section includes H-bridge circuit, H-bridge circuit and semiconductor chilling plate（9）Connection.
5. intelligent micro semiconductor high low incubator according to claim 1, it is characterized in that the H-bridge circuit is logical using 2 P
Channel mosfet and 2 N-channel MOS FET are constituted or constituted using 4 N-channel MOS FET.
6. intelligent micro semiconductor high low incubator according to claim 5, it is characterized in that described by 4 N-channel MOS FET
The H-bridge circuit of composition includes first N-channel MOS FET（Q1）, second N-channel MOS FET（Q2）, the 3rd N-channel
MOSFET （Q3）, the 4th N-channel MOS FET（Q4）；Wherein, first N-channel MOS FET（Q1）With the 3rd N-channel
MOSFET （Q3）With semiconductor chilling plate（9）A surface connect, second N-channel MOS FET（Q2）With the 4th N ditch
Road MOSFET（Q4）With semiconductor chilling plate（9）Another surface connect；During specific works：As first N-channel MOS FET
（Q1）With the 4th N-channel MOS FET（Q4）Conducting, second N-channel MOS FET（Q2）With the 3rd N-channel MOS FET
（Q3）During closing, semiconductor chilling plate passes through forward current；As first N-channel MOS FET（Q1）With the 4th N-channel
MOSFET （Q4）Close, second N-channel MOS FET（Q2）With the 3rd N-channel MOS FET（Q3）During conducting, semiconductor system
Cold passes through reverse current；It is loaded into and partly leads on the basis of sense of current control is realized, then by pulse width modulation regulation
Body cooling piece（9）On power, realize refrigeration or heating power regulation.
7. intelligent micro semiconductor high low incubator according to claim 1, it is characterized in that the semiconductor chilling plate（9）Position
In internal heat-conducting block（8）With outside heat-conducting block（10）Between；Semiconductor chilling plate（9）With internal heat-conducting block（8）The boundary being in contact
Heat-conducting silicone grease, semiconductor chilling plate are scribbled between face（9）With outside heat-conducting block（10）Heat conduction is also coated between the interface being in contact
Silicone grease；Internal heat-conducting block（8）With outside heat-conducting block（10）All carry comb teeth-shaped structure；Internally heat-conducting block（8）With outside heat conduction
Block（10）On all devise install temp probe mounting hole.
8. intelligent micro semiconductor high low incubator according to claim 1, it is characterized in that also including being placed in circuit module（5）
In ambient temperature probe, ambient temperature probe can be passed using integrated temperature sensor or negative temperature coefficient temperature
Sensor or thermocouple temperature sensor.
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| CN201710486497.6A CN107092286A (en) | 2017-06-23 | 2017-06-23 | A kind of intelligent micro semiconductor high low incubator |
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| CN201710486497.6A CN107092286A (en) | 2017-06-23 | 2017-06-23 | A kind of intelligent micro semiconductor high low incubator |
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| CN108294861A (en) * | 2018-01-05 | 2018-07-20 | 袁沛兰 | A kind of eyeshade with charge function |
| CN108832865A (en) * | 2018-07-27 | 2018-11-16 | 广东好太太科技集团股份有限公司 | A kind of electric clothes airing machine frequency conversion control circuit and method for controlling frequency conversion |
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| CN109857170A (en) * | 2019-03-26 | 2019-06-07 | 北京理工亘舒科技有限公司 | A kind of temperature control method and device |
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| CN111776425A (en) * | 2020-06-19 | 2020-10-16 | 北京三快在线科技有限公司 | Meal box and control method, equipment, medium and unmanned equipment thereof |
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