CN107084661B - Structural adhesive curing stress testing device and testing method - Google Patents
Structural adhesive curing stress testing device and testing method Download PDFInfo
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- CN107084661B CN107084661B CN201710330283.XA CN201710330283A CN107084661B CN 107084661 B CN107084661 B CN 107084661B CN 201710330283 A CN201710330283 A CN 201710330283A CN 107084661 B CN107084661 B CN 107084661B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 97
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 97
- 238000012360 testing method Methods 0.000 title claims abstract description 28
- 238000009662 stress testing Methods 0.000 title claims description 10
- 239000011521 glass Substances 0.000 claims abstract description 69
- 230000006750 UV protection Effects 0.000 claims abstract description 24
- 238000005259 measurement Methods 0.000 claims abstract description 18
- 238000004321 preservation Methods 0.000 claims abstract description 16
- 238000002347 injection Methods 0.000 claims abstract description 14
- 239000007924 injection Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 13
- 230000005483 Hooke's law Effects 0.000 claims description 6
- 229920006335 epoxy glue Polymers 0.000 claims description 5
- 238000007790 scraping Methods 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000001723 curing Methods 0.000 description 99
- 230000003287 optical effect Effects 0.000 description 12
- 239000011888 foil Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention relates to a testing device and a testing method for curing stress of aerospace structural adhesive, and solves the problems that the existing testing device cannot measure the stress of the curing structural adhesive when the curing structural adhesive is irradiated by light, and the measurement situation is inconsistent with the actual engineering situation. The device comprises an ultraviolet protection heat preservation box, a strain amplifier, a data acquisition instrument, an ultraviolet lamp, a strain gauge, a transparent organic glass sheet and a curing platform; the shape and size of the upper end surface of the curing platform are the same as those of the actual adhesive structural adhesive, and the curing platform is provided with an adhesive injection hole and a plurality of pillars; the ultraviolet lamp is arranged at the upper end of the strain gauge; the strain gauge is arranged at the upper end of the transparent organic glass sheet, the transparent organic glass sheet is arranged at the upper end of the curing platform, and the structural adhesive is arranged in a gap formed by the transparent organic glass sheet and the curing platform; the strain gauge is connected with a strain amplifier, and the strain amplifier is connected with a data acquisition instrument. The testing device is simple in structure, the testing method is simple, and the testing device is suitable for testing the curing stress of structural adhesives with different formulas.
Description
Technical Field
The invention belongs to the field of stress measurement, and particularly relates to a device and a method for testing the curing stress of an aerospace structural adhesive.
Background
The aerospace camera has high requirements on the surface shape of the optical element, in order to reduce the influence of assembly stress on the surface shape of the optical element, the optical element and a supporting structure of the optical element are generally bonded by structural adhesive, and the curing stress generated in the curing process of the structural adhesive becomes a main factor influencing the surface shape of the optical element. In addition, the structural adhesive curing stress can generate prestress between the optical element and the supporting structure, and the stress higher than a predicted value is generated when the structural adhesive is tested in a mechanical environment and a thermal environment, so that the aerospace load risk is increased. Therefore, before the optical element and the supporting structure are glued, the curing stress of the structural glue in the current optical-mechanical connection state needs to be measured experimentally, and data support is provided for stress prediction of the aerospace optical element.
The method for testing the curing stress generally adopts opaque materials such as aluminum, iron and the like to manufacture a container filled with structural adhesive, the structure cannot measure the stress value of the structural adhesive which can be cured only by light irradiation, secondly, in the design of the container for bearing the structural adhesive, the filling mode of the structural adhesive, the size and the shape of the structural adhesive and the deformation structure during curing stress contraction are different from the actual bonding condition of the optical element, and the measured stress value has no engineering reference value.
Disclosure of Invention
The invention provides a structural adhesive curing stress testing device and a testing method, which aim to solve the problems that the existing testing device cannot measure the structural adhesive curing stress value when the light irradiates and the measuring condition is not consistent with the actual engineering condition, so that the measuring result is inaccurate.
The technical scheme for solving the problems is as follows:
a structural adhesive curing stress testing device comprises an ultraviolet protection heat preservation box 1, a strain amplifier 9 and a data acquisition instrument 10 which are arranged outside the ultraviolet protection heat preservation box 1, and an ultraviolet lamp 6, a strain foil 7, a transparent organic glass foil 5 and a curing platform 3 which are arranged in the ultraviolet protection heat preservation box 1; the shape and size of the upper end face of the curing platform 3 are the same as those of the actual adhesive structural adhesive 4, and a plurality of support columns 11 are arranged at the edge of the upper end of the curing platform 3; the curing platform 3 is provided with a glue injection hole 12; the ultraviolet lamp 6 is arranged at the upper end of the strain gauge 7; the strain gauge 7 is arranged at the upper end of the transparent organic glass sheet 5, the transparent organic glass sheet 5 is arranged at the upper end of the curing platform 3 through a strut 11 of the curing platform 3, and the structural adhesive 4 is arranged in a gap formed by the transparent organic glass sheet 5 and the curing platform 3; the strain gauge 7 is connected with a strain amplifier 9 through a data cable 8, and the strain amplifier 9 is connected with a data acquisition instrument 10 through the data cable 8.
Further, in order to stably support the curing platform 3, an object stage 2 is further arranged below the curing platform 3.
Further, in order to ensure the accuracy of the measurement result, the glue injection hole 12 is arranged at the center of the curing platform 3.
Further, in order to ensure the accuracy of the measurement result, the strain gauge 7 is arranged at the center of the transparent organic glass sheet 5.
Further, in order to ensure the bonding firmness, the strain gauge 7 is adhered to the center of the transparent organic glass sheet 5 by using epoxy glue, and the transparent organic glass sheet 5 is adhered to the upper end of the curing platform 3 by using silicon rubber.
A method for testing the curing stress of a structural adhesive comprises the following steps:
1) Selecting a curing platform 3 and a strain gauge 7, wherein the shape and the size of the upper end surface of the curing platform 3 are the same as those of the actual adhesive structural glue 4;
2) The strain gauge 7 is stuck on the transparent organic glass sheet 5;
3) Bonding the transparent organic glass sheet 5 with the support 11 at the upper end of the curing platform 3;
4) Injecting the structural adhesive 4 from the adhesive injection hole 12 of the curing platform 3, filling the gap formed by the transparent organic glass sheet 5 and the curing platform 3, and scraping the redundant adhesive solution;
5) Placing the curing platform 3 in the ultraviolet protection heat preservation box 1;
6) Connecting the strain gauge 7 with a strain amplifier 9, and connecting the strain amplifier 9 with a data acquisition instrument 10;
7) Opening the strain amplifier 9 and the data acquisition instrument 10, starting the ultraviolet lamp 6, setting the temperature of the ultraviolet protection incubator 1, and measuring a curing strain value;
8) Stopping data acquisition after the strain measurement data is unchanged, and storing the measured data to obtain the curing strain values of the structural adhesive 4 at different moments;
9) According to the strain of the transparent organic glass sheet 5 and the elastic modulus of the organic glass, the magnitude of the acting force of the structural adhesive on the transparent organic glass sheet 5 in the curing process is calculated by using a Hooke's law calculation formula, the acting force is a numerical value of the curing stress, the specific formula is that sigma = E epsilon,
wherein: σ — stress of test;
e-the elastic modulus of the organic glass is 6.9Gpa;
ε -curing strain value.
Further, the gap formed by the transparent organic glass sheet 5 and the curing platform 3 is 0.15-0.2mm.
Further, the structural adhesive 4 is injected from the adhesive injection hole 12 of the curing platform 3 by a syringe.
The invention has the advantages that:
1. the testing device provided by the invention has a simple structure, the testing method is simple, and the testing device is suitable for testing the curing stress of the structural adhesive with different formulas.
2. The organic glass curing platform used by the invention is transparent and can be compatible with the measurement of the curing stress of the light-cured structural adhesive.
3. Through the regulation of ultraviolet lamp intensity, can measure the solidification stress that photocuring structure glued under the different light intensity shines, through the regulation of ultraviolet protection insulation can temperature, can measure the solidification stress that structure glued under the different temperatures, have the guide effect to sticky condition in the actual engineering.
4. The structure of the curing platform is the same as the actual gluing model of the optical element of the space camera, the thickness and the shape of the glued spot are the same, and the measured data has engineering applicability.
Drawings
FIG. 1 is a schematic view of a measuring device according to the present invention;
FIG. 2 is a measurement curve of the curing stress of the structural adhesive 4 at 20 ℃;
FIG. 3 is a measurement curve of the curing stress of the structural adhesive 4 at 40 ℃;
FIG. 4 is a graph showing the measurement of the curing stress of the structural adhesive 4 at 60 ℃.
Reference numerals: 1-an ultraviolet protection heat preservation box, 2-an objective table, 3-a curing platform, 4-structural adhesive, 5-a transparent organic glass sheet, 6-an ultraviolet lamp, 7-a strain gauge, 8-a data cable, 9-a strain amplifier, 10-a data acquisition instrument, 11-a support and 12-an injection hole.
Detailed Description
The invention is described in further detail below with reference to the following figures and specific examples:
as shown in figure 1, the structural adhesive curing stress testing device comprises an ultraviolet protection heat preservation box 1, a strain amplifier 9 and a data acquisition instrument 10 which are arranged outside the ultraviolet protection heat preservation box 1, and an ultraviolet lamp 6, a strain foil 7, a transparent organic glass sheet 5 and a curing platform 3 which are arranged in the ultraviolet protection heat preservation box 1; 4 support columns 11 are arranged at the upper end edge of the curing platform 3; the curing platform 3 is provided with a glue injection hole 12; the ultraviolet lamp 6 is arranged at the upper end of the strain gauge 7; the strain gauge 7 is arranged at the upper end of the transparent organic glass sheet 5, the transparent organic glass sheet 5 is arranged at the upper end of the curing platform 3 through a strut 11 of the curing platform 3, and the structural adhesive 4 is arranged in a gap formed by the transparent organic glass sheet 5 and the curing platform 3; the strain gauge 7 is connected with a strain amplifier 9 through a data cable 8, and the strain amplifier 9 is connected with a data acquisition instrument 10 through the data cable 8. An object stage 2 is arranged below the curing platform 3. In order to ensure the accuracy of the measurement result, the glue injection hole 12 is arranged at the center of the curing platform 3. The strain gauge 7 is arranged in the center of the transparent organic glass sheet 5. In order to ensure the bonding firmness, the strain gauge 7 is adhered to the central position of the transparent organic glass sheet 5 by using epoxy glue, and the transparent organic glass sheet 5 is adhered to the upper end of the curing platform 3 by using silicon rubber. The structure of the curing platform 3 is similar to that of an actual bonding model of an optical element of an aerospace camera, the thickness and the shape of a bonded adhesive spot are similar, and the shape and the size of the upper end surface of the curing platform 3 are the same as those of the actual bonding structural adhesive 4.
Aiming at the requirement of the aerospace structural adhesive on the quantification of stress parameters, the invention provides a method and a device for testing the curing stress in the aerospace structural adhesive curing process, wherein the curing platform 3 is made of transparent organic glass and is compatible with the measurement of the curing stress of the photocuring structural adhesive 4, the strain gauge 7 is used for measuring the deformation of the organic glass caused by the structural adhesive 4 in the curing process to calculate the curing stress of the structural adhesive 4, and theoretical support is provided for the selection of the low-stress aerospace structural adhesive.
According to the method, the structural adhesive 4 is placed in the curing platform 3 made of glass, the strain gauge 7 is adhered to the top of the curing platform 3, the structural adhesive 4 in the curing platform 3 is cured at different temperatures through adjusting the strength of the ultraviolet lamp 6, and the curing stress of the structural adhesive 4 can be measured and recorded in real time according to the deformation of the tested organic glass. The device and the method can be used for measuring the curing stress of the structural adhesive 4 at different temperatures in real time. According to the testing method, organic glass with a certain size is selected, a circular surface with the same size as that of a glue spot when an actual optical element is glued is processed before measurement, a curing platform 3 is manufactured by a gluing method, a strain gauge 7 is glued to the top of a container, the curing platform 3 is placed in an ultraviolet protection heat preservation box 1, curing shrinkage or expansion deformation can occur to structural glue 4, and then real-time data of curing stress can be calculated according to the hooke's law.
The specific measurement steps are as follows:
1) Selecting a curing platform 3 and a strain gauge 7, wherein the shape and the size of the upper end surface of the curing platform 3 are the same as those of the actual adhesive structural glue 4;
2) The strain gauge 7 is adhered to the center of the transparent organic glass sheet 5 by epoxy glue;
3) Sticking a transparent organic glass sheet 5 on a support column at the upper end edge of the curing platform 3 by using silicon rubber;
4) Injecting the structural adhesive 4 from the adhesive injection hole 12 of the curing platform 3 by using an injector, filling the gap between the transparent organic glass sheet 5 and the curing platform 3, and scraping redundant adhesive solution;
5) Placing the curing platform 3 in the ultraviolet protection heat preservation box 1;
6) Connecting the strain gauge 7 to a strain amplifier 9 through a data line, and connecting the strain amplifier 9 to a data acquisition instrument 10 through the data line;
7) Opening the strain amplifier 9 and the data acquisition instrument 10, starting the ultraviolet lamp 6, setting the temperature of the ultraviolet protection incubator 1, and measuring a curing strain value;
8) Stopping data acquisition after the strain measurement data is unchanged, and storing the measured data to obtain the curing strain values of the structural adhesive 4 at different moments;
9) According to the strain of the transparent organic glass sheet 5 and the elastic modulus of the organic glass, the acting force of the structural adhesive 4 on the transparent organic glass sheet 5 in the curing process can be calculated by using a Hooke's law calculation formula, the acting force is a numerical value of the curing stress, the specific formula is that sigma = E epsilon,
wherein: σ — stress of test;
e-the elastic modulus of the organic glass is 6.9Gpa;
ε -curing strain value.
Among the above-mentioned measurement process, 4 curing processes are glued to the structure because the solidification is exothermic and the cross-linking reaction, and 4 can take place the inflation and shrink deformation are glued to the structure, because transparent organic glass piece 5's restraint, the deformation of 4 can arouse to paste the organic glass that has foil gage 7 and take place deformation to the structure. The strain gauge 7 records the strain through a strain gauge and a data acquisition instrument 10, and then the curing stress of the structural adhesive 4 at different moments can be obtained according to Hooke's law and strain data.
Before testing, firstly manufacturing a curing platform 3, selecting an organic glass manufacturing base material by utilizing the light-permeable characteristic of a transparent organic glass sheet, and determining that the adhesive surface of the curing platform 3 is phi 8mm and the thickness is 0.2mm according to the shape and size of an actual adhesive spot; the strain quantity of the organic glass caused by the curing stress of the structural adhesive 4 is more than 1 multiplied by 10 -6 The thickness of the transparent organic glass sheet 5 was determined to be 0.5mm.
Example 1:
in this example, the curing stress of a cured adhesive with a structure of 8mm phi x 0.2mm is measured at 20 ℃.
1) Selecting a curing platform 3 and a strain gauge 7, wherein the shape and the size of the upper end surface of the curing platform 3 are the same as those of the actual adhesive structural glue 4;
2) Firstly, the curing platform 3 and the transparent organic glass sheet 5 are put into an ultrasonic cleaning instrument containing absolute ethyl alcohol for cleaning, and are washed and dried by distilled water for the second time. Punching 45-degree cross stripes on the bonding positions of all the parts by using 220-mesh sand paper, and wiping the stripes with acetone for later use;
3) Adhering a strain gauge 7 to the central position of a transparent organic glass sheet 5, extruding bubbles in an adhesive layer by using a hand when adhering the strain gauge 7, wherein the strain gauge 7 adopts a 120-350 omega uniaxial strain gauge, the grid size is 1.0mm multiplied by 1.5mm, a glass fiber cloth reinforced polyimide substrate is resistant to heat of 250 ℃, the adhesive of the strain gauge 7 is an epoxy-phenolic adhesive, and the working temperature is-70-370 ℃;
4) The transparent organic glass sheet 5 is adhered to the support post 11 of the curing platform 3 by epoxy glue, and the adhering width is less than 1mm;
5): sucking the structural adhesive 4 into an injector, injecting the adhesive solution of the structural adhesive 4 into a gap of 0.2mm formed by the curing platform 3 and the transparent organic glass sheet 5 from an adhesive injection hole 12 of the curing platform 3, avoiding introducing air bubbles as much as possible, scraping redundant adhesive solution, stopping injecting the adhesive when the injected adhesive overflows a bonding surface, scraping the extruded adhesive by using a blade, and placing the curing platform 3 into the ultraviolet protection heat preservation box 1;
6) Connecting the strain gauge 7 to a strain amplifier 9 through a data line, and connecting the strain amplifier 9 to a data acquisition instrument 10 through a data cable;
7) Starting a strain amplifier 9 and a data acquisition instrument 10, starting an ultraviolet lamp 6, adjusting the temperature of the ultraviolet protection incubator 1 to 25 ℃, and starting to carry out curing strain measurement, wherein the strain amplifier 9 is a dynamic strain meter, the direct current is supplied for 2V-8V, the direct current is amplified by 100-1000 times, and the sampling frequency is 100/s;
8) Stopping data acquisition after the strain measurement data is unchanged, storing the measured data, and closing the ultraviolet protection heat preservation box 1;
9) According to the strain of the transparent organic glass sheet 5 and the elastic modulus of the organic glass, the acting force of the structural adhesive 4 on the transparent organic glass sheet 5 in the curing process can be calculated by using a Hooke's law calculation formula, the force is a numerical value of the curing stress, the specific formula is that sigma = E epsilon,
sigma-stress of the test;
e-the elastic modulus of the organic glass is 6.9Gpa;
ε -curing strain value.
The calculated stress versus practice for strain at each time is shown in figure 2.
Example 2:
the test procedure was as in example 1, in which the temperature of the ultraviolet protection incubator 1 was 40 ℃, and the stress-time relationship curve after calculation of the strain at each time is shown in fig. 3.
Example 3:
the test procedure was carried out as in example 1, in which the temperature of the ultraviolet protection incubator 1 was 60 ℃, and the stress-time relationship curve after calculation of the strain at each time is shown in fig. 4.
Claims (8)
1. The utility model provides a structural adhesive solidification stress testing arrangement which characterized in that: comprises an ultraviolet protection heat preservation box (1), a strain amplifier (9) and a data acquisition instrument (10) which are arranged outside the ultraviolet protection heat preservation box (1), and an ultraviolet lamp (6), a strain gauge (7), a transparent organic glass sheet (5) and a curing platform (3) which are arranged in the ultraviolet protection heat preservation box (1);
the shape and size of the upper end face of the curing platform (3) are the same as those of the actual adhesive structural adhesive (4), and a plurality of support columns (11) are arranged at the edge of the upper end of the curing platform (3); the curing platform (3) is provided with a glue injection hole (12);
the ultraviolet lamp (6) is arranged at the upper end of the strain gauge (7);
the strain gauge (7) is arranged at the upper end of the transparent organic glass sheet (5), the transparent organic glass sheet (5) is arranged at the upper end of the curing platform (3) through a strut (11) of the curing platform (3), and the structural adhesive (4) is arranged in a gap formed by the transparent organic glass sheet (5) and the curing platform (3);
the strain gauge (7) is connected with a strain amplifier (9) through a data cable (8), and the strain amplifier (9) is connected with a data acquisition instrument (10) through the data cable (8).
2. The structural adhesive curing stress testing device of claim 1, wherein: an object stage (2) is also arranged below the curing platform (3).
3. The structural adhesive curing stress testing device of claim 1 or 2, wherein: the glue injection hole (12) is arranged at the center of the curing platform (3).
4. The structural adhesive curing stress testing device of claim 3, wherein: the strain gauge (7) is arranged in the center of the transparent organic glass sheet (5).
5. The structural adhesive curing stress testing device of claim 4, wherein: the strain gauge (7) is adhered to the center of the transparent organic glass sheet (5) by using epoxy glue, and the transparent organic glass sheet (5) is adhered to the upper end of the curing platform (3) by using silicon rubber.
6. The method for testing the curing stress of the structural adhesive based on the device of any one of claims 1 to 5, is characterized by comprising the following steps:
1) Selecting a curing platform (3) and a strain gauge (7), wherein the shape and the size of the upper end surface of the curing platform (3) are the same as those of the actual adhesive structural glue (4);
2) Pasting the strain gauge (7) on the transparent organic glass sheet (5);
3) Bonding a transparent organic glass sheet (5) with a support (11) at the upper end of a curing platform (3);
4) Injecting the structural adhesive (4) from an adhesive injection hole (12) of the curing platform (3), filling a gap formed by the transparent organic glass sheet (5) and the curing platform (3), and scraping redundant adhesive solution;
5) Placing the curing platform (3) in an ultraviolet protection incubator (1);
6) Connecting the strain gauge (7) with a strain amplifier (9), and connecting the strain amplifier (9) with a data acquisition instrument (10);
7) Opening the strain amplifier (9) and the data acquisition instrument (10), starting the ultraviolet lamp (6), setting the temperature of the ultraviolet protection incubator (1), and measuring a curing strain value;
8) Stopping data acquisition after the strain measurement data is unchanged, and storing the measured data to obtain the curing strain values of the structural adhesive (4) at different moments;
9) According to the strain of the transparent organic glass sheet (5) and the elastic modulus of the organic glass, the magnitude of the acting force of the structural adhesive on the transparent organic glass sheet (5) in the curing process is calculated by adopting a Hooke's law calculation formula, the acting force is a numerical value of the curing stress, the specific formula is that sigma = Eepsilon,
wherein: sigma-stress of the test;
e-the elastic modulus of the organic glass is 6.9Gpa;
ε -curing strain value.
7. The method for testing the curing stress of structural adhesives according to claim 6, wherein: the clearance formed by the transparent organic glass sheet (5) and the curing platform (3) is 0.15-0.2mm.
8. The method for testing the curing stress of structural adhesives according to claim 6 or 7, wherein: and injecting the structural adhesive (4) from the adhesive injection hole (12) of the curing platform (3) by using an injector.
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| CN109000837B (en) * | 2018-05-09 | 2021-03-23 | 中南大学 | Method for monitoring interface stress between hot-press curing composite material part and mould |
| CN109766623B (en) * | 2019-01-04 | 2023-04-07 | 大连理工大学 | Disc type strain multiplier for amplifying surface strain of mechanical part under multi-axis load in real time and design method |
| CN113861906A (en) * | 2021-08-31 | 2021-12-31 | 山西省交通科技研发有限公司 | Intelligent core layer type structural adhesive for tracking and monitoring reinforcing performance of bridge structure |
| CN114993197B (en) * | 2022-06-20 | 2023-04-18 | 北京理工大学 | Curing stress measuring system, curing stress measuring method, device and equipment |
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