CN107083192A - A kind of preparation method of alumina polishing solution - Google Patents
A kind of preparation method of alumina polishing solution Download PDFInfo
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- CN107083192A CN107083192A CN201710250356.4A CN201710250356A CN107083192A CN 107083192 A CN107083192 A CN 107083192A CN 201710250356 A CN201710250356 A CN 201710250356A CN 107083192 A CN107083192 A CN 107083192A
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- percentage
- weight
- alumina
- polishing solution
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention discloses a kind of preparation method of alumina polishing solution, comprises the following steps：S1, by percentage by weight for 0.2% KOH solids add deionized water in, be stirred dissolving；S2, by be by weight percentage 0.4% polypropylene sodium and percentage by weight be 0.2% dispersant be dissolved in S2 aqueous slkali, by ultrasound disperseed；S3, the alumina powder of percentage by weight 10% added in the aqueous solution in S2, be stirred using stirring rod, obtain the alumina polishing solution.The alumina polishing solution is fast to sapphire polishing speed, and the surface quality of sapphire height obtained after having thrown.
Description
Technical field
The present invention relates to the technical field of polishing, more particularly to a kind of alumina polishing solution.
Background technology
Alumina polishing solution is primarily directed to large scale integrated circuit, light emitting diode (LED) Sapphire Substrate and hand
The polishing of the sapphire cover plate such as machine, wrist-watch, because the hardness of alumina powder is big, easily to Sapphire Substrate or lid during polishing
Plate causes to scratch so that the yield of Sapphire Substrate or cover plate declines.
The content of the invention
It is an object of the invention to provide a kind of alumina polishing solution, one in above-mentioned prior art problem is solved or many
It is individual.
The present invention provides a kind of preparation method of alumina polishing solution, comprises the following steps：
S1, by percentage by weight for 0.2% KOH solids add deionized water in, be stirred dissolving；
S2, by be by weight percentage 0.4% polypropylene sodium and percentage by weight be 0.2% dispersant be dissolved in S2's
In aqueous slkali, disperseed by ultrasound；
S3, the alumina powder of percentage by weight 10% added in the aqueous solution in S2, is stirred using stirring rod,
Obtain the alumina polishing solution.
In some embodiments, dispersant is the one or more in xanthans, silicon mosanom or CMC.It is selected
Dispersant be preferred, its dispersion effect is good, alumina powder in dispersant can 48h do not settle, settle, also may be used after 48h
It is set to be uniformly dispersed by rocking.
In some embodiments, the particle diameter of alumina powder is 3 microns.Particle diameter be preferred particle diameter, too small particle diameter,
Its polishing speed is slow, and excessive particle diameter also easily causes to scratch to Sapphire Substrate.
Embodiment
Following case study on implementation, the present invention is described in more detail.
Case study on implementation 1：
S1, by percentage by weight for 0.2% KOH solids add deionized water in, be stirred dissolving；
S2, by be by weight percentage 0.4% polypropylene sodium and percentage by weight be 0.2% xanthans be dissolved in S2's
In aqueous slkali, disperseed by ultrasound；
S3, by percentage by weight 10%, particle diameter is added in the aqueous solution in S2 for 3 microns of alumina powder, using stirring
Mix rod to be stirred, obtain the alumina polishing solution.
Case study on implementation 2：
S1, by percentage by weight for 0.2% KOH solids add deionized water in, be stirred dissolving；
S2, by be by weight percentage 0.4% polypropylene sodium and percentage by weight be 0.2% CMC be dissolved in S2 alkali
In solution, disperseed by ultrasound；
S3, by percentage by weight 10%, particle diameter is added in the aqueous solution in S2 for 3 microns of alumina powder, using stirring
Mix rod to be stirred, obtain the alumina polishing solution.
Case study on implementation 3：
S1, by percentage by weight for 0.2% KOH solids add deionized water in, be stirred dissolving；
S2, by be by weight percentage 0.4% polypropylene sodium and percentage by weight be 0.2% silicon mosanom be dissolved in S2
Aqueous slkali in, by ultrasound disperseed；
S3, by percentage by weight 10%, particle diameter is added in the aqueous solution in S2 for 3 microns of alumina powder, using stirring
Mix rod to be stirred, obtain the alumina polishing solution.
Performance test：Polishing experiments condition is to be carried out using the model polishing machines of Mecatech 334 of French PR ESI companies
Polishing experiment, polishing workpiece be C- to sapphire substrate, polish pressure is 2.80DaN, and lower wall rotating speed is 90RPM, upper disk rotating speed
For 60RPM, polishing flow quantity is 20ml/min, from the type polishing pads of Suba 600, and its surface is polyurethane material.
Table one：Under the same conditions, the alumina polishing solution in embodiment is polished experiment respectively, 3 is thrown altogether
Car, per car 2 hours, polishing speed such as following table
The embodiment that the present invention is provided, the alumina polishing solution is fast to sapphire polishing speed, and obtains after having thrown
Surface quality of sapphire it is high.
Presented above is only the preferred embodiment of the present invention, it is noted that to those skilled in the art, not
On the premise of departing from the invention design, various modifications and improvements can be made, these also should be regarded as the protection model of invention
Within enclosing.
Claims (3)
1. a kind of preparation method of alumina polishing solution, it is characterised in that comprise the following steps：
S1, by percentage by weight for 0.2% KOH solids add deionized water in, be stirred dissolving；
S2, by be by weight percentage 0.4% polypropylene sodium and percentage by weight be 0.2% dispersant be dissolved in S1 alkali soluble
In liquid, disperseed by ultrasound；
S3, the alumina powder of percentage by weight 10% added in the aqueous solution in S2, be stirred, obtained using stirring rod
The alumina polishing solution.
2. the preparation method of a kind of alumina polishing solution according to claim 1, it is characterised in that the dispersant is Huang
One or more in virgin rubber, silicon mosanom or CMC.
3. a kind of preparation method of alumina polishing solution according to claim 1, it is characterised in that the alumina powder
Particle diameter be 3 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710250356.4A CN107083192A (en) | 2017-04-17 | 2017-04-17 | A kind of preparation method of alumina polishing solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710250356.4A CN107083192A (en) | 2017-04-17 | 2017-04-17 | A kind of preparation method of alumina polishing solution |
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| Publication Number | Publication Date |
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| CN107083192A true CN107083192A (en) | 2017-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710250356.4A Pending CN107083192A (en) | 2017-04-17 | 2017-04-17 | A kind of preparation method of alumina polishing solution |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336218A (en) * | 2018-01-29 | 2018-07-27 | 长安大学 | A kind of road piezo-electricity composite material and preparation method thereof |
| CN110229618A (en) * | 2019-07-09 | 2019-09-13 | 河北宇天昊远纳米材料有限公司 | A kind of zirconium oxide polishing fluid |
| CN110283533A (en) * | 2019-07-09 | 2019-09-27 | 河北宇天昊远纳米材料有限公司 | A kind of alumina polishing solution |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101016439A (en) * | 2007-02-06 | 2007-08-15 | 中国科学院上海微***与信息技术研究所 | Chemical mechanical polishing pulp for sapphire substrate underlay |
| CN103881586A (en) * | 2014-04-18 | 2014-06-25 | 苏州纳迪微电子有限公司 | Preparation method of sapphire polishing solution |
| CN104559796A (en) * | 2013-10-14 | 2015-04-29 | 天津西美半导体材料有限公司 | Preparation method of surface modification aluminium oxide polishing solution applied to ultra-hard surfaces |
| CN104559798A (en) * | 2014-12-24 | 2015-04-29 | 上海新安纳电子科技有限公司 | Alumina-based chemical mechanical polishing slurry |
| CN105038605A (en) * | 2015-06-16 | 2015-11-11 | 东莞市中微纳米科技有限公司 | Sapphire coarse grinding fluid |
| CN105950021A (en) * | 2016-07-19 | 2016-09-21 | 苏州溶煋新材料科技有限公司 | Aluminum oxide base polishing solution for sapphire substrate polishing and preparation method thereof |
| CN106010297A (en) * | 2016-06-20 | 2016-10-12 | 上海新安纳电子科技有限公司 | Preparation method of aluminum oxide polishing solution |
-
2017
- 2017-04-17 CN CN201710250356.4A patent/CN107083192A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101016439A (en) * | 2007-02-06 | 2007-08-15 | 中国科学院上海微***与信息技术研究所 | Chemical mechanical polishing pulp for sapphire substrate underlay |
| CN104559796A (en) * | 2013-10-14 | 2015-04-29 | 天津西美半导体材料有限公司 | Preparation method of surface modification aluminium oxide polishing solution applied to ultra-hard surfaces |
| CN103881586A (en) * | 2014-04-18 | 2014-06-25 | 苏州纳迪微电子有限公司 | Preparation method of sapphire polishing solution |
| CN104559798A (en) * | 2014-12-24 | 2015-04-29 | 上海新安纳电子科技有限公司 | Alumina-based chemical mechanical polishing slurry |
| CN105038605A (en) * | 2015-06-16 | 2015-11-11 | 东莞市中微纳米科技有限公司 | Sapphire coarse grinding fluid |
| CN106010297A (en) * | 2016-06-20 | 2016-10-12 | 上海新安纳电子科技有限公司 | Preparation method of aluminum oxide polishing solution |
| CN105950021A (en) * | 2016-07-19 | 2016-09-21 | 苏州溶煋新材料科技有限公司 | Aluminum oxide base polishing solution for sapphire substrate polishing and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336218A (en) * | 2018-01-29 | 2018-07-27 | 长安大学 | A kind of road piezo-electricity composite material and preparation method thereof |
| CN108336218B (en) * | 2018-01-29 | 2021-12-07 | 长安大学 | Piezoelectric composite material for road and preparation method thereof |
| CN110229618A (en) * | 2019-07-09 | 2019-09-13 | 河北宇天昊远纳米材料有限公司 | A kind of zirconium oxide polishing fluid |
| CN110283533A (en) * | 2019-07-09 | 2019-09-27 | 河北宇天昊远纳米材料有限公司 | A kind of alumina polishing solution |
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Application publication date: 20170822 |