CN107069261A - Ultra-fine spacing integrated circuit connector - Google Patents
Ultra-fine spacing integrated circuit connector Download PDFInfo
- Publication number
- CN107069261A CN107069261A CN201710373874.5A CN201710373874A CN107069261A CN 107069261 A CN107069261 A CN 107069261A CN 201710373874 A CN201710373874 A CN 201710373874A CN 107069261 A CN107069261 A CN 107069261A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- connector
- ultra
- fine spacing
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a kind of ultra-fine spacing integrated circuit connector, including printed circuit board, connector and surface-mounted integrated circuit, printed circuit board, connector, surface-mounted integrated circuit by sequentially stacking from bottom to up, and connector realizes that the compression between surface-mounted integrated circuit pin and printed circuit board copper pad contacts conducting by applying fixed compression ratio.The reliability of surface-mounted integrated circuit and printed circuit board conductive interconnection under the conditions of thin space can be realized using technical scheme, reduce the package dimension of IC chip, the manufacturing cost that thin space integrated circuit can be replaced to flow packaging technology, reduction assembly cost and IC chip again, in addition to the cost of connector is greatly reduced, overall cost can also be greatly reduced.
Description
Technical field
Package technique is interconnected the present invention relates to microelectronics Packaging and surface, more particularly to a kind of ultra-fine spacing integrated circuit connects
Connect device, including printed circuit board, connector and surface-mounted integrated circuit.
Background technology
At present, the interconnection such as integrated circuit and circuit board is all to use Reflow Solder Technology, and tin cream was first both passed through mould printing
Onto the copper pad of printed circuit board；Then, integrated circuit is placed with tin cream by chip mounter；Finally, by flowing again
Scolding tin is melted in weldering, realizes that the conducting of circuit board and integrated circuit is connected.
However, the development trend of raising and the miniaturization with the performance of integrated circuit, and mobile communication equipment are small
Type development trend so that the pin of integrated circuit becomes more and more, pin spacing becomes less and less, and assembling also becomes close
Degree more and more higher, technology difficulty also become increasing, have been even up to interconnection manufacture and the limit of technique.
In the prior art, thin space refers to that the distance values of conductive layer and insulating barrier PH are：0.25mm, 0.18mm, 0.10mm,
0.05mm, 0.03mm etc., and the current limit pin spacing of integrated circuit is approximately 0.3mm, the printing of tin cream, chip be placed with
And it is difficult to complete in packaging technology that last flowing again, which is all, and often there is the defective workmanship in each stage, such as paste solder printing
Collapse, print it is imperfect, draw point and soldering paste it is too thin；In attachment and Reflow process the problems such as rosin joint, tin sweat(ing) and bridge joint failure.This
A little technological problemses can all cause the rise of hazard rate and the rise of manufacturing cost.
The content of the invention
For above-mentioned the deficiencies in the prior art, present invention solves the technical problem that be how to solve printed circuit board with it is integrated
The integrity problem of circuit board conductive interconnection under the conditions of thin space.
In order to solve the above technical problems, the technical scheme that the present invention is provided is a kind of ultra-fine spacing integrated circuit connector,
Including printed circuit board, connector and surface-mounted integrated circuit, the printed circuit board, connector, surface-mounted integrated circuit are by from bottom to up
Order is stacked, and the connector realizes the surface-mounted integrated circuit pin and the printed circuit board by applying fixed compression ratio
Compression contact conducting between copper pad.
The connector realizes that compression contact conduction mode is divided into card pressure or reflow welding by applying fixed compression ratio.
As a further improvement on the present invention, described card pressure is by being realized with pedestal connector and press box.Institute
State the inner side with pedestal connector and carry projection, can more stably limit compression ratio with the press box card press-fit, realize
The surface-mounted integrated circuit pin is conductively connected with the relatively reliable of the printed circuit board copper pad, while using more
It is simple and convenient.
The connector is flexible elastic conduction rubber, and its profile depends on being elastically compressed being connected to printed circuit board
Structure, can be overall back-shaped structure or monolithic isolating construction, can correspond to realize the top with surface-mounted integrated circuit, side,
Bottom is conductively connected.
As a further improvement on the present invention, the connector outer can also be plus insulation boundary layer, to ensure electric conductivity more
Plus it is reliable.
As a further improvement on the present invention, to be that conductive rubber is alternate with insulating barrier be superimposed accumulation and form PH the connector
Spacing, forms longitudinal direction conducting.
As a further improvement on the present invention, it is the radiating effect and function of raising integrated circuit board chip, in the print
Silica gel bed course is set between circuit board processed and the surface-mounted integrated circuit.
By the connector realize with the printed circuit board copper pad be conductively connected in addition to the surface-mounted integrated circuit,
It can also be elastomer connector, flexible PCB, hot sealing Elecrical connector.
Surface-mounted integrated circuit and the printed circuit board conduction under the conditions of thin space can be realized using technical scheme
The reliability of interconnection, reduces the package dimension of IC chip, can flow packaging technology, reduction again instead of thin space integrated circuit
The manufacturing cost of assembly cost and IC chip, in addition to the cost of connector is greatly reduced, overall cost can also significantly drop
It is low.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is the ultra-fine spacing integrated circuit connector structural representation of clamp-press type；
Fig. 3 is the band ultra-fine spacing integrated circuit connector structural representation of pedestal clamp-press type；
The joiner structure that Fig. 4 turns on for longitudinal direction；
Fig. 5 is the joiner structure of increase insulation boundary layer.
Embodiment
Below in conjunction with drawings and examples, the present invention is further illustrated, but is not limitation of the invention.
Fig. 1 shows schematic structural view of the invention, a kind of ultra-fine spacing integrated circuit connector, including printed circuit board 1,
Connector 2 and surface-mounted integrated circuit 3, the printed circuit board 1, connector 2, surface-mounted integrated circuit 3 by sequentially stacking from bottom to up, institute
The compressive deformation of connector 2 is stated to realize the reliable conductive of the pin of surface-mounted integrated circuit 3 and the copper pad of printed circuit board 1
Connection.
Embodiment 1：
Fig. 2 shows a kind of ultra-fine spacing integrated circuit connector of use clamp-press type conducting, including printed circuit board 1, connection
Device 2, surface-mounted integrated circuit 3 and press box 4, the printed circuit board 1, connector 2, surface-mounted integrated circuit 3 and press box 4 are by suitable from bottom to up
Sequence is stacked, and the compressive deformation of connector 2 is so as to realize the pin of surface-mounted integrated circuit 3 and the copper pad of printed circuit board 1
Reliable conductive connection.
Embodiment 2：
Fig. 3 shows another using the ultra-fine spacing integrated circuit connector turned on pedestal clamp-press type, including printed circuit
The difference of plate 1, connector 2, surface-mounted integrated circuit 3 and press box 4, embodiment 2 and example 1 is exactly that the connector 2 carries pedestal, its
Inner side can more stably limit compression ratio with projection and the card press-fit of the outer of press box 4, realize the integrated circuit
The pin of plate 3 is conductively connected with the relatively reliable of the copper pad of printed circuit board 1, while using simpler and just
It is prompt.
Fig. 4 shows the joiner structure of longitudinal direction conducting, black conductive rubber layer and white insulating barrier, and superposition accumulation is formed
PH spacing, forms longitudinal direction conducting.Black conductive rubber layer is formed by addition silica gel technical recipe, with superconduction low resistive energy,
For nanoscale metal material.
Fig. 5 shows the joiner structure of increase insulation boundary layer, can reach the conducting of protection connection integrated circuit board chip
Effect.
It can realize that surface-mounted integrated circuit is interconnected with printed circuit board under the conditions of thin space using technical scheme
Reliability, reduce the package dimension of IC chip, packaging technology, reduction are flowed instead of thin space integrated circuit be again assembled into
Originally with the manufacturing cost of IC chip, in addition to the cost of connector is greatly reduced, overall cost can also be greatly reduced.
Embodiments of the present invention are made that with detailed description above in association with drawings and examples, but the present invention is not limited to
Described embodiment.To those skilled in the art, without departing from the principles and spirit of the present invention, it is right
These embodiments carry out various change, modification, replacement and modification and still fallen within protection scope of the present invention.
Claims (10)
1. a kind of ultra-fine spacing integrated circuit connector, including printed circuit board（1）, surface-mounted integrated circuit（3）, the printed circuit
Plate（1）, surface-mounted integrated circuit（3）By sequentially stacking from bottom to up, it is characterised in that：Also include being placed on the printed circuit board（1）、
Surface-mounted integrated circuit（3）Between connector（2）, the connector（2）The integrated electricity is realized by applying fixed compression ratio
Road plate（3）Pin and the printed circuit board（1）Compression contact conducting between copper pad.
2. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）Pass through
Apply fixed compression ratio and realize that compression contact conduction mode is pressed for card.
3. ultra-fine spacing integrated circuit connector according to claim 2, it is characterised in that：The connector（2）Carry
Pedestal, its inner side carries projection.
4. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）Pass through
Apply fixed compression ratio and realize that compression contact conduction mode is reflow welding.
5. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）To be soft
Property elastic conduction rubber, be overall back-shaped structure.
6. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）To be soft
The elastic conduction rubber of property, is monolithic isolating construction.
7. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）Outer
Can also be plus insulation boundary layer.
8. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）To lead
Electric rubber is alternate with insulating barrier to be superimposed accumulation and forms PH spacing, forms longitudinal direction conducting.
9. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：It is additionally included in the printing electricity
Road plate（1）And the surface-mounted integrated circuit（3）Between the silica gel bed course that sets.
10. the ultra-fine spacing integrated circuit connector according to any one of claim 1 to 9, it is characterised in that：By described
Connector（2）Realize and the printed circuit board（1）What copper pad was conductively connected removes the surface-mounted integrated circuit（3）Outside, can be with
It is elastomer connector, flexible PCB, hot sealing Elecrical connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373874.5A CN107069261A (en) | 2017-05-24 | 2017-05-24 | Ultra-fine spacing integrated circuit connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373874.5A CN107069261A (en) | 2017-05-24 | 2017-05-24 | Ultra-fine spacing integrated circuit connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107069261A true CN107069261A (en) | 2017-08-18 |
Family
ID=59609854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710373874.5A Pending CN107069261A (en) | 2017-05-24 | 2017-05-24 | Ultra-fine spacing integrated circuit connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107069261A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104035A (en) * | 1992-09-24 | 1994-04-15 | Japan Aviation Electron Ind Ltd | Connector for electric onnection |
| CN1571074A (en) * | 2004-05-11 | 2005-01-26 | 番禺得意精密电子工业有限公司 | Conductive rubber and electronic component using same |
| CN2904339Y (en) * | 2006-02-06 | 2007-05-23 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN101310416A (en) * | 2006-01-26 | 2008-11-19 | 松下电工株式会社 | Board-to-board connector |
| CN202308344U (en) * | 2011-10-22 | 2012-07-04 | 厦门松德电子有限公司 | Environment-friendly conductive rubber connector |
| CN206931732U (en) * | 2017-05-24 | 2018-01-26 | 桂林恒昌电子科技有限公司 | Ultra-fine spacing integrated circuit connector |
-
2017
- 2017-05-24 CN CN201710373874.5A patent/CN107069261A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104035A (en) * | 1992-09-24 | 1994-04-15 | Japan Aviation Electron Ind Ltd | Connector for electric onnection |
| CN1571074A (en) * | 2004-05-11 | 2005-01-26 | 番禺得意精密电子工业有限公司 | Conductive rubber and electronic component using same |
| CN101310416A (en) * | 2006-01-26 | 2008-11-19 | 松下电工株式会社 | Board-to-board connector |
| CN2904339Y (en) * | 2006-02-06 | 2007-05-23 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN202308344U (en) * | 2011-10-22 | 2012-07-04 | 厦门松德电子有限公司 | Environment-friendly conductive rubber connector |
| CN206931732U (en) * | 2017-05-24 | 2018-01-26 | 桂林恒昌电子科技有限公司 | Ultra-fine spacing integrated circuit connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101009269B (en) | Semiconductor device and manufacturing method thereof | |
| EP2533617B1 (en) | Printed circuit board with chip package component | |
| CN101682133A (en) | Connector for interconnecting surface-mount devices and circuit substrates | |
| JP2006261565A (en) | Electronic functional component mounted body and its manufacturing method | |
| CN206931732U (en) | Ultra-fine spacing integrated circuit connector | |
| US7439625B2 (en) | Circuit board | |
| CN107069261A (en) | Ultra-fine spacing integrated circuit connector | |
| CN107017471A (en) | A kind of method that ultra-fine spacing connects integrated circuit | |
| US7040903B2 (en) | Method of connecting a contact with a solder and an electronic device using the method | |
| KR101698431B1 (en) | Semiconductor power module pakage and methods of fabricating the same | |
| CN212907709U (en) | Diode device structure | |
| JP6380244B2 (en) | Semiconductor device, power converter | |
| CN101112137A (en) | Connection component, multilayer substrate | |
| JP4699089B2 (en) | Chip-on-film semiconductor device | |
| US11259414B2 (en) | Flex on board anisotropic conductive adhesive interconnection | |
| KR101951732B1 (en) | Conductive contactor for substrate surface mount and preparing method for the same | |
| CN101217853B (en) | A welding method of chip pin and metal terminals | |
| US20060263934A1 (en) | Chip-type micro-connector and method of packaging the same | |
| CN2884613Y (en) | Electrical connector | |
| CN204303804U (en) | Detachably, assemblnig overlapping structure for semiconductor encapsulation body | |
| CN104066271A (en) | Printed circuit board and method for configuring integrated-circuit package element on circuit board | |
| CN204011406U (en) | Semiconductor device and the application plate that has carried semiconductor device and electronic unit | |
| KR102651162B1 (en) | Elastic and electric contact terminal and Structure for mounting the same | |
| CN219372674U (en) | Bonding pad for electronic element, circuit board assembly and electronic equipment | |
| CN219371421U (en) | Large current-carrying board-to-board power connector capable of meeting PIP and compression joint process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170818 |