CN107067442A - A kind of infrared scaling board synchronous with visible ray dual camera - Google Patents
A kind of infrared scaling board synchronous with visible ray dual camera Download PDFInfo
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- CN107067442A CN107067442A CN201710424493.5A CN201710424493A CN107067442A CN 107067442 A CN107067442 A CN 107067442A CN 201710424493 A CN201710424493 A CN 201710424493A CN 107067442 A CN107067442 A CN 107067442A
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- panel
- bottom plate
- scaling board
- infrared
- visible ray
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- 230000009977 dual effect Effects 0.000 title claims description 13
- 230000001360 synchronised effect Effects 0.000 title abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 48
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000005057 refrigeration Methods 0.000 claims description 8
- 241001292396 Cirrhitidae Species 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 238000012937 correction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- 239000006244 Medium Thermal Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10048—Infrared image
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Radiation Pyrometers (AREA)
Abstract
The invention discloses a kind of for infrared camera and the scaling board of the synchronous demarcation of visible image capturing head, the scaling board is by panel, heat conductive pad, cooling piece, conduction cooling pad, bottom plate, power supply, fixed screw, saddle covers heat bridge composition, scaling board uses panel, the design of bottom plate double-decker, upper strata panel temperature is relatively warm and outward appearance is white, lower floor's baseplate temp is relatively low and color is black, the panel of scaling board is according to the C＆T information that bottom plate is spilt after demarcation pattern hollow out, infrared camera and visible image capturing head can photograph identical demarcation pattern according to the C＆T difference between panel and bottom plate, calibration software is coordinated to realize the synchronous demarcation of infrared camera and visible image capturing head, in system available for infrared and visible ray use processing.
Description
Technical field
It is more particularly to a kind of simultaneously suitable for infrared camera and visible image capturing head the present invention relates to a kind of scaling board
The scaling board of demarcation, belongs to camera calibration field.
Background technology
Infrared image is with having visible image capturing head and infrared camera in visual image fusion system, they are gathered respectively
Visible images and infrared image.Because two camera inner parameters are inconsistent and installation site is inconsistent etc. it is many because
Element, causes their acquired image visual field size and location disunities.Image fusion system wants to realize a variety of band images
Fusion, it is necessary first to distortion correction and spatial registration are carried out to two kinds of images after collection, to eliminate the distortion of each camera
And image is spatially mutually aligned unanimously.The correction of the image of infrared and visible image capturing head and registration have a variety of methods,
Fairly simple method is to use to be similar to the demarcation solution that ordinary stereo calibration principle is realized.
In common binocular stereo calibration method by the graphic-print for having particular law on scaling board, to be calibrated two take the photograph
Picture head gathers same scaling board and its surrounding image, and then calibrating procedure searches for mark in the image that two width cameras are got
Position and size in image coordinate system residing for fixed board pattern, and by with being calculated after the contrast of the actual physical size of scaling board
The parameters such as focal length, zoom ratio and the distortion degree of each camera, while the relative position letter between two cameras can also be obtained
Breath.The distortion correction and space that two different camera acquired images can be just realized using parameter obtained by calibrating are matched somebody with somebody
It is accurate.Scaling board image is typically printed on hard plate material or ceramic material, and the relative position so demarcated between plate pattern is not
Can be because phenomenon deformation be expanded with heat and contract with cold, so as to ensure the precision of demarcation.
But in infrared camera and visible image capturing leader are fixed, due to scaling board figure of the infrared camera to printing type
Case（Especially middle Long Wave Infrared Probe）It is insensitive, therefore visible image capturing head can not be realized and infrared using common scaling board
The synchronous demarcation of camera.Existing infrared camera method uses circular steel ball and the realization of high-precision three-dimensional posture instrument, this method
Cost is higher and demarcation flow is complicated.Infrared camera and visible image capturing leader fixed board product currently without shaping can be real
The high efficiency of existing infrared camera and visible image capturing head is synchronously demarcated.The scaling board cost of general user's autonomous Design is higher,
And demarcation effect is bad.
The content of the invention
In order to solve above mentioned problem present in background technology, the present invention devises the demarcation of infrared and visible ray two waveband
Plate, can realize infrared camera and the synchronous demarcation of visible image capturing head, place is merged with infrared image available for visible images
In the system of reason.
To achieve these goals, concrete technical scheme of the invention is as follows：
It is a kind of infrared with visible ray dual camera scaling board including panel, heat conductive pad, cooling piece, conduction cooling pad, bottom plate, power supply, solid
Determine screw, saddle and cover heat bridge, panel is arranged on above bottom plate, polylith cooling piece is provided between panel and bottom plate, cooling piece leads to
Cross conduction cooling pad to be connected with bottom plate, cooling piece is connected by heat conductive pad with panel, the power supply is connected with cooling piece, set on bottom plate
There are multiple saddle to cover heat bridge, fixed between panel and bottom plate, between cooling piece and panel, bottom plate by fixed screw；Panel
Appearance color is white, and bottom plate appearance color is black, and panel temperature is higher than on baseplate temp, panel to be represented in hollow out mode
The pattern of scaling board.
Further, using the circular array of hollow out and the square border pattern of corner cut as the pattern of scaling board on the panel,
Each the spacing between small diameter of a circle and the center of circle is determined, jagged on square border.
Further, on the panel it is connected between circular array patterning and outside by land bridge.
Further, the cooling piece is semiconductor chilling plate, and polylith semiconductor chilling plate is separately mounted to panel and bottom plate
Between multiple different orientation, the refrigeration face of cooling piece is connected by conduction cooling pad with bottom plate side, and the radiating surface of cooling piece passes through
Heat conductive pad is connected with panel side.
Further, the appearance color of the panel and bottom plate is realized by different coating, the temperature of panel and bottom plate
Realized and controlled using semiconductor chilling plate.
Further, it is four that the saddle, which covers heat bridge, and the color that saddle covers heat bridge is black.
Further, the panel and bottom plate are made by alloy material, to increase the temperature diffusion of refrigerated medium thermal source.
Further, the power supply is constant voltage/current isolator, unified power supply mode or independence after multi-disc refrigeration piece collection is in parallel
Adjust power supply mode.
Further, the pattern of the scaling board can pass through the demarcation in Halcon softwares by Halcon software Direct Recognitions
Function realizes demarcation.The recognizer for voluntarily writing circular array feature is needed to find out two demarcation if using OpenCV softwares
Character pair point in plate could realize demarcation to after.
The present invention compared with prior art, with advantages below：
（1）The synchronous demarcation of infrared camera and visible image capturing head can be realized, makes simple and demarcation efficiency is higher.
（2）Designed using double-layer metal plate cold and hot surface, the temperature distribution of scaling board, cost are realized using semiconductor chilling plate
It is relatively low and effect is obvious.
Brief description of the drawings
Fig. 1 is the overall structure figure of the present invention；
Fig. 2 is the panel size figure of the present invention；
Fig. 3 is cooling piece scheme of installation in the present invention；
Fig. 4 is cooling piece electrical schematic in the present invention；
Description of reference numerals：1- panels, 2- heat conductive pads, 3- cooling pieces, 4- conduction cooling pads, 5- bottom plates, 6- power supplys, 7- fixed screws,
8- saddle covers heat bridge.
Embodiment
Below with reference to accompanying drawing, technical scheme is described further：
Embodiment 1
It is made up of as shown in figure 1, one kind of the present invention is infrared with visible ray dual camera scaling board following components：Face
Plate 1, heat conductive pad 2, cooling piece 3, conduction cooling pad 4, bottom plate 5, power supply 6, fixed screw 7, saddle cover heat bridge 8, and panel 1 is arranged on bottom plate
5 tops, are provided with polylith cooling piece 3, cooling piece 3 is connected by conduction cooling pad 4 with bottom plate 5, cooling piece 3 between panel 1 and bottom plate 5
It is connected by heat conductive pad 2 with panel 1, the power supply 6 is connected with cooling piece 3, multiple saddle is provided with bottom plate 5 and cover heat bridge 8, face
Fixed between plate 1 and bottom plate 5, between cooling piece 3 and panel 1, bottom plate 5 by fixed screw 7；The appearance color of panel 1 is white
Color, the appearance color of bottom plate 5 is black, and the temperature of panel 1 is higher than on the temperature of bottom plate 5, panel 1 represents scaling board in hollow out mode
Pattern.
The realization principle of scaling board is：Scaling board uses panel 1, the design of the double-decker of bottom plate 5, the temperature of upper strata panel 1
Relatively hot and outward appearance is white, and the temperature of lower floor's bottom plate 5 is relatively low and color is to represent mark on black, panel 1 in hollow out mode
The pattern of fixed board, the C＆T information of bottom plate 5 is spilt by the part of hollow out, passes through the face between control panel 1 and bottom plate 5
The difference of color and temperature is so that infrared camera and visible image capturing head can get the calibration maps in same scaling board
Case.
Panel 1 and bottom plate 5 are made using the preferable alloy material of thermal conductivity, to realize preferable heat-transfer effect, this reality
Apply in example and to be designed using stainless steel material.
In order to ensure that infrared camera and visible image capturing head can be while recognize demarcation pattern, scaling board uses double
Rotating fields panel and different and temperature and color are combined：The temperature of panel 1 is relatively hot and outward appearance is white, the temperature of bottom plate 5
The relatively low and color of degree is black, and appearance color realizes that the temperature of panel 1 utilizes semiconductor refrigerating by using different coating
The refrigeration and heat sinking function of piece 3 realize the semiconductor chilling plate that model TEC1-12703 is used in control, the present embodiment.
The pattern of scaling board, Mei Ge little are used as using the circular array of hollow out and the square border pattern of corner cut on the panel 1
Spacing between diameter of a circle and the center of circle is determined, jagged on square border.
As shown in Fig. 2 scaling board is designed and sized to 30 × 30cm in embodiment, wherein the main part of demarcation pattern is accounted for
It is 20 × 20cm according to space.Using circular array pattern as demarcation identification icon in the panel 1 of scaling board, set every in the present embodiment
Spacing between a diameter of 1.25cm of individual roundlet, the center of circle is 2.5cm, and devises breach in the upper left corner of panel 1 with convenient
Calibrating procedure recognizes the direction of rotation of scaling board.According to the requirement of stated accuracy, the specific quantity of the circle in circular array and big
I is voluntarily set according to the accuracy requirement of demarcation, and circle number of patterns more at most stated accuracy is relatively higher, battle array in the present embodiment
Row size is 7 × 7.
It is connected between circular array patterning and outside on the panel 1 by land bridge, and plays a part of heat transfer.
But, the land bridge of four direction can destroy the rectangular shape of circular array periphery, broken in order to solve that land bridge causes to pattern
4 saddle are devised in bad problem, scaling board and cover heat bridge 8.The color that saddle covers heat bridge 8 is black as 5 bottom plates, and saddle
Heat bridge 8 is covered to be fixed on bottom plate 5 thus in low temperature.
The fixed screw 7 of penetration type is used between panel 1 and bottom plate 5, and between cooling piece 3 and panel 1, bottom plate 5
It is fixed.
The polylith semiconductor chilling plate 3 is respectively placed at multiple different orientation between panel and bottom plate, cooling piece 3
Refrigeration face is connected by bottom plate side with conduction cooling pad, and the radiating surface of cooling piece 3 is connected by panel side with heat conductive pad.
As shown in figure 3, there is polylith cooling piece 3 to be respectively placed at four different sides up and down between panel 1 and bottom plate 5
On position, so that ensure the temperature equalization of panel 1 and bottom plate 5, and mounting means is：The side of bottom plate 5 is leaned in the refrigeration face of cooling piece 3,
The radiating surface of semiconductor chilling plate 3 leans on the side of panel 1.Using heat conductive pad 2 and led successively between cooling piece 3 and panel 1, bottom plate 5
Cold pad 4 is connected, and pad can play buffering, fixed and conductive force.
Because the rated power of general semiconductor refrigerating flake products is all very big, and need not be too big during scaling board real work
Refrigeration work consumption, therefore using power supply 6 be constant voltage/current isolator power with it is convenient control and regulation cooling piece 3 power.Multi-disc
Semiconductor chilling plate 3 can take unified power supply mode or separately adjustable power supply mode after parallel connection, and former mode can be right
The power of all cooling pieces 3 carries out unified adjustment, and latter approach can individually be adjusted to the power of each cooling piece 3.
One is used after power supply mode as shown in Figure 4 disclosed in the present embodiment, the i.e. parallel connection of each two semiconductor chilling plate 3
Constant current constant voltage source 6 is powered, and the output current in constant current constant voltage source 6 can be adjusted, so as to realize two semiconductor systems to being connected
The power of cold 3 is controlled.
The pattern of the scaling board can be by Halcon software Direct Recognitions, therefore can use the mark in Halcon softwares
Determine function and be directly realized by demarcation.
Demarcated if based on OpenCV storehouses, then need voluntarily to write the feature of circular array and the square border of corner cut
Recognizer, demarcation is realized to find out after character pair point and matching double points in two scaling boards.
Claims (9)
1. a kind of infrared and visible ray dual camera scaling board, it is characterised in that including panel, heat conductive pad, cooling piece, conduction cooling
Pad, bottom plate, power supply, fixed screw, saddle cover heat bridge, and panel is arranged on above bottom plate, and polylith is provided between panel and bottom plate
Cooling piece, cooling piece is connected by conduction cooling pad with bottom plate, and cooling piece is connected by heat conductive pad with panel, the power supply and cooling piece
Connection, is provided with multiple saddle on bottom plate and covers heat bridge, by solid between panel and bottom plate, between cooling piece and panel, bottom plate
Determine screw to fix；Panel appearance color is white, and bottom plate appearance color is black, and panel temperature is higher than on baseplate temp, panel
The pattern of scaling board is represented in hollow out mode.
2. as claimed in claim 1 a kind of infrared with visible ray dual camera scaling board, it is characterised in that on the panel with
The square border pattern of the circular array and corner cut of hollow out as scaling board pattern, each between small diameter of a circle and the center of circle between
It is jagged on square border away from determination.
3. a kind of infrared and visible ray dual camera scaling board as claimed in claim 2, it is characterised in that on the panel
It is connected between circular array patterning and outside by land bridge.
4. as claimed in claim 1 a kind of infrared with visible ray dual camera scaling board, it is characterised in that the cooling piece is
Semiconductor chilling plate, polylith semiconductor chilling plate is separately mounted to multiple different orientation between panel and bottom plate, cooling piece
Refrigeration face is connected by conduction cooling pad with bottom plate side, and the radiating surface of cooling piece is connected by heat conductive pad with panel side.
5. a kind of infrared and visible ray dual camera scaling board as claimed in claim 4, it is characterised in that the panel and bottom
The appearance color of plate realizes that the temperature of panel and bottom plate realizes control using semiconductor chilling plate by different coating.
6. a kind of infrared and visible ray dual camera scaling board as claimed in claim 1, it is characterised in that the saddle
It is four to cover heat bridge, and the color that saddle covers heat bridge is black.
7. a kind of infrared and visible ray dual camera scaling board as claimed in claim 1, it is characterised in that the panel and bottom
Plate is made by alloy material.
8. a kind of infrared and visible ray dual camera scaling board as claimed in claim 1, it is characterised in that the power supply is perseverance
Press constant-current source, unified power supply mode or separately adjustable power supply mode after multi-disc refrigeration piece collection is in parallel.
9. a kind of infrared and visible ray dual camera scaling board as described in any one of claim 1 ~ 8, it is characterised in that described
The pattern of scaling board can be realized and demarcated by Halcon software Direct Recognitions by the calibration function in Halcon softwares.
Priority Applications (1)
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|---|---|---|---|
| CN201710424493.5A CN107067442B (en) | 2017-06-07 | 2017-06-07 | Infrared and visible light double-camera synchronous calibration plate |
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|---|---|---|---|
| CN201710424493.5A CN107067442B (en) | 2017-06-07 | 2017-06-07 | Infrared and visible light double-camera synchronous calibration plate |
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| CN107067442A true CN107067442A (en) | 2017-08-18 |
| CN107067442B CN107067442B (en) | 2023-08-15 |
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Cited By (8)
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| CN107884073A (en) * | 2017-10-19 | 2018-04-06 | 中车青岛四方机车车辆股份有限公司 | Gridiron pattern calibration facility |
| CN108010088A (en) * | 2017-12-18 | 2018-05-08 | 南京理工大学 | For visible ray to be stereoscopic and the multispectral scaling board and caliberating device of infrared stereoscopic vision |
| CN108335334A (en) * | 2018-04-17 | 2018-07-27 | 深圳市道通科技股份有限公司 | Caliberating device, the system and method for vehicle-mounted camera |
| CN109523496A (en) * | 2018-10-19 | 2019-03-26 | 中国航空工业集团公司洛阳电光设备研究所 | A kind of infrared low-light Channel Image fusion distortion correction target plate |
| CN110298887A (en) * | 2019-05-31 | 2019-10-01 | 中国人民解放军陆军工程大学 | Visible light infrared dual-waveband composite calibration plate |
| CN111164962A (en) * | 2018-09-26 | 2020-05-15 | 深圳市大疆创新科技有限公司 | Image processing method, device, unmanned aerial vehicle, system and storage medium |
| CN112184784A (en) * | 2020-09-27 | 2021-01-05 | 烟台艾睿光电科技有限公司 | Double-spectrum image alignment method and device, electronic equipment and storage medium |
| US12061118B2 (en) | 2018-04-17 | 2024-08-13 | Autel Intelligent Technology Corp., Ltd. | Calibration apparatus, system and method for in-vehicle camera |
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Cited By (12)
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| CN107884073A (en) * | 2017-10-19 | 2018-04-06 | 中车青岛四方机车车辆股份有限公司 | Gridiron pattern calibration facility |
| CN108010088A (en) * | 2017-12-18 | 2018-05-08 | 南京理工大学 | For visible ray to be stereoscopic and the multispectral scaling board and caliberating device of infrared stereoscopic vision |
| CN108335334A (en) * | 2018-04-17 | 2018-07-27 | 深圳市道通科技股份有限公司 | Caliberating device, the system and method for vehicle-mounted camera |
| CN108335334B (en) * | 2018-04-17 | 2024-04-26 | 深圳市道通科技股份有限公司 | Calibration device, system and method for vehicle-mounted camera |
| US12061118B2 (en) | 2018-04-17 | 2024-08-13 | Autel Intelligent Technology Corp., Ltd. | Calibration apparatus, system and method for in-vehicle camera |
| CN111164962A (en) * | 2018-09-26 | 2020-05-15 | 深圳市大疆创新科技有限公司 | Image processing method, device, unmanned aerial vehicle, system and storage medium |
| CN111164962B (en) * | 2018-09-26 | 2021-11-30 | 深圳市大疆创新科技有限公司 | Image processing method, device, unmanned aerial vehicle, system and storage medium |
| CN109523496A (en) * | 2018-10-19 | 2019-03-26 | 中国航空工业集团公司洛阳电光设备研究所 | A kind of infrared low-light Channel Image fusion distortion correction target plate |
| CN109523496B (en) * | 2018-10-19 | 2023-04-07 | 中国航空工业集团公司洛阳电光设备研究所 | Infrared shimmer binary channels image fusion distortion correction target board |
| CN110298887A (en) * | 2019-05-31 | 2019-10-01 | 中国人民解放军陆军工程大学 | Visible light infrared dual-waveband composite calibration plate |
| CN112184784A (en) * | 2020-09-27 | 2021-01-05 | 烟台艾睿光电科技有限公司 | Double-spectrum image alignment method and device, electronic equipment and storage medium |
| CN112184784B (en) * | 2020-09-27 | 2023-06-06 | 烟台艾睿光电科技有限公司 | Dual-spectrum image alignment method and device, electronic equipment and storage medium |
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