CN107041079A - A kind of conducting wire typography method based on color ink jet printed technology - Google Patents
A kind of conducting wire typography method based on color ink jet printed technology Download PDFInfo
- Publication number
- CN107041079A CN107041079A CN201710313329.7A CN201710313329A CN107041079A CN 107041079 A CN107041079 A CN 107041079A CN 201710313329 A CN201710313329 A CN 201710313329A CN 107041079 A CN107041079 A CN 107041079A
- Authority
- CN
- China
- Prior art keywords
- ink
- metal ion
- reducing agent
- conducting wire
- method based
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of conducting wire typography method based on color ink jet printed technology, belongs to the manufacturing technology field of electronic component.The substrate surface containing amido link is handled using alkaline solution so that substrate surface reaches hydrophily and amido link is occurred sufficient hydrolysis;Metal ion ink and reducing agent ink are prepared respectively;Metal ion ink and reducing agent ink are individually positioned in the different print cartridges of color inkjet printer, on the base material that the two print processing is crossed in ink-jet, printing of the printing of metal ion ink prior to reducing agent ink, complete the graphical of metal ion and metal ion is reduced into metal simple-substance, form conductive metal layer.Can rapid shaping, without last handling process, used ink is free of solid particle, is not easily blocked printer head, rapid draing can solidify at room temperature, effectively lift manufacture efficiency, its layer printed circuit board consistency prepared is high, and defect is few, surface-brightening, electrical conductivity is high, and the adhesion with organic substrate is strong.
Description
Technical field
The invention belongs to the manufacturing technology field of electronic component, it is related to one kind and prepares electronics device using in-situ reducing technology
The method of part or circuit diagram.
Background technology
The present situation in field is manufactured according to China electronic device, formed the conventional method of conducting wire mainly include etching method,
Silk screen print method, vacuum deposition method, method of spin coating etc., the above method have process complexity, processing time length, waste former material
The problems such as material, low yield, high cost.Therefore printed electronic is particularly new in the last few years by increasing people institute extensive concern
Emerging electronic equipment manufacturing industry.Printed electronics are primarily due to mainly by the making of electronic product and text pattern
Printing technology combines so that itself have increases material manufacturing technology the characteristics of, this technology realize it is frivolous, flexible, wear-resisting, light
Matter, personalized customization production and environment-friendly aspect have very big advantage so that traditional electronic equipment manufacturing mode has
New selection.
Printed electronics using inkjet printing as mode of printing are of great interest in recent years, this new skill
Art is compared with other printing modes, with certain advantage.Particularly, inkjet technology is a kind of non-contacting print
Mode processed, can be effectively protected the surface of backing material will not be destroyed in the typography of contact.While its
It is a kind of droplet forming technique, compared with the modes such as silk-screen printing, intaglio printing and the letterpress at present, is not required to
The making of printing mould is carried out before printing, the cost of die sinking is reduced.Finally, in the not high application of some required precisions
Occasion, such as antenna and electrode, common commercial ink-jet printer just can meet the requirement of size and precision, reduce technology difficult
Degree and cost.
But, it generally there are following problem using the printed electronic technique of ink-jet printing technology at present:
1st, ink is generally nanoparticle form and organometallic precursor ink, and this two kinds of ink frequently can lead to inkjet printing
Blocking and needing follow-up high-temperature heat treatment process for machine shower nozzle, not only results in the complexity of technological process and to macromolecule
The selection that base material is has very big limitation.
2nd, above-mentioned sayed ink-making process is complex, and easily reunites and decompose in preservation for a long time.
3rd, in existing terahertz wave quasi-optics, the one-step shaping of conductive pattern can not be often realized, is required to after printing
Carry out the processing of additional process.
The content of the invention
Therefore, for above-mentioned deficiency, the present invention provides a kind of mode of utilization inkjet printing by metal ion oil
Ink is printed on substrate, while using the color theory of color inkjet printer, printed while realizing reducing agent ink, and then
The method that electronic component or circuit diagram are prepared by way of metal ion in-situ reducing.
The technical scheme that the present invention is provided:
A kind of conducting wire typography method based on color ink jet printed technology, process comprises the following steps:
(1) base material treatment:The substrate surface containing amido link is handled using alkaline solution so that substrate surface reaches
To hydrophily and amido link is set to occur sufficient hydrolysis;
(2) prepared by ink:Metal ion ink is made in dissolving metal salts in solvent 1, reducing agent is dissolved in solvent 2
In be made reducing agent ink, complete the preparation of ink;
(3) printing shaping of conductive pattern:The metal ion ink and reducing agent ink of preparation are individually positioned in colored spray
In the different print cartridges of black printer, the two is printed upon on the treated base material of step (1) by ink-jet, metal ion ink
The printing prior to reducing agent ink is printed, the mistake graphical and that metal ion is reduced into metal simple-substance of metal ion is completed
Journey, forms conductive metal layer, that is, completes the preparation of metal electron device or circuit diagram.
It is preferred that, base material is selected from polyimides, PEI in step (1).Alkaline solution described in step (1) is
The NaOH aqueous solution, concentration is 3mol/L, and processing time is 30~120min, and treatment temperature is 50 DEG C.
It is preferred that, it is formalin, sodium borohydride solution, ascorbic acid solution and hypophosphorous acid that reducing agent, which is selected from, in step (2)
One or more in sodium;Metal ion is silver ion.
It is preferred that, solvent 1 is selected from one or both of water and ethanol mixture, the volume ratio of further preferred water and ethanol
For 1:10~10:1 mixture;Solvent 2 is water, and the sodium hydrate aqueous solution of formaldehyde is preferred to use during using formalin;
It is preferred that, reducing agent solute concentration is 1~10wt%;The concentration of metal ion ink is 0.5~2mol/L.
Metal ion ink and reducing agent ink need to be positioned in the print cartridge for belonging to different colours in step (3), and full
Foot is first printed and reducing agent ink is printed after metal ion ink.
Preferably, in the design of printing figures, color color matching pattern should be adjusted to CMYK patterns, and black is prohibited
With.
Preferably, the method for the present invention for preparing electronic device or circuit diagram finally can also be by annealing at
Reason program, further to increase the suppleness and service life of electronic device.
The operation principle of this method is:This technique mainly beats the self-metallization reaction principle and color jet-ink of polyimides
The toning mechanism of print machine combines, and is put into the hydrolysis process that depth is carried out in hot alkaline solution to PI films first, is formed more
Amide group, different colours ink is printed on substrate by certain priority printing order in by using color printer
This characteristic on material, by the mixing color of computer, realizes that many materials of silver ion ink and various concentrations reducing agent are beaten
Print.First the silver ion of high concentration is printed on the PI films of surface hydrolysis, there occurs that ion exchange makes silver ion knot
Close in PI film surfaces.Then reducing agent ink is printed on same position again, has realized the reduction of silver ion, form
The silver-colored simple substance conductive pattern of gloss.
By adopting the above-described technical solution, the beneficial effects of the invention are as follows:
1st, the invention is provided electronic device or circuit diagram preparation method, metal ion materials of the whole process to printing
Sufficient utilization has been carried out, cost is effectively reduced.
2nd, the method that the present invention is provided, attached by the bonding action of chemical bond between the metallic particles and substrate of substrate surface
In on substrate so that conductive metal layer has good adhesive force with substrate.
3rd, the method that the present invention is provided, without being post-processed to made sample, prints one-step shaping, during saving
Between, improve operating efficiency.
4th, it can be regulated and controled in the present invention by the color matching to design configuration, by the printing mode of color printer, to reach
To the quantitative printing of many materials, the different printings of metal ion and reducing agent ink can be reached by controlling the ratio of color
Ratio, time-saving and efficiency.
5th, the metal of printing is nano particle, and nano particle is uniform, and the metal level of gained is fine and close thin layer, electric conductivity
It is good.
Brief description of the drawings
Fig. 1 is a kind of conducting wire typography schematic flow sheet based on inkjet printing provided by the present invention;
Fig. 2 is the circuit diagram prepared on polyimides (PI) base material of the embodiment of the present invention 1;
Fig. 3 is the surface SEM shape appearance figures of the circuit diagram prepared on polyimides (PI) base material of the embodiment of the present invention 1;
Comparison diagram before and after the silver-colored pattern adhesive force that Fig. 4 is printed by the embodiment of the present invention 1 is tested.
Embodiment
Below in conjunction with the accompanying drawings and embodiment the present invention is described in further detail.But this should not be interpreted as
The scope of the above-mentioned theme of the present invention is only limitted to following embodiment, all to belong to this hair based on the technology that present invention is realized
Bright scope.
Embodiment 1:
A kind of conducting wire typography based on color ink jet printed technology, comprises the following steps:
(1) base material treatment:Kapton is flushed three times successively using absolute ethyl alcohol with deionized water respectively, by film
The impurity on surface is got rid of.Then the PI films cleaned are put into the NaOH solution that 50 DEG C of concentration is 3mol/L and soaked
Bubble.Then, treated PI films are cleaned repeatedly repeatedly with deionized water, dried after wash clean standby;
(2) prepared by ink:It is 1 with volume ratio:1 deionized water and ethanol is as solvent, and compound concentration is 1mol/L's
AgNO3As metal ion ink, reducing agent ink is mainly the alkaline solution of formaldehyde, the reducing agent ink specific formula used
For:Contain sodium hydroxide in weight/mass percentage composition 30-40wt% formalin 8.5ml, reducing agent ink per L reducing agent ink
Concentration be 7.5g/L;
(3) printing shaping of conductive pattern:AgNO prepared by step (2)3Ink and formaldehyde ink injection ME-10 types are general
In the print cartridge of logical ink-jet printer, original-pack ink therein is changed into be configured to Ag+ ink and reducing agent ink respectively, be specifically
Cyan (Cyan) print cartridge is put into AgNO3Ink, formaldehyde ink is put into the print cartridge of yellow (Yellow) or carmetta (Magenta)
In, conductive silver figure just can be made into by color jet-ink printing.
Resistivity measurement is carried out to coating with four probe method, test result is 5.56 × 10-6Ω·cm.Adhesive force test is adopted
Adhesive tape method is used, is pulled on the conductive square of printing with cross-cut tester so that uniform pressure is parallel, cuts through coating to counterdie, then with same
Method vertical direction pull, formed 1mm × 1mm grid, sticked with 3M adhesive tapes coating and with hand pressing make itself and coating
Completely attach to, then pull open rapidly, its coating does not come off a bit.
Its preparation method can be realized by color inkjet printer realizes the fast of conductive pattern on Kapton
Rapid-result type, no last handling process, used ink is metal ion type ink, without solid particle, is not easily blocked printer
Shower nozzle, can solidify, effectively lift manufacture efficiency, its layer printed circuit board consistency prepared is high, defect in rapid draing at room temperature
Few, surface-brightening, electrical conductivity is high, and the adhesion with organic substrate is strong.
The invention is not limited in foregoing embodiment.The present invention, which is expanded to, any in this manual to be disclosed
New feature or any new combination, and disclose any new method or process the step of or any new combination.
Claims (7)
1. a kind of conducting wire typography method based on color ink jet printed technology, it is characterised in that process includes as follows
Step:
(1) base material treatment:The substrate surface containing amido link is handled using alkaline solution so that substrate surface reaches parent
It is aqueous and amido link is occurred sufficient hydrolysis;
(2) prepared by ink:Metal ion ink is made in dissolving metal salts in solvent 1, reducing agent is dissolved in solvent 2 and made
Into reducing agent ink, the preparation of ink is completed;
(3) printing shaping of conductive pattern:The metal ion ink and reducing agent ink of preparation are individually positioned in color jet-ink and beaten
In the different print cartridges of print machine, the two is printed upon on the treated base material of step (1) by ink-jet, the printing of metal ion ink
Prior to the printing of reducing agent ink, the process graphical and that metal ion is reduced into metal simple-substance of metal ion, shape are completed
Into conductive metal layer, that is, complete the preparation of metal electron device or circuit diagram.
2. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 1, it is special
Levy and be, base material is selected from polyimides, PEI in step (1).
3. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 1, it is special
Levy and be, the alkaline solution described in step (1) is the NaOH aqueous solution, concentration is 3mol/L, and processing time is 30~120min,
Treatment temperature is 50 DEG C.
4. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 1, it is special
Levy and be, it is formalin, sodium borohydride solution, ascorbic acid solution and sodium hypophosphite that reducing agent ink, which is selected from, in step (2)
In one or more;Metal ion is silver ion.
5. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 4, it is special
Levy and be, solvent 1 is selected from one or both of water and ethanol mixture, solvent 2 is water.
6. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 5, it is special
Levy and be, solvent 1 is that the volume ratio of water and ethanol is 1:10~10:1 mixture;Reducing agent ink is adopted when using formalin
With the sodium hydrate aqueous solution of formaldehyde.
7. according to a kind of conducting wire typography method based on color ink jet printed technology described in claim 5, it is special
Levy and be, reducing agent solute concentration is 1~10wt%;The concentration of metal ion ink is 0.5~2mol/L.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710313329.7A CN107041079A (en) | 2017-05-05 | 2017-05-05 | A kind of conducting wire typography method based on color ink jet printed technology |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710313329.7A CN107041079A (en) | 2017-05-05 | 2017-05-05 | A kind of conducting wire typography method based on color ink jet printed technology |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107041079A true CN107041079A (en) | 2017-08-11 |
Family
ID=59537782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710313329.7A Pending CN107041079A (en) | 2017-05-05 | 2017-05-05 | A kind of conducting wire typography method based on color ink jet printed technology |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107041079A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108541146A (en) * | 2018-04-24 | 2018-09-14 | 珠海元盛电子科技股份有限公司 | A kind of fully-additive process technology of full printing single layer FPC |
CN110446336A (en) * | 2019-09-11 | 2019-11-12 | 哈尔滨工业大学 | The electro-reduction reaction connection method in situ and its application in printed electronic device of a kind of metal nano ink |
CN110876255A (en) * | 2018-08-31 | 2020-03-10 | 德州迈特新材料研究中心 | Preparation technology of microwave band metamaterial wave absorber |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101580657A (en) * | 2008-05-13 | 2009-11-18 | 富葵精密组件(深圳)有限公司 | Ink and method for manufacturing conductive wires by ink |
CN101712823A (en) * | 2009-10-26 | 2010-05-26 | 李世洁 | Group of ink for printing conductive film and use method thereof |
CN101855679A (en) * | 2007-11-13 | 2010-10-06 | 世联株式会社 | Process for producing transparent electroconductive member |
CN102300414A (en) * | 2011-08-22 | 2011-12-28 | 电子科技大学 | Addition preparation method of printed circuit |
CN102823335A (en) * | 2010-04-02 | 2012-12-12 | 印可得株式会社 | Method for manufacturing a double-sided printed circuit board |
-
2017
- 2017-05-05 CN CN201710313329.7A patent/CN107041079A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101855679A (en) * | 2007-11-13 | 2010-10-06 | 世联株式会社 | Process for producing transparent electroconductive member |
CN101580657A (en) * | 2008-05-13 | 2009-11-18 | 富葵精密组件(深圳)有限公司 | Ink and method for manufacturing conductive wires by ink |
CN101712823A (en) * | 2009-10-26 | 2010-05-26 | 李世洁 | Group of ink for printing conductive film and use method thereof |
CN102823335A (en) * | 2010-04-02 | 2012-12-12 | 印可得株式会社 | Method for manufacturing a double-sided printed circuit board |
CN102300414A (en) * | 2011-08-22 | 2011-12-28 | 电子科技大学 | Addition preparation method of printed circuit |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108541146A (en) * | 2018-04-24 | 2018-09-14 | 珠海元盛电子科技股份有限公司 | A kind of fully-additive process technology of full printing single layer FPC |
CN110876255A (en) * | 2018-08-31 | 2020-03-10 | 德州迈特新材料研究中心 | Preparation technology of microwave band metamaterial wave absorber |
CN110446336A (en) * | 2019-09-11 | 2019-11-12 | 哈尔滨工业大学 | The electro-reduction reaction connection method in situ and its application in printed electronic device of a kind of metal nano ink |
CN110446336B (en) * | 2019-09-11 | 2022-03-01 | 哈尔滨工业大学 | In-situ electro-reduction reaction connection method of metal nano ink and application of metal nano ink in printed electronic device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5982033B2 (en) | Metal fine particle dispersion, copper fine particle dispersion, method for producing copper fine particle dispersion, and method for producing conductive substrate | |
CN107041079A (en) | A kind of conducting wire typography method based on color ink jet printed technology | |
JP2009527076A (en) | Silver organosol ink for conductive line pattern formation | |
US20090004445A1 (en) | Metallic Ink, and Method for Forming of Electrode Using the Same and Substrate | |
CN101717645A (en) | Etching plaster for metal and metal oxide transparent conducting layer and etching process | |
Chen et al. | A particle-free silver precursor ink useful for inkjet printing to fabricate highly conductive patterns | |
TWI627885B (en) | Method for producing three-dimensional conductive pattern structure and material for three-dimensional molding used there | |
CN104877464A (en) | Composite nano silver particle conductive ink and preparation method and printing application thereof | |
CN109401440A (en) | A kind of solvent type conductive ink, preparation method and application | |
CN107148154A (en) | A kind of conducting wire typography based on inkjet printing | |
CN102883543B (en) | A kind of method adopting additive process to prepare conducting wire | |
KR101704693B1 (en) | Pattern on the flexible substrate using for intense pulsed photo-sintering and method for forming the same | |
CN102558954B (en) | Preparation method for nano-copper ink applied to printed electronics | |
CN111432560A (en) | Manufacturing method of ultra-low resistance flexible conductive circuit | |
KR101940467B1 (en) | Resin substrate having metal film pattern formed thereon | |
CN110248477B (en) | Manufacturing method of embedded flexible conductive circuit | |
Busato et al. | Inkjet printing of palladium catalyst patterns on polyimide film for electroless copper plating | |
CN107072039A (en) | The method for preparing conducting wire | |
JP2007194174A (en) | Ink for conductor pattern, conductor pattern, wiring board, electro-optical device and electronic equipment | |
KR101505049B1 (en) | Manufacturing method of double-sided printed circuit board | |
KR101520412B1 (en) | Flexible printed circuit board by laser processing and printing process, and method for manufacturing the same | |
CN103194117B (en) | Preparation method and application of sintering-free ultrafine silver nanometer printing ink | |
CN103476204B (en) | A kind of addition preparation method of dual platen | |
JP2006024808A (en) | Conductive composition producing method, method of interlayer connection and conductive film or conductive image formation method | |
CN106928775A (en) | A kind of low temperature sintering nano-copper conductive ink, preparation method and printing application |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170811 |
|
RJ01 | Rejection of invention patent application after publication |