CN107039220B - A kind of electron beam optics system and increasing material manufacturing device - Google Patents
A kind of electron beam optics system and increasing material manufacturing device Download PDFInfo
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- CN107039220B CN107039220B CN201710388114.1A CN201710388114A CN107039220B CN 107039220 B CN107039220 B CN 107039220B CN 201710388114 A CN201710388114 A CN 201710388114A CN 107039220 B CN107039220 B CN 107039220B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
- H01J3/14—Arrangements for focusing or reflecting ray or beam
- H01J3/20—Magnetic lenses
- H01J3/22—Magnetic lenses using electromagnetic means only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/58—Means for feeding of material, e.g. heads for changing the material composition, e.g. by mixing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
- H01J3/26—Arrangements for deflecting ray or beam
- H01J3/28—Arrangements for deflecting ray or beam along one straight line or along two perpendicular straight lines
- H01J3/32—Arrangements for deflecting ray or beam along one straight line or along two perpendicular straight lines by magnetic fields only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/52—Hoppers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electron Sources, Ion Sources (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention belongs to 3D printing technique fields, disclose a kind of electron beam optics system, including being equipped with the Shu Tongkong that passes through of power supply beamlet and Shu Tongkong is sequentially communicated focusing system, positive deflection system, negative deflection system and the deflection system of setting, the positive Shu Tongkong of the deflection system and Shu Tongkong of negative deflection system is staggered, the electron beam line focus system is injected, and is successively projected through positive deflection system, negative deflection system and deflection system.The invention also discloses a kind of increasing material manufacturing devices with electron beam optics system.By the way that positive deflection system and negative deflection system are arranged between focusing system and deflection system; the Shu Tongkong of the positive deflection system and negative deflection system is staggered; so that the channel that electron beam passes through does not penetrate through straight; but bending; and then when generating metallic vapour; metallic vapour is greatly reduced by the amount after bent passage, is effectively protected cathode.
Description
Technical field
The present invention relates to 3D printing technique field more particularly to a kind of electron beam optics system and increasing material manufacturing devices.
Background technique
Increasing material manufacturing (3D printing) is a kind of to construct three-dimension object by continuously fusing the material of more than one thin layer
Manufacturing technology.Powder bed electron beam increasing material manufacturing is one kind of increases material manufacturing technology route, and basic processing step is as follows: powder
End, which is supplied and paves system, transforms into thin layer on workbench upper berth for dusty material, and the electron beam of high-energy density is on powder bed
Scan a section of three-dimension object；Later, workbench declines the distance of a layer thickness, on workbench upper berth one
The new powder of layer, next section of ray scanning three-dimension object；Above step is repeated, until three-dimension object manufacture is completed.
In powdering formula electron beam metal 3D printing, electron beam is after emission of cathode, respectively by focus coil and partially
Then switch coil reaches workbench, melt preset powder bed.As shown in Figure 1, general electron beam optics system includes focusing
The Shu Tongkong 103 for thering is power supply beamlet to pass through among system 101 and deflection system 102, focusing system 101 and deflection system 102,
The Shu Tongkong 103 of the focusing system 101 and Shu Tongkong 103 of deflection system 102 be it is coaxial, since the energy of electron beam is higher,
While melting metal powder, the vaporization of part metals material will lead to, metallic vapour disperse and logical through beam in vacuum chamber
Hole 103 moves upwards, it is easy to reach cathode across Shu Tongkong 103, form metal vapor deposition layer, and cathode surface in cathode surface
A series of problem can be brought by vapor deposition, such as density drop short-circuit, emission of cathode electronics between acceleration voltage and cathode (ground connection)
Ability that is low or even losing launching electronics, these problems can bring adverse effect to the product quality and efficiency of increasing material manufacturing.
Summary of the invention
The purpose of the present invention is to provide a kind of electron beam optics system and increasing material manufacturing devices, to solve existing increasing material system
Make the problem of metallic vapour existing for device electron beam optics system has an adverse effect to cathode.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of electron beam optics system, including being equipped with the Shu Tongkong that passes through of power supply beamlet and the Shu Tongkong is sequentially communicated
The focusing system of setting, positive deflection system, negative deflection system and deflection system, the Shu Tongkong and negative bias of the positive deflection system
The Shu Tongkong for transfering from one department to another system is staggered, and the electron beam line focus system is injected, and successively through positive deflection system, negative deflection system
And deflection system projects.
Preferably, the current direction being passed through in the electric current being passed through in the positive deflection system and negative deflection system on the contrary,
So that the angle that the electron beam injects positive deflection system post deflection is opposite with the angle for injecting negative deflection system post deflection.
Preferably, the positive deflection system is identical with the size of current in negative deflection system.
Preferably, being equipped with connector between the positive deflection system and negative deflection system, offered on the connector
Connecting hole, the connecting hole are used to for the Shu Tongkong of the positive deflection system and Shu Tongkong of negative deflection system being connected to.
Preferably, being tightly connected between the focusing system, positive deflection system, negative deflection system and deflection system.
Preferably, the Shu Tongkong of the focusing system and the Shu Tongkong of positive deflection system are coaxial, the deflection system
Shu Tongkong and the Shu Tongkong of negative deflection system are coaxial.
Preferably, the focusing system, positive deflection system, negative deflection system and deflection system include shell and
Coil in shell, the Shu Tongkong are opened up on the housing.
Preferably, the positive deflection system and negative deflection system be provided with it is multiple, and multiple positive deflection systems with
It is arranged alternately between multiple negative deflection systems.
The present invention also provides a kind of increasing material manufacturing devices, including above-mentioned electron beam optics system.
Preferably, further include formation cylinder, the axle center weight of the axle center of the Shu Tongkong of the deflection system and the formation cylinder
It closes.
The present invention between focusing system and deflection system by being arranged positive deflection system and negative deflection system, the positive deflection
The Shu Tongkong of system and negative deflection system is staggered, so that the channel that electron beam passes through does not penetrate through straight, but bends
, and then when generating metallic vapour, metallic vapour needs the channel by bending to get to cathode, reaches the metal of cathode
The amount of steam greatly reduces, and is effectively protected cathode, greatly improves stability, efficiency and the product quality of increasing material manufacturing.
It will be passed through contrary electric current in positive deflection system and negative deflection system, electron beam can be made to inject positively biased and transfered from one department to another
The direction of system is consistent but not coaxial with the direction for projecting negative deflection system, but the certain distance that is staggered in the horizontal direction, and can
Ensure that electron beam is finally projected from deflection system.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of electron beam optics system in the prior art of the invention；
Fig. 2 is the structural schematic diagram of one electron beam optics system of the embodiment of the present invention；
Fig. 3 is the structure that one electron beam optics system of the embodiment of the present invention shows positive deflection system and negative deflection system
Schematic diagram；
Fig. 4 is the structural schematic diagram of the increasing material manufacturing device of the embodiment of the present invention two；
Fig. 5 is the structural schematic diagram of the increasing material manufacturing device of the embodiment of the present invention three.
In figure:
1, focusing system；2, positive deflection system；3, negative deflection system；4, deflection system；5, Shu Tongkong；6, connector；7,
Shell；8, coil；9, cathode；10, working chamber；20, formation cylinder；30, powdering platform；40, hopper；50, scraper；60, electron beam
Generating device；70, piston；80, powder delivery board；90, powder box is mixed；61, connecting hole；101, focusing system；102, deflection system；
103, Shu Tongkong.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
Embodiment one
The present embodiment provides a kind of electron beam optics systems, as shown in Fig. 2, the electron beam optics system includes along electron beam
Focusing system 1, positive deflection system 2, negative deflection system 3 and deflection system 4 that direction is successively tightly connected are injected, and above-mentioned poly-
Burnt system 1, positive deflection system 2, negative deflection system 3 and deflection system 4 include shell 7, and coil 8 is equipped in shell 7,
Specifically, above-mentioned focusing system 1 may include astigmatism coil, focus coil, for making electronics beam convergence.Above-mentioned positive deflection system
It is passed through constant electric current in 2 coil 8, so that one fixed angle of deflection of a beam of electrons.In the coil 8 of negative deflection system 3
In be also passed into constant electric current so that one fixed angle of deflection of a beam of electrons.Above-mentioned deflection system 4 includes being arranged in X, Y
The deflection coil of two mutually perpendicular directions, for generating changing magnetic field, so that electron beam is transported according to scheduled path
It is dynamic, wherein the Z-direction in the direction and Fig. 2 of above-mentioned X, Y is perpendicular.
It is equipped on shell 7 in above-mentioned focusing system 1, positive deflection system 2, negative deflection system 3 and deflection system 4
And diameter identical Shu Tongkong 5, the Shu Tongkong 5 pass through for beamlet of powering, that is to say, that the beam of electron beam line focus system 1
Through-hole 5 is injected, and successively the Shu Tongkong 5 through positive deflection system 2, negative deflection system 3 and deflection system 4 is projected.Have, on
The diameter for stating Shu Tongkong 5 can be selected between 40mm-60mm, can specifically be set as needed.
In the present embodiment, the Shu Tongkong 5 of above-mentioned focusing system 1 and the Shu Tongkong 5 of positive deflection system 2 are coaxial, in order to pass through
The electron beam that the Shu Tongkong 5 of focusing system 1 passes through can smoothly enter into the Shu Tongkong 5 of positive deflection system 2；Similarly, above-mentioned
The Shu Tongkong 5 of deflection system 4 and the Shu Tongkong 5 of negative deflection system 3 are coaxial, in order to the electronics in negative 3 beam through-hole 5 of deflection system
Beam can smoothly enter into the Shu Tongkong 5 of deflection system 4.
The Shu Tongkong 5 of above-mentioned positive deflection system 2 and the Shu Tongkong 5 of negative deflection system 3 are staggered, and enable to electron beam
By channel do not penetrate through straight, but bend, that is, there is corner characteristic, and then when generating metallic vapour, metal
Steam is greatly reduced by the amount after bent passage, is effectively protected cathode 9, and 9 surface of cathode is avoided to form metal vapor deposition layer.
Improve the density of 9 launching electronics of cathode.
The electric current being passed through in above-mentioned positive deflection system 2 in the present embodiment and the current direction phase being passed through in negative deflection system 3
Instead, so that electron beam to inject the angle of positive 2 post deflection of deflection system opposite with the angle for injecting negative 3 post deflection of deflection system.It is logical
Cross above-mentioned setting, can make electron beam inject the direction of positive deflection system 2 and project negative deflection system 3 direction it is consistent but different
Axis, but the certain distance that is staggered in the horizontal direction, and can ensure that electron beam is finally projected from deflection system 4.
Further, above-mentioned positive deflection system 2 current direction identical, opposite with the size of current in negative deflection system 3
And the setting of identical size of current, it enables to electron beam to inject the angle of positive deflection system 2 and projects negative deflection system 3
Angle it is identical (as shown in Figure 3).So that the electricity that the beam angle and focusing system 1 when into deflection system 4 project
The angle of beamlet is identical, will not generate deviation.
Further, it is equipped with connector 6 between above-mentioned positive deflection system 2 and negative deflection system 3, is opened up on the connector 6
There is connecting hole 61, the connecting hole 61 is for the Shu Tongkong 5 of the Shu Tongkong 5 of positive deflection system 2 and negative deflection system 3 to be connected to.
Further, the diameter of the connecting hole 61 is greater than the diameter of Shu Tongkong 5, ensure that the Shu Tongkong 5 and negative bias of positive deflection system 2
Transfer from one department to another system 3 Shu Tongkong 5 staggeredly be connected to while, be also capable of high degree reduce metallic vapour reach cathode 9 amount.
In the present embodiment, above-mentioned electron beam optics system can only include that a positive deflection system 2 and a negative bias turn
Multiple positive deflection systems 2 and multiple negative deflection systems 3, of positive deflection system 2 and negative deflection system 3 also can be set in system 3
Number is identical.And when positive deflection system 2 and negative deflection system 3 are multiple, replace between positive deflection system 2 and negative deflection system 3
Setting.By the way that multiple positive deflection systems 2 and multiple negative deflection systems 3 is arranged, metallic vapour can be further reduced and reach cathode 9
Amount.
Embodiment two
The present embodiment provides a kind of increasing material manufacturing device, which includes electron beam light described in embodiment one
System, specifically, as shown in figure 4, the increasing material manufacturing device includes working chamber 10, formation cylinder 20, powdering platform 30, hopper
40, scraper 50 and electron beam generating apparatus 60, in which:
It is vacuum environment in above-mentioned working chamber 10, can specifically passes through the vacuum of the compositions such as sliding vane rotary pump, molecular pump, vacuum meter
System takes air in working chamber 10 away, obtains vacuum environment.
Be equipped with formation cylinder 20 in working chamber 10, the upper surface of the formation cylinder 20 it is closed and concordant be installed on powdering platform
On 30, and the piston 70 moved up and down is equipped in it.
Hopper 40 is symmetrically set in the one or both sides of formation cylinder 20, and powder delivery board 80 is equipped with below hopper 40, is used for
Dusty material in hopper 40 is delivered on powdering platform 30.
Above-mentioned scraper 50 can at least move in the horizontal direction, the dusty material on powdering platform 30 can be tiled
At the top of piston 70, and dusty material is made to form powder thin layer.In the present embodiment, above-mentioned scraper 50 two-way can scrape powder, i.e.,
Powder can be from left to right scraped, powder can also be scraped from right to left.
The electron beam optics system of the present embodiment, and the electron beam optics are mounted in above-mentioned electron beam generating apparatus 60
The axle center of the Shu Tongkong 5 of the deflection system 4 of system is overlapped with the axle center of the formation cylinder 20, is emitted by electron beam optics system
Electron beam out can be scanned the dusty material laid on formation cylinder 20, melt.In the present embodiment, above-mentioned electronics
The acceleration voltage of beam is 60kV, power 0-10kW.
At work, the model of three-dimension object stores in a computer the above-mentioned increasing material manufacturing device of the present embodiment, model
It is layered in a computer, and obtains each layer of machining information.The manufacture of three-dimension object carries out in working chamber 10, and powder is defeated
Dusty material of the plate 80 on powdering platform 30 in conveyor hopper 40 is sent, scraper 50 is above the piston 70 in formation cylinder 20 by powder
Powder material sprawls stratification, the electron beam process of the electron beam optics system sending powder bed；After the completion of first layer, powder delivery board
80 continue to convey dusty material on powdering platform 30, and powder is sprawled into powder thin layer again above piston 70 by scraper 50,
The electron beam that electron beam optics system issues adds the work powder thin layer ... so to recycle, and passes through two layers of Continuous maching or more of powder
Last thin layer constructs 3D solid.Without by the powder of electron-beam melting, then can be recycled.
The present embodiment has higher stability, efficiency and more preferable by using the electron beam optics system of embodiment one
Product quality.
Embodiment three
The present embodiment provides another increasing material manufacturing device, which includes electron beam described in embodiment one
Optical system, specifically, as shown in figure 5, the increasing material manufacturing device includes working chamber 10, formation cylinder 20, powdering platform 30, hopper
40, scraper 50 and electron beam generating apparatus 60, wherein above-mentioned working chamber 10, formation cylinder 20, powdering platform 30 and electron beam
The structure of generating device 60 and embodiment two are all the same, and difference is:
The same side of electron beam generating apparatus 60 is arranged in two hoppers 40 of the present embodiment, and is located at the same of formation cylinder 20
Side places different dusty materials respectively in two hoppers 40, and the lower section of two hoppers 40 is provided with mixed powder box 90,
Dusty material different in two hoppers 40 can be mixed in proportion by mixing powder box 90 by this, and is transferred on powdering platform 30.
The scraper 50 of the present embodiment is unidirectionally to scrape powder, i.e., it can from left to right scrape mixed dusty material to piston 70
Stratification is sprawled in top, forms powder thin layer, then correcting action, does not scrape powder in return course.
At work, the model of three-dimension object stores in a computer the above-mentioned increasing material manufacturing device of the present embodiment, model
It is layered in a computer, and obtains each layer of machining information.The manufacture of three-dimension object carries out in working chamber 10, and powder is defeated
Plate 80 is sent to convey dusty material different in two hoppers 40 into mixed powder box 90, dusty material is in mixed powder box 90 by proportion
Mixing, is then transferred on powdering platform 30, scraper 50 sprawls into dusty material above the piston 70 in formation cylinder 20
Layer, the electron beam process of the electron beam optics system sending powder bed；After the completion of first layer, powder delivery board 80 continues to mixed powder
Different dusty material in two hoppers 40 is conveyed in box 90, dusty material is mixed in proportion in mixed powder box 90, then by
It is transferred on powdering platform 30, powder is sprawled into powder thin layer, electron beam optics system again above piston 70 by scraper 50
The electron beam of sending adds the work powder thin layer ... so to recycle, and is constructed by two layers of Continuous maching or more of powder thin layer
3D solid.
In the present embodiment, since the proportion of the dusty material in each layer of powder thin layer is adjustable, the three of manufacture
Dimension object can be changed in the vertical direction with right and wrong single component, material composition.
The present embodiment has higher stability, efficiency and more preferable by using the electron beam optics system of embodiment one
Product quality.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (9)
1. a kind of electron beam optics system, which is characterized in that including being equipped with the Shu Tongkong (5) and the beam that power supply beamlet passes through
Through-hole (5) is sequentially communicated focusing system (1), positive deflection system (2), negative deflection system (3) and the deflection system (4) of setting,
The Shu Tongkong (5) of the positive deflection system (2) is staggered with the Shu Tongkong (5) of negative deflection system (3), and the electron beam is through poly-
Burnt system (1) is injected, and successively projects through positive deflection system (2), negative deflection system (3) and deflection system (4)；
Connector (6) are equipped between the positive deflection system (2) and negative deflection system (3), the company of offering on the connector (6)
It connects hole (61), the connecting hole (61) is used for the Shu Tongkong (5) of positive deflection system (2) and the beam of negative deflection system (3) is logical
Hole (5) connection.
2. electron beam optics system according to claim 1, which is characterized in that be passed through in the positive deflection system (2)
The current direction being passed through in electric current and negative deflection system (3) is on the contrary, so that the electron beam injects positive deflection system (2) post deflection
Angle it is opposite with the angle for injecting negative deflection system (3) post deflection.
3. electron beam optics system according to claim 2, which is characterized in that the positive deflection system (2) and negative bias turn
Size of current in system (3) is identical.
4. electron beam optics system according to claim 1, which is characterized in that the focusing system (1), positive deflection system
(2), it is tightly connected between negative deflection system (3) and deflection system (4).
5. electron beam optics system according to claim 1, which is characterized in that the Shu Tongkong (5) of the focusing system (1)
Coaxially with the Shu Tongkong (5) of positive deflection system (2), the beam of the Shu Tongkong (5) of the deflection system (4) and negative deflection system (3)
Through-hole (5) is coaxial.
6. electron beam optics system according to claim 5, which is characterized in that the focusing system (1), positive deflection system
(2), negative deflection system (3) and deflection system (4) are described including shell (7) and the coil (8) being located in shell (7)
Shu Tongkong (5) is provided on the shell (7).
7. electron beam optics system according to claim 1, which is characterized in that the positive deflection system (2) and negative bias
Transfer from one department to another to unite (3) be provided with multiple, and be arranged alternately between multiple positive deflection systems (2) and multiple negative deflection systems (3).
8. a kind of increasing material manufacturing device, which is characterized in that including electron beam optics system as claimed in claim 1 to 7.
9. increasing material manufacturing device according to claim 8, which is characterized in that it further include formation cylinder (20), the deflection system
The axle center of the Shu Tongkong (5) of system (4) is overlapped with the axle center of the formation cylinder (20).
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| CN201710388114.1A CN107039220B (en) | 2017-05-27 | 2017-05-27 | A kind of electron beam optics system and increasing material manufacturing device |
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| CN109216135B (en) * | 2018-03-21 | 2021-04-13 | 中国航空制造技术研究院 | Fuse wire additive manufacturing electron gun device with coaxial wire bundles |
| CN111036899A (en) * | 2019-11-20 | 2020-04-21 | 中国船舶重工集团公司第十二研究所 | Forming method of particle reinforced aluminum matrix composite material part |
| CN115863128B (en) * | 2023-02-06 | 2023-05-16 | 广东省科学院半导体研究所 | Focusing deflection module for key dimension measuring device and electron beam optical column |
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| CN206774495U (en) * | 2017-05-27 | 2017-12-19 | 清华大学天津高端装备研究院 | A kind of electron beam optics system and increasing material manufacturing device |
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| US7223974B2 (en) * | 2002-05-22 | 2007-05-29 | Applied Materials, Israel, Ltd. | Charged particle beam column and method for directing a charged particle beam |
| US20090212213A1 (en) * | 2005-03-03 | 2009-08-27 | Ebara Corporation | Projection electron beam apparatus and defect inspection system using the apparatus |
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| CN206122695U (en) * | 2015-11-21 | 2017-04-26 | 天津清研智束科技有限公司 | Realize controlling means and vibration material disk equipment of scanning of electron beam broad width |
| CN206774495U (en) * | 2017-05-27 | 2017-12-19 | 清华大学天津高端装备研究院 | A kind of electron beam optics system and increasing material manufacturing device |
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