CN107021449B - Prepare the preparation method and applications of ordered micro-configuration and controllable chemical composition interface - Google Patents
Prepare the preparation method and applications of ordered micro-configuration and controllable chemical composition interface Download PDFInfo
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- 238000000034 method Methods 0.000 claims abstract description 21
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- 229910001961 silver nitrate Inorganic materials 0.000 claims description 13
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Silicon Compounds (AREA)
Abstract
The present invention provides a kind of method at interface for preparing ordered micro-configuration and controllable chemical composition, liquid phase bubbling behaviour control method is carried out by the interface with microstructure and controllable chemical composition for preparing orderly, the adverse effect of bubble generation in terms of either pipeline transportation, medical treatment can be eliminated in terms of the electrode.
Description
Technical field
The present invention relates to new energy and energy-efficient field more particularly to a kind of ordered micro-configurations and controllable chemical of preparing
Form the regulation that substrate interface is applied to liquid phase bubbling behaviour.
Background technique
In aqueous media bubble be it is very common be also inevitable, have and widely answer very much in agricultural and industrial process
With.Such as mineral floating, ocean heat transfer and pollution-preventing isolator etc..Equally, the presence of bubble also brings some negative effects.In liquid
Body conveying system, bubble cause the corrosion and blocking of pipeline, reduce equipment life, result in waste of resources.Such as oil-gas gathering and transportation pipe
Road due to being vibrated by runner, runner is narrow, the vortex of seawater, diffusion, cause it to be formed a low-pressure area in a fluid.
On the interface of seawater and the metal pipe-wall of oil-gas gathering and transferring pipeline, due to the presence of low-pressure area, the original protective film of tube wall can be by
To numerous bubbles continuous rupture and cause to generate mechanical damage, to form cavitation erosion, if things go on like this, oil-gas gathering and transferring pipeline tube wall
It is just etched into air marks, is in hornet's nest shape.In elctro-catalyst, the adherency impeded electrode and electrolyte of electrode surface bubble are contacted,
To reduce electrolytic efficiency.Therefore, the behavior and characteristic for controlling bubble are vital for the application of bubble.
Bubble is generated, growth, the manipulation of the behaviors such as merging and release causes the concern of many scientists.It is passed in boiling
Hot aspect, surface roughness and period boiling heat transfer, coarse structure are introduced into, and to provide more nucleation sites, reduce base
Influence of the wellability for boiling heat transfer is than more significant between plate and vapor bubbles.The microstructure of rough surface helps to increase
The delay of nucleation site density and gas to reduce the initial degree of superheat and the nuclear boiling degree of superheat, and then improves boiling heat transfer efficiency.
The wellability of this outer surface also will affect the behaviors such as the generation, growth and release of bubble.Bubble required for hydrophobic surface from
By can be than in the low of water-wetted surface, therefore bubble be easier to generate in hydrophobic surface.When hydrophilic interface and hydrophobic interfaces infiltrate
In solution, moisture film and air film will form respectively.The moisture film on surface hinders the contact of bubble and hydrophilic solid interface, leads to small gas
Bubble release.On the contrary, the air film formed can increase bubble in the adhesion strength of hydrophobic interfaces, with the growth of bubble and offer can be merged
Time enough allows.It is well known that wellability is an important feature of the surface of solids, it is the chemical composition by material surface
It is codetermined with micro-geometry.It is therefore believed that can be with by the microstructure and chemical composition for coordinating interface
Realize effective manipulation of bubble.
In nature, the micro-/micro-nano structure and chemical composition of many biological surfaces realize in water phase to bubble realize reliably and
Effective manipulation.The mastoid process structure of large area is covered in lotus leaf surface, a large amount of equally distributed nanometer paraffin wax are covered in mastoid process
Matter is brilliant.Water droplet cannot fill up the groove of rough surface, form " air cushion " in lotus leaf surface, when extraneous macroscopical bubble and air film connect
Touching, causes bubbles burst.The air cushion and lotus leaf multiple dimensioned structure of classifying of lotus leaf front trapping are bubbles bursts
Principal element.The abdomen of water spider has a large amount of waterproof villus, and when pulling the plug, own abdomen fine, soft fur can store bubble, with
Ensure that it can long-term security be survived in residence under water.
The object of the present invention is to provide a kind of method of substrate interface for preparing ordered micro-configuration and controllable chemical composition,
By by microstructure and surface wettability combination, may be implemented microfluid and pipeline transportation and in terms of gas
The manipulation of bubble behavior, and cost of manufacture relatively economical, not will increase production cost.
Summary of the invention
The present invention is to solve existing pipeline transportation, health care and battery efficiency etc. the negative shadow of bubble bring
It rings, and improves underwater drag reduction capability, a kind of substrate interface preparing ordered micro-configuration and controllable chemical composition is provided.Pass through
The orderly substrate interface with microstructure and controllable chemical composition of preparation, can nucleation to bubble, growth, merging and
Manipulation is realized in the behaviors such as release.
In order to solve the above technical problems, the present invention provides a kind of substrate for preparing ordered micro-configuration and controllable chemical composition
The method at interface, by preparing the orderly substrate interface with microstructure and controllable chemical composition, nucleation, life to bubble
Manipulation is realized in the behaviors such as long, merging and release.
The orderly substrate interface with microstructure and controllable chemical composition of preparation using smooth silicon wafer or is covered
The silicon micron base for post bottom that smooth silicon wafer obtains is lost in film carving.
The method of the substrate interface provided by the invention for preparing ordered micro-configuration and controllable chemical composition, specifically includes:
The first step, the cleaning of silicon wafer；
Second step, the preparation of surface texture；
Third step, the building of hydrophobic surface.
Wherein, the first step is further specially by smooth silicon wafer (p-type, crystal orientation 100) or silicon with micrometer structure
Piece (being obtained using mask plate Beijing University micro-nano technology laboratory using mask plate etching P, the smooth silicon of crystal orientation 100) successively immerses third
Ultrasound 15min in ketone, ethyl alcohol after being rushed with water, is then immersed in 98% sulfuric acid and dioxygen water volume ratio is in the solution of 3:1,80
30min is heated at DEG C, takes out and is rinsed with a large amount of water, and silicon wafer is hydrophilic at this time.
Wherein, nano-wire array surface texture or micro-nano composite array surface texture can be constructed in the second step
Silicon wafer.
Wherein, second step is further specifically:
Prepare silicon nanowire array: the mixed reaction solution of configuration HF and silver nitrate are poured into ptfe autoclave,
The smooth silicon of first step cleaning is added, capping is placed in heating reaction 20min in 50 DEG C of baking ovens.Because polytetrafluoro reaction kettle kettle wall compared with
Reaction solution before silicon wafer is added, should be put into 50 DEG C of baking ovens in advance to ensure reaction effect and preheat 10min by thickness.Reaction
Silicon wafer is taken out after 20min, the film of the silver of the grey of sample surfaces covering is removed with nitric acid dousing 15s or so, then with a large amount of
Water rinses, high pure nitrogen drying.
Prepare micron and nanometer composite structure: the mixed reaction solution of configuration HF and silver nitrate are poured into ptfe autoclave
In, the silicon micron column piece of first step cleaning is added, capping is placed in heating reaction 20min in 50 DEG C of baking ovens.Because of polytetrafluoro reaction kettle
Kettle wall is thicker, to ensure reaction effect, before silicon wafer is added, reaction solution should be put into 50 DEG C of baking ovens in advance and preheat 10min.Instead
Control hydrogen is 10min between seasonable, and otherwise etching time is too long, can be etched away micron column.Silicon wafer is taken out, nitric acid dousing is used
15s or so with remove sample surfaces covering grey silver film, then with a large amount of water rinse, high pure nitrogen dry up.
Wherein, the concentration of HF is 5mol/L in mixed reaction solution, and the concentration of silver nitrate is 0.02mol/L, mixed reaction solution
It is specific be put into plastic beaker the preparation method comprises the following steps: weighing silver nitrate 0.1699g, with syringe draw 10ml hydrofluoric acid, then plus
Water is made into 50ml mixed solution.
Wherein, the third step can prepare hydrophobic surface and super hydrophobic surface by the time of control vapor deposition.
Silicon wafer and the second step preparation that third step further specially cleans up the first step have surface texture
Silicon wafer, dried up with high pure nitrogen, silicon wafer be put into vacuum desiccator at once, instilled a drop silicon fluoride, vacuumize, keep true
Empty condition 2h, hydroxylated silicon wafer form the monolayer of silicon fluoride on surface under silicon fluoride steam atmosphere, dredge to be formed
Water surface.When preparing super hydrophobic surface, vacuumizes and the time kept is 12h, herein it should be noted that smooth silicon face
It is smoother, it is vapor-deposited after 12h even across silicon fluoride, it is also not possible to reach super-hydrophobic state.
Beneficial effects of the present invention:
The present invention provides a kind of method for preparing the orderly substrate interface with microstructure and controllable chemical composition, can
With the realization manipulation of the behaviors such as nucleation, growth, merging and release to liquid phase bubble, either pipeline is eliminated in terms of electrode
The adverse effect that transport, medical treatment aspect bubble generate；And cost of manufacture relatively economical, it not will increase production cost.
Detailed description of the invention
Fig. 1 is Experimental equipment；
Fig. 2 is that the SEM of silicon micron column array schemes, column is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 3 is that the SEM of silicon micron column array side schemes, column is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 4 is that the SEM on silicon nanowire array surface schemes；
Fig. 5 is that the SEM of silicon nanowire array side schemes；
Fig. 6 is that the SEM on silicon micro-nano composite array surface schemes, column is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 7 is that the SEM of silicon micro-nano composite array side schemes, column is wide/pillar height/intercolumniation=10/5/10 μm；
Fig. 8 is hydrophobic substrate and CO2The test chart of the adhesion strength of bubble；
Fig. 9 is hydrophobic substrate and CO2The test chart of the adhesion strength of bubble；
Figure 10 is super hydrophobic base and CO2The test chart of the adhesion strength of bubble.
Specific embodiment
The present invention preparation orderly substrate interface with microstructure and controllable chemical composition, realization to bubble at
Manipulation is realized in the behaviors such as core, growth, merging and release.The substrate etches smooth silicon wafer using smooth silicon wafer and mask plate
Obtained silicon micron base for post bottom.
It is provided by the invention to prepare ordered micro-configuration and the method for chemical composition substrate interface specifically includes:
The first step, the cleaning of silicon wafer；
Second step, the preparation of surface texture；
Third step, the building of hydrophobic surface.
The first step further be specially by smooth silicon wafer (p-type, crystal orientation 100) or with micrometer structure silicon (utilize
Mask plate Beijing University micro-nano technology laboratory is obtained using mask plate etching P, the smooth silicon of crystal orientation 100) successively immerse respectively acetone,
Ultrasound 15min in ethyl alcohol after being rushed with water, is then immersed in 98% sulfuric acid and dioxygen water volume ratio is in the solution of 3:1, at 80 DEG C
30min is heated, takes out and is rinsed with a large amount of water.Silicon wafer is hydrophilic at this time.
When using smooth silicon wafer, first step preparation is nano-wire array surface texture, can be constructed in second step
The silicon wafer of nano-wire array surface texture, when using the silicon with micrometer structure, first step preparation is micro-nano nanowire arrays
Surface texture, prepared by second step is the silicon wafer of micro-nano composite array surface texture.
Second step is further specifically:
Prepare silicon nanowire array: the mixed reaction solution of configuration HF and silver nitrate are poured into ptfe autoclave,
The smooth silicon of first step cleaning is added, capping is placed in heating reaction 20min in 50 DEG C of baking ovens.Because polytetrafluoro reaction kettle kettle wall compared with
Reaction solution before silicon wafer is added, should be put into 50 DEG C of baking ovens in advance to ensure reaction effect and preheat 10min by thickness.Reaction
Silicon wafer is taken out after 20min, the film of the silver of the grey of sample surfaces covering is removed with nitric acid dousing 15s or so, then with a large amount of
Water rinses, high pure nitrogen drying,
Prepare micron and nanometer composite structure: the mixed reaction solution of configuration HF and silver nitrate are poured into ptfe autoclave
In, the silicon micron column piece of first step cleaning is added, capping is placed in heating reaction 20min in 50 DEG C of baking ovens.Because of polytetrafluoro reaction kettle
Kettle wall is thicker, to ensure reaction effect, before silicon wafer is added, reaction solution should be put into 50 DEG C of baking ovens in advance and preheat 10min.Instead
Silicon wafer is taken out after answering 10min, the film of the silver of the grey of sample surfaces covering is removed with nitric acid dousing 15s or so, then with big
It measures water to rinse, high pure nitrogen drying.
Wherein, the concentration of HF is 5mol/L in mixed reaction solution, and the concentration of silver nitrate is 0.02mol/L, specific preparation side
Method are as follows: weigh silver nitrate 0.1699g and be put into plastic beaker, draw 10ml hydrofluoric acid with syringe, add water that be made into 50ml mixed
Close solution.
Silicon wafer and the second step preparation that third step further specially cleans up the first step have surface texture
Silicon wafer, dried up with high pure nitrogen, silicon wafer be put into vacuum desiccator at once, instilled a drop silicon fluoride, vacuumize, keep true
Empty condition 2h, hydroxylated silicon wafer form the monolayer of silicon fluoride on surface under silicon fluoride steam atmosphere, dredge to be formed
Water surface.When preparing super hydrophobic surface, vacuumizes and the time kept is 12h.Herein it should be noted that smooth silicon face
It is smoother, it is vapor-deposited after 12h even across silicon fluoride, it is also not possible to reach super-hydrophobic state.
The present invention realizes the principle of liquid phase bubbling behaviour manipulation: in the substrate modified without silicon fluoride, substrate is to bubble
Adhesion strength is smaller, therefore the release radius of bubble is smaller on hydrophobic substrate.Silicon wafer after hydrofluoric acid corrodes, nano junction
Structure can provide more nucleation site.Hydrophobic substrate roughness increases, and will increase wellability, reduces the adhesion strength to bubble,
Many microbubbles can be generated.Material after vapor deposition modification, as the hydrophobicity of substrate enhances, substrate and hydrone it
Between interaction weaken, hydrone, which is ostracised, to come, and causes gas molecule to be easier to escape on hydrophobic surface, substrate is to bubble
Adhesion strength increase.The volume of bubble must enough great talent can have biggish buoyancy to overcome the adhesion strength of substrate to flee from substrate
Surface.The release radius of smooth silicon face after modification, the release radius ratio hydrophobic substrate of bubble is big.For hydrophobic substrate,
The increase of roughness, it will the hydrophobicity for increasing substrate increases the adhesion strength of bubble.Bubble during growth can with it is neighbouring
Bubble merge, generate discontinuous or continuous air film.
The present invention orderly has microstructure and controllable chemistry by preparing microstructure and surface wettability combination
The manipulation of liquid phase bubbling behaviour is realized at the interface of composition, may be implemented microfluid and pipeline transportation and in terms of gas
The adverse effect that bubble generates is eliminated in the manipulation of bubble behavior.
The present invention also provides above-mentioned interface applications during supercavity drag reduction.
Below using embodiment and attached drawing come the embodiment that the present invention will be described in detail, how skill is applied to the present invention whereby
Art means solve technical problem, and the realization process for reaching technical effect can fully understand and implement.
1 nano-wire array surface texture of embodiment
Silicon wafer (p-type, crystal orientation 100) is successively immersed to cleaning solution, acetone, ultrasound 15min in ethyl alcohol, after being rushed respectively with water,
It is then immersed in sulfuric acid and dioxygen water volume ratio is to heat 10min at 80 DEG C in the solution of 3:1, take out and rinsed with a large amount of water.
It weighs silver nitrate 0.1699g to be put into plastic beaker, draws 10ml hydrofluoric acid with syringe, add water and be made into 50ml
Mixed reaction solution is poured into polytetrafluoro reaction kettle, and the silicon wafer of cleaning is added, and capping, which is placed in 50 DEG C of baking ovens, heats reaction
Reaction solution, to ensure reaction effect, should be put into 50 DEG C of baking ovens in advance and preheat because polytetrafluoro reaction kettle kettle wall is thicker by 20min
10min.Silicon wafer is taken out after reaction, and the film of the silver of the grey of sample surfaces covering is removed with nitric acid dousing 15s or so, is then used
A large amount of water rinse, high pure nitrogen drying.Fig. 4 is that the SEM on silicon nanowire array surface schemes, and Fig. 5 is silicon nanowire array side
SEM figure, can achieve, silicon nanowires is uniformly distributed, and the diameter of nano wire is about 150-200nm, nano wire from electromicroscopic photograph
Length is about 4.82um.
The micro-nano composite array surface texture of embodiment 2
Silicon with micrometer structure (is etched into P, crystal orientation using mask plate using mask plate Beijing University micro-nano technology laboratory
100 smooth silicon obtain) (as shown in Figures 2 and 3) immerse cleaning solution, acetone, ultrasound 15min in ethyl alcohol respectively, it is rushed respectively with water
Afterwards, it is then immersed in sulfuric acid and dioxygen water volume ratio is to heat 10min at 80 DEG C in the solution of 3:1, take out and rushed with a large amount of water
It washes.
It weighs silver nitrate 0.1699g to be put into plastic beaker, draws 10ml hydrofluoric acid with syringe, add water and be made into 50ml
Mixed reaction solution is poured into polytetrafluoro reaction kettle, and the clean silicon wafer with micron rod structure, silicon wafer pillar column is added
Wide/pillar height/intercolumniation=10/5/10 μm, capping are placed in heating reaction 10min in 50 DEG C of baking ovens, control hydrofluoric acid herein
Etching time, etching time is too long, can be etched away micron column.Because polytetrafluoro reaction kettle kettle wall is thicker, to ensure to react effect
Reaction solution should be put into 50 DEG C of baking ovens in advance and preheat 10min by fruit.Silicon wafer is taken out after reaction, with concentrated nitric acid impregnate 15s or so with
The film for removing the silver of the grey of sample surfaces covering, is then rinsed with a large amount of water, high pure nitrogen drying.Fig. 6 is that silicon micro-nano is compound
The SEM of array surface schemes.Fig. 7 is that the SEM of silicon micro-nano composite array side schemes.Available from electromicroscopic photograph, silicon micron column exists
After hydrofluoric acid corrodes, only silicon column is etched into nanostructure, rather than pillar region is not corroded as nanostructure.Through
The micro-nano compound structure that excessive erosion silicon micron column obtains, the length of nano wire is about 5um.
Embodiment 3 has the silicon wafer of diverse microcosmic structure and chemical composition to CO2The manipulation of bubbling behaviour.
As shown in Figure 1, building realization device.Experiment needs first to adjust light source 1, high-speed camera 2, substrate 3 before starting
Position guarantees three kinds on the same line, while shown substrate side on camera control display 4 will be clear that.
After adjusting optical path, the hydrophobic substrate of above-mentioned preparation and super hydrophobic base are placed in 50 × 50 × 30mm3Dress
Full CO2Saturated solution (CO herein2Saturated solution is Watson sugar-free soda water) quartz cell in, silicon wafer substrate is placed in
Under liquid at 20mm, and the one side with microstructure is fixed upward.
Bubble is recorded in the behavior of substrate surface with the speed of 50frame/s with OLYMPUS i-SPEED 3 video camera.
Simultaneously again not pass through the silicon base of silicon fluoride vapor deposition as a control test.It is recorded.It is more above-mentioned
Various substrates immerse the action process of bubble after carbonated water.
Hydrophilic interface CO2Bubble nucleating and growth in situ, bubble release spherical in shape, and CO2The release radius of bubble with it is coarse
Degree has functional relation, and the diameter of bubble reduces with the increase of roughness.Hydrophobic substrate surface, CO2Bubble is in coronal life
It grows, and can merge, merge with neighbouring bubble；The roughness for increasing interface can increase the adhesion strength to bubble,
The last release radius of bubble will increase.And on super-hydrophobic surface, continuous air film is formed, can effectively be captured in liquid phase
Gas molecule.
The test of 4 adhesion strength curve graph of embodiment
Germany's daterphysics DCAT21 dynamic contact angular measurement instrument is selected to measure the adhesion strength of bubble and substrate.
Dynamic contact angular measurement software is opened, measurement parameter is set.Photography software is opened, clear visual field is adjusted, finds by special place
The needle cycle of reason, and adjust clear.The silicon wafer of preparation is attached on supporter, is put into the quartz cell equipped with water, it is ensured that needle cycle leaching
Enter in water and right above sample.The bubble of certain volume is squeezed on needle cycle, and adjusts the height of sample, is determined and is surveyed every time
Examination is identical to the squeeze distance of bubble, starts to measure sample to the adherency force curve of bubble.The data of measurement are carried out with Origin
Figure such as Fig. 8, Fig. 9 and Figure 10 are in operation.
Fig. 8 is the adhesion strength side view of hydrophobic substrate.Fig. 8 a is adhesion strength curve graph of the hydrophilic smooth substrate to bubble.Figure
8b is adhesion strength curve graph of the silicon micrometer structure to bubble；Fig. 8 c is adhesion strength curve graph of the hydrophilic silicon nanowires to bubble；Figure
8d is adhesion strength curve graph of the hydrophilic micro-nano compound structure to bubble.It will be seen that hydrophobic substrate is to bubble from figure
Adhesion strength is very weak.
Fig. 9 is the adhesion strength side view of hydrophobic substrate.Fig. 9 a is adhesion strength curve graph of the hydrophobic smooth substrate to bubble.Figure
9b is adhesion strength curve graph of the hydrophobic silicon micrometer structure to bubble；Fig. 9 c is adherency force curve of the hydrophilic silicon nanowires to bubble
Figure；Fig. 9 d is adhesion strength curve graph of the hydrophobic micro-nano compound structure to bubble.It will be seen that hydrophobic substrate is to gas from figure
Bubble has stronger adhesion strength.
Figure 10 is the adhesion strength side view of super hydrophobic base.Figure 10 a is that super-hydrophobic silicon nano wire is bent to the adhesion strength of bubble
Line chart.Figure 10 b is adhesion strength curve graph of the super-hydrophobic silicon micrometer structure to bubble；Figure 10 c is super-hydrophobic micro-nano compound structure pair
The adhesion strength curve graph of bubble；Fig. 8 d is the hydrophilic adhesion strength curve graph to bubble.It will be seen that super-hydrophobic base from figure
Bottom has very strong adhesion strength to bubble.
Table 1 is under water in the contact angle with diverse microcosmic structure and structure of chemical composition and the silicon base of chemical composition.
Table 1
All above-mentioned this intellectual properties of primarily implementation, there is no this new products of implementation of setting limitation other forms
And/or new method.Those skilled in the art will utilize this important information, above content modification, to realize similar execution feelings
Condition.But all modifications or transformation belong to the right of reservation based on new product of the present invention.
The above described is only a preferred embodiment of the present invention, being not that the invention has other forms of limitations, appoint
What those skilled in the art changed or be modified as possibly also with the technology contents of the disclosure above equivalent variations etc.
Imitate embodiment.But without departing from the technical solutions of the present invention, according to the technical essence of the invention to above embodiments institute
Any simple modification, equivalent variations and the remodeling made, still fall within the protection scope of technical solution of the present invention.
Claims (8)
1. a kind of method at the interface for preparing ordered micro-configuration and controllable chemical composition, it is characterised in that: prepare orderly tool
There is the substrate interface of microstructure and controllable chemical composition, the nucleation of bubble, growth, merging and release behavior are realized and grasped
Control；
The substrate etches the silicon micron base for post bottom that smooth silicon wafer obtains using smooth silicon wafer or mask plate；
The method at the interface for preparing ordered micro-configuration and controllable chemical composition, specifically includes,
The first step, the cleaning of silicon wafer；
Second step, the preparation of surface texture；
Third step, the building of hydrophobic surface；
The first step be specially smooth silicon wafer or silicon wafer with micrometer structure are successively immersed into acetone, ultrasound in ethyl alcohol
15min after being rushed with water, is then immersed in 98% sulfuric acid and dioxygen water volume ratio is to heat 30min at 80 DEG C in the solution of 3:1,
It takes out and is rinsed with a large amount of water, silicon wafer is hydrophilic at this time；
The second step specifically, configuration HF and silver nitrate mixed reaction solution, be poured into ptfe autoclave, be added
The silicon wafer of first step cleaning, capping are placed in heating reaction 20min in 50 DEG C of baking ovens；Silicon wafer is taken out after reaction 20min, is soaked with nitric acid
15s is steeped to remove the film of the silver of the grey of sample surfaces covering, is then rinsed with a large amount of water, high pure nitrogen drying；
The third step is specially after drying up silicon wafer with high pure nitrogen, to be put into vacuum desiccator at once, instills a drop fluorine silicon
Alkane vacuumizes, and keeps vacuum condition 2h, and hydroxylated silicon wafer forms single point of silicon fluoride under silicon fluoride steam atmosphere on surface
Sublayer, to form hydrophobic surface.
2. preparing the method at the interface of ordered micro-configuration and controllable chemical composition as described in claim 1, it is characterised in that:
Surface texture described in the second step is building nano-wire array surface texture or micro-nano composite array surface texture.
3. preparing the method at the interface of ordered micro-configuration and controllable chemical composition as described in claim 1, it is characterised in that:
In the third step, when preparing super hydrophobic surface, vacuumizes and the time kept is 12h.
4. preparing the method at the interface of ordered micro-configuration and controllable chemical composition as described in claim 1, it is characterised in that:
In the second step, before silicon wafer is added, mixed reaction solution is put into 50 DEG C of baking ovens preheats 10min in advance.
5. preparing the method at the interface of ordered micro-configuration and controllable chemical composition as claimed in claim 2, it is characterised in that:
When the silicon wafer for preparing micro-nano composite array surface texture, the etching time for controlling hydrofluoric acid is 10min.
6. preparing the method at the interface of ordered micro-configuration and controllable chemical composition as described in claim 1, it is characterised in that:
The concentration of HF is 5mol/L in mixed reaction solution, and the concentration of silver nitrate is 0.02mol/L.
7. preparing the method at the interface of ordered micro-configuration and controllable chemical composition as claimed in claim 6, it is characterised in that:
The specific of the mixed reaction solution is put into plastic beaker the preparation method comprises the following steps: weighing silver nitrate 0.1699g, is drawn with syringe
10ml hydrofluoric acid adds water and is made into 50ml mixed solution.
8. the method at the interface as described in any one of claim 1 to 7 for preparing ordered micro-configuration and controllable chemical composition,
It is characterized in that: hydrophobic surface and super hydrophobic surface being prepared by the time of control vapor deposition in the third step.
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