CN107009023A - A kind of focus control and its focus adjustment method for adjusting laser focal - Google Patents
A kind of focus control and its focus adjustment method for adjusting laser focal Download PDFInfo
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- CN107009023A CN107009023A CN201710391263.3A CN201710391263A CN107009023A CN 107009023 A CN107009023 A CN 107009023A CN 201710391263 A CN201710391263 A CN 201710391263A CN 107009023 A CN107009023 A CN 107009023A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000005259 measurement Methods 0.000 claims abstract description 57
- 238000005520 cutting process Methods 0.000 claims abstract description 45
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000001105 regulatory effect Effects 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000003698 laser cutting Methods 0.000 claims description 16
- 238000012887 quadratic function Methods 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 10
- 239000012141 concentrate Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of focus control for adjusting laser focal, it, which includes automatic production line, pedestal, laser measurement mechanism, sample position switching mechanism, laser, occurs and focus regulating mechanism, the pedestal is located at the side of automatic production line, and the laser measurement mechanism, sample position switching mechanism, laser occur and focus regulating mechanism is successively set on pedestal；The laser occurs and focus regulating mechanism includes Z axis support, X-axis expansion link, laser lens, and one end of the X-axis expansion link is flexibly connected with Z axis support, and the laser lens are located at the other end of X-axis expansion link and above automatic production line；A kind of focus adjustment method is also disclosed, sample cutting is carried out by repeatedly mobile focal length of the invention, the precision of Focussing is improved；Focussing mode need not contact cutting material, not influence cutting material to use, and Focussing mode is safe and reliable, and structure is easily designed and builds.
Description
Technical field
The invention belongs to laser cutting technique field, and in particular to a kind of focus control of adjustment laser focal and its focusing
Method.
Background technology
Laser cutting can improve production capacity, and cut quality is high, and meaning is very great in the industrial production, laser cutting machine
Before being cut, it is necessary to first adjust the focal length of laser and cutting material, once laser focal adjusts bad, laser energy
Amount will be unable to concentrate in the tiny area on cutting material surface, so that cause depth of cut not enough, and the cutting matter of incision
Amount is not good；Therefore, the adjustment of laser cutting focal length is most important for laser cutting.
The content of the invention
In view of this, it is a primary object of the present invention to provide a kind of focus control for adjusting laser focal and its focusing side
Method, can solve the problem that technical problem caused by the change of laser cutting process mid-focal length.
To reach above-mentioned purpose, the technical proposal of the invention is realized in this way：
The embodiment of the present invention provides a kind of focus control for adjusting laser focal, and it includes automatic production line, pedestal, laser
Measuring mechanism, sample position switching mechanism, laser occur and focus regulating mechanism, and the pedestal is located at the one of automatic production line
Side, the laser measurement mechanism, sample position switching mechanism, laser occur and focus regulating mechanism is successively set on pedestal；
The laser occurs and focus regulating mechanism includes Z axis support, X-axis expansion link, laser lens, one end of the X-axis expansion link
It is flexibly connected with Z axis support, the laser lens are located at the other end of X-axis expansion link and above automatic production line.
In such scheme, the sample position switching mechanism includes leading screw, measurement bar, specimen holder, light source, and the leading screw hangs down
Directly it is arranged on pedestal and lower end is connected with motor, one end of the measurement bar is set on leading screw, the other end is set
Specimen holder, the light source is located at the side of specimen holder；It is sharp that the measurement bar drives sample being located on specimen holder or so to be switched to
The position of flash ranging measuring mechanism or sample position switching mechanism, while also realizing that laser focal is adjusted by height regulation.
In such scheme, the sample clamp for clamping sample is provided with the specimen holder.
In such scheme, the laser measurement mechanism includes measurement seat, projection screen, CCD camera, and measurement seat hangs down
Face setting projection screen directly, the CCD camera is arranged on specimen holder and positioned at any side in left and right of light source, described
CCD camera is oppositely arranged with projection screen.
In such scheme, the laser measurement mechanism includes measurement seat, projection screen, photosensitive sensor, the measurement seat
Vertical plane on projection screen is set, the back of the projection screen sets photosensitive sensor.
The embodiment of the present invention also provides a kind of focus adjustment method of laser focal, and this method is realized by following steps：
Step one：Focus control as described in above-mentioned scheme is in laser cutting process, at regular intervals, will measure
Bar moves axially to setting position, and turns to immediately below laser lens, and then sample is cut；
Step 2：After the completion of sample cutting, traverse measurement bar turns to measurement bar in front of measurement seat, opens light source, right
Sample projection on projection screen carries out depth survey, obtains current depth；
Step 3：If current depth has reached the depth that pinpointed focus is cut, then proceed laser cutting and turn
To step 5；, whereas if current depth is not up to the depth that pinpointed focus is cut, then the adjustment of focal length is carried out, into step
Rapid four.
Step 4：After determining focal length height according to current depth, sample position switching mechanism is on current Z axis height basis
On, moved towards Z axis towards pedestal direction, sample cutting is carried out every a segment distance, or dorsad pedestal direction is moved towards Z axis,
Sample cutting is carried out every a segment distance；
Step 5：Focometry is completed with after Focussing, measurement bar being moved into original position, laser is then proceeded by and cuts
Cut.
In such scheme, the sample projection on projection screen carries out depth survey, obtains current depth, specifically
For：Sample is cut n time, to the progress image measurement sampling of n depth of cut, each depth data Li of acquisition (i=1 ...,
N), and according to each depth data Li set up depth array.
It is described that focal length height is determined according to current depth in such scheme, be specially：Place is filtered to depth data Li
After reason, then curvilinear function F (x)=ax is obtained to depth data Li progress quadratic function process of fitting treatment2+ bx+c, according to curve letter
Number F (x)=ax2+ bx+c determines most deep depth of cut Lmax, and will most deep depth of cut LmaxCorresponding Z axis coordinate is used as Jiao
Away from height.
In such scheme, as the curvilinear function F (x)=ax2+ bx+c determines that the depth trend of cutting is monotonic increase
When, it is focal length height to take the depth data Ln that n-th is cut；The curvilinear function F (x)=ax2+ bx+c determines the depth of cutting
When trend is monotone decreasing, it is focal length height to take the depth data L1 of the 1st cutting.
In such scheme, as the curvilinear function F (x)=ax2+ bx+c determines that the depth trend of cutting subtracts afterwards first to increase
When, to curvilinear function F'(x)=0 solve take extreme value x=xmax；Then contrasted in depth array, obtain a times cutting
Depth data La,La+1, 1 ＜ a ＜ n-1 so that La＜ Lxmax＜ La+1；IfSo take Lmax=
La+1；IfSo take Lmax=La；So as to try to achieve depth capacity point Lmax,1≤max≤n。
Compared with prior art, the present invention is pointed to the cutting on automatic production line in laser generation and focus regulating mechanism
In material cutting process, the sample position switching mechanism is periodically transferred under laser generation and focus regulating mechanism to sample
Product are cut, and are being transferred to the progress depth survey of laser measurement mechanism afterwards, if depth survey is qualified, the laser hair
Raw and focus regulating mechanism continues to cut to cutting material, and on the contrary then described laser occurs and focus regulating mechanism focusing is carried out
Cutting is further continued for after adjustment, so, sample cutting is carried out by repeatedly moving focal length, improves the precision of Focussing；Focal length
Adjustment mode need not contact cutting material, not influence cutting material to use, and Focussing mode is safe and reliable, and structure is easy
In designing and build.
Brief description of the drawings
Fig. 1 provides a kind of structural representation for the focus control for adjusting laser focal for the embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The embodiment of the present invention provides a kind of focus control for adjusting laser focal, as shown in figure 1, it includes automatic production line
1st, pedestal 2, laser measurement mechanism 3, sample position switching mechanism 4, laser occur and focus regulating mechanism 5, and the pedestal 2 is located at
The side of automatic production line 1, the laser measurement mechanism 3, sample position switching mechanism 4, laser occur and focus regulating mechanism 5
Set gradually on the base 2；The laser occurs and focus regulating mechanism 5 includes Z axis support 51, X-axis expansion link 52, laser mirror
First 53, one end of the X-axis expansion link 52 is flexibly connected with Z axis support 51, and the laser lens 53 are located at X-axis expansion link 52
The other end and positioned at the top of automatic production line 1, so, occurs in laser and focus regulating mechanism 5 is pointed to automatic production line 1
On cutting material cutting process in, the sample position switching mechanism 4 be periodically transferred to laser occur and Focussing
Sample is cut under mechanism 5, laser measurement mechanism 3 is transferred to afterwards and carries out depth survey, if depth survey is qualified,
Then the laser occurs and focus regulating mechanism 5 continues to cut to cutting material, and on the contrary then described laser occurs and Focussing
The focusing of mechanism 5 is further continued for cutting after being adjusted.
Specifically, the laser occurs and the X-axis expansion link 52 of focus regulating mechanism 5 is used to cut movement, Z axis support 51
For Focussing.
The sample position switching mechanism 4 includes leading screw 41, measurement bar 42, specimen holder 43, light source 44, and the leading screw 41 hangs down
Directly it is arranged on pedestal 1 and lower end is connected with motor, one end of the measurement bar 42 is set on leading screw 41, the other end
Specimen holder 43 is set, and the light source 44 is located at the side of specimen holder 43；The measurement bar 42 drives the sample being located on specimen holder 43
Product or so are switched to the position of laser measurement mechanism 3 or sample position switching mechanism 4, while also realizing laser by height regulation
Focussing.
The sample clamp 431 for clamping sample is provided with the specimen holder 43, thus it is ensured that sample is firm.
Further, the laser measurement mechanism 3 includes measurement seat 31, projection screen 32, CCD camera, the measurement seat
Projection screen 32 is set on 31 vertical plane, and the CCD camera is arranged on specimen holder 43 and appointed positioned at the left and right of light source 44
Meaning side, the CCD camera is oppositely arranged with projection screen 32.
Alternatively, the laser measurement mechanism 3 includes measurement seat 31, projection screen 32, photosensitive sensor, the measurement seat
Projection screen 32 is set on 31 vertical plane, and the back of the projection screen 32 sets photosensitive sensor.
The course of work of the present invention：
Step1. equipment is initialized：
Equipment is powered, and parameter is set to initial parameter.
Step2. focometry：
The laser occurs and focus regulating mechanism 5 is in laser cutting process, at regular intervals, the sample position
Measurement bar 42 is moved axially to setting position by switching mechanism 4 by leading screw 41, and is turned to immediately below laser lens 53, then
Carry out sample cutting.
After the completion of sample cutting, then by the traverse measurement bar 42 of leading screw 41, measurement bar 42 is turned into the front of measurement seat 31,
Light source 44 is opened, depth survey is carried out to the sample projection on projection screen 32.
If calculating obtains depth and reached the depth that pinpointed focus is cut, then proceed laser cutting, enter
Step4。
If being not up to the depth that pinpointed focus is cut if calculating and obtaining depth, the adjustment of focal length is carried out, is entered
Step3。
Step3. focal length is adjusted：
On the basis of the present level of Z axis support 51, moved towards Z axis support 51 towards the direction of pedestal 2, at a certain distance
Sample cutting is carried out, or towards Z axis support 51, dorsad the direction of pedestal 2 is moved, and sample cutting is carried out at a certain distance.
Then carry out focometry according to step2, will the corresponding Z axis coordinate of most deep depth of cut as focal length height, and
Z axis support 51 is moved to focal length height.
Step4. it is cut by laser：
Focometry is completed with after Focussing, measurement bar 42 being moved into original position, laser cutting is then proceeded by.
The embodiment of the present invention also provides a kind of focus adjustment method for adjusting laser focal, and this method is real by following steps
It is existing：
Step one：Focus control is in laser cutting process, at regular intervals, and measurement bar is moved axially to set position
Put, and turn to immediately below laser lens, then sample is cut；
Step 2：After the completion of sample cutting, traverse measurement bar turns to measurement bar in front of measurement seat, opens light source, right
Sample projection on projection screen carries out depth survey, obtains current depth；
Step 3：If current depth has reached the depth that pinpointed focus is cut, then proceed laser cutting and turn
To step 5；, whereas if current depth is not up to the depth that pinpointed focus is cut, then the adjustment of focal length is carried out, into step
Rapid four.
Step 4：After determining focal length height according to current depth, sample position switching mechanism is on current Z axis height basis
On, moved towards Z axis towards pedestal direction, sample cutting is carried out every a segment distance, or dorsad pedestal direction is moved towards Z axis,
Sample cutting is carried out every a segment distance；
Step 5：Focometry is completed with after Focussing, measurement bar being moved into original position, laser is then proceeded by and cuts
Cut.
Specifically, the sample projection on projection screen carries out depth survey, obtains current depth, is specially：It is right
Sample is cut n time, to the progress image measurement sampling of n depth of cut, each depth data Li of acquisition (i=1 ..., n), and
Depth array is set up according to each depth data Li.
It is described that focal length height is determined according to current depth, be specially：Depth data Li is filtered after processing, then to depth
Degrees of data Li carries out quadratic function process of fitting treatment and obtains curvilinear function F (x)=ax2+ bx+c, according to curvilinear function F (x)=ax2+
Bx+c determines most deep depth of cut Lmax, and will most deep depth of cut LmaxCorresponding Z axis coordinate is used as focal length height.
As the curvilinear function F (x)=ax2When+bx+c determines the depth trend of cutting for monotonic increase, n-th is taken to cut
The depth data Ln cut is focal length height；The curvilinear function F (x)=ax2+ bx+c determines that the depth trend of cutting is passed for dullness
When subtracting, it is focal length height to take the depth data L1 of the 1st cutting.
As the curvilinear function F (x)=ax2When+bx+c determines that the depth trend of cutting subtracts afterwards first to increase, to curvilinear function
F'(x)=0 solve and take extreme value x=xmax；Then contrasted in depth array, obtain the depth data L of a times cuttinga,
La+1, 1 ＜ a ＜ n-1 so that La＜ Lxmax＜ La+1；IfSo take Lmax=La+1；IfSo take Lmax=La；So as to try to achieve depth capacity point Lmax,1≤max≤n。
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.
Claims (10)
1. a kind of focus control for adjusting laser focal, it is characterised in that it includes automatic production line, pedestal, laser measuring machine
Structure, sample position switching mechanism, laser occur and focus regulating mechanism, and the pedestal is located at the side of automatic production line, described
Laser measurement mechanism, sample position switching mechanism, laser occur and focus regulating mechanism is successively set on pedestal；The laser
Occur and focus regulating mechanism includes Z axis support, X-axis expansion link, laser lens, one end and the Z axis support of the X-axis expansion link
It is flexibly connected, the laser lens are located at the other end of X-axis expansion link and above automatic production line.
2. a kind of focus control for adjusting laser focal according to claim 1, it is characterised in that：The sample position is cut
Converting mechanism includes leading screw, measurement bar, specimen holder, light source, and the leading screw is vertically set on pedestal and lower end and motor
Connection, one end of the measurement bar is set on leading screw, and the other end sets specimen holder, and the light source is located at the side of specimen holder；
The measurement bar drive is located at the position that sample on specimen holder or so is switched to laser measurement mechanism or sample position switching mechanism
Put, while also realizing that laser focal is adjusted by height regulation.
3. a kind of focus control for adjusting laser focal according to claim 2, it is characterised in that：Set on the specimen holder
It is equipped with the sample clamp for clamping sample.
4. a kind of focus control of adjustment laser focal according to Claims 2 or 3, it is characterised in that：The Laser Measuring
Measuring mechanism includes setting projection screen, the CCD phases on measurement seat, projection screen, CCD camera, the vertical plane of the measurement seat
Machine is arranged on specimen holder and positioned at any side in left and right of light source, and the CCD camera is oppositely arranged with projection screen.
5. a kind of focus control of adjustment laser focal according to Claims 2 or 3, it is characterised in that：The Laser Measuring
Measuring mechanism includes setting projection screen, the throwing on measurement seat, projection screen, photosensitive sensor, the vertical plane of the measurement seat
The back of shadow screen sets photosensitive sensor.
6. a kind of focus adjustment method of laser focal, it is characterised in that this method is realized by following steps：
Step one：Focus control as described in claim 1-5 any one is in laser cutting process, at regular intervals,
Measurement bar is moved axially into setting position, and turned to immediately below laser lens, then sample is cut；
Step 2：After the completion of sample cutting, measurement bar is turned in front of measurement seat, opens light source, to projection by traverse measurement bar
Sample projection on screen carries out depth survey, obtains current depth；
Step 3：If current depth has reached the depth that pinpointed focus is cut, then proceed laser cutting and go to step
Rapid five；, whereas if current depth is not up to the depth that pinpointed focus is cut, then the adjustment of focal length is carried out, into step 4.
Step 4：After determining focal length height according to current depth, sample position switching mechanism on the basis of current Z axis height,
Moved towards Z axis towards pedestal direction, sample cutting is carried out every a segment distance, or dorsad pedestal direction is moved towards Z axis, every
One segment distance carries out sample cutting；
Step 5：Focometry is completed with after Focussing, measurement bar being moved into original position, laser cutting is then proceeded by.
7. the focus adjustment method of a kind of laser focal according to claim 6, it is characterised in that described on projection screen
Sample projection carries out depth survey, obtains current depth, is specially：Sample is cut n times, image is carried out to n depth of cut
Measurement sampling, obtaining each depth data Li, (i=1 ... n), and sets up depth array according to each depth data Li.
8. the focus adjustment method of a kind of laser focal according to claim 6 or 7, it is characterised in that the basis is currently deep
Degree determines focal length height, is specially：Depth data Li is filtered after processing, then quadratic function plan is carried out to depth data Li
Conjunction processing obtains curvilinear function F (x)=ax2+ bx+c, according to curvilinear function F (x)=ax2+ bx+c determines most deep depth of cut
Lmax, and will most deep depth of cut LmaxCorresponding Z axis coordinate is used as focal length height.
9. the focus adjustment method of a kind of laser focal according to claim 8, it is characterised in that when the curvilinear function F (x)
=ax2When+bx+c determines the depth trend of cutting for monotonic increase, it is focal length height to take the depth data Ln that n-th is cut；Institute
State curvilinear function F (x)=ax2When+bx+c determines the depth trend of cutting for monotone decreasing, the depth data of the 1st cutting is taken
L1 is focal length height.
10. a kind of focus adjustment method for adjusting laser focal according to claim 8, it is characterised in that when the curve
Function F (x)=ax2+ bx+c determine cutting depth trend for first increases subtract afterwards when, to curvilinear function F'(x)=0 solution take extreme value
X=xmax；Then contrasted in depth array, obtain the depth data L of a times cuttinga,La+1, 1 ＜ a ＜ n-1 so that La
＜ Lxmax＜ La+1；IfSo take Lmax=La+1；IfSo take Lmax=
La；So as to try to achieve depth capacity point Lmax,1≤max≤n。
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|---|---|---|---|
| CN201710391263.3A CN107009023B (en) | 2017-05-27 | 2017-05-27 | A kind of focus control and its focus adjustment method adjusting laser focal |
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|---|---|---|---|
| CN201710391263.3A CN107009023B (en) | 2017-05-27 | 2017-05-27 | A kind of focus control and its focus adjustment method adjusting laser focal |
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| Publication Number | Publication Date |
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| CN107009023A true CN107009023A (en) | 2017-08-04 |
| CN107009023B CN107009023B (en) | 2019-02-15 |
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ID=59450997
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107322168A (en) * | 2017-08-24 | 2017-11-07 | 安徽华生机电设备有限公司 | Automatic focusing is away from laser marking machine |
| CN107716468A (en) * | 2017-10-31 | 2018-02-23 | 广东工业大学 | A kind of laser auto focusing method, system, device and readable storage medium storing program for executing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101670715A (en) * | 2009-09-23 | 2010-03-17 | 上海市激光技术研究所 | Tire laser marking device and method based on machine vision identity |
| KR20140010197A (en) * | 2014-01-15 | 2014-01-23 | 제일엠텍(주) | Apparatus for laser marking with function of automatic regulation of focus |
| CN205311080U (en) * | 2016-01-06 | 2016-06-15 | 武汉华工激光工程有限责任公司 | A laser marking device for outer machine of air conditioner |
| CN205705768U (en) * | 2016-05-05 | 2016-11-23 | 上海眸特实业有限公司 | Based on CCD detection have focal length self-tuning laser marking instrument |
| DE102015108248A1 (en) * | 2015-05-26 | 2016-12-01 | Scanlab Ag | Laser material processing system and method for adjusting the size and position of a laser focus |
| CN205768092U (en) * | 2016-05-30 | 2016-12-07 | 大族激光科技产业集团股份有限公司 | A kind of aluminum-plastic bubble-cap palte feeding, paging and laser mark printing device |
-
2017
- 2017-05-27 CN CN201710391263.3A patent/CN107009023B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101670715A (en) * | 2009-09-23 | 2010-03-17 | 上海市激光技术研究所 | Tire laser marking device and method based on machine vision identity |
| KR20140010197A (en) * | 2014-01-15 | 2014-01-23 | 제일엠텍(주) | Apparatus for laser marking with function of automatic regulation of focus |
| DE102015108248A1 (en) * | 2015-05-26 | 2016-12-01 | Scanlab Ag | Laser material processing system and method for adjusting the size and position of a laser focus |
| CN205311080U (en) * | 2016-01-06 | 2016-06-15 | 武汉华工激光工程有限责任公司 | A laser marking device for outer machine of air conditioner |
| CN205705768U (en) * | 2016-05-05 | 2016-11-23 | 上海眸特实业有限公司 | Based on CCD detection have focal length self-tuning laser marking instrument |
| CN205768092U (en) * | 2016-05-30 | 2016-12-07 | 大族激光科技产业集团股份有限公司 | A kind of aluminum-plastic bubble-cap palte feeding, paging and laser mark printing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107322168A (en) * | 2017-08-24 | 2017-11-07 | 安徽华生机电设备有限公司 | Automatic focusing is away from laser marking machine |
| CN107716468A (en) * | 2017-10-31 | 2018-02-23 | 广东工业大学 | A kind of laser auto focusing method, system, device and readable storage medium storing program for executing |
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| CN107009023B (en) | 2019-02-15 |
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Denomination of invention: A focusing device for adjusting laser focal length and its focusing method Effective date of registration: 20210128 Granted publication date: 20190215 Pledgee: Jiujiang Pohu new city investment and Construction Co.,Ltd. Pledgor: SUZHOU WEIYING LASER TECHNOLOGY Co.,Ltd. Registration number: Y2021980000823 |
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