CN107003537A - Camera gun suspension device with polymeric support elements - Google Patents
Camera gun suspension device with polymeric support elements Download PDFInfo
- Publication number
- CN107003537A CN107003537A CN201580065775.XA CN201580065775A CN107003537A CN 107003537 A CN107003537 A CN 107003537A CN 201580065775 A CN201580065775 A CN 201580065775A CN 107003537 A CN107003537 A CN 107003537A
- Authority
- CN
- China
- Prior art keywords
- supporting member
- mounting assembly
- moving link
- assembly according
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/025—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant characterised by having a particular shape
- F16F1/027—Planar, e.g. in sheet form; leaf springs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/005—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion using electro- or magnetostrictive actuation means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
- F16M13/02—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
- F16M13/022—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle repositionable
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of Camera Lenses (AREA)
- Rolling Contact Bearings (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Sliding-Contact Bearings (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
For the mounting assembly of camera lens element, its moving link for including the supporting member with line attachment structure and being attached to supporting member.Moving link includes plate, extends the flexible arm and line attachment structure for being coupled to supporting member from plate.The plate of supporting member supporting movement component, to be moved relative to supporting member.Supporting member includes the liner part from one in the plate of supporting member and moving link extension, and with another polymer interface surface portion slidably engaged in the plate of supporting member and moving link.Intelligent memory alloy wire is attached to the line attachment structure of supporting member and moving link, and extends between supporting member and the line attachment structure of moving link.
Description
The cross reference of related application
This application claims the rights and interests of following U.S. Provisional Application, entire contents are incorporated herein by reference and for owning
Purpose：Entitled " photorefractive crystals (OIS) camera gun suspends the improvement of device ", the application number submitted on December 2nd, 2014
For 62/086,595 U.S. Provisional Application, and submitted on March 6th, 2015 entitled " there are the two of integrated electrical lead
The U.S. Provisional Application of part formula camera gun suspension device " Application No. 62/129,562.
Technical field
Device is suspended present invention relates in general to camera gun, such as those are combined camera mirror in the mobile phone
Head suspension device.In particular it relates to the supporting member that can be movable relatively between part of this suspension device.
Background technology
Publication No. WO 2014/083318 and WO 2013/175197 PCT international applications disclose a kind of camera mirror
Head photorefractive crystals (OIS) suspension device system, it has what is supported by the deflection element or latch plate in fixed support component
Moving parts (camera lens element can mount to moving parts).Moving parts are supported for by multiple balls come in support
Moved on component.The deflection element formed by the metal of such as phosphor bronze has maneuvering board and flex member.Flex member is in maneuvering board
Extend between fixed support component and as spring, so that moving parts can be relative to fixed support component motion.Rolling
Pearl allows moving parts with the resistance exercise of very little.Moving parts and support component are closed by the shape memory extended in inter-module
Golden (SMA) line connection.Every in SMA wire has and is attached to one end of support component and is attached to the opposite end of moving parts.
Suspension device is activated by applying electric drive signal to SMA wire.Above-mentioned PCT Publication is incorporated by reference for all purposes
In this.
Still improved camera lens suspension device is persistently needed.These types high functionalized, durable and effectively manufacture
Suspension device structure will be especially desired to.
The content of the invention
Embodiments of the invention include the mounting assembly with improved supporting member.In embodiment, mounting assembly includes：
Include the supporting member of line attachment structure, and be attached to the moving link of supporting member.Moving link includes plate, extended from plate
It is coupled to the flexible arm and line attachment structure of supporting member.Limit the low friction polymeric material material position at slidably supported interface
Between supporting member and the plate of moving link.Intelligent memory alloy wire is attached to the line attachment knot of supporting member and moving link
Structure simultaneously extends between supporting member and the line attachment structure of moving link.Embodiment includes multiple abutment faces, abutment face
In each can include with periphery polymer surfaces part.
Brief description of the drawings
Figure 1A is the vertical view isometric view for the suspension device for including supporting member according to an embodiment of the invention.
Figure 1B is the plan view from above of the suspension device shown in Figure 1A.
Fig. 2A is the vertical view isometric view of the supporting member of the suspension device shown in Figure 1A.
Fig. 2 B are the face upwarding views of the supporting member shown in Fig. 2A.
Fig. 3 A are the detailed vertical view isometric views of the installation region of the supporting member shown in Fig. 2A.
Fig. 3 B are the detailed bottom isometric views of the installation region of the supporting member shown in Fig. 2A.
Fig. 4 A are the vertical view isometric views of the moving link of the suspension device shown in Figure 1A.
Fig. 4 B are the face upwarding views of the moving link shown in Fig. 4 A.
Fig. 5 is that the flexing arm installation region of the moving link shown in Fig. 4 A and the detailed vertical view of line attached apparatus are equidistantly regarded
Figure.
Fig. 6 is that the flexible arm installation region of the moving link shown in Fig. 4 A and the detailed vertical view of line attached apparatus are equidistantly regarded
Figure.
Fig. 7 is supporting member installation region and the detailed vertical view etc. of flexible arm installation region of the suspension device shown in Figure 1A
Away from view.
Fig. 8 is the detailed isometric view of one in the supporting member shown in Fig. 2A.
Fig. 9 is the vertical view isometric view for suspending device according to an embodiment of the invention.
Figure 10 is the exploded isometric view of the suspension device shown in Fig. 9.
Figure 11 is the sectional view of the suspension device shown in Fig. 9.
Figure 12 to Figure 18 is the annotation diagram for the suspension device that can include supporting member according to an embodiment of the invention.
Figure 19 to Figure 20 describes the feature of supporting member according to an embodiment of the invention.
Figure 21 to Figure 25 is the annotation diagram for the suspension device for including supporting member according to an embodiment of the invention.
Figure 26 A are the vertical view isometric views for the suspension device for including limiter according to an embodiment of the invention.
Figure 26 B are the plan view from above of the suspension device shown in Figure 1A.
Figure 27 is the vertical view isometric view of the supporting member of the suspension device shown in Figure 26 A.
Figure 28 A are the vertical view isometric views of the moving component of the suspension device shown in Figure 26 A.
Figure 28 B are the face upwarding views of the moving component shown in Figure 28 A.
Figure 29 is to show the embodiment of limiter, the detailed isometric view of a part for suspension device shown in Figure 26 A.
Figure 30 is to show the embodiment of limiter, the detailed side view of a part for suspension device shown in Figure 26 A.
Embodiment
Figure 1A and Figure 1B are shown includes supporting member 100 and slidably supported interface (in figure according to an embodiment of the invention
Shown in 2A and Fig. 8) mounting assembly 10.As illustrated, mounting assembly 10 includes flexible print circuit (FPC) or supporting member
12 and it is attached to the spring crimping circuit or moving link 14 of supporting member.Intelligent memory alloy (SMA) line 15 is in supporting member
Extend between 12 and moving link 14, and can be by electric actuation is with movement and controls moving link relative to the position of supporting member
Put.In embodiment, mounting assembly 10 is the photograph that can be bonded in such as mobile phone, tablet personal computer, laptop computer
Machine lens optical is steady as (OIS) device.
Fig. 2A, Fig. 2 B, Fig. 3 A and Fig. 3 B illustrate in greater detail supporting member 12.As illustrated, supporting member 12 is wrapped
Include the trace 18a-18d in the conductor layer on basalis 16 and multiple conductive traces 18, such as basalis.Dielectric layer 20 is positioned
Between conductive trace 18 and basalis 16, so that trace is electrically insulated with basalis.Such as (that is, the static crimp of crimp 24；
Show four static crimps in the embodiment shown) multiple line attachment structures be positioned on basalis 16.In shown reality
Apply in example, crimp 24 is organized into two pairs of adjacent structures, the adjacent structure of two couple, which is integrally formed in, to be located at and basalis
Major planar surface part 26 be spaced apart on the flange 25 in the basalis 16 at horizontal plane (for example, in a z-direction).It is other
Embodiment (not shown) include other line attachment structures (for example, welded disc) and/or with it is other arrangement (for example, individually rather than into
The line attachment structure of tissue over the ground).
In embodiment, below by supporting member 100 in greater detail from supporting member 12 (for example, from basalis 16
Part 26) extension and engagement movement component 14 bottom side (that is, the side shown in Fig. 4 B) can be transported relative to supporting member
Moving link is supported dynamicly.The plate 60 of supporting member 100 and moving link 14 coordinates, with movable member and supporting member 12 it
Between slidable polymer interface is provided.In other embodiments, supporting member is attached to moving link 14 and from moving link 14
Extend to slidably engage supporting member 12.Although showing three supporting members 100, other realities in the embodiment shown
Applying example has more or less supporting members.
Trace 18 includes terminal 30 and engagement pad 32 in the conductor layer on basalis 16.It is each by terminal in trace 18
30 are attached to engagement pad 32.For example, engagement pad 32a and 32b are located at the first installation region 33 of supporting member 12, and trace
Terminal 30a and 30b are attached to pad 32a and 32b by 18a and 18b respectively.Engagement pad 32 at second installation region 35 passes through trace
18 are similarly coupled to terminal 30.In the embodiment shown, engagement pad 32 is positioned at each crimp in crimp 24, and
And each in engagement pad is attached to single terminal 30 (for example, terminal 30d is attached to by trace 18d by single trace
Pad 32d).The part for the basalis 16 that terminal 30 is positioned on is formed (for example, in shown reality from the plane of main surface portion point 26
Apply in example, plane of the part perpendicular to main surface portion point).
Fig. 3 A and Fig. 3 B illustrate in greater detail the embodiment of the installation region 33 of supporting member 12.As illustrated, installing
Region 33 includes first and installs the installation pad 42 of pad 40 and second.The position that pad 42 includes being electrically isolated with the other parts of basalis is installed
Island or pad part 44 in basalis 16.Island pad part 44 can pass through the island pad part and adjacent part in basalis
Between the region of dielectric 20 that extends by partly from the adjacent part support substrate layer basalis of basalis 16.Trace 18a
Extend to island pad part 44 with engagement pad 32a, and in embodiment trace 18a and engagement pad 32a by electrical connection, such as
Plating the or other path 46 that dielectric 20 is extended through at installation pad 42 is to electrically couple to island pad part 44.Other realities
Applying example includes replacing path 46 or is attached to other electrical connections of path 46, such as, such as in engagement pad 32a and island pad part
The electroconductive binder at the edge of dielectric 20 is extended past between 44.The neighbouring installation pad 42 of pad 40 is installed, and including basalis
Pad part 48 (in embodiment, as electrically grounded or public structure) in 16 and electrical connection, such as engagement pad 32b is connected to
The path 50 of pad part 48.Installation region 35 can be similar to installation region 33.
Fig. 4 A, Fig. 4 B, Fig. 5, Fig. 6 and Fig. 7 illustrate in greater detail the embodiment of moving link 14.As illustrated, fortune
Dynamic component 14 includes plate 60 and the spring or flexible arm 62 that extend from plate 60.In the embodiment shown, plate 60 is rectangular elements, often
Individual flexible arm 62 is the slender member of the Part I 64 and Part II 66 extended with the both sides along the periphery of plate.Plate 60
Formed with flexible arm 62 in the spring metal basalis 68 of such as stainless steel.Moving link 14 also includes SMA wire attachment structure,
Such as (the motion crimp of crimp 70；Four motion organized in pairs crimps are shown in the embodiment shown).In shown reality
Apply in example, crimp 70 is integral with spring metal basalis 68 as plate 60, and by same spring metal basalis 68
Form basalis (that is, on the end of the arm 72 extended from plate).In other embodiments, moving link 14 is by differently structure
Make.For example, in other embodiments (not shown), flexible arm 62 can have different shapes, different quantity, different groups
Knit, and/or can extend from the other positions on plate 60.In other embodiments (not shown), crimp 70 can also be formed
To be attached to the independent structure (that is, integral not with plate) of plate 60.It is attached that other embodiments (not shown) includes other types of line
Binding structure (for example, welded disc) and/or the line attachment structure with other arrangement tissues (for example, individually rather than in couples).
The end of flexible arm 62 has installation region 74, and installation region 74 is configured for attachment to the installing zone of supporting member 12
Domain 33 and installation region 35.Conductive trace 76 on basalis 68 extends on flexible arm 62 from installation region 74.In embodiment
In, trace 76 also extends past the part of plate 60 on basalis 68.In the embodiment shown, trace 76 is also extended to positioned at plate
The engagement pad 77 on arm 72 on 60.In the embodiment shown, engagement pad 77 is located at what is extended from the major planar surface of plate 60
On platform.In other embodiments (not shown), engagement pad is (for example, on plate 60) located elsewhere.Dielectric layer 78
It is positioned between conductive trace 76 and basalis 68, trace and basalis is electrically insulated.Installation region 74 includes first and installed
Pad 80 and second installs pad 82.Each pad 82 of installing includes being located in the basalis 68 being electrically isolated with the other parts of basalis
Island or pad part 84.Each trace 76 extends past installation pad 80 (and being insulated with installing pad 80) from pad 82 is installed.In shown reality
Apply in example, the part that trace 76 extends between pad 80 and 82 is installed expands by the trace parts on flexible arm 62, to provide
Support for the island pad part 84 in basalis 68.Trace 76 extends to island pad part 84, and in embodiment
In, trace 76 is sent a telegram here by electrically connecting, such as extending through plating the or other path 86 of the dielectric 78 at installation pad 82
It is connected to island pad part.Other embodiments include replacing path 86 or are attached to other electrical connections of path 86, such as in mark
The electroconductive binder at the edge of dielectric 78 is extended past between line 76 and island pad part 84.Installing pad 80 is included by electricity Jie
Pad part 90 in the basalis 68 that matter 78 is electrically isolated with trace 76.In the embodiment shown, trace 76 is by installing the He of pad 80
The part for installing pad 82 is circular and in central opening, but in other embodiments (not shown), it takes other shapes
Formula.
As may in Figure 1A and Fig. 7 it is optimal shown in, the installation region 74 of moving link flexible arm 62 is mechanically attached
To the installation region 33 and installation region 35 of supporting member 12.Trace 76 on flexible arm 62 is electrically connected on supporting member 12
The trace 18 of association.In embodiment, pass through the pad part 84 and pad part 90 in the basalis 68 of moving link 14 and support
The welding between corresponding pad part 44 and pad part 48 in the basalis 16 of component 12 is mechanically connected.Can be such as
The opening in the trace 76 at pad part 84 and pad part 90 is placed through to be welded.Welding also causes moving link 14
It can be electrically connected between pad part 84 and pad part 90 and the corresponding pad part 44 and pad part 48 of supporting member 12.By these
Electrical connection, the metallic substrate layer 68 and motion crimp 70 of moving link 14 are so as to jointly be electrically connected to the trace 18 of association
(that is, such as through the trace 18b of path 50).Similarly, each flexible arm trace 76 is electrically connected to the trace 18 of association (i.e.,
Such as through the trace 18a of path 46).Other embodiments of the invention (not shown), which has, to be used to mechanically pacify flexible arm 62
It is filled to supporting member 12 and/or associates the other of trace 18 for the trace 76 on flexible arm to be electrically connected on supporting member
Structure.In the embodiment shown, conductive metal region 94 is positioned directly in the metal of the moving link 14 at crimp 70
(that is, dielectric or other insulating materials are not present between conductive metal region and metallic substrate layer) on basalis 68, to increase
Electrical connection between the SMA wire 15 that strong metal basalis is engaged with by crimp.
As described in more detail below, supporting member 12 and moving link 14 can be by addition and/or the technique shapes cut down
Into.In embodiment, basalis 16 and/or basalis 68 are stainless steels.In other embodiments, basalis 16 and/or base
Bottom 68 is other metals or material, such as phosphor bronze.Trace 18 and trace 76, terminal 30 and engagement pad 32 can be by
Copper, copper alloy or other conductors are formed.Polyimides or other insulating materials may be used as dielectric 20 and dielectric 78.Support
The other embodiments (not shown) of component 12 and/or moving link 14 has more or less traces 18 and trace 76, and
These traces can be arranged to different Bututs.The structure beyond crimp 24, such as weldment can be used to make SMA wire 15
It is attached to basalis 16.Other embodiments of the invention (not shown) has more or less crimps 24 and crimp 70,
And these crimps can be located at the diverse location on supporting member 12 and moving link 14 respectively.
Fig. 8 is the detailed diagram of a part for the supporting member 12 for including supporting member 100.As illustrated, supporting member 100 is wrapped
Include liner part 102 and polymer surfaces region or part 104.Liner part 102 extends from the basalis 16 of supporting member 12
So that surface portion 104 to be positioned to height (for example, highly for 25-200 μm in embodiment) place relative to supporting member 12,
Slided on supporting member 100 part that will highly the moving link 14 engaged by surface portion (such as plate 60) be allowed.In reality
Apply in example, liner part 102 and polymer surfaces part 104 can be single-piece polymeric members.Polymer surfaces part 104
The property of (and alternatively, liner part 102) can include it is relatively low rub, relatively low abrasion and/or relatively high firm
Degree.In one embodiment, liner part 102 and polymer surfaces part 104 are formed by such as POM (polyformaldehyde) material.
In other embodiments, surface portion 104 is formed by other polymer of such as fluoropolymer (for example, teflon/Teflon).
Supporting member 100 can be regularly attached by adhesive 106 (for example, resinoid in embodiment for 5-25 μ m-thicks)
To supporting member 12.In other embodiments, supporting member 100 is attached to branch by the other methods or structure such as by welding
Support component 12.In the embodiment shown, supporting member 100 is attached to the support in the depression 108 of the partial etching in basalis 16
Component 12.In other embodiments, supporting member 100 is attached to the surface portion of basalis 16, and the surface portion is without such as recessed
The depression in cave 108.
In other embodiments, liner part 102 can be formed by the other materials of such as metal, and surface portion
104 can be the layer or coating for the polymer being located on metal gasket part.For example, in embodiment, liner part 102 can be with
It is the forming pit in metallic substrate layer 16.In other embodiments, liner part 102 is for example by adhesive or welded attached
It is connected to the single metal or polymeric member of supporting member 12.In other embodiments, supporting member 100 can be from moving link
14 (for example, from basalis 68) extend and slidably engage supporting member 12 (for example, at basalis 16).Such as Fig. 8
Shown in embodiment, the surface portion 104 with periphery can be flat.In other embodiments, surface portion
104 have other shapes, such as convex.The surface of supported part engagement can be metal, and can be thrown by laser
Light, electropolishing or other methods are processed, to provide low surface roughness and further reduce rubbing for slidably supported interface
Wipe.Other embodiments are additionally included in the lubricant of slidably supported interface, such as carry Lean (Xylan/ teflon coatings/
Xylan).
Such as the supporting member of supporting member 100 provides important advantage.For example, except providing high-quality, reliable, low friction
Slidably supported interface outside, they relatively efficiently can manufacture and assemble, and realize supporting member 12 and moving link
The interval (that is, the suspension device of relative thin) of relative close between 14.
Fig. 9 to Figure 11 shows the mounting assembly 110 according to an embodiment of the invention with supporting member 200.As schemed
Show, mounting assembly 110 includes cover bottom 111, flexible print circuit (FPC) or supporting member 112, supporting member seat ring 113, motion structure
Part 114 and motion crimp 115.The feature of mounting assembly 110 can be similar to the feature of above-mentioned mounting assembly 10.Support structure
Part 112 includes multiple line attachment structures, such as static crimp 124.Supporting member seat ring 113 can be polymeric member and have
There is polymeric support plate surface part 203.Supporting member seat ring 113 is regularly attached (for example, by adhesive or pad) extremely
Cover bottom 111 and/or supporting member 112.Polymer surfaces part 203 (and alternatively, the other parts of supporting member seat ring 113)
Property can include it is relatively low rub, relatively low viscosity, relatively low abrasion, and/or relatively high rigidity.In a reality
Apply in example, supporting member seat ring 113 and polymer surfaces part 203 are formed by such as POM (polyformaldehyde) material.Implement other
In example, supporting member seat ring 113 and/or surface portion 203 by such as fluoropolymer (for example, teflon) other polymer shapes
Into.As shown in Figure 11, radome 117 can be attached to the part of cover bottom 111 and sealing cover mounting assembly 110.
Moving link 114 includes plate 160 and the spring or flexible arm 162 that extend from plate.Plate 160 and flexing arm 162 are by all
Spring metal layer such as stainless steel is formed.The end of flexible arm 162 has installation region 17, and installation region 17 is configured to install
To the installation region 133 of supporting member 112.Motion crimp 115 includes the line attachment structure of such as crimp 170, and attached
(for example, by welding) is connect to the plate 160 of moving link 114 with the part as moving link.Although not in Fig. 9 to Figure 11
In show, SMA wire be attached on supporting member 112 association crimp 124 and positioned at motion crimp 115 on crimping
Part 170, and in the association crimp 124 on supporting member 112 and the crimp 170 on motion crimp 115
Between extend.
Supporting member 200 includes pad (distance piece) part 202 and with surface region or part 204.Liner part 202
Extend from the plate 160 of moving component 114, and the engagement of surface portion 204 is located at the polymer surfaces portion on supporting member seat ring 113
Divide 203 to limit slidably supported interface, slidably supported interface will allow moving link 114 relative to supporting member seat ring and support structure
Part 112 is slided.The property of liner part 202 and surface portion 204 can include it is relatively low rub, relatively low viscosity, phase
To low abrasion, and/or relatively high rigidity.In the embodiment shown, liner part 202 is that the shaping being located in plate 160 is recessed
Hole.In other embodiments, liner part 202 is (by adhesive or welding) the separately fabricated component for being attached to plate 160
(for example, being manufactured by metal, polymer or ceramics).In embodiment, for example, liner part 202 and surface portion 204 are by poly- first
Aldehyde is formed.In embodiment, surface portion 204 can be the coating being located in liner part 202.It can be used as being used for surface portion
The example of the material of 204 coating includes the polymer of ceramics and such as polyformaldehyde and fluoropolymer (for example, teflon).To the greatest extent
Three supporting members 200 are shown in pipe Figure 10, but other embodiments have less or more supporting member.Surface portion 203
And/or surface portion 204 can be processed for example by laser polishing or impressing, to strengthen the smoothness on surface.Supporting member 200
Advantage with those advantages similar to above-mentioned supporting member 100.
Figure 12 to Figure 18 is the annotation diagram of camera gun mounting assembly improved according to an embodiment of the invention.It is outstanding
Put component and [be referred to as static FPC (flexible printing electricity into Figure 18 in Figure 12 with two critical piece-substrates or supporting member
Road)] and motion/spring member (being referred to as spring crimping circuit into Figure 18 in Figure 12).In the embodiment shown, due to quiet
State FPC (basal component) and spring crimping circuit (moving link), which have, such as to be formed in base metal [in the embodiment shown
For stainless steel (SST)] on lead (such as in copper " Cu " or copper alloy layer), engagement pad and terminal electric structure, they two
Person is integrated pin configuration.The electrical structure that insulator (for example, polyimides or " polymer ") layer will be electrically isolated with SST
Spaced-apart (Cu layers of other parts be connected to SST layers or directly on SST layers).At some positions, electric structure can be with
Opening in by passing through polymer layer from Cu traces or trace layer extends to SST layers of electrical connection (for example, " path ") to be electrically connected
It is connected to SST layers.In embodiment, camera lens can be attached to spring crimping circuit.In other embodiments, support camera lens is automatic
Focusing system can also be attached to spring crimping circuit.
As described above, static state FPC and spring crimping circuit can be by being overlying on base metal thereon (for example, such as SST
Spring metal), polymer and Cu (that is, " trace " layer) layer formed.Insulation can be applied on Cu all or part to cover
Cap rock.The portion of trace layer can be electroplated or be otherwise applied to the corrosion resistant metal of such as golden (Au) and/or nickel (Ni)
Point, to provide corrosion resistance.With photoetching (for example, using the photoresist mask for having pattern and/or pattern-free) combine it is such as wet
Method (for example, chemical) and dry method (for example, plasma) is etched, plating and the conventional addition of chemical plating and sputtering technology are sunk
Product and/or abatement technique and mechanical molding's method (for example, using stamping and shaping) can be used for manufacture according to the present invention's
Static FPC and spring the crimping circuit of embodiment.For example, the addition of these types and abatement technique are known and combine disk drive
The manufacture of head suspension device is used, and is generally disclosed in following United States Patent (USP), and all these patents, which pass through, quotes knot
Together in this for all purposes：In entitled " the low electricity for twin-stage driving disk drive suspension device of Bennin et al. under one's name
The United States Patent (USP) 8,885,299 of resistance ground joint ", the entitled " collection constructed with multiple traces in Rice et al. under one's name
Into lead suspend device " United States Patent (USP) 8,169,746, Hentges et al. under one's name it is entitled " be used for integrated-lead suspension
The United States Patent (USP) 8,144,430 of the multilayer aground plane structure of device ", Hentges et al. under one's name it is entitled " be used for it is integrated
Lead suspends the multilayer aground plane structure of device " United States Patent (USP) 7,929,252, in Swanson et al. under one's name entitled
The United States Patent (USP) 7,388,733 of " method for manufacturing the noble metal wire for mounting assembly ", in Peltoma et al. under one's name
The United States Patent (USP) 7,384,531 of entitled " being used for the electroplated ground feature that integrated-lead suspends device ".
In the embodiment shown, static FPC is single-piece member, and each in two diagonal corners of the component
It is upper that there are two static crimps (attachment structure) (amounting to 4 static crimps).Terminal pad section, which includes being located at, is connected to extension
By the terminal pad in the trace layer of the trace of component surface.As illustrated, for example, individually trace extends to four static pressures
It is each in fitting.The electric contact or terminal formed by trace layer and polymer layer is located at each in static crimp.From quiet
The forming pit engagement spring of the upper surface extension of state FPC components crimps the rear surface of circuit member, and as sliding interface
Supporting member, is moved with enabling spring to crimp circuit member relative to static FPC low frictions.Trace on static FPC will also
Terminal pad is attached to the electrical pad position on static FPC, and the electrical pad position is electrically and mechanically attached to spring crimping circuit structure
Part is [for example, the SST layers for providing electric signal to auto-focusing (AF) component and crimping circuit member to spring provide public or ground connection
Signal path].Corresponding trace on static FPC is attached to SST layers of the part for being connected to foot by path.
In the embodiment shown, spring crimping circuit is single-piece member, and including for supporting camera lens or automatic focusing
The central component of system and the one or more spring arms (being in the embodiment shown two spring arms) extended from central component.
Spring, which crimps component, has (all four motions of two motion crimps on each in two diagonal corners of component
Crimp).Pedestal in SST layers (in the embodiment shown, on the end of the spring arm relative with central component)
Or the correspondence position that foot is configured to weld or is otherwise attached on static FPC.Trace structure on spring crimping component
The trace (for example, through foot) that causes to be electrically coupled on static FPC and signal is attached to terminal pad, such as automatic focused on
(AF) terminal pad.In the embodiment shown, the SST layers of spring crimping circuit are used as leading to the SMA wire for being attached to motion crimp
End signal path.By the connection between the foot of spring arm and static state FPC SST layers (that is, two in embodiment
The SST layers of component are electrically coupled, and in common earthing potential) there is provided the corresponding of the SST layers that circuit is crimped to spring
The electrical connection between trace in terminal pad and static state FPC.
Important advantage is provided according to the suspension device on moving link flexible arm with trace of the present invention.For example,
They efficiently can manufacture and assemble.Trace is the plate that moving link is mounted to for electric signal to be coupled to or other portions
The resulting structure for the structure divided.
Figure 26 A, Figure 26 B, Figure 27, Figure 28 A, Figure 28 B and Figure 29-30, which are shown, to be included touching according to an embodiment of the invention
Hit the mounting assembly 10 ' of retainer or limiter 200.In addition to limiter 200, suspend device 10 ' feature can with including upper
The other embodiments of the invention for stating suspension device 10 are similar or identical.Limiter 200 can also be bonded to any of the present invention
Or in the embodiment of all other description.
As illustrated, limiter 200 is included such as on the plate 60 ' of moving link 14 ' or positioned at moving link 14 '
Plate 60 ' in opening 202 engaged structure and on supporting member 12 ' (for example, in the planar portions of supporting member
Point on) retainer 204.The bonding part 206 of retainer 204 is fixedly positioned and extended to out relative to supporting member 12 '
In mouth 202.The of opening 202 greater diameter than bonding part 206 Second bobbin diameter, to allow moving link 14 ' relative to branch
The conditional motion of component 12 ' is supportted (for example, in the side for the major planar surface for being substantially parallel to moving link and supporting member
Upwards).The feature of limiter 200, shape, size and the position of such as opening 202 and retainer 204 are configured to prevent motion
Component 14 ' is relative to the displacement of supporting member 12 ', and the displacement may result in the damage suspension part of device 10 ' or be attached to suspension
Other parts of such as lens of device.Bonding part 206 can be moved in the preset range of motion, but bonding part 206
The wall part of the engaged structure of engagement, such as plate 60 ' of restriction opening 202, to limit the scope of relative motion.
In embodiment, bonding part 206 is located in liner part 208.Can it is integral with bonding part 206 and/or
It is bigger than the bonding part in embodiment by the liner part 208 that is formed with the identical material of bonding part 206, and provide and be used for
The substrate of bonding part by major planar surface of the bonding part away from supporting member 12 ' to extend or otherwise position.Connect
Part 206 is closed to be located on the end of the liner part 208 relative with the major planar surface of supporting member 12 '.In embodiment, only
Moving part 204 can be attached (for example, by adhesive) to the separately fabricated polymeric member of supporting member 12 '.Other
In embodiment, retainer 204 can be the gold formed by one or more layers (for example, by basalis 16 ') of supporting member 12 '
Metal elements are attached (for example, by welding) in assembling to the separately fabricated component of supporting member.In other embodiments
In, retainer 204 can be integrated with other suspension members, such as with the supporting member shown in supporting member 100.Although institute
Two limiters 200 are shown in the embodiment shown, but other embodiments have more or less limiters.Opening 202
Can be through hole or recess or depression (for example, being formed by partial etching) as shown in the illustrated embodiment.Other
In embodiment, opening 202 can be located on supporting member 12 ', and retainer 204 can be located on moving link 14 '.Such as limit
The limiter of device 200 provides important advantage.For example, they can prevent from damaging suspension device or part mounted thereto
(for example, when it is incorporated into device therein and dropped).Suspension device including limiter can also be manufactured efficiently.
In embodiment, mounting assembly includes：(1) supporting member of line attachment structure is included；(2) it is attached to supporting member
Moving link, the moving link includes：(i) plate；(ii) flexible arm for being coupled to supporting member is extended from plate；(iii)
Line attachment structure；(3) supporting member, the plate of its supporting movement component relative to supporting member to move；(4) intelligent memory alloy
Line, its be attached to the line attachment structure of supporting member and moving link and supporting member and moving link line attachment structure it
Between extend；(5) limiter, it limits range of movement of the moving link relative to supporting member, and limiter includes：(i) it is located at
The opening in one in moving link plate and supporting member, wherein, opening has the first diameter；(ii) is located at moving link
Retainer on another in plate and supporting member, retainer includes the bonding part extended in opening, wherein, junction surface
Divide the Second bobbin diameter with less than the first diameter.In embodiment, retainer further comprises liner part, and wherein, connects
Part is closed to be located on the end of liner part.In embodiment, liner part is formed by supporting member.In embodiment, pad
Part is formed as the component separated with supporting member, and is attached to supporting member.In embodiment, opening is to be located at motion structure
Through hole in the plate of part.
Although describing the present invention by reference to preferred embodiment, it will be recognized to those skilled in the art that can be with
Without departing from the spirit and scope of the present invention, the change in form and details is made.Although for example, shown implementation
Example includes the trace (that is, on the top side of trace) on the side relative with supporting member of flexible arm, but other
Embodiment alternatively or additionally can include on the side towards moving link of flexible arm (that is, positioned at trace
On bottom side) trace.Although being described with reference to specific mounting assembly embodiment, supporting member 200 and supporting member 100
It can be bonded in other mounting assembly embodiments.According to an embodiment of the invention supporting member can be applied in combination, and/or
Engaged with ball bearings or for substituting ball bearings, to provide the relative motion between suspension device part.The He of supporting member 100
The feature of supporting member 200 can be combined with each other.
Claims (30)
1. a kind of mounting assembly, including：
Include the supporting member of line attachment structure；
The moving link of the supporting member is attached to, including：
Plate；
Extend and be attached to the flexing arm of the supporting member from the plate；With
Line attachment structure；
Supporting member, the supporting member supports the plate of the moving link to be moved relative to the supporting member, described
Supporting member includes：
From the liner part of an extension in the plate of the supporting member and the moving link；With
With another polymer interface table slidably engaged in the plate of the supporting member and the moving link
Face part；With
Intelligent memory alloy wire, the intelligent memory alloy wire is attached to the line of the supporting member and the moving link
Attachment structure, and extend between the supporting member and the line attachment structure of the moving link.
2. mounting assembly according to claim 1, it is characterised in that further comprise multiple supporting members.
3. mounting assembly according to claim 2, it is characterised in that the polymer interface surface element of the supporting member
Dividing includes one in polyformaldehyde and fluoropolymer, and the fluoropolymer is such as teflon and the fluoropolymer of load Lean
Thing.
4. mounting assembly according to claim 3, it is characterised in that the liner part of the supporting member includes gold
Category.
5. mounting assembly according to claim 4, it is characterised in that：
The plate of the moving link includes metal；With
The liner part of the supporting member includes the forming pit in the metal of moving link plate.
6. mounting assembly according to claim 2, it is characterised in that：
The supporting member includes metallic substrate layer；With
The liner part is attached to the metallic substrate layer of the supporting member and from the metal of the supporting member
Basalis extends.
7. mounting assembly according to claim 6, it is characterised in that the liner part of the supporting member includes polymerization
Thing, the polymer is optionally polyformaldehyde.
8. mounting assembly according to claim 7, it is characterised in that further comprise polymeric liner pad part being linked to
The adhesive phase of the metallic substrate layer of the supporting member.
9. mounting assembly according to claim 8, it is characterised in that：
The metallic substrate layer of the supporting member further comprises the depression of partial etching；With
The supporting member is attached to the metallic substrate layer in the depression of the partial etching of the supporting member, and from
Metallic substrate layer extension in the depression of the partial etching of the supporting member.
10. mounting assembly according to claim 8, it is characterised in that the polymer interface surface of the supporting member
Part includes polyformaldehyde.
11. mounting assembly according to claim 7, it is characterised in that the polymer interface surface of the supporting member
Part includes polyformaldehyde.
12. mounting assembly according to claim 6, it is characterised in that the liner part of the supporting member include with
Polymer interface part identical polymer.
13. mounting assembly according to claim 1, it is characterised in that the polymer interface surface of the supporting member
Part includes one in polyformaldehyde and fluoropolymer, and the fluoropolymer is such as teflon and carries the fluorine-containing poly- of Lean
Compound.
14. mounting assembly according to claim 13, it is characterised in that the liner part of the supporting member includes gold
Category.
15. mounting assembly according to claim 14, it is characterised in that：
The plate of the moving link includes metal；With
The liner part of the supporting member includes the forming pit in the metal of the moving link plate.
16. mounting assembly according to claim 1, it is characterised in that：
The supporting member includes metallic substrate layer；With
The liner part of the supporting member is attached to the metallic substrate layer of the supporting member and from the support structure
The metallic substrate layer extension of part.
17. mounting assembly according to claim 16, it is characterised in that the liner part of the supporting member includes poly-
Compound, the polymer is optionally polyformaldehyde.
18. mounting assembly according to claim 17, it is characterised in that further comprise the polymeric liner pad part
It is linked to the adhesive phase of the metallic substrate layer of the supporting member.
19. mounting assembly according to claim 18, it is characterised in that：
The metallic substrate layer of the supporting member further comprises the depression of partial etching；With
The supporting member is attached to the metallic substrate layer in the depression of the partial etching of the supporting member, and
And from the metallic substrate layer extension in the depression positioned at the partial etching of the supporting member.
20. mounting assembly according to claim 19, it is characterised in that the polymer interface surface of the supporting member
Part includes polyformaldehyde.
21. mounting assembly according to claim 17, it is characterised in that the polymer interface surface of the supporting member
Part includes polyformaldehyde.
22. mounting assembly according to claim 16, it is characterised in that the liner part of the supporting member include with
The polymer interface part identical polymer.
23. mounting assembly according to claim 16, it is characterised in that further comprise the polymeric liner pad part
It is linked to the adhesive phase of the metallic substrate layer of the supporting member.
24. a kind of mounting assembly, including：
Include the supporting member of line attachment structure；
The moving link of the supporting member is attached to, including：
Plate；
Extend and be attached to the flexing arm of the supporting member from the plate；With
Line attachment structure；
Low friction polymeric material, the low friction polymeric material is limited to the institute of the supporting member and the moving link
State the slidably supported interface between plate；With
Intelligent memory alloy wire, the intelligent memory alloy wire is attached to the line of the supporting member and the moving link
Attachment structure, and extend between the supporting member and the line attachment structure of the moving link.
25. mounting assembly according to claim 24, it is characterised in that the slidably supported interface includes multiple be spaced apart
Low friction polymer areas, wherein, each low friction polymer areas has periphery.
26. mounting assembly according to claim 25, it is characterised in that the low friction polymer areas is fixedly mounted
To moving link plate.
27. mounting assembly according to claim 26, it is characterised in that further comprise being attached to the moving link plate
And the liner part extended from the moving link plate, the low friction polymer areas is located in the liner part.
28. mounting assembly according to claim 25, it is characterised in that the low friction polymer areas is mounted to institute
The polymeric columns of supporting member are stated, the low friction polymer areas is attached to the support structure alternately through adhesive
Part.
29. mounting assembly according to claim 24, it is characterised in that the slidably supported interface is included from the support
The liner part of component extension, the liner part alternatively includes the forming pit being located in the supporting member.
30. a kind of mounting assembly, including：
Include the supporting member of line attachment structure；
The moving link of the supporting member is attached to, including：
Plate；
Extend and be attached to the flexing arm of the supporting member from the plate；With
Line attachment structure；
Supporting member, the supporting member supports the plate of the moving link to be moved relative to the supporting member, described
Supporting member includes：
The liner part extended from the supporting member；With
The polymer interface surface portion slidably engaged with the plate of the moving link；
With
Intelligent memory alloy wire, the intelligent memory alloy wire is attached to the line of the supporting member and the moving link
Attachment structure, and extend between the supporting member and the line attachment structure of the moving link.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010580844.3A CN111638603A (en) | 2014-12-02 | 2015-11-25 | Camera lens suspension with polymer bearing |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462086595P | 2014-12-02 | 2014-12-02 | |
| US62/086,595 | 2014-12-02 | ||
| US201562129562P | 2015-03-06 | 2015-03-06 | |
| US62/129,562 | 2015-03-06 | ||
| PCT/US2015/062713 WO2016089699A1 (en) | 2014-12-02 | 2015-11-25 | Camera lens suspension with polymer bearings |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010580844.3A Division CN111638603A (en) | 2014-12-02 | 2015-11-25 | Camera lens suspension with polymer bearing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107003537A true CN107003537A (en) | 2017-08-01 |
| CN107003537B CN107003537B (en) | 2020-07-14 |
Family
ID=56079116
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010580844.3A Pending CN111638603A (en) | 2014-12-02 | 2015-11-25 | Camera lens suspension with polymer bearing |
| CN201580065775.XA Active CN107003537B (en) | 2014-12-02 | 2015-11-25 | Camera lens suspension with polymer bearing |
| CN201580065890.7A Active CN107003538B (en) | 2014-12-02 | 2015-11-25 | Integrated camera lens suspension |
| CN201580065332.0A Active CN107003536B (en) | 2014-12-02 | 2015-12-02 | Ball bearing retainer |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010580844.3A Pending CN111638603A (en) | 2014-12-02 | 2015-11-25 | Camera lens suspension with polymer bearing |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580065890.7A Active CN107003538B (en) | 2014-12-02 | 2015-11-25 | Integrated camera lens suspension |
| CN201580065332.0A Active CN107003536B (en) | 2014-12-02 | 2015-12-02 | Ball bearing retainer |
Country Status (6)
| Country | Link |
|---|---|
| US (9) | US9366879B1 (en) |
| EP (5) | EP3227746B1 (en) |
| JP (4) | JP6692356B2 (en) |
| KR (3) | KR102529554B1 (en) |
| CN (4) | CN111638603A (en) |
| WO (3) | WO2016089685A1 (en) |
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