CN106992103A - Thermal circuit beraker - Google Patents
Thermal circuit beraker Download PDFInfo
- Publication number
- CN106992103A CN106992103A CN201610039726.5A CN201610039726A CN106992103A CN 106992103 A CN106992103 A CN 106992103A CN 201610039726 A CN201610039726 A CN 201610039726A CN 106992103 A CN106992103 A CN 106992103A
- Authority
- CN
- China
- Prior art keywords
- sheet metal
- thermal circuit
- circuit beraker
- temperature
- encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H71/00—Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00
- H01H71/02—Housings; Casings; Bases; Mountings
- H01H71/0207—Mounting or assembling the different parts of the circuit breaker
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H71/00—Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00
- H01H71/08—Terminals; Connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H71/00—Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00
- H01H71/10—Operating or release mechanisms
- H01H71/12—Automatic release mechanisms with or without manual release
- H01H71/14—Electrothermal mechanisms
- H01H71/16—Electrothermal mechanisms with bimetal element
Landscapes
- Thermally Actuated Switches (AREA)
Abstract
A kind of thermal circuit beraker, including：One bimetal release；Insulation-encapsulated, the bimetal release is encapsulated in the insulation-encapsulated；With a pair of electrodes pin, the two ends of the bimetal release are respectively electrically connected to.Insulating coating is formed with least a portion extended from the insulation-encapsulated of the pair of electrode pin；And curable materials of the insulating coating by solidification temperature less than the triggering temperature of the thermal circuit beraker are made.In the present invention, on the region insulated the need for insulating coating is precisely defined on electrode pin and with electrode pin reliable connection, so that it can be reliably prevented that between the electrode pin of heat protective device occur short circuit, improve safety in utilization.In addition, therefore the cost of the insulating coating, reduces the manufacturing cost of heat protective device less than conventional insulating tape.Furthermore, it is possible to the insulating coating be efficiently formed using automation spray painting apparatus, so as to improve manufacture efficiency.
Description
Technical field
It is suitable to interconnected battery the present invention relates to a kind of reducible thermal circuit beraker, more particularly to one kind
Reducible thermal circuit beraker of group.
Background technology
In the prior art, heat protective device, for example, reducible thermal circuit beraker
(Temperature Cut Off Breaker), it is most important for battery pack trouble free service.It is logical
Often, thermal circuit beraker is connected on the connection circuit between battery pack, to realize between battery pack
Interconnection.When battery pack breaks down, for example, when overheat, excessively stream or overvoltage occurs in battery pack
When, thermal circuit beraker will be triggered automatically, to disconnect the connection circuit between battery pack, so that real
Now to the overheat, excessively stream and overvoltage protection of battery pack.
Occur between the interconnection region of battery pack, the electrode pin in order to prevent thermal circuit beraker short
Road or overlap joint, in the prior art, typically insulate the need for the electrode pin of thermal circuit beraker
Insulating tape is wound on region, so as to realize the insulation protection in the region to needing to insulate.Generally,
Insulating tape can only be wound manually, and this causes winding precision to be difficult to control to, and insulating tape holds
Easily occur coming off and separate, once insulating tape comes off or separated, it is possible to cause thermal circuit beraker
Short circuit, loses the defencive function to battery pack, has a strong impact on the trouble free service of battery pack.In addition,
Winding insulating tape can also increase manufacture and the maintenance cost of thermal circuit beraker manually.
The content of the invention
The purpose of the present invention aims to solve the problem that the above-mentioned problems in the prior art and defect extremely
Few one side.
According to an aspect of the present invention there is provided a kind of thermal circuit beraker, including：One bimetallic
Switch；Insulation-encapsulated, the bimetal release is encapsulated in the insulation-encapsulated；With a pair
Electrode pin, is respectively electrically connected to the two ends of the bimetal release.Draw in the pair of electrode
Insulating coating is formed with least a portion extended from the insulation-encapsulated of pin；And
Curable material of the insulating coating by solidification temperature less than the triggering temperature of the thermal circuit beraker
Material is made.
According to the embodiment of an example of the present invention, the solidification temperature of the curable materials
Not higher than 60 degrees Celsius.
According to the embodiment of another exemplary of the present invention, the curable materials are taken the photograph 60
The hardening time at temperature below family name's degree is not more than 30 minutes.
According to the embodiment of another exemplary of the present invention, the curable materials can be born
VDCT volts ,direct-current ,test be not less than 500V.
According to the embodiment of another exemplary of the present invention, the curable materials are in 500V
Leakage current under VDCT volts ,direct-current ,test above is less than 0.1mA.
According to the embodiment of another exemplary of the present invention, the curable materials include resin
With the curing agent being blended in the resin, it is described after the curable materials are cured
Resin is crosslinked with the curing agent.
According to the embodiment of another exemplary of the present invention, the bimetal release includes one
Fixed sheet metal and a movable sheet metal；When the temperature on the thermal circuit beraker reaches the heat
During the triggering temperature of breaker, the movable sheet metal thermal deformation simultaneously divides with the fixed sheet metal
From so that the thermal circuit beraker is off；When the temperature on the thermal circuit beraker is less than
During the triggering temperature of the thermal circuit beraker, the movable sheet metal connects with the fixed sheet metal
Touch so that the thermal circuit beraker is in an ON state.
According to the embodiment of another exemplary of the present invention, the thermal circuit beraker also includes one
PTC devices, the PTC devices are encapsulated in the insulation-encapsulated, and with double gold
Belong to switch in parallel；And after the movable sheet metal is separated with the fixed sheet metal, institute
State PTC devices the temperature of the thermal circuit beraker is maintained at more than the triggering temperature, so as to
The thermal circuit beraker is set to be maintained at off-state.
It is every in the pair of electrode pin according to the embodiment of another exemplary of the present invention
It is individual including：First sheet metal, one end is electrically connected to the bimetal release, and the other end is from described
Extend in insulation-encapsulated；With the second sheet metal, the other end of first sheet metal is welded on
On, and extend from the other end of first sheet metal, the corrosion resistance of second sheet metal
Can be better than first sheet metal corrosion resistance, and first sheet metal be located at institute
All parts outside insulation-encapsulated are stated to be wrapped by the insulating coating.
It is described according to another aspect of the present invention there is provided a kind of method for manufacturing thermal circuit beraker
Thermal circuit beraker includes a bimetal release, the insulation-encapsulated of the encapsulating bimetal release and divided
Be not electrically connected to a pair of electrodes pin at the two ends of the bimetal release, methods described include with
Lower step：
S100：Extend from the insulation-encapsulated at least the one of the pair of electrode pin
Insulating coating is formed on part,
Wherein, the insulating coating is less than the triggering temperature of the thermal circuit beraker by solidification temperature
Curable materials are made.
According to the embodiment of an example of the present invention, abovementioned steps S100 includes：
S110：The curable materials of liquid are sprayed to described in the pair of electrode pin at least
In a part；With
S120：It is curable in described at least a portion of the pair of electrode pin to being sprayed on
Material is solidified, to form the insulating coating.
According to the embodiment of another exemplary of the present invention, the solidification temperature of the curable materials
Not higher than 60 degrees Celsius of degree, and in abovementioned steps S120, at not higher than 60 degrees Celsius
At a temperature of it is curable in described at least a portion of the pair of electrode pin to being sprayed on
Material is solidified.
According to the embodiment of another exemplary of the present invention, the curable materials are taken the photograph 60
The hardening time at temperature below family name's degree is not more than 30 minutes.
According to the embodiment of another exemplary of the present invention, the curable materials can be born
VDCT volts ,direct-current ,test be not less than 500V.
According to the embodiment of another exemplary of the present invention, the curable materials are in 500V
Leakage current under VDCT volts ,direct-current ,test above is less than 0.1mA.
According to the embodiment of another exemplary of the present invention, the curable materials include resin
With the curing agent being blended in the resin, it is described after the curable materials are cured
Resin is crosslinked with the curing agent.
According to the embodiment of another exemplary of the present invention, the bimetal release includes one
Fixed sheet metal and a movable sheet metal；When the temperature on the thermal circuit beraker reaches the heat
During the triggering temperature of breaker, the movable sheet metal thermal deformation simultaneously divides with the fixed sheet metal
From so that the thermal circuit beraker is off；When the temperature on the thermal circuit beraker is less than
During the triggering temperature of the thermal circuit beraker, the movable sheet metal connects with the fixed sheet metal
Touch so that the thermal circuit beraker is in an ON state.
According to the embodiment of another exemplary of the present invention, the thermal circuit beraker also includes one
PTC devices, the PTC devices are encapsulated in the insulation-encapsulated, and with double gold
Belong to switch in parallel；And after the movable sheet metal is separated with the fixed sheet metal, institute
State PTC devices the temperature of the thermal circuit beraker is maintained at more than the triggering temperature, so as to
The thermal circuit beraker is set to be maintained at off-state.
It is every in the pair of electrode pin according to the embodiment of another exemplary of the present invention
It is individual including：First sheet metal, one end is electrically connected to the bimetal release, and the other end is from described
Extend in insulation-encapsulated；With the second sheet metal, the other end of first sheet metal is welded on
On, and extend from the other end of first sheet metal, the corrosion resistance of second sheet metal
Can be better than first sheet metal corrosion resistance, and first sheet metal be located at institute
All parts outside insulation-encapsulated are stated to be wrapped by the insulating coating.
In the foregoing individual embodiments according to the present invention, it is disconnected that insulating coating is precisely defined at heat
On the region insulated the need on the electrode pin of road device and with electrode pin reliable connection so that
It can reliably prevent short circuit occur between the electrode pin of heat protective device, improve using peace
Quan Xing.
In addition, in the foregoing individual embodiments according to the present invention, the cost of the insulating coating is low
In conventional insulating tape, therefore, the manufacturing cost of heat protective device is reduced.
In addition, in some embodiments of the invention, can be efficient using automation spray painting apparatus
Ground forms the insulating coating, so as to improve manufacture efficiency.
By the description made for the present invention of below with reference to accompanying drawing, other purposes of the invention and
Advantage will be evident, and can help that complete understanding of the invention will be obtained.
Brief description of the drawings
Fig. 1 shows the plane of the thermal circuit beraker of the embodiment according to an example of the present invention
Schematic diagram, wherein insulating coating are not coated on a pair of electrodes pin of thermal circuit beraker also；
Fig. 2 shows the plane of the thermal circuit beraker of the embodiment according to an example of the present invention
Schematic diagram, wherein insulating coating are had been applied on a pair of electrodes pin of thermal circuit beraker；
Fig. 3 a show the circuit of the thermal circuit beraker of the embodiment according to an example of the present invention
Schematic diagram, wherein, bimetal release is in closure state；With
Fig. 3 b show the circuit of the thermal circuit beraker of the embodiment according to an example of the present invention
Schematic diagram, wherein, bimetal release is in separated position.
Embodiment
Below by embodiment, and with reference to accompanying drawing, make further tool to technical scheme
The explanation of body.In the description, same or analogous drawing reference numeral indicates same or analogous portion
Part.Following explanations referring to the drawings to embodiment of the present invention are intended to overall invention of the invention
Design is explained, and is not construed as a kind of limitation to the present invention.
In addition, in the following detailed description, for ease of explaining, elaborating many specific thin
Save to provide the comprehensive understanding to present disclosure embodiment.It should be apparent, however, that one or more implement
Example can also be carried out in the case of these no details.In other cases, it is known
Construction and device diagrammatically embody to simplify accompanying drawing.
Conceived according to the general technical of the present invention there is provided a kind of thermal circuit beraker, including：One
Individual bimetal release；Insulation-encapsulated, the bimetal release is encapsulated in the insulation-encapsulated；
With a pair of electrodes pin, the two ends of the bimetal release are respectively electrically connected to.The pair of
Insulation is formed with least a portion extended from the insulation-encapsulated of electrode pin to apply
Layer；And the insulating coating by solidification temperature less than the thermal circuit beraker triggering temperature can
Curing materials are made.
Fig. 1 is shown according to the flat of the thermal circuit beraker 100 of the embodiment of an example of the present invention
Face schematic diagram, wherein insulating coating 140 are not coated to a pair of electrodes of thermal circuit beraker 100 also
On pin 110,120；Fig. 2 shows the heat of the embodiment according to an example of the present invention
The floor map of breaker 100, wherein insulating coating 140 have been applied to thermal circuit beraker
On 100 a pair of electrodes pin 110,120.Fig. 3 a are shown according to an example of the present invention
The circuit theory diagrams of the thermal circuit beraker 100 of the embodiment of property, wherein, bimetal release 101,
102 are in closure state；The embodiment according to an example of the present invention is shown with Fig. 3 b
Thermal circuit beraker 100 circuit theory diagrams, wherein, bimetal release 101,102 be in point
Open state.
As shown in Figure 1, Figure 2, shown in Fig. 3 a and 3b, in the illustrated embodiment, thermal circuit beraker
100 is main including a bimetal release 101,102, and insulation-encapsulated 130 and a pair of electrodes are drawn
Pin 110,120.Bimetal release 101,102 is encapsulated in insulation-encapsulated 130.A pair
Electrode pin 110,120 is respectively electrically connected to the two ends of bimetal release 101,102 and extension
To the outside of insulation-encapsulated 130.
As depicted in figs. 1 and 2, in one embodiment of the invention, in a pair of electrodes pin
110th, 120 at least a portion extended from insulation-encapsulated 130 (needs the area of insulation
Domain) on be formed with insulating coating 140.The insulating coating 140 be wrapped in a pair of electrodes pin 110,
On the region insulated the need for 120.
Because the bimetal release 101 of thermal circuit beraker 100,102 pairs of temperature are very sensitive, therefore,
If thermal circuit beraker 100 will be reduced by when significantly larger than its high temperature for triggering temperature influences
The stability and long-term reliability of thermal circuit beraker 100.
In order to not influence the stability and long-term reliability of thermal circuit beraker 100, the one of the present invention
In individual embodiment, aforementioned dielectric coating 140 is less than the triggering temperature of thermal circuit beraker by solidification temperature
Curable materials be made.In this way, it is possible to prevent thermal circuit beraker 100 by significantly larger than its
The high temperature influence of temperature is triggered, so as to ensure that the stability and reliably and with long-term of thermal circuit beraker 100
Property.
In one embodiment of the invention, the solidification temperature of aforementioned curable material is not higher than
60 degrees Celsius, it is preferable that not higher than 45 degrees Celsius, it is highly preferred that not higher than 30 is Celsius
Degree.
In one embodiment of the invention, aforementioned curable material is below 60 degrees Celsius
At a temperature of hardening time be not more than 30 minutes, it is preferable that be not more than 20 minutes, more preferably
Ground, no more than 10 minutes.
In one embodiment of the invention, the DC test that aforementioned curable material can be born
Voltage is not less than 500V, it is preferable that be not less than 800V, it is highly preferred that being not less than 1000V.
In one embodiment of the invention, direct current of the aforementioned curable material in more than 500V
Leakage current under test voltage is less than 0.1mA.
In one embodiment of the invention, aforementioned curable material is comprising resin and is blended in tree
Curing agent in fat, after curable materials are cured, resin is crosslinked with curing agent.
In one embodiment of the invention, aforementioned curable material has before being cured
Good mobility, can flow on the side of electrode pin.
As shown in Figure 1, Figure 2, it is in one embodiment of the invention, double shown in Fig. 3 a and 3b
Metal switch 101,102 includes a fixed sheet metal 101 and a movable sheet metal 102.
As shown in Figure 3 b, when the temperature on thermal circuit beraker reaches the triggering temperature of thermal circuit beraker,
The movable thermal deformation of sheet metal 102 is simultaneously separated with fixed sheet metal 101 so that thermal circuit beraker is in
Off-state.As shown in Figure 3 a, when the temperature on thermal circuit beraker is less than the triggering of thermal circuit beraker
During temperature, movable sheet metal 102 is contacted with fixed sheet metal 101 so that thermal circuit beraker is in
On-state.
As shown in Figure 1, Figure 2, it is in one embodiment of the invention, preceding shown in Fig. 3 a and 3b
Stating thermal circuit beraker also includes PTC (Positive Temperature Coefficient) device
103, the PTC devices 103 are encapsulated in insulation-encapsulated 130, and with bimetal release 101,
102 is in parallel.
As shown in Figure 3 b, after movable sheet metal 102 is separated with fixed sheet metal 101,
Electric current flows through PTC devices 103 so that the temperature rise of PTC devices 103, so, PTC
The temperature of thermal circuit beraker can be just maintained at more than triggering temperature by device 103, to make heat disconnected
Road device is maintained at off-state.
As shown in Figure 1, Figure 2, shown in Fig. 3 a and 3b, in one embodiment of the invention, one
To each including the first sheet metal 111,121 and the second metal in electrode pin 110,120
Piece 112,122.One end (inside end) of first sheet metal 111,121 is electrically connected to double gold
Category switch 101,102, the other end (outer end) extends from insulation-encapsulated 130.The
Two sheet metals 112,122 are welded on the other end (outer end) of the first sheet metal 111,121
On, and extend from the other end of the first sheet metal 111,121.
In one embodiment of the invention, as depicted in figs. 1 and 2, the second sheet metal 112,
122 corrosion resistance is better than the corrosion resistance of the first sheet metal 111,121, and the
All parts being located at outside insulation-encapsulated 130 of one sheet metal 111,121 are by insulating coating
140 wrap.Thus it is readily able to be wrapped in by the first sheet metal 111,121 corroded
In insulating coating 140, the first sheet metal 111,121 is played a protective role.
In one embodiment of the invention, foregoing first sheet metal 111,121 can be by copper
It is made, foregoing second sheet metal 112,122 can be made up of nickel.
Describe a kind of method for manufacturing foregoing thermal circuit beraker, the party in detail below with reference to accompanying drawings
Method is mainly included the following steps that：
S100：In extending from insulation-encapsulated 130 for a pair of electrodes pin 110,120
Insulating coating 140 is formed at least a portion,
Wherein, insulating coating 140 is less than consolidating for the triggering temperature of thermal circuit beraker by solidification temperature
Change material to be made.
In one embodiment of the invention, abovementioned steps S100 includes：
S110：The curable materials of liquid are sprayed into a pair of electrodes pin 110,120 extremely
In a few part；With
S120：To being sprayed on consolidating at least a portion of a pair of electrodes pin 110,120
Change material to be solidified, to form insulating coating 140.
In one embodiment of the invention, the solidification temperature of aforementioned curable material is not higher than
60 degrees Celsius, it is preferable that not higher than 45 degrees Celsius, it is highly preferred that not higher than 30 is Celsius
Degree.
In abovementioned steps S120, to being sprayed on a pair at a temperature of not higher than 60 degrees Celsius
Curable materials at least a portion of electrode pin 110,120 are solidified.
In one embodiment of the invention, aforementioned curable material is below 60 degrees Celsius
At a temperature of hardening time be not more than 30 minutes, it is preferable that be not more than 20 minutes, more preferably
Ground, no more than 10 minutes.
In one embodiment of the invention, the DC test that aforementioned curable material can be born
Voltage is not less than 500V, it is preferable that be not less than 800V, it is highly preferred that being not less than 1000V.
In one embodiment of the invention, direct current of the aforementioned curable material in more than 500V
Leakage current under test voltage is less than 0.1mA.
In one embodiment of the invention, aforementioned curable material is comprising resin and is blended in tree
Curing agent in fat, after curable materials are cured, resin is crosslinked with curing agent.
In one embodiment of the invention, aforementioned curable material has before being cured
Good mobility, can flow on the side of electrode pin.
It will be understood to those skilled in the art that embodiment described above is all exemplary
, and those skilled in the art can make improvements, described in various embodiments
Structure free group can be carried out in the case of the conflict in terms of not recurring structure or principle
Close.
Although with reference to accompanying drawing, the present invention is described, the embodiment purport disclosed in accompanying drawing
Illustrative to the preferred embodiment for the present invention, and it is not intended that to the present invention's
One kind limitation.
Although some embodiments of this present general inventive concept are shown and illustrated, this area is common
Technical staff will be understood that, in the case of without departing substantially from the principle of this present general inventive concept and spirit,
These embodiments can be made a change, the scope of the present invention is with claim and their equivalent
Limit.
It should be noted that word " comprising " is not excluded for other element or steps, word " one " or " one
It is individual " be not excluded for it is multiple.In addition, any element label of claim should not be construed as limitation originally
The scope of invention.
Claims (19)
1. a kind of thermal circuit beraker, including：
One bimetal release (101,102)；
Insulation-encapsulated (130), the bimetal release (101,102) is encapsulated in described exhausted
In edge encapsulation (130)；With
A pair of electrodes pin (110,120), be respectively electrically connected to the bimetal release (101,
102) two ends,
It is characterized in that：
In the pair of electrode pin (110,120) from the insulation-encapsulated (130)
Insulating coating (140) is formed with least a portion extended；And
The insulating coating (140) is less than the triggering temperature of the thermal circuit beraker by solidification temperature
Curable materials be made.
2. thermal circuit beraker according to claim 1, it is characterised in that：It is described curable
The solidification temperature of material is not higher than 60 degrees Celsius.
3. thermal circuit beraker according to claim 2, it is characterised in that：It is described curable
Hardening time at temperature of the material below 60 degrees Celsius is not more than 30 minutes.
4. thermal circuit beraker according to claim 1, it is characterised in that：It is described curable
The VDCT volts ,direct-current ,test that material can be born is not less than 500V.
5. thermal circuit beraker according to claim 4, it is characterised in that：It is described curable
Leakage current of the material under more than 500V VDCT volts ,direct-current ,test is less than 0.1mA.
6. thermal circuit beraker according to claim 1, it is characterised in that：
The curable materials include resin and the curing agent being blended in the resin, described
After curable materials are cured, the resin is crosslinked with the curing agent.
7. thermal circuit beraker according to claim 1, it is characterised in that：
The bimetal release (101,102) includes a fixed sheet metal (101) and one
Individual movable sheet metal (102)；
It is described when the temperature on the thermal circuit beraker reaches the triggering temperature of the thermal circuit beraker
Movable sheet metal (102) thermal deformation is simultaneously separated with the fixed sheet metal (101) so that institute
Thermal circuit beraker is stated to be off；
It is described when the temperature on the thermal circuit beraker is less than the triggering temperature of the thermal circuit beraker
Movable sheet metal (102) is contacted with the fixed sheet metal (101) so that the thermal cut-out
Device is in an ON state.
8. thermal circuit beraker according to claim 7, it is characterised in that：
The thermal circuit beraker also includes a PTC device (103), the PTC devices (103)
Be encapsulated in the insulation-encapsulated (130), and with the bimetal release (101,102)
It is in parallel；And
After the movable sheet metal (102) separates with the fixed sheet metal (101),
The PTC devices (103) by the temperature of the thermal circuit beraker be maintained at it is described triggering temperature with
On, to make the thermal circuit beraker be maintained at off-state.
9. thermal circuit beraker according to claim 1, it is characterised in that：
Each including in the pair of electrode pin (110,120)：
First sheet metal (111,121), one end be electrically connected to the bimetal release (101,
102), the other end extends from the insulation-encapsulated (130)；With
Second sheet metal (112,122), is welded on first sheet metal (111,121)
The other end on, and extend from the other end of first sheet metal (111,121),
The corrosion resistance of second sheet metal (112,122) is better than first sheet metal
The corrosion resistance of (111,121), and
First sheet metal (111,121) be located at the insulation-encapsulated (130) outside
All parts wrapped by the insulating coating (140).
10. a kind of method for manufacturing thermal circuit beraker,
The thermal circuit beraker includes a bimetal release (101,102), encapsulates double gold
Category switchs the insulation-encapsulated (130) of (101,102) and is respectively electrically connected to the bimetallic
A pair of electrodes pin (110,120) at the two ends of (101,102) is switched,
Characterized in that, the described method comprises the following steps：
S100：In the pair of electrode pin (110,120) from the insulation-encapsulated (130)
In form insulating coating (140) at least a portion for extending,
Wherein, the insulating coating (140) is tactile less than the thermal circuit beraker by solidification temperature
The curable materials of hair temperature are made.
11. method according to claim 10, it is characterised in that the step S100
Including：
S110：The curable materials of liquid are sprayed into the pair of electrode pin (110,120)
Described at least a portion on；With
S120：Described at least one to being sprayed on the pair of electrode pin (110,120)
Curable materials on point are solidified, to form the insulating coating (140).
12. method according to claim 11, it is characterised in that：The curable material
The solidification temperature of material is not higher than 60 degrees Celsius, and in abovementioned steps S120, not higher than
To being sprayed on the described of the pair of electrode pin (110,120) at a temperature of 60 degrees Celsius
Curable materials at least a portion are solidified.
13. method according to claim 12, it is characterised in that：The curable material
Expect that the hardening time at the temperature below 60 degrees Celsius is not more than 30 minutes.
14. method according to claim 11, it is characterised in that：The curable material
Expect that the VDCT volts ,direct-current ,test that can be born is not less than 500V.
15. method according to claim 14, it is characterised in that：The curable material
Expect that the leakage current under more than 500V VDCT volts ,direct-current ,test is less than 0.1mA.
16. method according to claim 11, it is characterised in that：
The curable materials include resin and the curing agent being blended in the resin, described
After curable materials are cured, the resin is crosslinked with the curing agent.
17. method according to claim 11, it is characterised in that：
The bimetal release (101,102) includes a fixed sheet metal (101) and one
Individual movable sheet metal (102)；
It is described when the temperature on the thermal circuit beraker reaches the triggering temperature of the thermal circuit beraker
Movable sheet metal (102) thermal deformation is simultaneously separated with the fixed sheet metal (101) so that institute
Thermal circuit beraker is stated to be off；
It is described when the temperature on the thermal circuit beraker is less than the triggering temperature of the thermal circuit beraker
Movable sheet metal (102) is contacted with the fixed sheet metal (101) so that the thermal cut-out
Device is in an ON state.
18. method according to claim 17, it is characterised in that：
The thermal circuit beraker also includes a PTC device (103), the PTC devices (103)
Be encapsulated in the insulation-encapsulated (130), and with the bimetal release (101,102)
It is in parallel；And
After the movable sheet metal (102) separates with the fixed sheet metal (101),
The PTC devices (103) by the temperature of the thermal circuit beraker be maintained at it is described triggering temperature with
On, to make the thermal circuit beraker be maintained at off-state.
19. method according to claim 11, it is characterised in that：
Each including in the pair of electrode pin (110,120)：
First sheet metal (111,121), one end be electrically connected to the bimetal release (101,
102), the other end extends from the insulation-encapsulated (130)；With
Second sheet metal (112,122), is welded on first sheet metal (111,121)
The other end on, and extend from the other end of first sheet metal (111,121),
The corrosion resistance of second sheet metal (112,122) is better than first sheet metal
The corrosion resistance of (111,121), and
First sheet metal (111,121) be located at the insulation-encapsulated (130) outside
All parts wrapped by the insulating coating (140).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610039726.5A CN106992103A (en) | 2016-01-21 | 2016-01-21 | Thermal circuit beraker |
| PCT/CN2017/071897 WO2017125068A1 (en) | 2016-01-21 | 2017-01-20 | Temperature cut off breaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610039726.5A CN106992103A (en) | 2016-01-21 | 2016-01-21 | Thermal circuit beraker |
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| Publication Number | Publication Date |
|---|---|
| CN106992103A true CN106992103A (en) | 2017-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610039726.5A Pending CN106992103A (en) | 2016-01-21 | 2016-01-21 | Thermal circuit beraker |
Country Status (2)
| Country | Link |
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| CN (1) | CN106992103A (en) |
| WO (1) | WO2017125068A1 (en) |
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| CN1229204A (en) * | 1998-03-13 | 1999-09-22 | 打矢恒温器株式会社 | Thermal protector |
| CN201490127U (en) * | 2008-11-17 | 2010-05-26 | 邬若军 | Novel overcurrent and overheating protector |
| CN101740399A (en) * | 2008-11-25 | 2010-06-16 | 三星电子株式会社 | Method for partially covering insulating layer on metal wire in package |
| CN202025689U (en) * | 2011-05-13 | 2011-11-02 | 朱天兵 | Combined overcurrent/overheating protector |
| CN102763296A (en) * | 2010-12-16 | 2012-10-31 | 矢崎总业株式会社 | Liquid-proof structure for wire harness |
| CN202758812U (en) * | 2012-09-11 | 2013-02-27 | 常州市常宏同力电器有限公司 | A current and temperature dual protector |
| CN103346533A (en) * | 2013-06-25 | 2013-10-09 | 冯锐 | Circuit structure with protection function |
| CN103617928A (en) * | 2013-12-19 | 2014-03-05 | 上海长园维安电子线路保护有限公司 | Thin circuit protection device |
| CN104064414A (en) * | 2014-06-03 | 2014-09-24 | 东莞市凯恩电子科技有限公司 | Load protection device for over-temperature, overload and instantaneous kicking |
| CN204885059U (en) * | 2015-08-17 | 2015-12-16 | 王小春 | Breaker |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005142147A (en) * | 2003-10-15 | 2005-06-02 | Alps Electric Co Ltd | Thermally-actuated switch and its manufacturing method |
| CN203859064U (en) * | 2014-05-23 | 2014-10-01 | 宁波生方美丽华电器有限公司 | Thermoswitch |
-
2016
- 2016-01-21 CN CN201610039726.5A patent/CN106992103A/en active Pending
-
2017
- 2017-01-20 WO PCT/CN2017/071897 patent/WO2017125068A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1229204A (en) * | 1998-03-13 | 1999-09-22 | 打矢恒温器株式会社 | Thermal protector |
| CN201490127U (en) * | 2008-11-17 | 2010-05-26 | 邬若军 | Novel overcurrent and overheating protector |
| CN101740399A (en) * | 2008-11-25 | 2010-06-16 | 三星电子株式会社 | Method for partially covering insulating layer on metal wire in package |
| CN102763296A (en) * | 2010-12-16 | 2012-10-31 | 矢崎总业株式会社 | Liquid-proof structure for wire harness |
| CN202025689U (en) * | 2011-05-13 | 2011-11-02 | 朱天兵 | Combined overcurrent/overheating protector |
| CN202758812U (en) * | 2012-09-11 | 2013-02-27 | 常州市常宏同力电器有限公司 | A current and temperature dual protector |
| CN103346533A (en) * | 2013-06-25 | 2013-10-09 | 冯锐 | Circuit structure with protection function |
| CN103617928A (en) * | 2013-12-19 | 2014-03-05 | 上海长园维安电子线路保护有限公司 | Thin circuit protection device |
| CN104064414A (en) * | 2014-06-03 | 2014-09-24 | 东莞市凯恩电子科技有限公司 | Load protection device for over-temperature, overload and instantaneous kicking |
| CN204885059U (en) * | 2015-08-17 | 2015-12-16 | 王小春 | Breaker |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017125068A1 (en) | 2017-07-27 |
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Address after: 307 Qinjiang Road, Xuhui District, Shanghai Applicant after: LITTELFUSE ELECTRONICS (SHANGHAI) CO.,LTD. Applicant after: Tyco Electronics Corp. Address before: No. 287 Qinjiang Road, Caohejing Development Zone, Shanghai, 2003 Applicant before: RAYCHEM ELECTRONICS (SHANGHAI) Ltd. Applicant before: Tyco Electronics Corp. |
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Effective date of registration: 20190619 Address after: 307 Qinjiang Road, Xuhui District, Shanghai Applicant after: LITTELFUSE ELECTRONICS (SHANGHAI) CO.,LTD. Applicant after: Lite Co.,Ltd. Address before: 2003 No. 307 Qinjiang Road, Xuhui District, Shanghai Applicant before: LITTELFUSE ELECTRONICS (SHANGHAI) CO.,LTD. Applicant before: Tyco Electronics Corp. |
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