CN106954351A - A kind of flexible PCB hot-press equipment - Google Patents

A kind of flexible PCB hot-press equipment Download PDF

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Publication number
CN106954351A
CN106954351A CN201710297100.9A CN201710297100A CN106954351A CN 106954351 A CN106954351 A CN 106954351A CN 201710297100 A CN201710297100 A CN 201710297100A CN 106954351 A CN106954351 A CN 106954351A
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CN
China
Prior art keywords
fixture
hot
head
flexible pcb
disk roller
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Granted
Application number
CN201710297100.9A
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Chinese (zh)
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CN106954351B (en
Inventor
刘飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Anda Intelligent Equipment Co Ltd
Original Assignee
DONGGUAN ANDA AUTOMATIC EQUIPMENT Co Ltd
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Priority to CN201710297100.9A priority Critical patent/CN106954351B/en
Publication of CN106954351A publication Critical patent/CN106954351A/en
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Publication of CN106954351B publication Critical patent/CN106954351B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The present invention relates to technical field of processing equipment; refer in particular to a kind of flexible PCB hot-press equipment; including frame, the frame is provided with feed device, the diaphragm apparatus for protection circuit plate and the hot-press arrangement for making circuit board molding for carrying out feeding to circuit board.The present invention between feed device and hot-press arrangement by being provided with one layer of barrier film, when carrying out hot pressing to FPC, thermal head presses to FPC by barrier film, after it ensure that hot pressing effect, prevent because hot-press arrangement push it is too deep and so that FPC is subject to crushing, so as to reduce FPC scrappage, and then save production cost.

Description

A kind of flexible PCB hot-press equipment
Technical field
The present invention relates to technical field of processing equipment, a kind of flexible PCB hot-press equipment is referred in particular to.
Background technology
With the development of science and technology, the volume of the electronic equipment such as mobile phone, walkman is less and less, but function is more and more, In order to reach this situation, highly integrated circuit is essential.But, the property of ordinary circuit board itself determines it Volume can not continue to reduce after reaching to a certain degree, and in order to solve this problem, increasing producer is more attentions Power has been placed on flexible PCB(That is FPC)On.
Compared to PCB, FPC weight, volume and thickness are respectively provided with advantage, can not only reduce the electronic equipment used Volume and weight, due also to its is easier to process and make it that winding displacement is simpler, reduce scrappage, thus be more exposed to people Welcome.And FPC production stage final step, it is necessary to motherboard is firstly placed on mould, after thermal head punching press, FPC can be molded.
But, it is relatively thin due to FPC, thus in hot pressing easily because thermal head push it is too deep cause FPC to be damaged, no Beneficial to FPC production.
The content of the invention
The present invention provides a kind of flexible PCB hot-press equipment, FPC when can reduce hot pressing for problem of the prior art Scrappage, so as to improve production efficiency, and save production cost.
In order to solve the above-mentioned technical problem, the present invention is adopted the following technical scheme that:
A kind of flexible PCB hot-press equipment that the present invention is provided, including support, the support are provided with for entering to circuit board The feed device of row feeding, the diaphragm apparatus for protection circuit plate and for some chip hot pressing to be pasted on substrate The hot-press arrangement of conjunction.
Wherein, the feed device includes two mobile carriers and two slide rails, and two slide rails are respectively arranged at described Support;Side plate of the mobile carrier including base plate, the both sides for being respectively arranged at the base plate;Screw mandrel is provided between two blocks of side plates The lateral wall of transmission mechanism, wherein side plate is provided with the first drive mechanism for being used for driving the lead screw transmission mechanism;The silk The upper ends of bar transmission mechanism have circuit board mould;The lower surface of the base plate is provided with connector, and the connector activity is even It is connected to the slide rail.
Further, the feed mechanism also includes processing carrier, and the processing carrier is located between two mobile carriers, Support member is provided with the processing carrier.
Wherein, the diaphragm apparatus is including barrier film, the plastic film residue collect mechanism at the two ends for being respectively arranged at the support and puts film machine Structure, the barrier film is arranged between the feed device and the hot-press arrangement, and the barrier film is connected to the film gatherer Structure and the film placing mechanism.
Further, the plastic film residue collect mechanism includes bearing support, the first fixture, the second fixture and the first disk roller, described Barrier film is wire-wrapped in first disk roller, and first fixture is plugged in first disk roller respectively with second fixture Both sides;First fixture includes the first head, head rod and resistance regulation part, and first head is plugged in First disk roller, the head rod is through the bearing support and is plugged in first head;The resistance regulation portion Part includes two resisting force sheets and the adjustment sheet for controlling the gap between two resisting force sheets, the adjustment sheet, two resistances Piece is socketed on the head rod;Wherein a resisting force sheet is fixedly connected on the bearing support.
Further, second fixture includes the second head, the second connecting rod, spring, stop collar and pulling block, Second head is plugged in first disk roller, and second connecting rod is through the bearing support and is connected to second bar Head, the spring housing is located at second connecting rod, and the stop collar is socketed on second connecting rod, and the pulling block is connected to Second connecting rod.
Further, the film placing mechanism includes the second disk roller, the 3rd fixture, the 4th fixture, support frame and two Root pin, the barrier film is wire-wrapped in second disk roller, and the 3rd fixture is connected to institute with the 4th fixture State the both sides of the second disk roller;Support frame as described above is used to install the 3rd fixture and the 4th fixture;Described 3rd consolidates Determine part and the 4th fixture and be respectively equipped with pin-and-hole, second disk roller is respectively arranged at two ends with cotter way, and the pin is passed through The pin-and-hole is plugged in the cotter way.
Further, the 3rd fixture includes pull handle, the 3rd connecting rod, the 3rd adapter sleeve, the 3rd head And limit spring, the 3rd adapter sleeve is wrapped in the 3rd connecting rod, the two ends difference grafting of the 3rd connecting rod In the pull handle and the 3rd head, the pin-and-hole is arranged at the 3rd head;3rd adapter sleeve and described the Limit spring is provided between three connecting rods.
Wherein, the hot-press arrangement includes four hot pressing modules, and each hot pressing module includes multiple second driving machines respectively Structure and the quantity thermal head equal with drive mechanism described in second, the thermal head are located at the lower section of the drive mechanism.
Further, the thermal head is connected to the barrier film.
Beneficial effects of the present invention:The present invention is by the way that provided with diaphragm apparatus, when carrying out hot pressing to FPC, hot-press arrangement leads to Diaphragm apparatus is crossed to contact with FPC, thus avoid because hot-press arrangement push it is too deep caused by FPC damage, and then reduce FPC Scrappage.
Brief description of the drawings
Fig. 1 is overall schematic of the invention.
Fig. 2 is top view of the invention.
Fig. 3 is the schematic diagram of mobile carrier of the present invention and guide rail.
Fig. 4 processes the schematic diagram of carrier for the present invention.
Fig. 5 is the overall schematic of diaphragm apparatus of the present invention.
Fig. 6 is the decomposing schematic representation of plastic film residue collect mechanism of the present invention.
Fig. 7 is the decomposing schematic representation of the first fixture of the invention.
Fig. 8 is the sectional view of the second fixture of the invention.
Fig. 9 is the schematic diagram of film placing mechanism of the present invention.
Figure 10 puts the decomposing schematic representation of membrane structure for the present invention.
Figure 11 is the sectional view of the 3rd fixture of the invention.
Figure 12 is the top view of hot pressing module of the present invention.
Figure 13 is hot pressing module of the present invention and the schematic diagram of processing carrier.
Reference:
1-support, 2-feed device, 3-diaphragm apparatus, 4-hot-press arrangement, 21-mobile carrier, 22-processing is carried Tool, 23-slide rail, 211-base plate, 212-side plate, 213-lead screw transmission mechanism, the 214-the first drive mechanism, 215-circuit board mould, 216-connector, 221-support member, 31-barrier film, 32-plastic film residue collect mechanism, 33-put film machine Structure, 321-bearing support, the 322-the first fixture, the 323-the second fixture, the 324-the first disk roller, 3221-the first Head, 3222-head rod, 3223-resisting force sheet, 3224-adjustment sheet, the 3231-the second head, 3232-the Two connecting rods, 3233-back-moving spring, 3234-stop collar, 3235-pulling block, the 331-the second disk roller, 3311-pin Groove, the 332-the three fixture, the 333-the four fixture, 334-support frame, 335-pin-and-hole, 336-pin, 3321-limit spring, 3322-pull handle, the 3323-the three connecting rod, the 3324-the three adapter sleeve, 3325-the three Head, 41-hot pressing module, the 411-the second drive mechanism, 412-thermal head.
Embodiment
For the ease of the understanding of those skilled in the art, the present invention is made further with reference to embodiment and accompanying drawing It is bright, the content that embodiment is referred to not limitation of the invention.The present invention is described in detail below in conjunction with accompanying drawing.
As shown in Figure 1, Figure 2 with shown in Figure 13, a kind of flexible PCB hot-press equipment for providing of the present invention, including support 1 is described Support 1 is provided with for the feed device 2 that feeding is carried out to circuit board, the diaphragm apparatus 3 for protection circuit plate and is used for The hot-press arrangement 4 that some chip hot pressing are fitted on substrate.The present invention is by between feed device 2 and hot-press arrangement 4 Provided with diaphragm apparatus 3, when being operated, FPC to be processed is delivered to by feed device 2 first the lower section of hot-press arrangement 4, FPC is pressed to by hot-press arrangement 4 again and completes hot pressing, now due to being provided with diaphragm apparatus 3, therefore hot pressing between hot-press arrangement 4 and FPC Device 4 is to be contacted by diaphragm apparatus 3 with FPC, has no and is directly contacted with FPC, both prevented because hot-press arrangement 4 push it is too deep Caused by FPC be subject to crushing, to turn avoid and scald FPC caused by directly being contacted because of hot-press arrangement 4 with FPC, so as to reduce FPC scrappage, saves processing cost.
As shown in Figures 2 to 4, in the present embodiment, the feed device 2 includes processing carrier 22, two mobile carriers 21 and two slide rails 23, two slide rails 23 are respectively arranged at the support 1, and positioned at the both sides of the hot-press arrangement 4;It is described Side plate 212 of the mobile carrier 21 including base plate 211, the both sides for being respectively arranged at the base plate 211;Set between two blocks of side plates 212 There is lead screw transmission mechanism 213, wherein the lateral wall of side plate 212, which is provided with, is used to drive the first of the lead screw transmission mechanism 213 Drive mechanism 214;The upper ends of the lead screw transmission mechanism 213 have circuit board mould 215;The lower surface of the base plate 211 Provided with connector 216, the connector 216 is slidably connected to the slide rail 23;The processing carrier 22 is located at two mobile loads Between tool 21, support member 221 is provided with the processing carrier 22.When needing to carry out hot pressing, motherboard is placed on circuit board mould 215 top, by the first drive mechanism 214 drive lead screw transmission mechanism 213 move so that drive circuit board mould 215 by The top of mobile carrier 21 moves to the top of processing carrier 22;After the motherboard is machined, the first drive mechanism 214 continues Driving, drives next circuit board mould 215 to be translated to the lower section of hot-press arrangement 4, is placed with by next 215, circuit board mould The circuit board mould 215 of the motherboard is pushed into the top of another mobile carrier 21, so as to complete discharging.The present invention realizes automation Feeding and hot pressing, reduce artificial cost.Simultaneously as the size of two mobile carriers 21, shape are identical, therefore can be with Change the direction of feeding by changing the rotation direction of the first drive mechanism 214.
As shown in figure 5, in the present embodiment, the diaphragm apparatus 3 includes barrier film 31, is respectively arranged at the support 1 The plastic film residue collect mechanism 32 and film placing mechanism 33 at top two ends, the barrier film 31 are arranged at the feed device 2 and the hot-press arrangement 4 Between, the barrier film 31 is connected to the plastic film residue collect mechanism 32 and the film placing mechanism 33.When carrying out hot pressing, feed device 2 FPC for treating hot pressing deliver to the lower section of hot-press arrangement 4, and hot-press arrangement 4 is pushed, and drive barrier film 31 to press to FPC, with hot-press arrangement 4 Push, the tension force of barrier film 31 can be increasing, when the tension force is equal to the power that hot-press arrangement 4 is pushed, hot-press arrangement 4 can not continue Push, be maintained at certain height;Hot-press arrangement 4 resets after hot pressing is finished, and barrier film 31 is not because by the pressure of hot-press arrangement 4 Power also resets therewith, and feed device 2 continues FPC to be sent from the lower section of hot-press arrangement 4, and next FPC is delivered under hot-press arrangement 4 Side, proceeds hot pressing.The present invention can control the elasticity of barrier film 31 by setting plastic film residue collect mechanism 32 and film placing mechanism 33, It ensure that the state of script can timely be recovered by completing metacneme 31 in hot pressing, so as to ensure that hot pressing is carried out in which can continue to.
As shown in Figure 6 and Figure 7, in the present embodiment, the plastic film residue collect mechanism 32 includes bearing support 321, the first fixture 322nd, the second fixture 323 and the first disk roller 324, the barrier film 31 are wire-wrapped in first disk roller 324, first fixture 322 include the first head 3221, head rod 3222 and resistance regulation part, and first head 3221 is plugged in described First disk roller 324, the head rod 3222 is through the bearing support 321 and is plugged in first head 3221;It is described Resistance regulation part includes two resisting force sheets 3223 and the adjustment sheet for adjusting the gap between two resisting force sheets 3223 3224, the adjustment sheet 3224, two resisting force sheets 3223 are socketed on the head rod 3222;A wherein resisting force sheet 3223 It is fixedly connected on the bearing support 321.When hot-press arrangement 4, which pushes drive barrier film 31, presses to FPC, the first disk roller 324 can occur Rotate, so as to drive the first fixture 322 and the second fixture 323 to be rotated coaxially.Therefore, barrier film 31 is controlled in order to reach Elasticity effect, the present invention is in the first fixture 322 provided with resisting force sheet 3223 and for adjusting between resisting force sheet 3223 Gap adjustment sheet 3224, head rod 3222 is driven by pivoted eyelid 3224 and is moved forward and backward, another resistance is driven Power piece 3223 is moved, so as to adjust the gap between two resisting force sheets 3223.When the gap between two resisting force sheets 3223 reduces When, the resistance increase that the first fixture 322 overcomes needed for rotating, so that the resistance that the first disk roller 324 overcomes needed for rotating Increase, and then be more difficult to drive the first disk roller 324 to rotate when barrier film 31 is pushed, the tension force of barrier film 31 is increased with this.
As shown in figure 8, in the present embodiment, second fixture 323 includes the second head 3231, the second connecting rod 3232nd, back-moving spring 3233, stop collar 3234 and pulling block 3235, second head 3231 are plugged in first disk roller 324, second connecting rod 3232 is through the bearing support 321 and is connected to second head 3231, the back-moving spring 3233 are sheathed on second connecting rod 3232, and the stop collar 3234 is socketed on second connecting rod 3232, described spacing One end of set 3234 is connected to pulling block 3235, and the other end is connected in bearing support 321;The pulling block 3235 is connected to described second and connected Extension bar 3232.Repaired or during change of lap, pulled toward the direction away from the first disk roller 324 when needing to pull down the first disk roller 324 Pulling block 3235, because stop collar 3234 is fixedly connected on bearing support 321, therefore pulling block 3235 can depart from stop collar 3234, and lead to Cross the second connecting rod 3232 drive the second head 3231 depart from the first disk roller 324, the deformation by compression of back-moving spring 3233 so that The first disk roller 324 can be taken down, hand is now unclamped, pulling block 3235, second connects in the presence of the restorative change of back-moving spring 3233 Extension bar 3232 can recover original state;When needing to load onto the first disk roller 324, pulling block 3235 is pulled open, the first disk roller is installed Pulling block 3235 is unclamped after 324, second fixture 323 recovers original state in the presence of back-moving spring 3233, so that Obtain the first disk roller 324 and recover vacant state in the presence of the first fixture 322 and the second fixture 323.The present invention by Second fixture 323 is provided with quick-disassembly structure, the Quick Release effect to the first disk roller 324 is realized, consequently facilitating pulling down the first disk roller 324 are safeguarded or are changed, and save maintenance cost.
As shown in figs, in the present embodiment, the film placing mechanism 33 includes the second disk roller 331, the 3rd fixture 332nd, the 4th fixture 333, support frame 334 and two pins 336, the barrier film 31 are wire-wrapped in second disk roller 331, institute State the both sides that the 3rd fixture 332 is connected to second disk roller 331 with the 4th fixture 333;Support frame as described above 334 are used to install the 3rd fixture 332 and the 4th fixture 333;3rd fixture 332 and the 4th fixture 333 are respectively equipped with pin-and-hole 335, and second disk roller 331 is respectively arranged at two ends with cotter way 3311, and the pin 336 is through described Pin-and-hole 335 is plugged in the cotter way 3311.When the second disk roller 331 is connected to the 3rd fixture 332 and the 4th fixture After 333, pin 336 is inserted into pin-and-hole 335 so that pin 336 is through pin-and-hole 335 and inserts in pin 336, ensure that Second disk roller 331 is without departing from the 3rd fixture 332 or the 4th fixture 333.
As shown in figure 11, in the present embodiment, the 3rd fixture 332 includes pull handle 3322, the 3rd connecting rod 3323rd, the 3rd adapter sleeve 3324, the 3rd head 3325 and limit spring 3321, the two ends difference of the 3rd connecting rod 3323 The head 3325 of pull handle 3322 and the 3rd is plugged in, the pin-and-hole 335 is arranged at the 3rd head 3325;It is described 3rd adapter sleeve 3324 is socketed on the 3rd connecting rod 3323, the 3rd adapter sleeve 3324 and the 3rd connecting rod 3323 Between be provided with limit spring 3321., can be by pulling open pull handle by being provided with limit spring 3321 in the 3rd fixture 332 3322 realize the Quick Release of the second disk roller 331 so that the maintenance of the second disk roller 331 more facilitates.
As shown in Figure 12 and Figure 13, in the present embodiment, the hot-press arrangement 4 includes four hot pressing modules 41, Mei Gere Die block 41 includes multiple second drive mechanisms 411 and the quantity thermal head 412 equal with drive mechanism described in second respectively, The thermal head 412 is located at the lower section of the drive mechanism.The present invention is set provided with four hot pressing modules 41, each hot pressing module 41 There are 20 the second drive mechanisms 411 and 20 thermal heads 412, realize the function of once manufacturing 80 pieces of FPC, so that Improve processing efficiency.Preferably, each thermal head 412 is respectively equipped with independent temperature, can be individually to any one hot pressing First 412 temperature is controlled, it is achieved thereby that to the precise control of temperature, reducing FPC scrappage.
As shown in figure 13, in the present embodiment, the thermal head 412 is connected to the barrier film 31, passes through the second driving machine Structure 411 realizes pushing for control thermal head 412, after the second drive mechanism 411 resets, and recovering deformation by barrier film 31 drives The rising of thermal head 412, without setting specialized agency to may be such that, thermal head 412 rises, and reduces the maintenance cost of the present invention.
The above, is only present pre-ferred embodiments, not makees any formal limitation to the present invention, although The present invention is disclosed as above with preferred embodiment, but is not limited to the present invention, any those skilled in the art, Do not depart from the range of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent change The Equivalent embodiments of change, as long as being, without departing from technical solution of the present invention content, to refer to according to the technology of the present invention to above example Any simple modification, equivalent variations and the modification made, are belonged in the range of technical solution of the present invention.

Claims (10)

1. a kind of flexible PCB hot-press equipment, it is characterised in that:Including support, the support is provided with for entering to circuit board The feed device of row feeding, the diaphragm apparatus for protection circuit plate and for some chip hot pressing to be pasted on substrate The hot-press arrangement of conjunction.
2. a kind of flexible PCB hot-press equipment according to claim 1, it is characterised in that:The feed device includes two Individual mobile carrier and two slide rails, two slide rails are respectively arranged at the support;The mobile carrier includes base plate, set respectively It is placed in the side plate of the both sides of the base plate;Lead screw transmission mechanism is provided between two blocks of side plates, the lateral wall of wherein side plate is provided with The first drive mechanism for driving the lead screw transmission mechanism;The upper ends of the lead screw transmission mechanism have circuit board module Tool;The lower surface of the base plate is provided with connector, and the connector is movably connected on the slide rail.
3. a kind of flexible PCB hot-press equipment according to claim 2, it is characterised in that:The feed mechanism also includes Carrier is processed, the processing carrier is located between two mobile carriers, support member is provided with the processing carrier.
4. a kind of flexible PCB hot-press equipment according to claim 1, it is characterised in that:The diaphragm apparatus include every Film, be respectively arranged at the support two ends plastic film residue collect mechanism and film placing mechanism, the barrier film be arranged at the feed device with Between the hot-press arrangement, the barrier film is connected to the plastic film residue collect mechanism and the film placing mechanism.
5. a kind of flexible PCB hot-press equipment according to claim 4, it is characterised in that:The plastic film residue collect mechanism includes branch Bolster, the first fixture, the second fixture and the first disk roller, the barrier film are wire-wrapped in first disk roller, and described first fixes Part is plugged in the both sides of first disk roller with second fixture respectively;First fixture includes the first head, the One connecting rod and resistance regulation part, first head are plugged in first disk roller, and the head rod passes through institute State bearing support and be plugged in first head;The resistance regulation part includes two resisting force sheets and for controlling two resistances The adjustment sheet in the gap between power piece, the adjustment sheet, two resisting force sheets are socketed on the head rod;A wherein resistance Piece is fixedly connected on the bearing support.
6. a kind of flexible PCB hot-press equipment according to claim 5, it is characterised in that:Second fixture includes Second head, the second connecting rod, spring, stop collar and pulling block, second head are plugged in first disk roller, described Two connecting rods are through the bearing support and are connected to second head, and the spring housing is located at second connecting rod, described Stop collar is socketed on second connecting rod, and the pulling block is connected to second connecting rod.
7. a kind of flexible PCB hot-press equipment according to claim 4, it is characterised in that:The film placing mechanism includes the Two disk rollers, the 3rd fixture, the 4th fixture, support frame and two pins, the barrier film are wire-wrapped in second disk roller, institute State the 3rd fixture and be connected to the both sides of second disk roller with the 4th fixture;Support frame as described above is used to install institute State the 3rd fixture and the 4th fixture;3rd fixture is respectively equipped with pin-and-hole with the 4th fixture, described Second disk roller is respectively arranged at two ends with cotter way, and the pin is plugged in the cotter way through the pin-and-hole.
8. a kind of flexible PCB hot-press equipment according to claim 7, it is characterised in that:3rd fixture includes Pull handle, the 3rd connecting rod, the 3rd adapter sleeve, the 3rd head and limit spring, the 3rd adapter sleeve are wrapped in described 3rd connecting rod, the two ends of the 3rd connecting rod are plugged in the pull handle and the 3rd head respectively, and the pin-and-hole is set It is placed in the 3rd head;Limit spring is provided between 3rd adapter sleeve and the 3rd connecting rod.
9. a kind of flexible PCB hot-press equipment according to claim 1, it is characterised in that:The hot-press arrangement includes four Individual hot pressing module, each hot pressing module includes multiple second drive mechanisms respectively and quantity is equal with drive mechanism described in second Thermal head, the thermal head be located at the drive mechanism lower section.
10. a kind of flexible PCB hot-press equipment according to claim 9, it is characterised in that:The thermal head is connected to The barrier film.
CN201710297100.9A 2017-04-28 2017-04-28 Flexible circuit board hot pressing equipment Active CN106954351B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710297100.9A CN106954351B (en) 2017-04-28 2017-04-28 Flexible circuit board hot pressing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710297100.9A CN106954351B (en) 2017-04-28 2017-04-28 Flexible circuit board hot pressing equipment

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Publication Number Publication Date
CN106954351A true CN106954351A (en) 2017-07-14
CN106954351B CN106954351B (en) 2024-01-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117082767A (en) * 2023-10-16 2023-11-17 上海贺鸿电子科技股份有限公司 Aluminum-based and FR4 mixed-pressure composite device capable of efficiently radiating heat

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WO2003075446A1 (en) * 2002-03-01 2003-09-12 Seiko Epson Corporation Piezoelectric actuator, and timepiece and portable unit with piezoelectric actuator
US20070175021A1 (en) * 2006-01-26 2007-08-02 Roland Speckels Arrangement For Mounting Electronic Components On A Support
US20130306712A1 (en) * 2012-05-15 2013-11-21 Hon Hai Precision Industry Co., Ltd. Hot press device and hot pressing method
CN204104218U (en) * 2014-09-12 2015-01-14 湖州胜僖电子科技有限公司 A kind of flexible PCB pressing workbench
CN204145892U (en) * 2014-09-12 2015-02-04 湖州胜僖电子科技有限公司 A kind of flexible PCB pressing equipment of improvement
CN206993497U (en) * 2017-04-28 2018-02-09 东莞市安达自动化设备有限公司 A kind of flexible PCB hot-press equipment

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Publication number Priority date Publication date Assignee Title
US6544377B1 (en) * 1997-11-20 2003-04-08 Matsushita Electric Industrial Co., Ltd. Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
US20030121616A1 (en) * 1997-11-20 2003-07-03 Shozo Minamitani Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
WO2003075446A1 (en) * 2002-03-01 2003-09-12 Seiko Epson Corporation Piezoelectric actuator, and timepiece and portable unit with piezoelectric actuator
US20070175021A1 (en) * 2006-01-26 2007-08-02 Roland Speckels Arrangement For Mounting Electronic Components On A Support
US20130306712A1 (en) * 2012-05-15 2013-11-21 Hon Hai Precision Industry Co., Ltd. Hot press device and hot pressing method
CN204104218U (en) * 2014-09-12 2015-01-14 湖州胜僖电子科技有限公司 A kind of flexible PCB pressing workbench
CN204145892U (en) * 2014-09-12 2015-02-04 湖州胜僖电子科技有限公司 A kind of flexible PCB pressing equipment of improvement
CN206993497U (en) * 2017-04-28 2018-02-09 东莞市安达自动化设备有限公司 A kind of flexible PCB hot-press equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117082767A (en) * 2023-10-16 2023-11-17 上海贺鸿电子科技股份有限公司 Aluminum-based and FR4 mixed-pressure composite device capable of efficiently radiating heat
CN117082767B (en) * 2023-10-16 2024-01-26 上海贺鸿电子科技股份有限公司 Aluminum-based and FR4 mixed-pressure composite device capable of efficiently radiating heat

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