CN106946477A - LED glass closes chip architecture and its glass processing lamination process - Google Patents
LED glass closes chip architecture and its glass processing lamination process Download PDFInfo
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- CN106946477A CN106946477A CN201710126321.XA CN201710126321A CN106946477A CN 106946477 A CN106946477 A CN 106946477A CN 201710126321 A CN201710126321 A CN 201710126321A CN 106946477 A CN106946477 A CN 106946477A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10064—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising at least two glass sheets, only one of which being an outer layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to video, photoelectric glass technical field, specifically a kind of LED glass closes chip architecture and its glass processing lamination process, provided with PVB doublings layer and light emitting diode between bottom electro-conductive glass and top layer glass, it is characterized in that the area of top layer glass is less than the area of bottom electro-conductive glass, there is gap between the edge of bottom electro-conductive glass and the edge of top layer glass, the surface of the exposed bottom electro-conductive glass marginal gap after the completion of piece is closed of the circuit pack that bottom electro-conductive glass is etched.Compared with the existing technology, combining structure simple possible, production technology is novel, the advantage is that by the present invention：Top layer glass size is less than bottom electro-conductive glass, without having to worry about pullling the factors such as electric wire, efficiency high easy to clean when glass is cleaned；In doubling, without lead line is attached with FPCB, without worrying electrostatic breakdown；After the completion of glass pressing just by FPCB and bottom conductive exposed glass surface connection, in the absence of subsequently can not secondary reparation phenomenon.
Description
[technical field]
The present invention relates to video, photoelectric glass technical field, specifically a kind of LED glass closes chip architecture and its glass
Process lamination process.
[background technology]
The products such as traditional screen glass and photoelectric glass use the glass of formed objects, and PVB doublings come first lead line again
Realize, it mainly has the disadvantage that：1st, after lead line, circuit or FPC easily are broken during glass cleaning；2、
There is substantial amounts of electrostatic during PVB doublings, light emitting diode is punctured easily by exposed wire electrodischarge；The 3rd, once PVB doublings are complete
Find that it is that can not carry out secondary reparation to draw electric wire bad connection into rear.Therefore need to design a kind of new glass conjunction chip architecture
And its production technology.
[content of the invention]
It is an object of the invention to solve, the deficiencies in the prior art close chip architecture there is provided a kind of LED glass and its glass adds
Work lamination process, using glass size blade technolgy, bottom electro-conductive glass circuit pack is exposed, without drawing during doubling
Circuit or bonding FPC, electrostatic can not produce effective discharge path, circuit or flexibility reconnected after the completion of doubling
Wiring board, secondary reparation can be also carried out even if there is bad connection, substantially increased production efficiency and reduced product fraction defective.
To achieve these goals, design a kind of LED glass and close chip architecture, including bottom electro-conductive glass, PVB doublings, top
Layer glass, light emitting diode, provided with PVB doublings layer and light emitting diode, its feature between bottom electro-conductive glass and top layer glass
Be that the area of top layer glass is less than the area of bottom electro-conductive glass, the edge of bottom electro-conductive glass and the edge of top layer glass it
Between there is gap, the exposed bottom electro-conductive glass marginal gap after the completion of piece is closed of the circuit pack that bottom electro-conductive glass is etched
Surface.
Also design a kind of glass processing lamination process that chip architecture is closed using the LED glass, it is characterised in that bottom is led
Electric glass carries out filling resin or pressed after being put into resin film, and the area of top layer glass is less than the face of bottom electro-conductive glass
Product, and by the surface of the exposed bottom electro-conductive glass marginal gap after the completion of piece is closed of the circuit pack of bottom electro-conductive glass, press
The bottom electro-conductive glass edge that has closed carries out FPCB installations, and FPCB passes through partial denudation circuit outside and external drive
Circuit is connected.
Described glass processing lamination process, specific method is as follows：
A. before etching, the visual inspection of conductive membrane stage is first carried out to bottom electro-conductive glass；
B. bottom electro-conductive glass carries out laser-induced thermal etching circuit using burst domain scanning mode；
C. visual inspection is carried out to the conducting film circuit of bottom electro-conductive glass after overetch, according to the data gathered point
Analyse conducting film circuit whether short-circuit or breaking, there is not damaged, breakage；
D. LED attachments are carried out using large LED photoelectric glass chip mounter after etched circuit；
Bottom electro-conductive glass after the completion of e.LED attachments is directly entered UV curing apparatus and solidified；
Bottom electro-conductive glass after the completion of f.UV solidifications enters back into silver paste curing apparatus and carries out solidification work；
G. the bottom electro-conductive glass solidified carries out energization inspection, is connected using contact tool after substrate conducting glass,
Carry out high temperature, low temperature and light closing continuous ageing test；
H. the bottom electro-conductive glass after burn-in test is complete carries out filling resin or pressed after being put into resin film, top layer
The area of glass is less than the area of bottom electro-conductive glass, and the part circuit of bottom electro-conductive glass is exposed after the completion of piece is closed
The surface of bottom electro-conductive glass marginal gap；
I. the bottom electro-conductive glass that has pressed carries out FPCB installations, FPCB by way of conductive double sided adhesive tape or scolding tin with it is naked
The corresponding connection of circuit on bottom electro-conductive glass marginal gap surface is exposed at, while the FPCB other ends connect with external drive circuit plate
Connect；
Glass after j.FPCB installations enters aging streamline, carries out high temperature, low temperature and lights closing continuous ageing survey
Examination；
K. the glass after the completion of burn-in test is installed on framework, and drive circuit board and power supply are placed on the space in framework；
L. the monomer photoelectric glass after being completed carries out polylith assembly, is carried out monomer photoelectric glass using mounting bracket
Splicing, while connecting Switching Power Supply, netting twine and control system, plays out video documents content and image measurement.
Check that the method for conductive membrane stage is specific as follows using vision system before described bottom electro-conductive glass etching：It is conductive
The brightness of each pixel is almost equal among the image that camera is obtained when film is without breakage, when conducting film has damaged generation
The brightness of opposite position imagery zone pixel has obvious difference with the brightness of normal region pixel, the shadow that will have brightness to change
As the image for being converted into being represented with 0 and 1 using numerical value alignments, with 0 region represented into the damaged area of conducting film after changing
Domain, first determines whether out the damaged region of conducting film by means of which, then calculates the damaged area of conducting film to judge the original
Whether material, which can continue to put into producing line, is continuing with；Detect behind the damaged position of conducting film with laser erosion will be carried out
The circuit at quarter is contrasted, if damaged position is not in the range of etched circuit, this bottom electro-conductive glass can continue to put into
Produced in the producing line of next link.
Described burst domain scanning mode is specific as follows：Laser lithography system is virtually divided whole bottom electro-conductive glass
Piece, work is etched with face, and laser head light source is shone on bottom electro-conductive glass in the way of fan-shaped, and then laser head is with solid
Pinpoint as center of circle swing, required face can be etched rapidly.
After described bottom electro-conductive glass etched circuit, visual inspection is carried out to conducting film circuit using vision system
Specific method is as follows：The brightness of each pixel in image is obtained using camera, each brightness carries out calculus calculating to image
Etching line segment can be found out in the picture, and whether judgement is carried out continuously to etching line segment, and such as etching line segment is judged as continuous shape
State, this bottom electro-conductive glass can continue to put into be produced in the producing line of next link.
Compared with the existing technology, combining structure simple possible, production technology is novel, the advantage is that by the present invention：
1st, top layer glass size of the present invention is less than bottom electro-conductive glass, without having to worry about pullling circuit when glass is cleaned
Etc. factor, efficiency high easy to clean；
2nd, the present invention is in doubling, without lead line is attached with FPCB, without worrying the phenomenons such as electrostatic breakdown；
3rd, circuit of the present invention just by FPCB and bottom conductive exposed glass on surface after the completion of the pressing of two sheet glass enters
Row connection, in the absence of can not subsequently carry out the phenomenon of secondary reparation.
[brief description of the drawings]
Fig. 1 is the schematic diagram that LED glass of the present invention closes chip architecture；
In figure：1. the bottom electro-conductive glass 2.PVB doublings layer light emitting diode 5.FPCB flexible wires of 3. top layer glass 4.
Road plate.
[embodiment]
The invention will be further described below in conjunction with the accompanying drawings, for the structure and principle of this device people professional to this
It is very clear.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to limit this
Invention.
Referring to Fig. 1, described LED glass closes chip architecture, including bottom electro-conductive glass, PVB doublings, top layer glass, luminous
Diode, provided with PVB doublings layer and light emitting diode between bottom electro-conductive glass and top layer glass, it is characterised in that top layer glass
Area be less than bottom electro-conductive glass area, there is gap between the edge of bottom electro-conductive glass and the edge of top layer glass,
The surface for the exposed bottom electro-conductive glass marginal gap after the completion of piece is closed of circuit pack that bottom electro-conductive glass is etched.
Embodiment
The specific method of glass production lamination process is as follows：
A. before etching, the visual inspection of conductive membrane stage is first carried out to bottom electro-conductive glass；
B. bottom electro-conductive glass carries out laser-induced thermal etching circuit using burst domain scanning mode；
C. visual inspection is carried out to the conducting film circuit of bottom electro-conductive glass after overetch, according to the data gathered point
Analyse conducting film circuit whether short-circuit or breaking, there is not damaged, breakage；
D. LED attachments are carried out using large LED photoelectric glass chip mounter after etched circuit；
Bottom electro-conductive glass after the completion of e.LED attachments is directly entered UV curing apparatus and solidified；
Bottom electro-conductive glass after the completion of f.UV solidifications enters back into silver paste curing apparatus and carries out solidification work；
G. the bottom electro-conductive glass solidified carries out energization inspection, is connected using contact tool after substrate conducting glass,
Carry out high temperature, low temperature and light closing continuous ageing test；
H. the bottom electro-conductive glass after burn-in test is complete carries out filling resin or pressed after being put into resin film, top layer
The area of glass is less than the area of bottom electro-conductive glass, and the part circuit of bottom electro-conductive glass is exposed after the completion of piece is closed
The surface of bottom electro-conductive glass marginal gap；
I. the bottom electro-conductive glass that has pressed carries out FPCB installations, FPCB by way of conductive double sided adhesive tape or scolding tin with it is naked
The corresponding connection of circuit on bottom electro-conductive glass marginal gap surface is exposed at, while the FPCB other ends connect with external drive circuit plate
Connect；
Glass after j.FPCB installations enters aging streamline, carries out high temperature, low temperature and lights closing continuous ageing survey
Examination；
K. the glass after the completion of burn-in test is installed on framework, and drive circuit board and power supply are placed on the space in framework；
L. the monomer photoelectric glass after being completed carries out polylith assembly, is carried out monomer photoelectric glass using mounting bracket
Splicing, while connecting Switching Power Supply, netting twine and control system, plays out video documents content and image measurement.
Check that the method for conductive membrane stage is specific as follows using vision system before the etching of bottom electro-conductive glass：Conducting film does not have
The brightness of each pixel is almost equal among the image that camera is obtained when damaged, corresponding when conducting film has damaged generation
The brightness of position images area pixel has obvious difference with the brightness of normal region pixel, and the image for having brightness to change is utilized
Numerical value alignments are converted into the image represented with 0 and 1, are utilized after changing with 0 region represented into the damaged region of conducting film
This mode first determines whether out the damaged region of conducting film, then calculates the damaged area of conducting film whether to judge the raw material
It can continue to put into producing line to be continuing with；Detect behind the damaged position of conducting film with the circuit of laser-induced thermal etching will be carried out
Contrasted, if damaged position is not in the range of etched circuit, this bottom electro-conductive glass can continue to put into next link
Producing line in produce.
Burst domain scanning mode is specific as follows：Laser lithography system carries out virtual burst to whole bottom electro-conductive glass, with
Face is etched work, and laser head light source is shone on bottom electro-conductive glass in the way of fan-shaped, then laser head is with fixing point
For center of circle swing, required face can be etched rapidly.
After bottom electro-conductive glass etched circuit, the specific side of visual inspection is carried out to conducting film circuit using vision system
Method is as follows：The brightness of each pixel in image is obtained using camera, image each brightness progress calculus is calculated can be in figure
Etching line segment is found out as in, and whether judgement is carried out continuously to etching line segment, such as etching line segment is judged as continuous state, this bottom
Layer electro-conductive glass can continue to put into be produced in the producing line of next link.
Claims (6)
1. a kind of LED glass closes chip architecture, including bottom electro-conductive glass, PVB doublings, top layer glass, light emitting diode, bottom is led
Provided with PVB doublings layer and light emitting diode between electric glass and top layer glass, it is characterised in that the area of top layer glass is less than bottom
, there is gap in the area of layer electro-conductive glass, between the edge of bottom electro-conductive glass and the edge of top layer glass by the conductive glass of bottom
The surface of the exposed bottom electro-conductive glass marginal gap after the completion of piece is closed of circuit pack of glass etching.
2. a kind of glass processing lamination process that chip architecture is closed using LED glass as claimed in claim 1, it is characterised in that bottom
Electro-conductive glass carries out filling resin or pressed after being put into resin film, and the area of top layer glass is less than bottom electro-conductive glass
Area, and by the surface of the exposed bottom electro-conductive glass marginal gap after the completion of piece is closed of the circuit pack of bottom electro-conductive glass,
The bottom electro-conductive glass edge pressed carries out FPCB installations, and FPCB is driven by the circuit of the partial denudation outside with outside
Dynamic circuit connection.
3. a kind of LED glass as claimed in claim 2 closes the glass processing lamination process of chip architecture, it is characterised in that specific side
Method is as follows：
A. before etching, the visual inspection of conductive membrane stage is first carried out to bottom electro-conductive glass；
B. bottom electro-conductive glass carries out laser-induced thermal etching circuit using burst domain scanning mode；
C. visual inspection is carried out to the conducting film circuit of bottom electro-conductive glass after overetch, led according to the data analysis gathered
Whether electrolemma circuit is short-circuit or breaking, there is not damaged, breakage；
D. LED attachments are carried out using large LED photoelectric glass chip mounter after etched circuit；
Bottom electro-conductive glass after the completion of e.LED attachments is directly entered UV curing apparatus and solidified；
Bottom electro-conductive glass after the completion of f.UV solidifications enters back into silver paste curing apparatus and carries out solidification work；
G. the bottom electro-conductive glass solidified carries out energization inspection, is connected using contact tool after substrate conducting glass, carries out
High temperature, low temperature light closing continuous ageing test；
H. the bottom electro-conductive glass after burn-in test is complete carries out filling resin or pressed after being put into resin film, top layer glass
Area be less than bottom electro-conductive glass area, and by the part circuit of bottom electro-conductive glass it is exposed close piece after the completion of bottom
The surface of electro-conductive glass marginal gap；
I. the bottom electro-conductive glass that has pressed carries out FPCB installations, FPCB by way of conductive double sided adhesive tape or scolding tin with it is exposed
The corresponding connection of circuit on bottom electro-conductive glass marginal gap surface, while the FPCB other ends are connected with external drive circuit plate；
Glass after j.FPCB installations enters aging streamline, carries out high temperature, low temperature and lights closing continuous ageing test；
K. the glass after the completion of burn-in test is installed on framework, and drive circuit board and power supply are placed on the space in framework；
L. the monomer photoelectric glass after being completed carries out polylith assembly, is spelled monomer photoelectric glass using mounting bracket
Connect, while connecting Switching Power Supply, netting twine and control system, play out video documents content and image measurement.
4. a kind of LED glass as claimed in claim 3 closes the glass processing lamination process of chip architecture, it is characterised in that bottom is led
Check that the method for conductive membrane stage is specific as follows using vision system before electric glass etching：Camera institute when conducting film is without breakage
The brightness of each pixel is almost equal among the image of acquisition, the opposite position imagery zone picture when conducting film has damaged generation
The brightness of element has obvious difference with the brightness of normal region pixel, will have the image that brightness changes to turn using numerical value alignments
Change the image represented with 0 and 1 into, sentenced first by means of which into the damaged region of conducting film with 0 region represented after changing
Break and the damaged region of conducting film, then calculate the damaged area of conducting film to judge whether the raw material can continue to put into
It is continuing with producing line；Contrasted after detecting the damaged position of conducting film with the circuit of laser-induced thermal etching will be carried out, if broken
The position of damage is not in the range of etched circuit, and this bottom electro-conductive glass can continue to put into be produced in the producing line of next link.
5. a kind of LED glass as claimed in claim 3 closes the glass processing lamination process of chip architecture, it is characterised in that burst area
Scan mode is specific as follows：Laser lithography system carries out virtual burst to whole bottom electro-conductive glass, and work is etched with face
Make, laser head light source is shone on bottom electro-conductive glass in the way of fan-shaped, then laser head is using fixing point as center of circle swing,
Required face can be etched rapidly.
6. a kind of LED glass as claimed in claim 3 closes the glass processing lamination process of chip architecture, it is characterised in that bottom is led
After electric glass etching circuit, the specific method for carrying out visual inspection to conducting film circuit using vision system is as follows：Using taking the photograph
As head obtains the brightness of each pixel in image, etching line can be found out to image each brightness progress calculus calculating in the picture
Section, and whether judgements is carried out continuously to etching line segment, such as etch line segment and be judged as continuous state, this bottom electro-conductive glass can be with
Produced in the producing line for continuing to put into next link.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126321.XA CN106946477A (en) | 2017-03-05 | 2017-03-05 | LED glass closes chip architecture and its glass processing lamination process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710126321.XA CN106946477A (en) | 2017-03-05 | 2017-03-05 | LED glass closes chip architecture and its glass processing lamination process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106946477A true CN106946477A (en) | 2017-07-14 |
Family
ID=59468167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710126321.XA Pending CN106946477A (en) | 2017-03-05 | 2017-03-05 | LED glass closes chip architecture and its glass processing lamination process |
Country Status (1)
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| CN (1) | CN106946477A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106910810A (en) * | 2017-03-09 | 2017-06-30 | 丁文兰 | A kind of intelligent display building glass and preparation technology |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN106910810B (en) * | 2017-03-09 | 2019-02-12 | 丁文兰 | A kind of intelligent display building glass and preparation process |
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Application publication date: 20170714 |