CN106937228A - A kind of MEMS microphone - Google Patents
A kind of MEMS microphone Download PDFInfo
- Publication number
- CN106937228A CN106937228A CN201511018058.XA CN201511018058A CN106937228A CN 106937228 A CN106937228 A CN 106937228A CN 201511018058 A CN201511018058 A CN 201511018058A CN 106937228 A CN106937228 A CN 106937228A
- Authority
- CN
- China
- Prior art keywords
- substrate
- mems microphone
- sensor
- acoustic aperture
- mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000002184 metal Substances 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The present invention relates to electronic device field, more particularly to a kind of MEMS microphone.A kind of MEMS microphone, the MEMS microphone includes：First substrate；Second substrate, is fixedly connected with the first substrate, is arranged at the first substrate top, and the acoustic aperture through the second substrate is provided with the second substrate；Mesh layer, is covered on the top of the second substrate, and the mesh layer is provided with multiple mesh；Sensor, is connected with the acoustic aperture on the second substrate, is arranged between the first substrate and the second substrate, and the sensor is identified to sound；And sound passes sequentially through the mesh, the acoustic aperture into the sensor.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of MEMS microphone.
Background technology
Current MEMS microphone typically each has an acoustic aperture, and the acoustic aperture is connect with the external world
Tactile, so, during extraneous dust can enter into sensor or substrate from this acoustic aperture, meeting
The aggravation of dust in microphone is caused, causes microphone effectively to use, if in humidity
Environment in, the extraneous moisture of electronic equipment can be entered into microphone, meanwhile, if sound
When the frequency of amount is higher, the volume that sensor is received just has more noise, sensor
The sound of outside can not clearly be received.
The content of the invention
For problems of the prior art, the invention provides a kind of MEMS microphone,
Can dust-proof, spill resistant, and volume can be adjusted.
The present invention is adopted the following technical scheme that：
A kind of MEMS microphone, the MEMS microphone includes：
First substrate；
Second substrate, is fixedly connected with the first substrate, is arranged at the first substrate top,
The acoustic aperture through the second substrate is provided with the second substrate；
Mesh layer, is covered on the top of the second substrate, and the mesh layer is provided with multiple nets
Hole；
Sensor, is connected with the acoustic aperture on the second substrate, be arranged at the first substrate with
Between the second substrate, the sensor is identified to sound；And
Sound passes sequentially through the mesh, the acoustic aperture into the sensor.
Preferably, the MEMS microphone also includes：
Column；And
The first substrate is fixedly connected with the second substrate by the column.
Preferably, the MEMS microphone also includes：
Sensor, is fixedly connected with the second substrate, is arranged at the lower section of the acoustic aperture, right
Sound is identified.
Preferably, the first substrate and/or the second substrate and/or the column are PCB
Plate.
Preferably, the mesh layer is nonwoven fabric layer.
Preferably, the mesh layer is metal device.
The beneficial effects of the invention are as follows：
The MEMS microphone that the present invention is provided pastes one layer of mesh above second substrate
Layer, the mesh layer can be dust-proof, and because mesh layer can shelter from acoustic aperture, so as to prevent water
In point entering to acoustic aperture, and can be to the regulation of the sound of high frequency due to having pasted one layer of mesh layer
Into clearly scope.
Brief description of the drawings
Fig. 1 is a kind of structural representation of MEMS microphone of the invention；
Fig. 2 is the structural representation of mesh layer of the present invention.
Specific embodiment
It should be noted that in the case where not conflicting, following technical proposals, technical characteristic it
Between can be mutually combined.
Specific embodiment of the invention is further described below in conjunction with the accompanying drawings：
As shown in figure 1, a kind of MEMS microphone is present embodiments provided, the MEMS
Microphone includes：
First substrate；
Second substrate, is fixedly connected with the first substrate, is arranged at the first substrate top,
The acoustic aperture through the second substrate is provided with the second substrate；
Mesh layer, is covered on the top of the second substrate, and the mesh layer is provided with multiple nets
Hole；
Sensor, is connected with the acoustic aperture on the second substrate, be arranged at the first substrate with
Between the second substrate, the sensor is identified to sound；And
Sound passes sequentially through the mesh, the acoustic aperture into the sensor.
In a preferred embodiment of the invention, MEMS microphone also includes：
Column；And
First substrate is fixedly connected with second substrate by column.
First substrate and second substrate in the present embodiment can be pcb board, in the present embodiment
Column can also be pcb board.
In a preferred embodiment of the invention, MEMS microphone also includes：
Integrated circuit, is electrically connected respectively at sensor and second substrate, and sound is processed.
As shown in Fig. 2 including multiple mesh in mesh layer in Fig. 2, the present invention one is preferably
Embodiment in, mesh layer is weaved cotton cloth for high temperature cloth.
In a preferred embodiment of the invention, mesh layer is high-temperature metal device.
Mesh layer (mesh) in the present embodiment can be covered in second by artificial mode
On substrate, the mesh number in mesh layer can be configured according to actual situation, and mesh layer can
Sound to high frequency is adjusted, by sound adjust to one clearly within the scope of.
The size of the quantity of mesh and mesh can be according to reality in mesh layer in the present embodiment
Situation is customized.
It should be noted that：Mesh layer can cover whole second substrate in the present embodiment, especially
It is to cover the acoustic aperture on second substrate, this can play certain dustproof effect to acoustic aperture, while covering
Lid acoustic aperture can also the sound of incoming sensor to external world play certain adjustment effect, mesh layer energy
The enough sound to high frequency is adjusted into clearly scope, so mesh layer covering acoustic aperture is not only
Simple improvement in one structure, while also there is important work in the regulation of high-frequency sound
With, it can be seen that the tuning of mesh layer collection, three effects of waterproof and dustproof.
Further, after the one side of the mesh layer in the present embodiment is covered on second substrate,
Another side can completely in extraneous environment, naturally it is also possible to not exclusively covering, this
Can be set according to actual conditions, when mesh layer can completely in external environment
When, its effect has obtained a greater degree of performance.
Further, blind hole can also be on the first substrate provided with, in first substrate and the second base
When being fixedly connected between plate, the sensor on second substrate is arranged at the blind of first substrate
Kong Zhong, to reduce the occupancy volume of microphone.
The MEMS microphone that the present invention is provided pastes one layer of mesh above second substrate
Layer, the mesh layer can be dust-proof, and because mesh layer can shelter from acoustic aperture, so as to prevent water
In point entering to acoustic aperture, and can be to the regulation of the sound of high frequency due to having pasted one layer of mesh layer
Into clearly scope.
By explanation and accompanying drawing, typical case's implementation of the ad hoc structure of specific embodiment is given
Example, based on spirit of the invention, can also make other conversions.Although foregoing invention proposes existing
Preferred embodiment, however, these contents be not intended as limitation.
For a person skilled in the art, after reading described above, various changes and modifications
Undoubtedly it will be evident that.Therefore, appending claims should regard as cover it is of the invention true
Whole variations and modifications of sincere figure and scope.It is any and all etc. in Claims scope
The scope and content of valency, are all considered as still belonging to the intent and scope of the invention.
Claims (6)
1. a kind of MEMS microphone, it is characterised in that the MEMS microphone includes：
First substrate；
Second substrate, is fixedly connected with the first substrate, is arranged at the first substrate top,
The acoustic aperture through the second substrate is provided with the second substrate；
Mesh layer, is covered on the top of the second substrate, and the mesh layer is provided with multiple nets
Hole；
Sensor, is connected with the acoustic aperture on the second substrate, be arranged at the first substrate with
Between the second substrate, the sensor is identified to sound；And
Sound passes sequentially through the mesh, the acoustic aperture into the sensor.
2. MEMS microphone according to claim 1, it is characterised in that described
MEMS microphone also includes：
Column；And
The first substrate is fixedly connected with the second substrate by the column.
3. MEMS microphone according to claim 1, it is characterised in that described
MEMS microphone also includes：
Sensor, is fixedly connected with the second substrate, is arranged at the lower section of the acoustic aperture, right
Sound is identified.
4. MEMS microphone according to claim 2, it is characterised in that described
One substrate and/or the second substrate and/or the column are pcb board.
5. MEMS microphone according to claim 1, it is characterised in that the net
Aperture layer is nonwoven fabric layer.
6. MEMS microphone according to claim 1, it is characterised in that the net
Aperture layer is metal device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511018058.XA CN106937228A (en) | 2015-12-29 | 2015-12-29 | A kind of MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511018058.XA CN106937228A (en) | 2015-12-29 | 2015-12-29 | A kind of MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106937228A true CN106937228A (en) | 2017-07-07 |
Family
ID=59440907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511018058.XA Pending CN106937228A (en) | 2015-12-29 | 2015-12-29 | A kind of MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106937228A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111866695A (en) * | 2019-04-30 | 2020-10-30 | 讯芯电子科技（中山）有限公司 | Microphone device manufacturing method and microphone device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202334882U (en) * | 2011-11-30 | 2012-07-11 | 歌尔声学股份有限公司 | Mems microphone |
| CN203883992U (en) * | 2014-05-05 | 2014-10-15 | 歌尔声学股份有限公司 | MEMS microphone |
| CN204733381U (en) * | 2015-03-31 | 2015-10-28 | 北京卓锐微技术有限公司 | A kind of integrated silicon capacitor microphone |
| CN205454093U (en) * | 2015-12-29 | 2016-08-10 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone |
-
2015
- 2015-12-29 CN CN201511018058.XA patent/CN106937228A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202334882U (en) * | 2011-11-30 | 2012-07-11 | 歌尔声学股份有限公司 | Mems microphone |
| CN203883992U (en) * | 2014-05-05 | 2014-10-15 | 歌尔声学股份有限公司 | MEMS microphone |
| CN204733381U (en) * | 2015-03-31 | 2015-10-28 | 北京卓锐微技术有限公司 | A kind of integrated silicon capacitor microphone |
| CN205454093U (en) * | 2015-12-29 | 2016-08-10 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111866695A (en) * | 2019-04-30 | 2020-10-30 | 讯芯电子科技（中山）有限公司 | Microphone device manufacturing method and microphone device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |