CN106935336A - Inner surface metallization hollow ceramic insulator, hollow metallization machines and method - Google Patents
Inner surface metallization hollow ceramic insulator, hollow metallization machines and method Download PDFInfo
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- CN106935336A CN106935336A CN201710118096.5A CN201710118096A CN106935336A CN 106935336 A CN106935336 A CN 106935336A CN 201710118096 A CN201710118096 A CN 201710118096A CN 106935336 A CN106935336 A CN 106935336A
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- ceramic insulator
- hollow ceramic
- hollow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/04—Treating the surfaces, e.g. applying coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/38—Fittings, e.g. caps; Fastenings therefor
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Abstract
This application discloses inner surface metallization hollow ceramic insulator, hollow metallization machines and method, can solve the problems, such as that hollow ceramic insulator the via hole is uneven.The hollow metallization machines, including aspiration pump, bleed-off passage, hold bucket and fixture；The hollow ceramic insulator method for metallising, comprises the following steps：Prepare satisfactory tungsten slurry；The fixture is arranged on described holding on bucket；The hollow ceramic insulator is put on the fixture in plane shoulder hole；The tungsten slurry is filled on the hollow ceramic insulator, starts aspiration pump；Solidification, sintering tungsten slurry；Plating metal；Grind the hollow ceramic insulator.The hollow metallization machines and hollow ceramic insulator method for metallising that the application is provided can make to obtain uniform metallization coating on hollow ceramic insulator hole wall, and simple and quick, and production efficiency is high.
Description
Technical field
The present invention relates to material manufacture field, more particularly to a kind of inner surface metallization hollow ceramic insulator, hollow gold
Categoryization equipment and insulator method for metallising.
Background technology
Common isolator has two kinds of materials：Glass insulator and ceramic insulator.Glass belongs to non-crystal structure,
There is no definite melting point, although the superior insulation performance with inorganic material, but because mechanical strength itself is not high and with hydrophilic
Property, therefore, conductive path is easily formed, so glass insulator is not suitable for welding airtightness encapsulation；Aluminium oxide ceramics insulate
Son is made through high temperature sintering using high-purity mangesium oxide aluminium powder, with high mechanical strength, electric property be good, thermal coefficient of expansion
A series of excellent performances such as small, high temperature electrical equipment good insulation preformance, heat-resistant antifriction be good so that ceramic insulator turns into electrovacuum device
The predominating insulation of part.However, because aluminium oxide ceramics cannot directly be welded with metal, accordingly, it would be desirable to be burnt in ceramic surface
Tie with certain thickness and the good coat of metal of compactness.
The quality of ceramic insulator metallization can directly influence sealing-in air-tightness intensity, and uniform metallization coating can be with
Increase substantially Metallization strength.Traditional ceramic metallization method mainly have vacuum evaporatation, vacuum sputtering coating method,
Mo-Mn sintering process etc., but these methods can not all make to obtain uniform metallization coating on the hole wall of hollow ceramic insulator.
The content of the invention
In view of this, in order to obtain uniform metallization coating on the inner surface of hollow ceramic insulator, the present invention is carried
A kind of inner surface metallization hollow ceramic insulator, a kind of hollow metallization machines and hollow ceramic insulator metallization side are gone out
Method.
The embodiment of the present application provides a kind of hollow metallization machines, including aspiration pump, bleed-off passage, holds bucket and fixture；
The bucket that holds has side wall, bottom wall and chamber, and the chamber roof horizontal opening, the side wall has aspirating hole；The pumping is logical
Road one end connects the aspirating hole, and other end connection aspiration pump makes the aspiration pump pass through bleed-off passage and the chamber；
Have on the fixture through the vertical riser hole of upper and lower plane, upper plane aperture is more than lower plane aperture, the ladder hole position
In the top of the chamber；The fixture covers the chamber roof horizontal opening, and the fixture and the side wall have airtight
Property attachment structure.
Further, the air-tightness attachment structure is：On the fixture have location hole, the top side wall have with
The corresponding fixing hole of the location hole, the location hole and fixing hole are bolted.
Selectively, the air-tightness attachment structure is：The clamp edges have external screw thread；On the side wall have with
The internal thread that the external screw thread is engaged.
The embodiment of the present application additionally provides a kind of hollow ceramic insulator for applying the hollow metallization machines and metallizes
Method, comprises the following steps：Tungsten slurry is stirred at a constant temperature, while adding diluent, reaches the viscosity of the tungsten slurry
To 60000~61000cP；The fixture is arranged on described holding on bucket by the air-tightness attachment structure；By the hollow
Ceramic insulator is put on the fixture in plane shoulder hole, and the external diameter of the hollow ceramic insulator is less than the upper plane one
Hold the aperture of shoulder hole, the aperture of the external diameter more than fixture lower plane one end shoulder hole of the hollow ceramic insulator；Will
The tungsten slurry is filled on the hollow ceramic insulator, starts aspiration pump, the tungsten slurry is equably covered in described
On the inner surface of hollow ceramic insulator；Solidify the tungsten slurry of the hollow ceramic insulator inner surface；Sinter the hollow pottery
The tungsten slurry of porcelain insulator inner surface；Plating metal；Grind the hollow ceramic insulator two ends.
The application also proposes a kind of inner surface metallization hollow ceramic insulator, uses embodiment of the present invention methods described system
Into comprising three part-structures, hollow ceramic insulator, tungsten metal layer and coating.
Above-mentioned at least one technical scheme that the embodiment of the present application is used can reach following beneficial effect：Hollow can be made
Uniform metallization coating is obtained on the inner surface of ceramic insulator, and it is simple and quick, production efficiency is high.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding of the present application, constitutes the part of the application, this Shen
Schematic description and description please does not constitute the improper restriction to the application for explaining the application.In the accompanying drawings：
Fig. 1 is hollow metallization machines structure；
Fig. 2 is another hollow metallization machines structure；
Fig. 3 is porous fixture top view；
Fig. 4 is porous fixture profile；
Fig. 5 is hollow ceramic insulator method for metallising flow chart.
Fig. 6 is single hole ceramic insulator top view；
Fig. 7 is single hole ceramic insulator profile；
Fig. 8 is hollow ceramic insulator top view；
Fig. 9 is that hollow ceramic insulator is put into fixture top view；
Figure 10 is that hollow ceramic insulator is put into fixture profile；
Figure 11 is hollow ceramic insulator filling tungsten slurry profile；
Figure 12 is hollow ceramic insulator inner surface covering tungsten slurry profile；
Figure 13 is a kind of inner surface metallization hollow ceramic insulator structure chart.
Specific embodiment
To make the purpose, technical scheme and advantage of the application clearer, below in conjunction with the application specific embodiment and
Corresponding accompanying drawing is clearly and completely described to technical scheme.Obviously, described embodiment is only the application one
Section Example, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, belong to the scope of the application protection.
Below in conjunction with accompanying drawing, the technical scheme that each embodiment of the application is provided is described in detail.
Fig. 1 is hollow metallization machines structure chart.The hollow metallization machines, including aspiration pump 11, bleed-off passage 12,
Hold bucket and fixture 13.
The bucket that holds has side wall 14, bottom wall 15 and chamber 16, and the chamber roof horizontal opening, the side wall has pumping
Hole 17.
Described bleed-off passage one end connects the aspirating hole, and other end connection aspiration pump makes the aspiration pump pass through pumping
Passage and the chamber.
Have on the fixture through the vertical riser hole 18 of upper and lower plane, upper plane aperture is more than lower plane aperture, institute
Shoulder hole is stated positioned at the top of the chamber.
The fixture covers the chamber roof horizontal opening, and there is air-tightness to connect knot for the fixture and the side wall
Structure.
The air-tightness attachment structure is：There is location hole 19, it is fixed with described that the top side wall has on the fixture
The corresponding fixing hole 20 in position hole, the location hole and fixing hole are connected by bolt 21.
Fig. 2 is another hollow metallization machines schematic diagram.The hollow metallization machines, including aspiration pump 11, pumping
Passage 12, hold bucket and fixture 213.
The bucket that holds has side wall 14, bottom wall 15 and chamber 16, and the chamber roof horizontal opening, the side wall has pumping
Hole 17.
Described bleed-off passage one end connects the aspirating hole, and other end connection aspiration pump makes the aspiration pump pass through pumping
Passage and the chamber.
Have on the fixture through the vertical riser hole 18 of upper and lower plane, upper plane aperture is more than lower plane aperture, institute
Shoulder hole is stated positioned at the top of the chamber.
The fixture covers the chamber roof horizontal opening, and there is air-tightness to connect knot for the fixture and the side wall
Structure.
The structure of air-tightness connection is：The clamp edges have external screw thread 219；On the side wall have with it is described
The internal thread 220 that external screw thread is engaged.
It should be noted that the fixture and the side wall air-tightness attachment structure, are not limited to the embodiment institute of Fig. 1~2
The scheme shown, other realize that the fixture and chamber realize the technological means of air-tightness connection (for example with sealing strip, sealing
Circle, fluid sealant etc.) fall within the scope of protection of the invention.
Preferably, the shape of the cross section of the shoulder hole 18 is circular；It should be noted that equipment of the invention is not limited
The shape of cross section of the shoulder hole, design of the invention is also applied for other shapes, for example ellipse, square, rectangle,
Rhombus, triangle etc..
In Fig. 1~2, during pumping pump work, air flows through the bleed-off passage, makes to produce negative pressure in chamber, holds outside bucket
The air-flow in portion enters in the chamber from the fixture top through shoulder hole.The arrow table that bleed-off passage described in Fig. 1~2 is marked
Show the direction of air flow.
Fig. 3 is porous fixture top view, and Fig. 4 is porous fixture profile.In embodiment illustrated in fig. 3, fixture top view
Profile is square, preferably tabular；Preferably, the shoulder hole 18 is multiple, and is evenly distributed on the fixture；It is described
There is location hole 19, positioned at the peripheral part of fixture on fixture.
Fig. 5 is hollow ceramic insulator method for metallising flow chart.Specifically, the hollow ceramic insulator metallization side
Method, comprises the following steps：
Step 51, tungsten slurry is stirred at a constant temperature, while adding diluent, reach the viscosity of the tungsten slurry
60000~61000cP；
Preferably 25~27 DEG C of the steady temperature；
The stirring tungsten slurry is preferably stirred towards same direction；
The preferred terpinol of diluent；
The measurement apparatus preferred viscosities meter of the tungsten slurry viscosity；
Step 52, the fixture is arranged on described holding on bucket by the air-tightness attachment structure；
Step 53, the hollow ceramic insulator is put on the fixture in plane shoulder hole, the hollow ceramics are absolutely
, less than the aperture of upper plane one end shoulder hole, the external diameter of the hollow ceramic insulator is more than the fixture for the external diameter of edge
The aperture of lower plane one end shoulder hole；
Step 54, the tungsten slurry is filled on the hollow ceramic insulator, starts in aspiration pump, the chamber and produce
Raw negative pressure, makes the tungsten slurry equably be covered on the inner surface of the hollow ceramic insulator；
The negative pressure value preferably -0.095MPa~-0.091MPa；
Step 55, the tungsten slurry for solidifying the hollow ceramic insulator inner surface；
The preferred insulating box of curing apparatus；
Preferably 125~130 DEG C of solidification temperature, hardening time is preferably not less than 15 minutes；
Step 56, the tungsten slurry for sintering the hollow ceramic insulator inner surface, make table in the hollow ceramic insulator
Face forms tungsten metal layer；
Preferably 1600~1650 DEG C of sintering temperature, soaking time preferably 2~3 hours；
The preferred clock hood type furnace of agglomerating plant；
Step 57, plating metal, making the surface of the tungsten metal layer increases coating；
It is preferred that electroplating metallic nickel；
Step 58, the grinding hollow ceramic insulator two ends, removal remain in the hollow ceramic insulator two ends
Metal (comprising tungsten metal layer and coating), and make the satisfactory size of length of the hollow ceramic insulator.
By step 51~58, inner surface metallization hollow ceramic insulator is made.The inner surface metallization hollow pottery
The inner surface covering tungsten metal layer of porcelain insulator, the tungsten metal layer outer covering coating.
It should be noted that when in step 54, tungsten slurry is filled in shoulder hole, covering the hollow ceramic insulator
During outer surface, start and negative pressure is produced in aspiration pump, the chamber, while the tungsten slurry is equably covered in the hollow making pottery
On the outer surface of porcelain insulator；By step 55, while solidifying the tungsten slurry of the hollow ceramic insulator outer surface；By step
Rapid 56, while sintering the tungsten slurry of the hollow ceramic insulator outer surface, form the hollow ceramic insulator outer surface
Tungsten metal layer；By step 57, plating metal, making the surface of the tungsten metal layer of the outer surface increases coating.Pass through again
Step 58, is made inner surface metallization hollow ceramic insulator, the outer surface of the inner surface metallization hollow ceramic insulator
Also tungsten metal layer, the tungsten metal layer outer covering coating are covered.
Fig. 6 is single hole ceramic insulation top view；Fig. 7 is single hole ceramic insulator profile；The hollow ceramic insulator
There is single hole 62 in 61.
Fig. 8 is hollow ceramic insulator top view；Have porous 82 in the hollow ceramic insulator 81, such as four holes.
The inner surface shape of cross section of the hollow ceramic insulator, it is preferably circular, but the method for the present invention is not limited to
It is circular inner surface metallization hollow ceramic insulator to make inner surface cross section.This method is also applied for inner surface cross section
It is the inner surface metallization hollow ceramic insulator of other shapes.
The step of Fig. 9~10 are for the method for the invention is explained further 53.
Wherein, Fig. 9 is that hollow ceramic insulator is put into fixture schematic top plan view；Figure 10 is that hollow ceramic insulator is put into folder
Tool generalized section.Be put into the hollow ceramic insulator 61 in the shoulder hole 018 by expression；The hollow ceramic insulator
External diameter be less than the upper plane aperture, the external diameter of the hollow ceramic insulator is more than the lower plane aperture.
The step of Figure 11~12 are for the method for the invention is explained further 54.
Wherein, Figure 11 is hollow ceramic insulator filling tungsten slurry generalized section, and the tungsten slurry 112 is filled in into institute
State on hollow ceramic insulator 61.
Wherein, Figure 12 is hollow ceramic insulator inner surface covering tungsten slurry generalized section；Start the aspiration pump, institute
State and negative pressure is produced in chamber, the air-flow of pressure official post flows from top to down, drive the tungsten slurry 121 with mobility, make described
Tungsten slurry is equably covered on the inner surface of the hollow ceramic insulator 61.
Figure 13 is a kind of inner surface metallization hollow ceramic insulator schematic diagram.The inner surface metallization hollow ceramics are absolutely
Edge, is made using the hollow ceramic insulator method for metallising, comprising three part-structures, hollow ceramic insulator, tungsten gold
Categoryization layer and coating.The inner surface covering tungsten metal layer 132 of the inner surface metallization hollow ceramic insulator 61, the tungsten
Metal layer outer covering coating 133, the preferred metallic nickel of coating.
Further, the outer surface of inner surface metallization hollow ceramic insulator also covers tungsten metal layer, described
Tungsten metal layer outer covering coating.
It is pointed out that the hollow ceramic insulator that the inner surface metallization hollow ceramic insulator is included, can
Being single hole (as shown in figs. 6-7), or porous (as shown in Figure 8).
Also, it should be noted that term " including ", "comprising" or its any other variant be intended to nonexcludability
Comprising, so that process, method or equipment including a series of key elements not only include those key elements, but also including not having
Other key elements being expressly recited, or it is this process, method or the intrinsic key element of equipment also to include.Not more
In the case of limitation, the key element limited by sentence "including a ...", it is not excluded that in the process including the key element, method
Or also there is other identical element in equipment.
Embodiments herein is the foregoing is only, the application is not limited to.For those skilled in the art
For, the application can have various modifications and variations.It is all any modifications made within spirit herein and principle, equivalent
Replace, improve etc., within the scope of should be included in claims hereof.
Claims (10)
1. a kind of hollow metallization machines, it is characterised in that including aspiration pump, bleed-off passage, hold bucket and fixture；
The bucket that holds has side wall, bottom wall and chamber, and the chamber roof horizontal opening, the side wall has aspirating hole；
Described bleed-off passage one end connects the aspirating hole, and other end connection aspiration pump makes the aspiration pump pass through bleed-off passage
With the chamber；
Have on the fixture through the vertical riser hole of upper and lower plane, upper plane aperture is more than lower plane aperture, the ladder
Hole position is in the top of the chamber；
The fixture covers the chamber roof horizontal opening, and the fixture and the side wall have air-tightness attachment structure.
2. hollow metallization machines according to claim 1, it is characterised in that the air-tightness attachment structure is：
There is location hole, the top side wall has the fixing hole corresponding with the location hole, the positioning on the fixture
Hole and fixing hole are bolted.
3. hollow metallization machines according to claim 1, it is characterised in that the air-tightness attachment structure is：
The clamp edges have external screw thread；There is the internal thread being engaged with the external screw thread on the side wall.
4. hollow metallization machines according to claims 1 to 3 any one, it is characterised in that the fixture is flat board
Shape；Multiple shoulder holes are distributed with the fixture.
5. the hollow ceramic insulator metallization of the hollow metallization machines described in a kind of application claims 1 to 3 any one
Method, it is characterised in that comprise the following steps：
Tungsten slurry is stirred at a constant temperature, while add diluent, the viscosity for making the tungsten slurry reaches 60000~
61000cP；
The fixture is arranged on described holding on bucket by the air-tightness attachment structure；
The hollow ceramic insulator is put on the fixture in plane shoulder hole, the external diameter of the hollow ceramic insulator is small
In the aperture of upper plane one end shoulder hole, the external diameter of the hollow ceramic insulator is more than fixture lower plane one end rank
The aperture in terraced hole；
The tungsten slurry is filled on the hollow ceramic insulator, starts aspiration pump, the tungsten slurry is equably covered
On the inner surface of the hollow ceramic insulator；
Solidify the tungsten slurry of the hollow ceramic insulator inner surface；
Sinter the tungsten slurry of the hollow ceramic insulator inner surface；
Plating metal；
Grind the hollow ceramic insulator two ends.
6. hollow ceramic insulator method for metallising according to claim 5, it is characterised in that the diluent is pine tar
Alcohol.
7. hollow ceramic insulator method for metallising according to claim 5, it is characterised in that the solidification temperature is
125~130 DEG C, hardening time is not less than 15 minutes.
8. hollow ceramic insulator method for metallising according to claim 5, it is characterised in that the sintering temperature is
1600~1650 DEG C, soaking time 2~3 hours.
9. hollow ceramic insulator method for metallising according to claim 5, it is characterised in that the plating metal is plating
Nickel.
10. a kind of inner surface metallization hollow ceramic insulator, it is characterised in that usage right 5~9 any one methods of requirement
It is made, comprising three part-structures, hollow ceramic insulator, tungsten metal layer and coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710118096.5A CN106935336B (en) | 2017-03-01 | 2017-03-01 | Inner surface metallization hollow ceramic insulator and method for metallising |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710118096.5A CN106935336B (en) | 2017-03-01 | 2017-03-01 | Inner surface metallization hollow ceramic insulator and method for metallising |
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| Publication Number | Publication Date |
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| CN106935336A true CN106935336A (en) | 2017-07-07 |
| CN106935336B CN106935336B (en) | 2018-12-14 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397263A (en) * | 2020-11-05 | 2021-02-23 | 中国电子科技集团公司第四十研究所 | Surface treatment method of miniature radio frequency glass insulator |
| CN113725085A (en) * | 2021-08-31 | 2021-11-30 | 深圳技术大学 | Assembly process method of packaging part and packaging part |
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| CN1887813A (en) * | 2006-07-16 | 2007-01-03 | 常熟市银洋陶瓷器件有限公司 | Ceramic metallizing process |
| CN201886839U (en) * | 2010-11-17 | 2011-06-29 | 湖南省新化县林海陶瓷有限公司 | Glazing metalizing ceramic insulator |
| CN103187316A (en) * | 2013-03-12 | 2013-07-03 | 江苏省宜兴电子器件总厂 | Hole wall metalizing process during production of ceramic shells |
| CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
| CN206497790U (en) * | 2017-03-01 | 2017-09-15 | 河北盛平电子科技有限公司 | A kind of hollow metallization machines |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1887813A (en) * | 2006-07-16 | 2007-01-03 | 常熟市银洋陶瓷器件有限公司 | Ceramic metallizing process |
| CN201886839U (en) * | 2010-11-17 | 2011-06-29 | 湖南省新化县林海陶瓷有限公司 | Glazing metalizing ceramic insulator |
| CN103187316A (en) * | 2013-03-12 | 2013-07-03 | 江苏省宜兴电子器件总厂 | Hole wall metalizing process during production of ceramic shells |
| CN104259057A (en) * | 2014-09-18 | 2015-01-07 | 中国建筑材料科学研究总院 | Vacuum pasting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397263A (en) * | 2020-11-05 | 2021-02-23 | 中国电子科技集团公司第四十研究所 | Surface treatment method of miniature radio frequency glass insulator |
| CN112397263B (en) * | 2020-11-05 | 2021-12-28 | 中国电子科技集团公司第四十研究所 | Surface treatment method of miniature radio frequency glass insulator |
| CN113725085A (en) * | 2021-08-31 | 2021-11-30 | 深圳技术大学 | Assembly process method of packaging part and packaging part |
| CN113725085B (en) * | 2021-08-31 | 2024-03-29 | 深圳技术大学 | Assembling process method of packaging part and packaging part |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106935336B (en) | 2018-12-14 |
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Address after: 050091 4th floor, building 4, No. 368, xinshibei Road, Shijiazhuang City, Hebei Province Patentee after: Hebei Sheng Ping Electronic Technology Co., Ltd. Address before: 050091, East fourth floor, building 368, No. four Xinshi North Road, Hebei, Shijiazhuang Patentee before: Hebei Sheng Ping Electronic Technology Co., Ltd. |