CN106933336A - The manufacture method of Intelligent glove - Google Patents
The manufacture method of Intelligent glove Download PDFInfo
- Publication number
- CN106933336A CN106933336A CN201511014206.0A CN201511014206A CN106933336A CN 106933336 A CN106933336 A CN 106933336A CN 201511014206 A CN201511014206 A CN 201511014206A CN 106933336 A CN106933336 A CN 106933336A
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- China
- Prior art keywords
- double
- circuit
- sensor cluster
- manufacture method
- decker
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/011—Arrangements for interaction with the human body, e.g. for user immersion in virtual reality
- G06F3/014—Hand-worn input/output arrangements, e.g. data gloves
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
- Gloves (AREA)
Abstract
The invention provides a kind of manufacture method of Intelligent glove, the manufacture method includes：Glove bulk of the manufacture with double-decker part, the outer layer in the double-decker part opens up and cracks or be open；And by it is described crack or be open circuit and sensor cluster are inserted between the double-decker part.The method according to the invention is provided for circuit and sensor cluster by optimize technique and more preferably protected, it is to avoid the infringement that may be produced to it in production process.
Description
Technical field
The present invention relates to Intelligent glove technical field, specifically, the present invention relates to a kind of manufacture method of Intelligent glove.
Background technology
In the prior art, gloves manufacturing process includes for two panels being cut into the opening that pieces of cloth corresponding with hand shape are sutured along edge and reserve hand entrance, after it has been gathered, gloves turns up so that suture vestige is hidden in into gloves inner side by from opening.
Intelligent glove gradually enters into the visual field of people as a kind of new product.In general, Intelligent glove dorsal side is provided with double-decker so that the equipment such as circuit and sensor are embedded between double-decker.When Intelligent glove is manufactured among the generally advance embedded double-decker by circuit and sensor etc., then the opponent's set as described in the prior art is sutured and turned up.Flexible PCB may be damaged in sewing process；And in eversion process, in the case of evagination operation being carried out by robot or automation equipment, top is turned up with being automatically performed at opening generally using push rod by from each finger section of gloves to gloves, the process may be damaged to embedded circuit or sensor, the injury Intelligent glove yield rate can be caused low or use in quality problems.
The content of the invention
It is an object of the invention to provide a kind of Intelligent glove production method, it prevents damage in process of production to circuit and sensor cluster as far as possible.
The present invention also aims to provide a kind of Intelligent glove production method, it is suitable to streamline production in enormous quantities, high yield rate and is difficult the presence of internal injury.
The present invention also aims to provide a kind of Intelligent glove production method, it is provided for circuit and the enhanced protection of sensor cluster.
The present invention also aims to provide a kind of Intelligent glove production method so that the Intelligent glove produced by the method has more preferably quality, product stability and life-span.
Other objects of the present invention are understood by when specification is combined.
To solve at least one of above-mentioned purpose, there is provided a kind of manufacture method of Intelligent glove, the manufacture method includes：
Glove bulk of the manufacture with double-decker part, the outer layer in the double-decker part opens up and cracks or be open；And
By it is described crack or be open circuit and sensor cluster are inserted between the double-decker part.
By from cracking or be open insertion circuit and sensor cluster avoids glove bulk procedure of processing for damage that circuit and sensor cluster are likely to result in.
Alternatively, in the manufacture method of above-mentioned Intelligent glove, methods described is additionally included in described in the insertion sensor cluster rear enclosed cracks or is open.
Cracking or be open can insert circuit and sensor cluster rear enclosed or can play other effects.
Alternatively, in the manufacture method of above-mentioned Intelligent glove, it is described manufacture with double-decker part glove bulk the step of include：
Two gloves half portions of the manufacture with palm shape, wherein at least one gloves half portion has double-decker；
The regions in addition to opening of described two gloves half portions are sutured along the circumferential profiles of two gloves half portions to form the gloves of suture；And
It is open come the gloves of the suture of turning up to form the glove bulk by described.
Before circuit and sensor cluster insertion carry out gloves and turn up that suture vestige can be hidden.
Alternatively, include gloves being manufactured into whole back there is double-decker in the manufacture method of above-mentioned Intelligent glove, the step of glove bulk of the manufacture with double-decker part.
The glove bulk that whole back has double-decker can arrange more circuits and sensor cluster.
Alternatively, in the manufacture method of above-mentioned Intelligent glove, the outer layer in the double-decker part opens up the step of cracking or be open and is cracked including the outer layer along glove bulk back and laterally being opened up substantially through whole glove bulk back.
Alternatively, in the manufacture method of above-mentioned Intelligent glove, the position base that opens up for cracking is flushed with this thumb forefinger seam.
Extend transversely through whole back and the insertion that can facilitate circuit and sensor cluster is flushed with thumb webs.
Alternatively, in the manufacture method of above-mentioned Intelligent glove, the step of methods described is additionally included in being positioned to the circuit and sensor cluster after the circuit and sensor cluster insertion double-decker part.
The travelling of circuit and sensor cluster in subsequent handling is prevented after positioning, possible damage is further prevented.
Alternatively, in the manufacture method of above-mentioned Intelligent glove, methods described is additionally included in the step of being packaged to the circuit and sensor cluster before the circuit and sensor cluster are inserted into double-decker part.
Alternatively, in the manufacture method of above-mentioned Intelligent glove, the encapsulation step includes：
The circuit and sensor cluster are clipped between double-deck TPU membrane corresponding with the circuit and sensor cluster shape；And
The circuit and sensor cluster are encapsulated using HF hot melt technique along the edge of the double-deck TPU membrane.
Further circuit and sensor cluster can be protected using TPU membrane hot melt encapsulation technology.
Alternatively, periphery is included in the manufacture method of above-mentioned Intelligent glove, the step of encapsulate the circuit and sensor cluster using HF hot melt technique along the edge of the double-deck TPU membrane form insertion of the TPU membrane guiding piece in order to the circuit and sensor cluster.
The insertion of circuit and sensor cluster is easy in the setting of periphery guiding piece, reduces insertion difficulty, the possibility that reduction may be damaged.
In sum, the manufacture method of Intelligent glove of the invention is easy to operate, improves final product quality, life-span and yield rate.
Brief description of the drawings
Referring to the drawings, the disclosure will be easier to understand.Skilled addressee readily understands that be：These accompanying drawings are intended solely for illustrative purposes, and are not intended to be construed as limiting protection scope of the present invention.Additionally, the numeral being similar in figure is used to represent similar part, wherein：
Fig. 1 shows can be using a kind of decomposition view of Intelligent glove made according to the method for the present invention；
Fig. 2 shows the schematic diagram in circuit and sensor cluster insertion process in Intelligent glove manufacture method of the invention；
Fig. 3 shows the encapsulation schematic diagram of circuit according to an embodiment of the invention and sensor cluster；
Fig. 4 shows the schematic diagram in D-D sections in Fig. 3；And
Fig. 5 shows the schematic diagram of section B-B in Fig. 3.
Specific embodiment：
It is readily appreciated that, technology according to the present invention scheme, in the case where true spirit is not changed, those of ordinary skill in the art can propose the various structures mode that can mutually replace and implementation.Therefore, detailed description below and accompanying drawing are only the exemplary illustrations to technical scheme, and are not to be construed as whole of the invention or are considered as to define or limit technical solution of the present invention.
Mention in this manual or the orientation term such as up, down, left, right, before and after, front, the back side, top, the bottom that may mention is defined relative to the construction shown in each accompanying drawing, they are relative concepts, it is therefore possible to can according to its residing diverse location, different use state and correspondingly changed.So, also these or other orientation term should not be construed to restricted term.
With reference first to Fig. 1, it illustrates a kind of decomposition view of exemplary Intelligent glove, Intelligent glove includes glove bulk 1, and glove bulk 1 for example has closed glove form, i.e. wherein finger tip portion is wrapped in gloves, and it only has the opening 14 that hand can be stretched into from it.The material of glove bulk 1 can be any commonly employed in the material for making gloves, including but not limited to cloth, skin or PU skins etc..Glove bulk 1 has double-decker to allow the insertion of circuit and sensor cluster 2 at the gloves back corresponding to the back of the hand.As discussed in greater detail below, have first to crack on the outer layer of the back double-decker of glove bulk 1 11, second to crack 13 and land 12.
Intelligent glove 1 also includes circuit and sensor cluster 2.In the present embodiment, circuit and sensor cluster 2 basically form hand bone shape, and it has the sensor 22 that can be randomly distributed in each finger part or other parts, and the flexible PCB 21 or wire harness 24 for connecting each sensor 22 to hub 23.In addition, finger button unit 25 is connected to hub 23 also by wire harness 27, hub 23 receives the signal that each sensor 22 and pushbutton unit 25 are sent, and be further connected with control box 3 by wire harness 26 and the joint 28 that is detachably connected with control box 3, transmitted to its signal by the treatment of control box 3.Circuit and sensor cluster 2 will crack by first and 11 be embedded in the double-decker at the back of glove bulk 1, it is connected to the wire harness 26 of hub 23 and cracks 13 through second, so that joint 28 can expose and be connected on the corresponding interface of control box 3 (depending on not going out), control box 3 is combined on the land 12 at gloves back, for example can be by the mode such as bonding or sewing.
With reference now to Fig. 2, it illustrates the manufacture intermediateness of Intelligent glove manufacture method of the invention.Intelligent glove manufacture method of the invention generally comprises following steps：Glove bulk 1 of the manufacture with double-decker part, the outer layer in the double-decker part opens up and cracks or be open；And by it is described crack or be open circuit and sensor cluster 2 are inserted between the double-decker part.Just as shown in Figure 2, glove bulk 1 is made substantially, and its back has cracks 11.Then by circuit and sensor cluster 2 by between the 11 insertion double-deckers that crack.The part of hub circumference can then first by between finger part insertion double-decker be inserted into as shown in FIG., also first by the partial insertion of hub circumference can be inserted into finger part certainly.Can be closed after circuit and sensor cluster insertion and crack 11, such as by suture.Although 11 inserting circuit and sensor cluster 2 using cracking in the embodiments illustrated in the figures, but the opening with certain area can be also opened up in alternative, opening can be closed by patch after circuit and sensor cluster insertion, for example patch can be a part for gloves overall appearance design, such as form pictorial trademark.Preferably, it can be positioned after circuit is inserted with sensor cluster 2.The mode of positioning can use that suture is positioned or any other mode is to avoid the travelling of circuit and sensor cluster 2.After circuit and sensor cluster 2 are fully-inserted, can be cracked by second 13 exposes the joint 28 drawn from hub, and so as to being connected with control box 3, control box 3 can be then bound at land 12 again.
As being clearly shown that in Fig. 2, in a preferred embodiment, first cracks opens up into the outer layer along the back of glove bulk 1 and laterally substantially runs through whole glove bulk back.It is so-called substantially through refer to crack at least across four positions of finger so that be parallel to each other four finger parts of circuit and sensor cluster can directly by crack insert and without bending.Further optionally, the first webs that position base eats with this thumb that open up for cracking are flushed.Although shown in figure first crack be specifically directed and position, in fact, other trends and position to crack or be open for other circuits and Sensor Design be probably preferred.
In one embodiment, glove bulk 1 is manufactured by the following method：Two gloves half portions of the manufacture with palm shape, wherein at least one gloves half portion has a double-decker, and such as one gloves half portion is completely or partially for double-decker or two gloves half portions are double-decker wholly or in part；The region in addition to opening 14 of described two gloves half portions is sutured to form glove bulk 1 along two circumferential profiles of gloves half portion；And by the opening 14 come the glove bulk 1 that turns up.Wherein term " turning up " refers to that outside will be translated on the inside of the script of glove bulk 1, and accordingly, the outside of the script of glove bulk 1 is referred to as the inner side after upset, can so hiding the suture vestige of glove bulk 1.It should be noted that crack or be open can be opened up in manufacture or after manufacture before the manufacture of glove bulk 1, and crack to open up the successively result brought for the present invention substantially identical.
In one embodiment, the step of manufacture method of Intelligent glove is packaged before being additionally included in and for circuit and sensor cluster 2 inserting double-decker part to the circuit and sensor cluster.Incorporated by reference to Fig. 3 to Fig. 5 is referred to, wire harness 24 can be removed for circuit and sensor cluster 2, flexible PCB 21 and the part of sensor 22 outside 26,27 are integrally packaged, to strengthen the protection to it.In one embodiment, as Figure 4 and 5 are illustrated in greater detail, encapsulation step may include to be clipped in circuit and sensor cluster between duplicature corresponding with circuit and sensor cluster shape, for example in one embodiment, film can be between TPU membrane (TPUE film), specifically upper strata TPU membrane 44 and lower floor's TPU membrane 45, TPU membrane 44,45 have the width slightly wider than the component packaged by it so that TPU membrane 44,45 can be bonded to each other in edge；Then, the circuit and sensor cluster 2 can be encapsulated using HF hot melt technique for example, by the edge along double-deck TPU membrane.The flexible circuit of TPU membrane encapsulation has bigger intensity, can prevent production operation and use injury of the bending for circuit board module in operation.Certainly, the material selected by encapsulating can be not limited to TPU membrane and packaging technology is also not necessarily limited to HF hot melt technique.In another embodiment, encapsulation step is additionally included in periphery and forms insertion of the TPU membrane guiding piece 43 in order to the circuit and sensor cluster 2.Guiding piece 43 can be made up of TPU membrane completely; it can be the grumeleuse of TPU materials; the insertion of whole circuit and sensor cluster 2 is guided due to guiding piece 43, it may be easily hindered, therefore the presence of guiding piece 43 further protects whole circuit and sensor cluster 2 during insertion.
Now referring additionally to Fig. 4 and Fig. 5, which respectively show the sectional view of middle D-D sections and section B-B in Fig. 3.In one embodiment, as shown in figure 4, in potted end, in order to seal, can be filled in glue 46 between upper strata TPU membrane 44 and lower floor's TPU membrane 45 using gluing process by the region 41 that flexible PCB is connected with wire harness, and wire harness 47 is embedded in glue 46.And as shown in figure 5, in centre portion 42, sensor 49 is attached on flexible PCB 48, and overall encapsulated by upper strata TPU membrane and lower floor's TPU membrane.
Better than the manufacture method of prior art, it is mainly reflected in the manufacture method of Intelligent glove described in detail above：
1. provided for circuit and sensor cluster by optimize technique and more preferably protected.Avoid the infringement that may be produced to it in production process；
2. by encapsulating protection of the enhancing to circuit and sensor cluster, improve product quality, product stability and life-span.
Specific embodiment described above is only for more clearly describing principle of the invention, wherein being clearly shown that or describing all parts and be easier to understand principle of the invention.Without departing from the scope of the invention, those skilled in the art easily can carry out various modifications or change to the present invention.Therefore it should be appreciated that these modifications or change should be included within scope of patent protection of the invention.
Claims (10)
1. a kind of manufacture method of Intelligent glove, it is characterised in that the manufacture method includes：
Glove bulk of the manufacture with double-decker part, the outer layer in the double-decker part opens up and cracks or be open；And
By it is described crack or be open circuit and sensor cluster are inserted between the double-decker part.
2. the manufacture method of Intelligent glove according to claim 1, it is characterised in that methods described is additionally included in described in the insertion circuit and sensor cluster rear enclosed cracks or be open.
3. the manufacture method of Intelligent glove according to claim 1 and 2, it is characterised in that the step of manufacture has the glove bulk of double-decker part includes：
Two gloves half portions of the manufacture with palm shape, wherein at least one gloves half portion has double-decker；
The regions in addition to opening of described two gloves half portions are sutured along the circumferential profiles of two gloves half portions to form the gloves of suture；And
It is open come the gloves of the suture of turning up to form the glove bulk by described.
4. the manufacture method of Intelligent glove according to claim 1 and 2, it is characterised in that the step of manufacture has the glove bulk of double-decker part includes that glove bulk is manufactured into whole back has double-decker.
5. the manufacture method of Intelligent glove according to claim 4, it is characterised in that the outer layer in the double-decker part opens up the step of cracking or be open and cracked including the outer layer along glove bulk back and laterally being opened up substantially through whole glove bulk back.
6. the manufacture method of Intelligent glove according to claim 5, it is characterised in that the position base that opens up for cracking is flushed with this thumb forefinger webs.
7. the manufacture method of Intelligent glove according to claim 1, it is characterised in that the step of methods described is additionally included in being positioned to the circuit and sensor cluster after the circuit and sensor cluster insertion double-decker part.
8. the manufacture method of Intelligent glove according to claim 1, it is characterised in that the step of methods described is additionally included in being packaged to the circuit and sensor cluster before the circuit and sensor cluster insertion double-decker part.
9. the manufacture method of Intelligent glove according to claim 8, it is characterised in that the encapsulation step includes：
The circuit and sensor cluster are clipped between double-deck TPU membrane corresponding with the circuit and sensor cluster shape；And
The circuit and sensor cluster are encapsulated using HF hot melt technique along the edge of the double-deck TPU membrane.
10. the manufacture method of Intelligent glove according to claim 9, characterized in that, the step of encapsulating the circuit and sensor cluster using HF hot melt technique along the edge of the double-deck TPU membrane is included in periphery forms the guiding piece of TPU membrane composition in order to the insertion of the circuit and sensor cluster.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511014206.0A CN106933336A (en) | 2015-12-31 | 2015-12-31 | The manufacture method of Intelligent glove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511014206.0A CN106933336A (en) | 2015-12-31 | 2015-12-31 | The manufacture method of Intelligent glove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106933336A true CN106933336A (en) | 2017-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511014206.0A Pending CN106933336A (en) | 2015-12-31 | 2015-12-31 | The manufacture method of Intelligent glove |
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| CN (1) | CN106933336A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110013219A (en) * | 2018-01-05 | 2019-07-16 | 富伯生医科技股份有限公司 | The finger movement sensor glove of sensor can be fixed |
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| CN102063825A (en) * | 2010-12-15 | 2011-05-18 | 北京理工大学 | Sign language recognizing device based on data gloves |
| CN202588385U (en) * | 2012-03-08 | 2012-12-12 | 马佳辉 | Detachable and washable USB electric heating glove |
| US20140215684A1 (en) * | 2013-02-07 | 2014-08-07 | Timothy J. Hardy | Pressure Sensing Glove |
| CN104156141A (en) * | 2014-09-09 | 2014-11-19 | 联想(北京)有限公司 | Wearable electronic equipment control method and device |
| CN104432711A (en) * | 2014-11-04 | 2015-03-25 | 深圳市鼎芯无限科技有限公司 | Intelligent glove and use method thereof |
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2015
- 2015-12-31 CN CN201511014206.0A patent/CN106933336A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006002313A1 (en) * | 2004-06-22 | 2006-01-05 | Mayo Foundation For Medical Education And Research | Device and methods for assessment of body cavity pressures |
| CN201718530U (en) * | 2010-07-30 | 2011-01-26 | 赵延 | Dismountable USB warm gloves |
| CN102063825A (en) * | 2010-12-15 | 2011-05-18 | 北京理工大学 | Sign language recognizing device based on data gloves |
| CN202588385U (en) * | 2012-03-08 | 2012-12-12 | 马佳辉 | Detachable and washable USB electric heating glove |
| US20140215684A1 (en) * | 2013-02-07 | 2014-08-07 | Timothy J. Hardy | Pressure Sensing Glove |
| CN104156141A (en) * | 2014-09-09 | 2014-11-19 | 联想(北京)有限公司 | Wearable electronic equipment control method and device |
| CN104432711A (en) * | 2014-11-04 | 2015-03-25 | 深圳市鼎芯无限科技有限公司 | Intelligent glove and use method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110013219A (en) * | 2018-01-05 | 2019-07-16 | 富伯生医科技股份有限公司 | The finger movement sensor glove of sensor can be fixed |
| CN110013219B (en) * | 2018-01-05 | 2021-08-06 | 富伯生医科技股份有限公司 | Finger motion induction glove capable of fixing sensor |
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Application publication date: 20170707 |
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