CN106925905B - A kind of TiAl-base alloy special-purpose high temperature Ti base solder and preparation method thereof and soldering processes - Google Patents
A kind of TiAl-base alloy special-purpose high temperature Ti base solder and preparation method thereof and soldering processes Download PDFInfo
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- CN106925905B CN106925905B CN201710048757.1A CN201710048757A CN106925905B CN 106925905 B CN106925905 B CN 106925905B CN 201710048757 A CN201710048757 A CN 201710048757A CN 106925905 B CN106925905 B CN 106925905B
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 271
- 239000000956 alloy Substances 0.000 title claims abstract description 271
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 227
- 238000000034 method Methods 0.000 title claims abstract description 90
- 238000005476 soldering Methods 0.000 title claims abstract description 75
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000005219 brazing Methods 0.000 claims abstract description 156
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 78
- 229910052709 silver Inorganic materials 0.000 claims abstract description 78
- 229910052796 boron Inorganic materials 0.000 claims abstract description 77
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 76
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 75
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 69
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 50
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 39
- 239000000654 additive Substances 0.000 claims abstract description 24
- 230000000996 additive effect Effects 0.000 claims abstract description 24
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000002844 melting Methods 0.000 claims abstract description 20
- 230000008018 melting Effects 0.000 claims abstract description 20
- 239000007789 gas Substances 0.000 claims abstract description 13
- 229910052786 argon Inorganic materials 0.000 claims abstract description 10
- 239000011888 foil Substances 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 103
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 98
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 96
- 238000001035 drying Methods 0.000 claims description 49
- 239000012535 impurity Substances 0.000 claims description 49
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 49
- 238000001291 vacuum drying Methods 0.000 claims description 49
- 229910010038 TiAl Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 230000006698 induction Effects 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 4
- 239000003708 ampul Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 23
- 229910052737 gold Inorganic materials 0.000 claims 23
- 239000010931 gold Substances 0.000 claims 23
- 150000002576 ketones Chemical class 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 238000007670 refining Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 238000003723 Smelting Methods 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 95
- 238000004321 preservation Methods 0.000 description 22
- 238000003466 welding Methods 0.000 description 17
- 238000009792 diffusion process Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910017868 Cu—Ni—Co Inorganic materials 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical compound [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to high-temp solders and preparation method thereof and soldering processes, specially a kind of high temperature Ti base solder for TiAl-base alloy soldering and preparation method thereof and soldering processes, solve the problems such as existing solder postwelding joint mechanical property and high-temperature behavior are poor, brazing filler metal fusing point is low, solder preparation and soldering processes are complicated.Solder of the invention is by weight percentage by Fe:10%~30%, Mn:10%~30%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, additive amount are 0~5%；Remaining is Ti.Preparation method: one, raw material is weighed；Two, raw material is fitted into smelting equipment and vacuumizes and pour argon gas, then carry out multiple melting and cooling；Three, the master alloy after melting is subjected to chilling and gets rid of band to get solder of the invention.Chilling solder foil is brazed according to the soldering processes of 1100 DEG C~1250 DEG C, 0~120min.Solder prepared by the present invention has high-melting-point, outstanding wetability and mechanical property compared with existing solder；Solder preparation and soldering processes are simple.
Description
Technical field:
The present invention is that one kind is used for dedicated high temperature Ti base solder of TiAl-base alloy and preparation method thereof and soldering processes, it
More particularly to TiAl-base alloy special-purpose high temperature Ti base solder, TiAl-base alloy special-purpose high temperature Ti base solder preparation method and
The soldering processes of TiAl-base alloy special-purpose high temperature Ti base solder.
Background technique:
In recent years, with the continuous development of science and technology, requirement of the people to aero-engine performance is also higher and higher.Wherein send out
Most important performance indicator is exactly the thermal efficiency and thrust ratio of engine in motivation, and improving the two performance indicators most simply has
The method of effect is exactly that traditional nickel base superalloy is replaced using novel light, material resistant to high temperature.Between nearest decades,
TiAl-base alloy is due to having many advantages, such as that density is low, elasticity modulus is high and good elevated temperature strength, creep resistant and anti-oxidant, quilt
Think to have broad application prospects in aerospace field.In recent years, extensive, deep with being carried out to T iA l alloy
The functionization of research, TiAl-base alloy has achieved huge advance, and alloy part is widely used for automobile or aero-engine
High-temperature component, such as the turbine disk, blade and air valve.But original performance shortcomings, if room temperature ductility is low, thermoplasticity
Deformability difference etc. is not still overcome, so thus bring TiAl-base alloy connection difficult problem also becomes especially to dash forward
Out.
Publish thesis from the point of view of situation both at home and abroad from existing, the interconnection technique of TiAl-base alloy be broadly divided into melting welding (such as arc-welding,
Laser Welding and electron beam welding etc.) and solid State Welding (such as soldering, diffusion welding (DW), SHS process and friction welding (FW)).To TiAl
Although the result of study of the fusion welding method of based alloy shows that fusion welding method can be attached TiAl-base alloy itself,
The craftsmanship of melting welding is poor.This is mainly due to the essential brittleness of TiAl-base alloy, and its joint made by flame welding to be made to be also easy to produce crackle.And with
Fusion welding method is compared, and solid-state bonding process has heat input small, and Thermal Cycle process control is relatively easy, can by test
The features such as to design the Joining Technology parameter for meeting TiAl-base alloy performance characteristics, so as to improve quality of connection.Therefore domestic
Solid-state connection is had conducted extensive research outside, used connection method includes diffusion welding (DW), SHS process and friction welding (FW)
Deng.However, these solid-state bonding process there are respective advantage and disadvantage, can be obtained without any method satisfactory enough
Welding point.For example, friction welding joint form is restricted, it is difficult to connect complex-shaped component.TiAl-base alloy is spread
Connection studies have shown that joint interface brittlement phase is more, strength of joint dispersibility is larger.Due to SHS process (SHS)
The moment vigorous reaction feature that has of connection method itself, the TiAl-base alloy connector porosity actually obtained is big, connector
Intensity dispersion.In contrast, soldering itself has a lot of advantages, for example, brazing temperature it is low, influence that small, connector is remaining answers on base material
Power is small, can require to select a variety of filling metals according to connection temperature, strength of joint, the metal and xenogenesis for being suitble to connection infusibilized
Metal.Therefore TiAl-base alloy is attached with good prospect using method for welding.
One of an important factor for solder is influence soldered fitting performance, TiAl-base alloy property is active, is easy and other materials
Strong reaction occurs for material, to realize its soldering connection, first has to carry out solder preferred.Currently, soldering TiAl-base alloy
Solder mainly has 3 classes, i.e. silver-based, aluminium base, titanium-based or titanium zirconium base.3 kinds of solder common compositions and performance are as shown in the table:
Table 1
| Solder type | Performance (tensile strength) |
| AgCu eutectic | 225MPa |
| Ag34Cu16Zn | 210MPa |
| A l foil | 220MPa |
| Ti-Zr-Cu-Ni-Co | 316MPa |
Wherein Ag base solder has suitable fusing point, but Ag base solder is sensitive to chloride ion, thus the anti-corruption of soldered fitting
Corrosion can be poor, and the intensity of soldered fitting is relatively low.And Al base solder can be formed largely when being brazed TiAl-base alloy in joint
Weld metal zone brittle intermetallic thing phase so that connector is very crisp, and fatigue behaviour and impact strength are lower.In addition, Ag base
With Al base solder since the fusing point of itself is lower, the use temperature of material is lower after brazing.Compared with Ag base and Al base solder,
Ti base solder has good wetability on TiAl-base alloy surface, in postwelding connector intensity with higher, and it is corrosion-resistant
It has excellent performance.Since the fusing point of Ti base solder is apparently higher than Ag base and Al base solder, so the material after soldering is with higher
Use temperature.But containing Cu element and Ni element in most of Ti base solder, these elements can generate strong with Ti element
Diffusion dissolution reaction, easily cause the corrosion of matrix and brittle metal part compound phase can be generated.
Summary of the invention:
In order to solve current TiAl-base alloy soldering joint strength it is low, soldering after materials'use temperature it is low, under hot environment
Joint performance is poor, solder preparation process and soldering processes complexity problem, and that the object of the present invention is to provide a kind of wetabilitys is good, connects
Head intensity is high, diffusion is high, postwelding is high using temperature, and the TiAl of joint weld metal zone brittle intermetallic thing phase is effectively reduced
Based alloy special-purpose high temperature Ti base solder and preparation method thereof and soldering processes.
To achieve the goals above, the technical scheme is that
The component and content (weight percent) of TiAl-base alloy special-purpose high temperature Ti base solder of the invention are Fe:10.0%
~30.0%；Mn:10.0%~30.0%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, additive amount be 0~
5%；Remaining is Ti.
Above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is prepared with technique in the steps below:
(1) Ti, Fe, Mn, Al, B, Co, Cr, Mg, Ag, Nb and Zn element are weighed according to above-mentioned formula on an electronic balance
Raw material, wherein the purity of Ti, Fe, Mn, Al, B, Co, Cr, Mg, Ag, Nb and Zn element is in 99.9wt% or more.Due to Mn
Element can largely volatilize in melting, be that need to carry out element compensation to Mn element in configuration ingredient, by test of many times, Mn element
Cancellation ratio be 1%~2%；
(2) it will be placed in high vacuum Ar atmosphere protection non-consumable arc furnace by the raw material of above-mentioned recipe configuration；
(3) before melting, 1 × 10 is first evacuated in furnace-3~1 × 10-4Pa after applying argon gas prepurging 2~4 times, is evacuated to
1×10-3~1 × 10-4Pa, applying argon gas is to -0.035MP or more again；
(4) when melting sample, in order to keep cast alloy uniform, the sample in water jacketed copper crucible is anti-under function composite by electromagnetic stirring
Remelt refines 8~10 times, and overturns sample using rod is instead dialled；
(5) sample after melting is the TiAl-base alloy special-purpose high temperature Ti base solder master alloy of preparation；
(6) it after crushing master alloy, is packed into the quartz glass tube of high vacuum single roller strip machine.Quartz ampoule nozzle is in rectangular
Shape, the length is a=6~8mm；Width b=0.5~1mm；
(7) quartz glass tube is installed in and is got rid of in the induction heating circle with machine, and by its nozzle to copper roller surface spacing tune
It is made into 0.2~0.3mm, to guarantee that the liquid being injected on copper roller is plate stream, and forms condition of steady flow；
(8) fire door is closed, is evacuated to 1.5 × 10 using mechanical pump-1Pa or more, molecular pump pumping high vacuum to 3 × 10- 3Pa or more, then cavity is full of high-purity Ar gas；
(9) high frequency electric source is opened, after the master alloy high-frequency induction heating in quartz glass tube to substantially uniformity melting,
T=1100 DEG C of temperature~1250 DEG C are meltblown, keep the temperature superheated melt 1 minute；
(10) motor is opened, selection copper roller diameter is 230mm, and copper roller width is 40mm, and adjusts copper roller revolving speed us=20
~35m/s；
(11) Ar atmospheric pressure is adjusted to 0.2MPa, is continuously ejected into the superheated melt in quartz glass tube with high pressure argon gas
High-speed rotating cooling copper roller surface, liquid metal are closed due to being formed foil shape by chilling to obtain TiAl base of the present invention
Golden special-purpose high temperature Ti base solder.
Using the chilling solder foil of above-mentioned technique preparation with a thickness of 0.040 ± 0.003mm, and any surface finish, two sides are flat
It is whole.
Chemical component, fusion temperature and brazing process parameter of the invention are as follows:
Table 2
Before brazing, by TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded acetone soln,
Each 20min of ultrasonic cleaning is successively carried out in ethanol solution, to remove surface impurity, takes out drying, and press TiAl-base alloy/pricker
Material/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig.Brazing process vacuum degree is not less than
5×10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, is kept the temperature after 10min with the liter of 15 DEG C/min
Warm rate is heated to brazing temperature, finally keeps the temperature by the soldering processes time, cools to room temperature with the furnace after completing soldering.Using this kind
Ti base high-temp solder vacuum brazing TiAl-base alloy, high-temperature behavior are much higher than Ag base solder, Al base solder and Ti-Zr-Ni-Cu
Solder.Welding point tensile strength reaches 420MPa.
The present invention has the advantage that and beneficial effect is:
(1) present invention is polynary Ti base high-temp solder, because it has good wetability, soldering on TiAl-base alloy surface
When have good mobility, capillary absorption function can be given full play to, solder can adequately fill up joint gap, thus can get
Fine and close high-strength joint；
(2) polynary Ti base high-temp solder of the invention be thin ribbon shaped solder, solder with a thickness of 40 μm, can make joint clearance of brazing into
One step reduces.And its physical characteristic is changed compared with the solder of other states.The melting region of this solder is compared with common state
Solder is about 14 DEG C low, and soldered fitting size is narrower, so the room temperature tensile intensity of the polynary Ti base high-temp solder is apparent
Higher than Ag base, Al base and other Ti base solders；
(3) polynary Ti base high-temp solder ingredient of the invention is different from traditional Ti base solder, so during the brazing process in solder
Elements diffusion performance greatly promote.Apparent layered structure and a large amount of weld metal zone brittle intermetallic things will not be generated after brazing
Phase facilitates the promotion of joint performance；
(4) fusing point of polynary Ti base high-temp solder of the invention is apparently higher than Ag base, Al base and other Ti base solders, thus
The use temperature of material is obviously improved after soldering；
(5) present invention is noble metal containing minute quantity in polynary Ti base high-temp solder, thus cheap, save the cost.
Detailed description of the invention:
Fig. 1 is the process flow chart being brazed using TiAl-base alloy special-purpose high temperature Ti base solder
Specific embodiment:
One, in the specific implementation process, TiAl-base alloy special-purpose high temperature Ti base solder of the present invention and preparation method thereof is as follows:
Specific embodiment 1: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
10%~15%, Mn:10%~15%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 2: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
10%~15%, Mn:15%~20%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 3: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
10%~15%, Mn:20%~25%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 4: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
10%~15%, Mn:25%~30%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 5: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
15%~20%, Mn:10%~15%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 6: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
15%~20%, Mn:15%~20%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 7: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
15%~20%, Mn:20%~25%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 8: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
15%~20%, Mn:25%~30%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 9: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
20%~25%, Mn:10%~15%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 10: TiAl-base alloy special-purpose high temperature Ti base solder Fe by weight percentage in present embodiment:
20%~25%, Mn:15%~20%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element adds
Dosage is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, the and of Nb:0~5%
Zn:0~4%；Remaining is Ti.
Specific embodiment 11: TiAl-base alloy special-purpose high temperature Ti base solder is by weight percentage in present embodiment
Fe:20%~25%, Mn:20%~25%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element
Additive amount be Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, Nb:0~
5% and Zn:0~4%；Remaining is Ti.
Specific embodiment 12: TiAl-base alloy special-purpose high temperature Ti base solder is by weight percentage in present embodiment
Fe:20%~25%, Mn:25%~30%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element
Additive amount be Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, Nb:0~
5% and Zn:0~4%；Remaining is Ti.
Specific embodiment 13: TiAl-base alloy special-purpose high temperature Ti base solder is by weight percentage in present embodiment
Fe:25%~30%, Mn:10%~15%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element
Additive amount be Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, Nb:0~
5% and Zn:0~4%；Remaining is Ti.
Specific embodiment 14: TiAl-base alloy special-purpose high temperature Ti base solder is by weight percentage in present embodiment
Fe:25%~30%, Mn:15%~20%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element
Additive amount be Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, Nb:0~
5% and Zn:0~4%；Remaining is Ti.
Specific embodiment 15: TiAl-base alloy special-purpose high temperature Ti base solder is by weight percentage in present embodiment
Fe:25%~30%, Mn:20%~25%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element
Additive amount be Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, Nb:0~
5% and Zn:0~4%；Remaining is Ti.
Specific embodiment 16: TiAl-base alloy special-purpose high temperature Ti base solder is by weight percentage in present embodiment
Fe:25%~30%, Mn:25%~30%；One of Al, B, Co, Cr, Mg, Ag, Nb and Zn or two or more, wherein each element
Additive amount be Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0~5%, Ag:0~4%, Nb:0~
5% and Zn:0~4%；Remaining is Ti.
Trace element Al of the above-mentioned specific embodiment one into specific embodiment 16, B, Co, Cr, Mg, Ag, Nb and
Zn, a combination thereof mode are listed below:
(1) a kind of element is individually added, such as: Al, B, Co, Cr, Mg, Ag, Nb and Zn；
(2) two various elements are added, such as: Al+B, Al+Nb, Al+Co, Nb+Cr, Co+B；
(3) three kinds of elements are added, such as: Al+B+Nb, Al+B+Cr, Nb+Cr+B, Al+B+Ag, Mg+B+Ag；
(4) four kinds of elements are added, such as: Al+B+Nb+Cr, Al+B+Nb+Co, Al+B+Mg+Zn；
(5) five kinds of elements are added, such as: Al+B+Nb+Cr+Co, Al+B+Mg+Nb+Zn；
(6) six kinds of elements are added, such as: Al+B+Nb+Cr+Mg+Ag, Al+B+Co+Cr+Mg+Ag；
(7) seven kinds of elements are added, such as: Al+B+Nb+Cr+Co+Ag+Zn；
(8) eight kinds of elements are added, such as: Al+B+Nb+Cr+Co+Mg+Ag+Zn.
Specific embodiment 17: present embodiment TiAl-base alloy special-purpose high temperature Ti base solder the preparation method is as follows:
(1) Ti, Fe, Mn, Al, B, Co, Cr, Mg, Ag, Nb and Zn element are weighed according to above-mentioned formula on an electronic balance
Raw material, wherein the purity of Ti, Fe, Mn, Al, B, Co, Cr, Mg, Ag, Nb and Zn element is in 99.9wt% or more.Due to Mn
Element can largely volatilize in melting, be that need to carry out element compensation to Mn element in configuration ingredient, by test of many times, Mn element
Cancellation ratio be 1%~2%；
(2) it will be placed in high vacuum Ar atmosphere protection non-consumable arc furnace by the raw material of above-mentioned recipe configuration；
(3) before melting, 1 × 10 is first evacuated in furnace-3~1 × 10-4Pa after applying argon gas prepurging 2~4 times, is evacuated to
1×10-3~1 × 10-4Pa, applying argon gas is to -0.035MP or more again；
(4) when melting sample, in order to keep cast alloy uniform, the sample in water jacketed copper crucible is anti-under function composite by electromagnetic stirring
Remelt refines 8~10 times, and overturns sample using rod is instead dialled；
(5) sample after melting is the TiAl-base alloy special-purpose high temperature Ti base solder master alloy of preparation；
(6) it after crushing master alloy, is packed into the quartz glass tube of high vacuum single roller strip machine.Quartz ampoule nozzle is in rectangular
Shape, the length is a=6~8mm；Width b=0.5~1mm；
(7) quartz glass tube is installed in and is got rid of in the induction heating circle with machine, and by its nozzle to copper roller surface spacing tune
It is made into 0.2~0.3mm, to guarantee that the liquid being injected on copper roller is plate stream, and forms condition of steady flow；
(8) fire door is closed, is evacuated to 1.5 × 10 using mechanical pump-1Pa or more, molecular pump pumping high vacuum to 3 × 10- 3Pa or more, then cavity is full of high-purity Ar gas；
(9) high frequency electric source is opened, after the master alloy high-frequency induction heating in quartz glass tube to substantially uniformity melting,
T=1100 DEG C of temperature~1250 DEG C are meltblown, keep the temperature superheated melt 1 minute；
(10) motor is opened, selection copper roller diameter is 230mm, and copper roller width is 40mm, and adjusts copper roller revolving speed us=20
~35m/s；
(11) Ar atmospheric pressure is adjusted to 0.2MPa, is continuously ejected into the superheated melt in quartz glass tube with high pressure argon gas
High-speed rotating cooling copper roller surface, liquid metal are closed due to being formed foil shape by chilling to obtain TiAl base of the present invention
Golden special-purpose high temperature Ti base solder.
Using the chilling solder foil of above-mentioned technique preparation with a thickness of 0.040 ± 0.003mm, and any surface finish, two sides are flat
It is whole.
Specific embodiment 18: by TiAl-base alloy special-purpose high temperature of the embodiment above one into embodiment 17
Ti base solder is processed into a thickness of 20 μm~30 μm.
Specific embodiment 19: by TiAl-base alloy special-purpose high temperature of the embodiment above one into embodiment 17
Ti base solder is processed into a thickness of 30 μm~40 μm.
Two, in the specific implementation process, the present invention is brazed the soldering processes (figure of TiAl-base alloy special-purpose high temperature Ti base solder
1):
Specific embodiment 20: before brazing, by the TiAl-base alloy special-purpose high temperature Ti in the embodiment above 18
Base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, to go
Except surface impurity, drying is taken out, and is put into brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
It is brazed in vacuum drying oven.Brazing process vacuum degree is not less than 5 × 10-3Pa, first with the heating rate of 10 DEG C/min by sample
It is heated to 800 DEG C, keeps the temperature and be heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, keep the temperature 0~30min.
Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 21: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 30~
60min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 22: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 60~
90min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 23: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 90~
120min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 24: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 0~
30min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 25: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 30~
60min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 26: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 60~
90min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 27: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 90~
120min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 28: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 0~
30min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 29: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 30~
60min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 30: before brazing, by the TiAl-base alloy special-purpose high temperature Ti in the embodiment above 18
Base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, to go
Except surface impurity, drying is taken out, and is put into brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
It is brazed in vacuum drying oven.Brazing process vacuum degree is not less than 5 × 10-3Pa, first with the heating rate of 10 DEG C/min by sample
It is heated to 800 DEG C, keeps the temperature and be heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, heat preservation 60~
90min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 31: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 18
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 90~
120min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 32: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 0~
30min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 33: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 30~
60min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 34: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 60~
90min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 35: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1100 DEG C~1150 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 90~
120min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 36: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 0~
30min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 37: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 30~
60min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 38: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 60~
90min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 39: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1150 DEG C~1200 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 90~
120min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 40: before brazing, by the TiAl-base alloy special-purpose high temperature Ti in the embodiment above 19
Base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, to go
Except surface impurity, drying is taken out, and is put into brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
It is brazed in vacuum drying oven.Brazing process vacuum degree is not less than 5 × 10-3Pa, first with the heating rate of 10 DEG C/min by sample
It is heated to 800 DEG C, keeps the temperature and be heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, keep the temperature 0~30min.
Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 41: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 30~
60min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 42: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 60~
90min.Room temperature is cooled to the furnace after completing soldering.
Specific embodiment 43: before brazing, by the TiAl-base alloy special-purpose high temperature in the embodiment above 19
Ti base solder and TiAl-base alloy sample to be welded successively carry out each 20min of ultrasonic cleaning in acetone soln, ethanol solution, with
Surface impurity is removed, takes out drying, and put in brazing jig by TiAl-base alloy/solder/TiAl-base alloy assembled in sequence
Enter in vacuum drying oven and is brazed.Brazing process vacuum degree is not less than 5 × 10-3Pa will be tried with the heating rate of 10 DEG C/min first
Sample is heated to 800 DEG C, keeps the temperature and is heated to 1200 DEG C~1250 DEG C with the heating rate of 15 DEG C/min after 10min, and heat preservation 90~
120min.Room temperature is cooled to the furnace after completing soldering.
The tensile strength of sample after the embodiment above is brazed, soldered fitting can reach 420MPa.
It is arrived containing other alloy element Als, the preparation method of B, Co, Cr, Mg, Ag, Nb and Zn solder and specific embodiment one
Specific embodiment 19 is identical, and soldering processes process is identical to specific embodiment 43 as specific embodiment 20.
Claims (3)
1. a kind of TiAl-base alloy special-purpose high temperature Ti base solder, which is characterized in that solder uses following one of ingredient and content:
(1) solder Fe:10%~15%, Mn:10%~15% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(2) solder Fe:10%~15%, Mn:15%~20% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(3) solder Fe:10%~15%, Mn:20%~25% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(4) solder Fe:10%~15%, Mn:25%~30% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(5) solder Fe:15%~20%, Mn:10%~15% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(6) solder Fe:15%~20%, Mn:15%~20% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(7) solder Fe:15%~20%, Mn:20%~25% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(8) solder Fe:15%~20%, Mn:25%~30% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(9) solder Fe:20%~25%, Mn:10%~15% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(10) solder Fe:20%~25%, Mn:15%~20% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(11) solder Fe:20%~25%, Mn:20%~25% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(12) solder Fe:20%~25%, Mn:25%~30% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(13) solder Fe:25%~30%, Mn:10%~15% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(14) solder Fe:25%~30%, Mn:15%~20% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(15) solder Fe:25%~30%, Mn:20%~25% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti；
(16) solder Fe:25%~30%, Mn:25%~30% by weight percentage；Al, B, Co, Cr, Mg, Ag, Nb and Zn it
One or two or more, wherein the additive amount of each element is Al:0~5%, B:0~3%, Co:0~5%, Cr:0~5%, Mg:0
~5%, Ag:0~4%, Nb:0~5% and Zn:0~4%；Remaining is Ti.
2. a kind of preparation method of TiAl-base alloy special-purpose high temperature Ti base solder described in claim 1, which is characterized in that including
Following steps:
(1) Ti, Fe, Mn, Al, B, Co, Cr, Mg, Ag, Nb and Zn element are weighed into former material according to above-mentioned formula on an electronic balance
Material, wherein the purity of Ti, Fe, Mn, Al, B, Co, Cr, Mg, Ag, Nb and Zn element is in 99.9wt% or more；Due to Mn element
It can largely volatilize in melting, be that need to carry out element compensation to Mn element in configuration ingredient, by test of many times, the benefit of Mn element
Repaying rate is 1%~2%；
(2) it will be placed in high vacuum Ar atmosphere protection non-consumable arc furnace by the raw material of above-mentioned recipe configuration；
(3) before melting, 1 × 10 is first evacuated in furnace-3~1 × 10-4Pa, after applying argon gas prepurging 2~4 times, it is evacuated to 1 ×
10-3~1 × 10-4Pa, applying argon gas is to -0.035MP or more again；
(4) when melting sample, in order to keep cast alloy uniform, the sample in water jacketed copper crucible melts repeatedly under function composite by electromagnetic stirring
Refining 8~10 times, and sample is overturn using rod is instead dialled；
(5) sample after melting is the TiAl-base alloy special-purpose high temperature Ti base solder master alloy of preparation；
(6) it after crushing master alloy, is packed into the quartz glass tube of high vacuum single roller strip machine；Quartz ampoule nozzle is rectangle,
The length is a=6~8mm；Width b=0.5~1mm；
(7) quartz glass tube is installed in and is got rid of in the induction heating circle with machine, and its nozzle to copper roller surface spacing is adjusted to
0.2~0.3mm to guarantee that the liquid being injected on copper roller is plate stream, and forms condition of steady flow；
(8) fire door is closed, is evacuated to 1.5 × 10 using mechanical pump-1Pa or more, molecular pump pumping high vacuum to 3 × 10-3Pa with
On, then cavity is full of high-purity Ar gas；
(9) high frequency electric source is opened, after the master alloy high-frequency induction heating in quartz glass tube to substantially uniformity melting, melt-blown
T=1100 DEG C of temperature~1250 DEG C keep the temperature superheated melt 1 minute；
(10) motor is opened, selection copper roller diameter is 230mm, and copper roller width is 40mm, and adjusts copper roller revolving speed us=20~35m/
s；
(11) Ar atmospheric pressure is adjusted to 0.2MPa, the superheated melt in quartz glass tube is continuously ejected into high speed with high pressure argon gas
The cooling copper roller surface of rotation, liquid metal is due to being formed foil shape by chilling, to obtain TiAl-base alloy special-purpose high temperature
Ti base solder；
Using the chilling solder foil of above-mentioned technique preparation with a thickness of 0.040 ± 0.003mm, and any surface finish, two sides are smooth；
(12) above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is processed into a thickness of 20 μm~30 μm or 30 μm~40 μm.
3. a kind of soldering processes of TiAl-base alloy special-purpose high temperature Ti base solder described in claim 1, it is characterised in that: use
One of following soldering processes:
(1) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 0~30min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(2) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 30~60min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(3) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 60~90min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(4) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 90~120min；Room temperature is cooled to the furnace after completing soldering, it will
Above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is processed into a thickness of 20 μm~30 μm；
(5) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 0~30min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(6) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 30~60min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(7) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 60~90min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(8) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 90~120min；Room temperature is cooled to the furnace after completing soldering, it will
Above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is processed into a thickness of 20 μm~30 μm；
(9) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 0~30min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(10) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 30~60min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(11) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 60~90min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 20 μm~30 μm；
(12) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 90~120min；Room temperature is cooled to the furnace after completing soldering, it will
Above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is processed into a thickness of 20 μm~30 μm；
(13) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 0~30min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(14) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 30~60min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(15) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 60~90min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(16) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1100 DEG C~1150 DEG C, keeps the temperature 90~120min；Room temperature is cooled to the furnace after completing soldering, it will
Above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is processed into a thickness of 30 μm~40 μm；
(17) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 0~30min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(18) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 30~60min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(19) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 60~90min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(20) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1150 DEG C~1200 DEG C, keeps the temperature 90~120min；Room temperature is cooled to the furnace after completing soldering, it will
Above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is processed into a thickness of 30 μm~40 μm；
(21) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 0~30min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(22) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 30~60min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(23) before brazing, by upper the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded third
Each 20min of ultrasonic cleaning is successively carried out in ketone solution, ethanol solution, to remove surface impurity, takes out drying, and press TiAl base
Alloy/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum
Degree is not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 60~90min；Room temperature is cooled to the furnace after completing soldering, it will be upper
TiAl-base alloy special-purpose high temperature Ti base solder is stated to be processed into a thickness of 30 μm~40 μm；
(24) before brazing, by the TiAl-base alloy special-purpose high temperature Ti base solder and TiAl-base alloy sample to be welded in acetone
Each 20min of ultrasonic cleaning is successively carried out in solution, ethanol solution, to remove surface impurity, takes out drying, and close by TiAl base
Gold/solder/TiAl-base alloy assembled in sequence is put into vacuum drying oven and is brazed in brazing jig, brazing process vacuum degree
Not less than 5 × 10-3Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min first by Pa, keep the temperature after 10min with 15 DEG C/
The heating rate of min is heated to 1200 DEG C~1250 DEG C, keeps the temperature 90~120min；Room temperature is cooled to the furnace after completing soldering, it will
Above-mentioned TiAl-base alloy special-purpose high temperature Ti base solder is processed into a thickness of 30 μm~40 μm.
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| CN108453332B (en) * | 2018-02-08 | 2021-01-08 | 中国科学院金属研究所 | Brazing process for vacuum brazing TiAl-based alloy by using amorphous Ti-Zr-Cu-Ni brazing filler metal |
| CN109604865B (en) * | 2018-11-16 | 2021-05-04 | 南京理工大学 | Zirconium-based solder for connecting TiAl alloy and Ni-based high-temperature alloy |
| CN111702278B (en) * | 2020-05-13 | 2021-10-22 | 中国科学院金属研究所 | Ti2Medium-temperature Ti-based brazing filler metal for brazing same or different AlNb-based alloys as well as preparation method and brazing process thereof |
| CN111702277B (en) * | 2020-05-13 | 2021-10-22 | 中国科学院金属研究所 | Ti2Medium-temperature Ti-based brazing filler metal special for brazing same or different AlNb-based alloy materials and preparation method and brazing process thereof |
| CN111702280B (en) * | 2020-05-13 | 2021-09-24 | 中国科学院金属研究所 | Ti2Medium-temperature Ti-based brazing filler metal special for brazing same or different AlNb-based alloy materials and preparation method and brazing process thereof |
| CN113441692A (en) * | 2021-06-28 | 2021-09-28 | 哈尔滨工业大学 | Rapid solidification device and solidification method for refined TiAl-based alloy |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7419086B2 (en) * | 2003-07-14 | 2008-09-02 | Honeywell International Inc. | Low cost brazes for titanium |
| CN101157567B (en) * | 2007-09-11 | 2010-06-02 | 江苏科技大学 | Boron-containing titanium-based amorphous solder for braze welding Si3N4 ceramic and preparation method thereof |
| CN101367159B (en) * | 2008-10-06 | 2010-08-11 | 江苏科技大学 | Cu-P based amorphous brazing filler metal and method for manufacturing the same |
| CN102198569B (en) * | 2011-04-19 | 2013-04-24 | 哈尔滨工业大学 | Preparation method of high-temperature solder for brazing TiAl-based alloy |
| CN102922172A (en) * | 2012-10-24 | 2013-02-13 | 中国航空工业集团公司北京航空材料研究院 | Titanium-zirconium-ferrum based solder for TiAl or Ti3Al alloy soldering |
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