CN106910702B - A kind of automatic wafer transporter and transport method - Google Patents
A kind of automatic wafer transporter and transport method Download PDFInfo
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- CN106910702B CN106910702B CN201710119260.4A CN201710119260A CN106910702B CN 106910702 B CN106910702 B CN 106910702B CN 201710119260 A CN201710119260 A CN 201710119260A CN 106910702 B CN106910702 B CN 106910702B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of automatic wafer transporter and transport methods, it is characterised in that: the automatic wafer transporter includes cassette mould group, the second mechanical arm mould group for extracting with the first mechanical arm mould group of storing wafer and for transmitting the wafer in the first mechanical arm mould group to workbench.Wafer conveying function of the invention preferably completes the conveying of wafer, and multiple limit and inductor are equipped between each component, can prevent the damage of wafer during conveying.
Description
Technical field
The present invention relates to field of semiconductor manufacture more particularly to a kind of wafer transporter machine transport methods.
Background technique
Semiconductor crystal wafer can be moved to due to that need to pass through the processing of various different processes and need to cooperate process equipment
Different work stations.In order to facilitate wafer carrying and avoid by external collision, multiple wafers can be accommodated in wafer and kept in
In cassette.
In general, the multiple slots successively arranged are provided in wafer clamping box for temporary storage horizontal to accommodate multiple wafers, and
One side face has opening setting out and being loaded into for wafer.Furthermore being also provided in opening can prevent wafer in carrying
When the stop dog component that skids off.However, operating personnel is normal when the wafer clamping box for temporary storage of storing wafer is carried to subsequent work station
It can forget to release limit of the stop dog component to wafer, and mechanical arm is caused by force to take out wafer from opening, wafer is caused to hit
It hits stop dog component and ruptures and damage.In addition, the slot spacing of wafer clamping box for temporary storage is greater than wafer thickness, and wafer clamping box for temporary storage
Accommodating space can be greater than wafer area, therefore wafer can still shake in handling process in wafer clamping box for temporary storage, and with crystalline substance
Circle clamping box for temporary storage mutually collides, this will also result in the rupture and damage of wafer.Therefore, operating personnel's malfunction how is effectively reduced
Chance and to reduce the probability mutually collided between wafer clamping box for temporary storage and wafer in handling process be that industry wants the project solved
One of.
In the past, it is (hereinafter, appropriately referred to as brilliant to take out the semiconductor crystal wafer of receiving in a reservoir from container using manipulator
Circle), temporarily it is placed on calibrating installation.Groove is detected using calibrating installation, reaches the wafer being positioned on calibrating installation
Align to specified position.The wafer aligned by calibrating installation is taken out from calibrating installation using manipulator, it is then defeated
It is sent to the wafer processing device for handling wafer.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of automatic wafer transporter and transport methods.
In order to solve the above technical problems, the technical scheme adopted by the invention is that: a kind of automatic wafer transporter, feature
Be: the automatic wafer transporter includes cassette mould group, for extracting and the first mechanical arm mould group and use of storing wafer
In the second mechanical arm mould group of the wafer in the first mechanical arm mould group of transmission to workbench, in which:
The cassette mould group include for installing the workbench of cassette, in Z-direction lifting action cassette liter
Platform transmission device and cassette mould group fixed frame drop, the cassette fixed frame be equipped be distributed in workbench two sides for scan card
The fibre optical sensor of wafer in casket；
The first mechanical arm mould group includes the first mechanical arm fixing seat for being equipped with line slide rail, the first mechanical arm
The linear transmission of fixing seat side and the first mechanical arm that reciprocating action is done on line slide rail, first manipulator
Arm end is equipped with " C " type pallet for carrying wafer；
The second mechanical arm mould group includes the transmission shaft fixing seat for being equipped with two transmission shaft sliding rails, two and transmission shaft
Sliding rail cooperation the second mechanical arm, in the second mechanical arm mould group Z-direction the lifting shaft drive of lifting action,
For the traverse gear of the second mechanical arm mould group crosswise movement, second mechanical arm end is equipped with and " C " type support
The matched slotting disk of disk.
Further, cassette lifting platform transmission device and lifting shaft drive include servo motor, screw rod, for joining
Move the first synchronous belt of servo motor and screw rod and the Z-axis transmission sliding rail for lifting, the main shaft end of servo motor and silk
Bar end be equipped with matched first belt gear of the first synchronous belt, the servo motor and screw rod are equipped with corresponding peace
Seat is filled, the workbench and transmission shaft fixing seat of the cassette have additional and the matched sliding block of Z-axis transmission sliding rail.
Further, the linear transmission of the first mechanical arm mould group and the second mechanical arm mould group lateral means are wrapped
Include that stepper motor, the second synchronous belt, two for strutting the second belt gear of the second synchronous belt, second belt teeth
There is the main shaft end for being fixed on stepper motor in wheel, another of second belt gear is separately fixed at the first machinery
On arm fixation seat and transmission shaft fixing seat, second belt gear, which struts the second synchronous belt, is rectangle circulation biography
Dynamic, distracted second synchronous belt folder is located on the first mechanical arm and the second mechanical arm by clamping plate respectively, passes through step
The second synchronous belt drive is driven into motor, drives the first mechanical arm and the second mechanical arm respectively in linear guide and transmission
Reciprocating action is carried out on axis sliding rail.
Further, line slide rail, transmission shaft sliding rail and Z-axis transmission sliding rail both ends be equipped with limited block, described first
Mechanical arm and the second mechanical arm are equipped with range limiter.
Wherein, the transport method of automatic wafer transporter is as follows:
A, machine is assembled, trial operation；
B, cassette is mounted on the workbench of cassette；
C, the servo motor linkage screw rod of cassette lifting platform transmission device declines cassette workbench, passes through optical fiber
Cassette memory is placed with the number of plies of wafer and the sum of storing wafer is sent to data end to being scanned in cassette by sensor
End；
D, extract to wafer in cassette: the pallet on the first mechanical arm slides into cassette on line slide rail,
It is extracted for the first wafer, and transports to the second mechanical arm the top for inserting disk；
E, wafer docks: the second mechanical arm mould group is risen by lifting shaft drive, by inserting disk for wafer from support
It is extracted in disk；
F, wafer conveys: the second mechanical arm starts to be slided on transmission axis rail, the slotting disk of the second mechanical arm
First wafer is sent to wafer work platform；
G, the first mechanical arm mould group repeats Step d, extracts the second wafer on pallet；
H, the second mechanical arm mould group repeats e, f step, at this point, clamping has the slotting disk of the first wafer to be located on pallet
Side, clamping have the slotting disk of the second wafer to be located at wafer work platform；
I, after the first wafer is stored go back to original position along line slide rail by the first mechanical arm mould group, continue to repeat Step d.
Further, conveying step is gradually to act；Overstroke, triggering safety signal just will do it to be acted in next step.
Further, artificial, even number, odd number, Quan Xuan are divided into the extraction selection of the wafer number of plies in step d.
Further, two root cutting disks of the second mechanical arm described in step f vertical direction on transmission shaft sliding rail is overlapped,
Spacing is 3mm.
By the above-mentioned description to structure of the invention it is found that compared to the prior art, the present invention has the advantage that
1, the present invention is linked using servo motor, screw rod and synchronous belt, ensure that during Z axis raising and lowering
Stability can largely ensure the stability in its Z-direction, ensure that manipulator to the conveying of wafer for manipulator
Action gap precision.
2, the present invention wafer in cassette is stored by fibre optical sensor the accurate number of plies and storage quantity into
Row detection, scanning, and feed back into computer data platform, the operation extracted and stored to wafer can be carried out from different aspect.
3, the stroke sensor and limited block being equipped with, can guarantee the stroke of manipulator, prevent beyond loss caused by stroke.
4, it by using the national standard component that servo motor, stepper motor and fibre optical sensor are in existing market, can guarantee
The stability of its component, so that the present apparatus uses stabilization, long service life.
5, the combination of complete machine and transport method can effectively prevent the damage caused by wafer during conveying.
Detailed description of the invention
The attached drawing constituted part of this application is used to provide further understanding of the present invention, schematic reality of the invention
It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of automatic wafer transporter of the present invention；
Fig. 2 is a kind of cartridge structure schematic diagram of automatic wafer transporter of the present invention；
Fig. 3 is a kind of cassette schematic perspective view of automatic wafer transporter of the present invention；
Fig. 4 is a kind of first synchronous belt fit structure schematic diagram of automatic wafer transporter of the present invention；
Fig. 5 is a kind of first mechanical arm modular structure schematic diagram of automatic wafer transporter of the present invention；
Fig. 6 is a kind of first mechanical arm mould group side structure schematic view of automatic wafer transporter of the present invention；
Fig. 7 is a kind of second mechanical arm modular structure schematic diagram of automatic wafer transporter of the present invention；
Fig. 8 is a kind of second mechanical arm mould group schematic perspective view of automatic wafer transporter of the present invention；
Fig. 9 is a kind of second mechanical arm mould group schematic view of the front view of automatic wafer transporter of the present invention；
Figure 10 is a kind of clamping plate of automatic wafer transporter of the present invention and the fit structure schematic diagram of synchronous belt.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Embodiment
Referring to figs. 1 to Figure 10, a kind of automatic wafer transporter, automatic wafer transporter includes cassette mould group 1, for extracting
With the first mechanical arm mould group 2 of storing wafer and for transmitting the wafer in the first mechanical arm mould group to the second of workbench
Mechanical arm mould group 3, in which:
Cassette mould group include for installing the workbench 4 of cassette, in Z-direction lifting action cassette lifting platform
Transmission device 5 and cassette mould group fixed frame 6, cassette fixed frame, which is equipped with, is distributed in workbench two sides for scanning crystalline substance in cassette
Round fibre optical sensor 7；
First mechanical arm mould group includes the first mechanical arm fixing seat 8 for being equipped with line slide rail 27, the first mechanical arm
The linear transmission 9 of fixing seat side and the first mechanical arm 10 that reciprocating action is done on line slide rail, the first manipulator
Arm end is equipped with " C " the type pallet 11 for carrying wafer；
Second mechanical arm mould group includes transmission shaft fixing seat 12, two and transmission shaft equipped with two transmission shaft sliding rails 28
Second mechanical arm 13 of sliding rail cooperation, the lifting shaft of lifting action is driven dress in the second mechanical arm mould group Z-direction
Set 14, for the traverse gear 15 of the second mechanical arm mould group crosswise movement, the second mechanical arm end is equipped with and " C " type
The matched slotting disk 16 of pallet.
Cassette lifting platform transmission device 5 and lifting shaft drive 14 include servo motor 17, screw rod 18, for linking
Z-axis transmission sliding rail 20 of the servo motor 17 with the first synchronous belt 19 of screw rod 18 and for lifting, the main shaft end of servo motor
End and screw end be equipped with matched first belt gear 21 of the first synchronous belt, servo motor 17 and screw rod 18 are equipped with
Corresponding mounting base, the workbench 4 and transmission shaft fixing seat 12 of cassette have additional and the matched sliding block of Z-axis transmission sliding rail
22。
The linear transmission 9 of first mechanical arm mould group and the second mechanical arm mould group lateral means 15 include stepping
Motor 23, the second synchronous belt 24, two for strutting the second belt gear 25 of the second synchronous belt, the second belt gear 25
In have the main shaft end for being fixed on stepper motor, another of the second belt gear 25 is separately fixed at the first mechanical arm
In fixing seat 8 and transmission shaft fixing seat 12, the second belt gear 25, which struts the second synchronous belt 24, is rectangle circulation transmission,
Distracted second synchronous belt folder 24 by 26 the first mechanical arm of sandwiched of clamping plate and the second mechanical arm, passes through stepping electricity respectively
Machine 23 drives the transmission of the second synchronous belt 24, drives the first mechanical arm 10 and the second mechanical arm 13 respectively in linear guide 27
With reciprocating action is carried out on transmission shaft sliding rail 28.
Line slide rail 27, transmission shaft sliding rail 28 and Z-axis transmission sliding rail 20 are equipped with limited block, the first mechanical arm at both ends
10 and second mechanical arm 13 be equipped with range limiter.
The transport method of automatic wafer transporter is as follows:
A, machine is assembled, trial operation；
B, cassette is mounted on the workbench of cassette；
C, the servo motor linkage screw rod of cassette lifting platform transmission device declines cassette workbench, passes through optical fiber
Cassette memory is placed with the number of plies of wafer and the sum of storing wafer is sent to data end to being scanned in cassette by sensor
End；
D, extract to wafer in cassette: the pallet on the first mechanical arm slides into cassette on line slide rail,
It is extracted for the first wafer, and transports to the second mechanical arm the top for inserting disk；
E, wafer docks: the second mechanical arm mould group is risen by lifting shaft drive, by inserting disk for wafer from support
It is extracted in disk；
F, wafer conveys: the second mechanical arm starts to be slided on transmission axis rail, the slotting disk of the second mechanical arm
First wafer is sent to wafer work platform；
G, the first mechanical arm mould group repeats Step d, extracts the second wafer on pallet；
H, the second mechanical arm mould group repeats e, f step, at this point, clamping has the slotting disk of the first wafer to be located on pallet
Side, clamping have the slotting disk of the second wafer to be located at wafer work platform；
I, after the first wafer is stored go back to original position along line slide rail by the first mechanical arm mould group, continue to repeat Step d.
Conveying step is gradually to act；Overstroke, triggering safety signal just will do it to be acted in next step.
Artificial, even number, odd number, Quan Xuan are divided into the extraction selection of the wafer number of plies in step d.
Two root cutting disks of the second mechanical arm vertical direction on transmission shaft sliding rail is overlapped in step f, spacing 3mm.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (8)
1. a kind of automatic wafer transporter, it is characterised in that: the automatic wafer transporter includes cassette mould group (1), for mentioning
It takes with the first mechanical arm mould group (2) of storing wafer and for transmitting the wafer in the first mechanical arm mould group to workbench
Second mechanical arm mould group (3), in which:
The cassette mould group include for installing the workbench of cassette (4), in Z-direction lifting action cassette lifting
Platform transmission device (5) and cassette mould group fixed frame (6), the cassette mould group fixed frame, which is equipped with, is distributed in workbench two sides use
In the fibre optical sensor (7) of wafer in scanning cassette；
The first mechanical arm mould group includes the first mechanical arm fixing seat (8) for being equipped with line slide rail (27), the first machinery
The linear transmission (9) of arm fixation seat side and the first mechanical arm (10) that reciprocating action is done on line slide rail, institute
The first mechanical arm end is stated equipped with " C " the type pallet (11) for carrying wafer；
The second mechanical arm mould group includes transmission shaft fixing seat (12), two and biography equipped with two transmission shaft sliding rails (28)
Moving axis sliding rail cooperation the second mechanical arm (13), in the second mechanical arm mould group Z-direction lifting action lifting shaft
Transmission device (14), for the traverse gear (15) of the second mechanical arm mould group crosswise movement, second mechanical arm
End is equipped with and the matched slotting disk (16) of " C " type pallet.
2. a kind of automatic wafer transporter according to claim 1, it is characterised in that: the cassette lifting platform transmission device
(5) and lifting shaft drive (14) include servo motor (17), screw rod (18), for the servo motor that links (17) and screw rod
(18) the first synchronous belt (19) and the Z-axis transmission sliding rail (20) for lifting, the main shaft end of servo motor and screw rod end
End be equipped with matched first belt gear (21) of the first synchronous belt, the servo motor (17) and screw rod (18) are equipped with
Corresponding mounting base, the workbench (4) and transmission shaft fixing seat (12) of the cassette have additional and match with Z-axis transmission sliding rail
Sliding block (22).
3. a kind of automatic wafer transporter according to claim 1, it is characterised in that: the first mechanical arm mould group
Linear transmission (9) and the second mechanical arm mould group lateral means (15) include stepper motor (23), the second synchronous belt
(24), two for strutting the second belt gear (25) of the second synchronous belt, has one in second belt gear (25)
It is fixed on the main shaft end of stepper motor, to be separately fixed at the first mechanical arm solid for another of second belt gear (25)
In reservation (8) and transmission shaft fixing seat (12), second belt gear (25) struts the second synchronous belt (24) in rectangular
Shape circulation transmission, distracted second synchronous belt folder (24) are mechanical by clamping plate (26) first mechanical arm of sandwiched and second respectively
Arm drives the second synchronous belt (24) transmission by stepper motor (23), drives the first mechanical arm (10) and the second machinery
Arm (13) carries out reciprocating action in linear guide (27) and transmission shaft sliding rail (28) respectively.
4. a kind of automatic wafer transporter according to claim 1 or 2, it is characterised in that: the line slide rail (27) passes
Moving axis sliding rail (28) and Z-axis transmission sliding rail (20) are equipped with limited block, first mechanical arm (10) and the second machine at both ends
Tool arm (13) is equipped with range limiter.
5. a kind of transport method of automatic wafer transporter, it is characterised in that: the transport method of the automatic wafer transporter is such as
Under:
A, machine is assembled, trial operation；
B, cassette is mounted on the workbench of cassette；
C, the servo motor linkage screw rod of cassette lifting platform transmission device declines cassette workbench, passes through Fibre Optical Sensor
Cassette memory is placed with the number of plies of wafer and the sum of storing wafer is sent to data terminal to being scanned in cassette by device；
D, extract to wafer in cassette: the pallet on the first mechanical arm slides into cassette on line slide rail, for
First wafer extracts, and transports to the second mechanical arm the top for inserting disk；
E, wafer dock: the second mechanical arm mould group by lifting shaft drive rise, by insert disk by wafer from pallet
It extracts；
F, wafer conveys: the second mechanical arm starts to be slided on transmission axis rail, and the slotting disk of the second mechanical arm is by the
Wafer is sent to wafer work platform；
G, the first mechanical arm mould group repeats Step d, extracts the second wafer on pallet；
H, the second mechanical arm mould group repeats e, f step, at this point, clamping has the slotting disk of the first wafer to be located above pallet, dress
The slotting disk for accompanying the second wafer is located at wafer work platform；
I, after the first wafer is stored go back to original position along line slide rail by the first mechanical arm mould group, continue to repeat Step d.
6. a kind of transport method of automatic wafer transporter according to claim 5, it is characterised in that: the transport method
It is gradually to act from a to i；Overstroke, triggering safety signal just will do it to be acted in next step.
7. a kind of transport method of automatic wafer transporter according to claim 5, it is characterised in that: to crystalline substance in step d
The extraction selection of the circle number of plies is divided into artificial, even number, odd number, Quan Xuan.
8. a kind of transport method of automatic wafer transporter according to claim 5, it is characterised in that: described in step f
Two root cutting disks of the second mechanical arm vertical direction on transmission shaft sliding rail is overlapped, spacing 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710119260.4A CN106910702B (en) | 2017-03-02 | 2017-03-02 | A kind of automatic wafer transporter and transport method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710119260.4A CN106910702B (en) | 2017-03-02 | 2017-03-02 | A kind of automatic wafer transporter and transport method |
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| Publication Number | Publication Date |
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| CN106910702A CN106910702A (en) | 2017-06-30 |
| CN106910702B true CN106910702B (en) | 2019-05-03 |
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| CN201710119260.4A Active CN106910702B (en) | 2017-03-02 | 2017-03-02 | A kind of automatic wafer transporter and transport method |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109360803B (en) * | 2018-11-16 | 2024-02-09 | 罗博特科智能科技股份有限公司 | Battery piece magazine carries auto-change over device |
| CN109545728B (en) * | 2018-12-07 | 2021-03-05 | 江苏汇成光电有限公司 | Automatic wafer transfer method |
| CN110371669A (en) * | 2019-06-28 | 2019-10-25 | 上海提牛机电设备有限公司 | A kind of wafer frame box mobile mechanism and wafer feed system up and down |
| CN110255156A (en) * | 2019-06-29 | 2019-09-20 | 苏州精濑光电有限公司 | A kind of transferring device |
| CN113003185A (en) * | 2021-02-23 | 2021-06-22 | 胡慧红 | Flat pasting equipment for wafer photoetching development |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6149379A (en) * | 1998-01-13 | 2000-11-21 | Samsung Electronics Co., Ltd. | Wafer transfer method using a serial number detecting device in semiconductor fabricating equipment |
| CN101060093A (en) * | 2006-04-19 | 2007-10-24 | 东京毅力科创株式会社 | Substrate transportation and processing apparatus |
| CN102502253A (en) * | 2011-11-18 | 2012-06-20 | 北京七星华创电子股份有限公司 | Conveying system for wafer-shaped object |
| CN204067322U (en) * | 2013-10-16 | 2014-12-31 | 应用材料意大利有限公司 | Wafer transport machine system |
-
2017
- 2017-03-02 CN CN201710119260.4A patent/CN106910702B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6149379A (en) * | 1998-01-13 | 2000-11-21 | Samsung Electronics Co., Ltd. | Wafer transfer method using a serial number detecting device in semiconductor fabricating equipment |
| CN101060093A (en) * | 2006-04-19 | 2007-10-24 | 东京毅力科创株式会社 | Substrate transportation and processing apparatus |
| CN102502253A (en) * | 2011-11-18 | 2012-06-20 | 北京七星华创电子股份有限公司 | Conveying system for wafer-shaped object |
| CN204067322U (en) * | 2013-10-16 | 2014-12-31 | 应用材料意大利有限公司 | Wafer transport machine system |
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| Publication number | Publication date |
|---|---|
| CN106910702A (en) | 2017-06-30 |
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