CN106900162A - Radiator structure - Google Patents
Radiator structure Download PDFInfo
- Publication number
- CN106900162A CN106900162A CN201510962139.9A CN201510962139A CN106900162A CN 106900162 A CN106900162 A CN 106900162A CN 201510962139 A CN201510962139 A CN 201510962139A CN 106900162 A CN106900162 A CN 106900162A
- Authority
- CN
- China
- Prior art keywords
- groove
- layer
- phase
- radiator structure
- change material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of radiator structure, including evaporation ends, steam pipe, condensation end and liquid pipe, the evaporation ends, steam pipe, condenser pipe and liquid pipe join end to end and are interconnected and form heat-radiation loop successively, circulation has the first phase-change material in the heat-radiation loop, it is characterized in that, the condensation end is provided with the second phase-change material, and second phase-change material is isolated from each other with first phase-change material.
Description
Technical field
The present invention relates to a kind of radiator structure.
Background technology
As process chip develops towards high frequency, high integration direction, display develops towards pixel ratio direction high, and the heat dissipation problem for being equipped with the electronic equipment of Electrosurgical treatment equipment and pixel ratio display high is increasingly highlighted.In the past, electronic equipment was radiated using graphite heat radiation fin more than industry.Recently, also have using liquid-cooling heat radiation.However, either using graphite heat radiation fin or liquid-cooling heat radiation, due to being to carry out heat exchange by diffusion way and the external world, radiating efficiency is not high, and radiating effect is undesirable.
The content of the invention
In view of this, it is necessary to which a kind of radiator structure that can solve the problem that above-mentioned technical problem is provided.
A kind of radiator structure, including evaporation ends, steam pipe, condensation end and liquid pipe.The evaporation ends, steam pipe, condenser pipe and liquid pipe join end to end and are interconnected and form heat-radiation loop successively.Circulation has the first phase-change material in the heat-radiation loop.The condensation end is provided with the second phase-change material.Second phase-change material is isolated from each other with first phase-change material.
Compared to prior art, the radiator structure that the present invention is provided can absorb substantial amounts of heat, and then improve radiating efficiency due to being provided with the second phase-change material being isolated from each other with first phase-change material in the condensation end.
Brief description of the drawings
The schematic perspective view of the radiator structure that Fig. 1 is provided for first embodiment of the invention.
Fig. 2 is the top view of the radiator structure of Fig. 1.
Fig. 3 is the generalized section along Fig. 2 III-III lines.
Fig. 4 is the generalized section along Fig. 2 line VI -- VIs.
Fig. 5 is the generalized section along Fig. 2 IV-IV lines.
Fig. 6 is the generalized section along Fig. 2 V-V lines.
Fig. 7 is the schematic diagram of the radiator structure that second embodiment of the invention is provided.
Main element symbol description
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
The radiator structure that the present invention is provided is described further with reference to specific embodiment.
Fig. 1, Fig. 2 and Fig. 5 are referred to, the radiator structure 100 that first embodiment of the invention is provided includes evaporation ends 10, steam pipe 20, condensation end 30 and liquid pipe 40.The steam pipe 20 and liquid pipe 40 are connected between the evaporation ends 10 and the condensation end 30.In present embodiment, the steam pipe 20 and the interval setting of the liquid pipe 40 and separated from one another.The evaporation ends 10, the steam pipe 20, the condensation end 30 and the liquid pipe 40 join end to end and are interconnected and form the heat-radiation loop of closure successively.Circulation has the first phase-change material 101 in the heat-radiation loop.In present embodiment, the radiator structure 100 is made of substrate of flexible circuit board.First phase-change material 101 is water, alcohol etc..
Fig. 3 is referred to, in present embodiment, the evaporation ends 10 are three-decker, including ground floor 11, the second layer 12 and third layer 13.The second layer 12 is folded between the ground floor 11 and third layer 13.The ground floor 11, the second layer 12 and third layer 13 are made of metal material.The evaporation ends 10 are contacted with thermal source.
The ground floor 11 includes bottom surface 111.From the bottom surface 111 a plurality of first groove 112 is formed with to the etched inside of the ground floor 11.In present embodiment, a plurality of first groove 112 is interconnected.
The second layer 12 includes opposite top surface 121 and bottom surface 122.The top surface 121 is oppositely arranged with the bottom surface 111 of the ground floor 11.In present embodiment, the second layer 12 is formed with a plurality of second groove 123 from the top surface 121 and the bottom surface 122 to the etched inside of the second layer 12 respectively.The second groove 123 of the opposite both sides of the second layer 12 is spaced.In present embodiment, the second layer 12 is further opened with through hole 124.The second groove 123 of the opposite both sides of the second layer 12 is interconnected by the through hole 124.In other embodiment, the network that the second groove 123 and the through hole 124 of the opposite both sides of the second layer 12 can be by being interconnected and through the second layers 12 replaces.
The third layer 13 includes top surface 131.The top surface 131 is oppositely arranged with the bottom surface 122 of the second layer.From the top surface 131 a plurality of 3rd groove 132 is formed to the etched inside of the third layer 13.In present embodiment, a plurality of 3rd groove 132 is interconnected, and is corresponded with a plurality of first groove 112.
The ground floor 11, the second layer 12 and third layer 13 are bonded by viscose glue 14.The first groove 112 is oppositely arranged with the second groove 123 of the top surface 121 of the second layer 12.3rd groove 132 is oppositely arranged with the second groove 123 of the bottom surface 122 of the second layer 12.In present embodiment, the 3rd groove 132 is interconnected by the through hole 124 with the first groove 112.3rd groove 132, the second groove 123, the through hole 124 and the first groove 112 surround a vaporization space 15.In present embodiment, the 3rd groove 132, the second groove 123, the through hole 124 and the first groove 112 are connected because the second layer 12 offers through hole 124, capillary force can be lifted, increase the power of liquid backflow, promote liquid backflow.
Also referring to Fig. 1, Fig. 2 and Fig. 4, the steam pipe 20 is connected with the evaporation ends 10.In present embodiment, the steam pipe 20 is double-layer structure, including the top layer 21 and bottom 22 being oppositely arranged.
The top layer 21 includes lower surface 211.From the lower surface 211 at least one top layer groove 212 is formed to the etched inside of the top layer 21.In present embodiment, a top layer groove 212 is formed from 211 etched insides of the top layer 21 of the lower surface.Multiple top layer grooves 2121 are formed with the bottom etching of the top layer groove 212.The top layer groove 212 and the top layer groove 2121 are along the axially arranged of the top layer 21.
The bottom 22 includes upper surface 221.The upper surface 221 is oppositely arranged with the lower surface 211 of the top layer 21.From the upper surface 221 bottom groove 222 is formed with to the etched inside of the bottom 22.The bottom groove 222 is corresponding with the top layer groove 212.Multiple bottom grooves 2221 are formed with the bottom etching of the bottom groove 222.The bottom groove 222 and the bottom groove 2221 are along the axially arranged of the bottom 22.In present embodiment, the bottom groove 2221 is corresponded with the top layer groove 2121.
The top layer 21 is bonded with the bottom 22 by viscose glue 23.The top layer groove 212 is oppositely arranged with the bottom groove 222.The top layer groove 212 surrounds steam passage 24 with the bottom groove 222.One end of the steam passage 24 connects with the vaporization space 15.
Also referring to Fig. 1, Fig. 2 and Fig. 5, the condensation end 30 is connected with the other end of the steam passage 24.In present embodiment, the condensation end 30 is three-decker, including top exterior layer 31, internal layer 32 and bottom exterior layer 33.The internal layer 32 is folded between the top exterior layer 31 and the bottom exterior layer 33.
The top exterior layer 31 includes lower surface 311.From the lower surface 311 an outer layer groove 312 is internally formed to the top exterior layer 31.
The internal layer 32 includes opposite top surface 321 and bottom surface 322.The top surface 321 is oppositely arranged with the lower surface 311 of the top exterior layer 31.From the top surface 321 an internal layer groove 323 corresponding with the outer layer groove 312 has been internally formed to the internal layer 32.From the bottom surface 322 internal layer groove 324 has been internally formed to the internal layer 32.The internal layer groove 324 is disposed opposite to each other with the internal layer groove 323.
The bottom exterior layer 33 includes upper surface 331.The upper surface 331 is oppositely arranged with the bottom surface 322 of the internal layer 32.From the upper surface 331 outer layer groove 332 is internally formed to the bottom exterior layer 33.The outer layer groove 332 is corresponding with the internal layer groove 324.
The top exterior layer 31, internal layer 32 and bottom exterior layer 33 are bonded by viscose glue 34.The outer layer groove 312 is oppositely arranged with the internal layer groove 323, and surrounds a closed receiving space 35.The receiving space 35 contains the second phase-change material 36.In present embodiment, second phase-change material 36 is different from first phase-change material 101, and second phase-change material 36 has faster radiating efficiency than first phase-change material 101.Second phase-change material 36 can be wax etc..Substantially 30 ~ 40 DEG C of the temperature range that second phase-change material 36 undergoes phase transition.The outer layer groove 332 is oppositely arranged with the internal layer groove 324, and surrounds a liquefaction space 37.The liquefaction space 37 is isolated from each other with the receiving space 35.First phase-change material is mutually isolated with second phase-change material 36.The one end of the one end in the liquefaction space 37 with the steam passage 24 away from the evaporation ends 10 is interconnected.In present embodiment, the S-type setting in the liquefaction space 37, with increasing heat radiation area, accelerates rate of heat dispation.
Also referring to Fig. 1, Fig. 2 and Fig. 6, in present embodiment, the liquid pipe 40 is double-layer structure, including the top layer 41 and bottom 42 being oppositely arranged.
The top layer 41 includes lower surface 411.From the lower surface 411 at least one top layer groove 412 is formed to the etched inside of the top layer 21.In present embodiment, a top layer groove 412 is formed from 411 etched insides of the top layer 41 of the lower surface.Multiple top layer grooves 4121 are formed with the bottom etching of the top layer groove 412.The top layer groove 412 and the top layer groove 4121 are along the axially arranged of the top layer 41.
The bottom 42 includes upper surface 421.The upper surface 421 is oppositely arranged with the lower surface 411 of the top layer 41.From the upper surface 421 bottom groove 422 is formed with to the etched inside of the bottom 42.The bottom groove 422 is corresponding with the top layer groove 412.Multiple bottom grooves 4221 are formed with the bottom etching of the bottom groove 4121.The bottom groove 421 and the bottom groove 4221 are along the axially arranged of the bottom 42.In present embodiment, the bottom groove 4221 is corresponded with the top layer groove 4121.
The top layer 41 is bonded with the bottom 42 by viscose glue 43.The top layer groove 412 is oppositely arranged with the bottom groove 422.The top layer groove 412 surrounds a fluid passage 44 with the bottom groove 422.The two ends of the fluid passage 44 connect with the vaporization space 15 and the liquefaction space 37 away from one end of the steam passage 24 respectively.In present embodiment, the top layer groove 4121 of the liquid pipe 40 and the density of bottom groove 4221 are more than the top layer groove 2121 of the steam pipe 20 and the density of bottom groove 2221, to lift capillary force, first phase-change material 101 after the condensation end 30 liquefies is set smoothly to be back to the evaporation ends 10.Further to lift the reflowing result of the first phase-change material 101, in present embodiment, the second layer 12 of the evaporation ends 10 extends partially into the fluid passage 44.
During work, first phase-change material 101 absorbs heat and is vaporizated into steam in the evaporation ends 10, steam is transmitted to the condensation end 30 along the steam pipe 20, in the condensation end 30, steam release heat liquefaction is liquid, liquid is back to the evaporation ends 10 along the liquid pipe 40, so moves in circles.
It is appreciated that, in other embodiment, further to lift capillary force, can be to the top layer groove 212 of the steam pipe 20, top layer groove 2121, bottom groove 222 and bottom groove 2221, and the surface of the top layer groove 412 of the liquid pipe 40, top layer groove 4121, bottom groove 422 and bottom groove 2221 carries out brown treatment.
Refer to Fig. 7, the radiator structure 200 that second embodiment of the invention is provided is roughly the same with the radiator structure 100 that first embodiment of the invention is provided, its difference is that the radiator structure 200 includes two evaporation ends 50, and the structure of the evaporation ends 50 is identical with the structure of the evaporation ends 10；The steam pipe 60 has Liang Ge steam pipes branch 61 away from one end of the condensation end 70, the connection corresponding with evaporation ends 50 of each described steam pipe branch 61；The liquid pipe 80 has Liang Ge liquid pipes branch 81 away from one end of the condensation end 70, the connection corresponding with evaporation ends 50 of each liquid pipe branch 81.Radiator structure 200 described in present embodiment radiates to two thermals source simultaneously.
It is appreciated that, in other embodiment, the radiator structure 200 may also comprise multiple evaporation ends 50, and the steam pipe 60 and liquid pipe 80 include multiple branches respectively away from one end of the condensation end 70, and the steam pipe branch 61 and liquid pipe branch 71 correspond with the evaporation ends 50 and be interconnected.
Compared to prior art, the radiator structure that the present invention is provided can absorb substantial amounts of heat, and then improve radiating efficiency due to being provided with the second phase-change material being isolated from each other with first phase-change material in the condensation end.Further, since the steam pipe is separated with liquid pipe, more multi-phase change material can be set in heat-radiation loop, back-flow velocity is lifted, accelerate radiating rate, and can be to the electronic equipment Homogeneouslly-radiating with the radiator structure.
It is understood that for the person of ordinary skill of the art, other various corresponding changes and deformation can be made with technology according to the present invention design, and all these changes and deformation should all belong to the protection domain of the claims in the present invention.
Claims (11)
1. a kind of radiator structure, including evaporation ends, steam pipe, condensation end and liquid pipe, the evaporation ends, steam pipe, condenser pipe and liquid pipe join end to end and are interconnected and form heat-radiation loop successively, circulation has the first phase-change material in the heat-radiation loop, it is characterized in that, the condensation end is provided with the second phase-change material, and second phase-change material is isolated from each other with first phase-change material.
2. radiator structure as claimed in claim 1, it is characterized in that, the condensation end includes top exterior layer and internal layer, the top exterior layer offers outer layer groove, the internal layer offers internal layer groove corresponding with the outer layer groove, the outer layer groove is oppositely arranged to form closed receiving space with the internal layer groove, and second phase-change material is arranged in the receiving space.
3. radiator structure as claimed in claim 2, it is characterized in that, the condensation end also includes bottom exterior layer, the bottom exterior layer offers outer layer groove, the internal layer offers internal layer groove away from the side of the internal layer groove, the outer layer groove is correspondingly arranged with the internal layer groove and surrounds liquefaction space, and liquefaction space two ends connect with the steam pipe and the liquid pipe respectively.
4. radiator structure as claimed in claim 3, it is characterised in that the S-type setting in liquefaction space.
5. radiator structure as claimed in claim 1, it is characterised in that the steam pipe is separated from one another with the liquid pipe.
6. radiator structure as claimed in claim 1, it is characterised in that the temperature range that second phase-change material undergoes phase transition is 30 ~ 40 DEG C.
7. radiator structure as claimed in claim 1, it is characterized in that, the evaporation ends include ground floor, the second layer and third layer, the second layer are folded between the ground floor and third layer, and the ground floor offers interconnected first groove, the third layer offers the 3rd interconnected groove, the first groove is oppositely arranged with the second layer, and the 3rd groove is oppositely arranged with the second layer, and the first groove is interconnected with the 3rd groove and forms vaporization space.
8. radiator structure as claimed in claim 7, it is characterized in that, the opposite both sides of the second layer offer second layer groove, the second layer groove is oppositely arranged with the first groove and the 3rd groove respectively, the second layer is further opened with through hole, and the first groove, second groove and the 3rd groove are interconnected by the through hole.
9. radiator structure as claimed in claim 8, it is characterised in that the second layer is extended into the liquid pipe.
10. radiator structure as claimed in claim 7, it is characterised in that the second layer is formed with and is interconnected and through the network of the second layer, and the first groove and the 3rd groove are interconnected by the network.
A kind of 11. radiator structures, including evaporation ends, steam pipe, condensation end and liquid pipe, the evaporation ends, steam pipe, condenser pipe and liquid pipe join end to end and are interconnected and form heat-radiation loop successively, circulation has the first phase-change material in the heat-radiation loop, characterized in that, the steam pipe and the liquid pipe interval setting and separated from one another.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510962139.9A CN106900162A (en) | 2015-12-21 | 2015-12-21 | Radiator structure |
| TW104143939A TW201723408A (en) | 2015-12-21 | 2015-12-28 | Heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510962139.9A CN106900162A (en) | 2015-12-21 | 2015-12-21 | Radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106900162A true CN106900162A (en) | 2017-06-27 |
Family
ID=59190507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510962139.9A Pending CN106900162A (en) | 2015-12-21 | 2015-12-21 | Radiator structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106900162A (en) |
| TW (1) | TW201723408A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107883798A (en) * | 2017-12-14 | 2018-04-06 | 广东工业大学 | A kind of data center's energy-recuperation system |
| CN110848821A (en) * | 2019-11-21 | 2020-02-28 | 青岛海尔空调器有限总公司 | Radiating component, radiator and air conditioner |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413929B (en) * | 2017-08-16 | 2020-11-24 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and method for manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101307996A (en) * | 2007-05-17 | 2008-11-19 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| US20130133871A1 (en) * | 2010-04-12 | 2013-05-30 | Thermavant Technologies Llc | Multiple Thermal Circuit Heat Spreader |
| CN103648252A (en) * | 2013-11-15 | 2014-03-19 | 深圳市禾望电气有限公司 | Cooling system for electrical device |
-
2015
- 2015-12-21 CN CN201510962139.9A patent/CN106900162A/en active Pending
- 2015-12-28 TW TW104143939A patent/TW201723408A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101307996A (en) * | 2007-05-17 | 2008-11-19 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| US20130133871A1 (en) * | 2010-04-12 | 2013-05-30 | Thermavant Technologies Llc | Multiple Thermal Circuit Heat Spreader |
| CN103648252A (en) * | 2013-11-15 | 2014-03-19 | 深圳市禾望电气有限公司 | Cooling system for electrical device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107883798A (en) * | 2017-12-14 | 2018-04-06 | 广东工业大学 | A kind of data center's energy-recuperation system |
| WO2019114789A1 (en) * | 2017-12-14 | 2019-06-20 | 广东工业大学 | Data center energy recovery system |
| CN110848821A (en) * | 2019-11-21 | 2020-02-28 | 青岛海尔空调器有限总公司 | Radiating component, radiator and air conditioner |
| CN110848821B (en) * | 2019-11-21 | 2023-10-20 | 青岛海尔空调器有限总公司 | Heat radiation member, heat radiator and air conditioner |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201723408A (en) | 2017-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9583415B2 (en) | Packages with thermal interface material on the sidewalls of stacked dies | |
| CN108271332B (en) | Radiator | |
| CN101932221B (en) | Radiating device | |
| US10631435B2 (en) | Heat dissipation assembly | |
| US9875953B2 (en) | Interlayer chip cooling apparatus | |
| CN106900162A (en) | Radiator structure | |
| WO2018153111A1 (en) | Connected body vapour chamber heat sink and electronic device | |
| CN205748068U (en) | Stagewise composite construction flat late heat transfer pipe | |
| EP1708261B1 (en) | Heat pipe radiator for a heat-generating component | |
| CN104112736B (en) | 3D IC with the complicated microchannel fluid cooling of interlayer | |
| TWM517315U (en) | Heat dissipating unit | |
| CN204388671U (en) | A kind of NEW TYPE OF COMPOSITE capillary wick plume | |
| JP6327029B2 (en) | LAMINATED STRUCTURE HAVING INTERNAL COMMUNICATION SPACE AND ITS MANUFACTURING METHOD | |
| CN102646651B (en) | Thin hot plate structure | |
| DE10017971A1 (en) | Cooling device for cooling components of power electronics with a micro heat exchanger | |
| US10378836B2 (en) | Water-cooling radiator assembly | |
| CN206389664U (en) | A kind of corrugated tube type microcirculation radiator and microcirculation heat-exchange system | |
| Park et al. | Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application | |
| US8884425B1 (en) | Thermal management in 2.5 D semiconductor packaging | |
| KR20230025448A (en) | Systems and methods to improve thermal management of heat-generating components | |
| US20190154352A1 (en) | Loop heat pipe structure | |
| CN102636059B (en) | Heat pipe with compounding capillary and manufacturing method thereof | |
| Bar-Cohen | Towards embedded cooling-Gen 3 thermal packaging technology | |
| CN101754654A (en) | Heat transfer substrate and heat dissipation device provided with same | |
| CN207427681U (en) | Loop heat pipe structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170627 |