CN106887268A - Silk-screen printing circuit electrode and preparation method thereof - Google Patents
Silk-screen printing circuit electrode and preparation method thereof Download PDFInfo
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- CN106887268A CN106887268A CN201710011595.4A CN201710011595A CN106887268A CN 106887268 A CN106887268 A CN 106887268A CN 201710011595 A CN201710011595 A CN 201710011595A CN 106887268 A CN106887268 A CN 106887268A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract
The invention discloses a kind of silk-screen printing circuit electrode and preparation method thereof, it includes base material and copper alloy electric slurry, the copper alloy electric slurry is coated on base material, the copper alloy electric slurry includes conductive phase, 10~40% organic phase and 5~10% Binder Phase that percentage by weight is 50~80%, the conductive phase is the mixture of copper powder, silver powder and titanium valve, wherein, the percentage by weight of copper powder, silver powder and titanium valve is 10~90%：5~10%：5~10%.The copper that the present invention sinters the alloy to be formed and can well prevent copper alloy electric slurry in sintering process by copper alloy electric slurry is aoxidized, copper alloy electric slurry can be perfectly adhered on base material, adhesive property is good, has the advantages that cheap, easy preparation, adhesive property, solderability, tensile strength, electric conductivity are good.
Description
Technical field
The present invention relates to a kind of electrocondution slurry technical field, more particularly, to a kind of silk-screen printing circuit electrode and its preparation
Method.
Background technology
Electric slurry is a kind of new material, compared to other traditional circuit equipment have efficiently, environmental protection, energy-conservation, it is low into
This features such as, solar cell, space flight and aviation, sensing element, resistor network, display, lithium-ion electric have been widely used in it
The technical fields such as the electrode material in pond.
Electric slurry is mixed into uniform paste by conductive phase, Binder Phase, organic phase by three-roll rolling, on substrate
It is several microns of film layers to some tens of pm to form thickness by printing-sintering technology, can be used as manufacturing the base of various electronic components
Plinth material；Wherein, conductive phase is various metal dusts, and Binder Phase is various glass and oxide powder, and organic phase is have airborne
Body or organic bond, it includes thickener, solvent, dispersant and thixotropic agent.
In recent decades, Precious Metal, such as production technology such as Ag conductor pastes are quite ripe and obtain extensively should
With；Cheap metal slurry, such as Ni, Al, Cu, Zn slurry are not sent out well due to its electric conductivity, inoxidizability limitation
Exhibition.Copper with the only choosing that its high conductivity and cheap performance are the electric slurry conductive phases for being only second to Ag, but but because its
Easily oxidizable is restricted.
The content of the invention
Based on this, it is necessary in view of the shortcomings of the prior art, there is provided there is one kind high conduction performance to be not easy to oxidation simultaneously
Silk-screen printing circuit electrode and preparation method thereof.
In order to solve the above technical problems, the technical solution adopted in the present invention is：A kind of silk-screen printing circuit electrode, including
Base material and copper alloy electric slurry, the copper alloy electric slurry are coated on base material, and the copper alloy electric slurry includes weight
Amount percentage is 50~80% conductive phase, 10~40% organic phase and 5~10% Binder Phase, and the conductive phase is copper
The mixture of powder, silver powder and titanium valve, wherein, the percentage by weight of copper powder, silver powder and titanium valve is 10~90%：5~10%：5~
10%.
A kind of preparation method of silk-screen printing circuit electrode, it is characterised in that comprise the following steps：
(1) conductive phase, is prepared：According to percentage by weight by 10~90% copper powder, 5~10% silver powder and 5~10%
Titanium valve carry out proportioning mixing, obtain final product conductive phase；
(2) Binder Phase, is prepared：According to weight than 0~20：0~20：60~80 respectively by zinc-aluminium-silica glass powder, titanium-
Aluminium-silica glass powder and conductive crystallite glass dust are mixed at a temperature of being less than 300 DEG C, obtain final product Binder Phase；
(3) organic phase, is prepared：By weight percentage by 10~20% thickener, 75~80% organic solvent, 5~
15% dispersant and 0~10% thixotropic agent are mixed, and obtain final product organic phase；
(4) blister copper alloy electric slurry, is prepared：By the conductive phase in step (1), (2), (3), Binder Phase and organic phase warp
Agitator is obtained blister copper alloy electric slurry after being sufficiently mixed；
(5) thin copper alloy electric slurry, is prepared：Blister copper alloy electric slurry is placed in three-roll grinder and is ground
Treatment, after grinding preset times, is obtained thin copper alloy electric slurry；
(6) semi-finished product silk-screen printing circuit electrode, is prepared：Obtained copper alloy electric slurry is printed by screen process press
Brush is obtained screen printing electrode or circuit on base material, obtains semi-finished product silk-screen printing circuit electrode；
(7), dumping：Semi-finished product silk-screen printing circuit electrode is carried out into dumping operation in continuous tunnel furnace；
(8), sinter：Semi-finished product silk-screen printing circuit electrode is sintered operation in continuous tunnel furnace；
(9), cool down：Open tunnel furnace door to take out semi-finished product silk-screen printing circuit electrode, cooled down rapidly with ventilating fan
To room temperature, silk-screen printing circuit electrode finished product is obtained final product.
In sum, silk-screen printing circuit electrode of the present invention and preparation method thereof sinters to be formed by copper alloy electric slurry
Alloy can well prevent copper of the copper alloy electric slurry in sintering process from aoxidizing, copper alloy electric slurry can be attached well
On base material, adhesive property is good, good with cheap, easy preparation, adhesive property, solderability, tensile strength, electric conductivity
The advantages of.
Specific embodiment
It is specific purposes, the function that can further appreciate that feature of the invention, technological means and reached, with reference to
Specific embodiment is described in further detail to the present invention.
Silk-screen printing circuit electrode of the present invention includes base material and copper alloy electric slurry, and the copper alloy electric slurry is coated
On base material, the copper alloy electric slurry includes conductive phase, 10~40% organic phase that percentage by weight is 50~80%
And 5~10% Binder Phase, the conductive phase for copper powder, silver powder and titanium valve mixture, wherein, copper powder, silver powder and titanium valve
Percentage by weight is 10~90%：5~10%：5~10%, the particle diameter of the copper powder is nanoscale or micron order；The bonding
Mutually for zinc-aluminium-silica glass powder, titanium-aluminium-silica glass powder and conductive crystallite glass dust mixture, the zinc-aluminium-silica glass powder,
The particle size range of titanium-aluminium-silica glass powder and conductive crystallite glass dust is 1~10 μm.
The organic phase include thickener, organic solvent, thixotropic agent and dispersant, wherein, thickener, organic solvent, point
The percentage by weight of powder and thixotropic agent is 10~20%：75~80%：5~15%：0~10%, the thickener is ethyl
At least one in cellulose, NC Nitroncellulose, butyral resin, the organic solvent is terpinol, butyl click pyrrole alcohol, citric acid
At least one in tributyl, the thixotropic agent is castor oil, and the dispersant is oleic acid.
According to the invention described above silk-screen printing circuit electrode, the present invention provides a kind of preparation side of silk-screen printing circuit electrode
Method, the technical characteristic that the copper alloy electric slurry being related in the method can be illustrated with above-mentioned silk-screen printing circuit electrode embodiment
It is identical, and identical technique effect can be produced.The preparation method of silk-screen printing circuit electrode of the present invention is starched by copper alloy electronics
The copper that the alloy that material sintering is formed can well prevent copper alloy electric slurry in sintering process is aoxidized；Copper alloy of the invention
Electric slurry can be perfectly adhered on base material, and adhesive property is good；Copper alloy electric slurry of the invention can apply to very well
The printing of circuit and the printing of electrode；Copper alloy electric slurry of the invention have it is cheap, easily preparation, adhesive property, solderability,
The advantages of tensile strength, good electric conductivity.
The preparation method of silk-screen printing circuit electrode of the present invention, comprises the following steps：
(1) conductive phase, is prepared：According to percentage by weight by 10~90% copper powder, 5~10% silver powder and 5~10%
Titanium valve carry out proportioning mixing, obtain final product conductive phase, wherein, copper powder size value range be nanoscale or micron order；
(2) Binder Phase, is prepared：According to weight than 0~20：0~20：60~80 respectively by zinc-aluminium-silica glass powder, titanium-
Aluminium-silica glass powder and conductive crystallite glass dust are mixed at a temperature of being less than 300 DEG C, obtain final product Binder Phase, wherein, zinc-aluminium-silicon glass
The particle size range of glass powder, titanium-aluminium-silica glass powder and conductive crystallite glass dust is 1~10 μm；
(3) organic phase, is prepared：By weight percentage by 10~20% thickener, 75~80% organic solvent, 5~
15% dispersant and 0~10% thixotropic agent are mixed, and obtain final product organic phase, wherein, the thickener be ethyl cellulose,
At least one in NC Nitroncellulose, butyral resin, the organic solvent is terpinol, butyl click pyrrole alcohol, ATBC
In at least one, the thixotropic agent be castor oil, the dispersant be oleic acid；
(4) blister copper alloy electric slurry, is prepared：By the conductive phase in step (1), (2), (3), Binder Phase and organic phase warp
Agitator is obtained blister copper alloy electric slurry after being sufficiently mixed；
(5) thin copper alloy electric slurry, is prepared：Blister copper alloy electric slurry is placed in three-roll grinder and is ground
Treatment, after grinding preset times, is obtained thin copper alloy electric slurry, wherein, the milling gap of three-roll grinder is respectively set as
10~15 μm and 5~10 μm, preset times are 3 times；
(6) semi-finished product silk-screen printing circuit electrode, is prepared：Obtained copper alloy electric slurry is printed by screen process press
Brush is obtained screen printing electrode or circuit on base material, obtains semi-finished product silk-screen printing circuit electrode；
(7), dumping：Semi-finished product silk-screen printing circuit electrode is carried out into dumping operation in continuous tunnel furnace, is led in continuous tunnel furnace
Nitrogen excludes air, and the oxygen content in continuous tunnel furnace is reduced into 1~10%, and it is 200~300 to set the temperature value in continuous tunnel furnace
DEG C, dumping activity time is 10~15min；
(8), sinter：Semi-finished product silk-screen printing circuit electrode is sintered operation in continuous tunnel furnace, to being taken out in continuous tunnel furnace
Vacuum and logical nitrogen, control oxygen content for 10~50ppm, and it is 400~600 DEG C to set the sintered heat insulating temperature in continuous tunnel furnace,
Wherein, the programming rate in continuous tunnel furnace is set as 10~15 DEG C/min, and the heating-up time is set as 40~60min, during sintered heat insulating
Between be set as 10~15min；
(9), cool down：Open tunnel furnace door to take out semi-finished product silk-screen printing circuit electrode, cooled down rapidly with ventilating fan
To room temperature, cool time is not higher than 10min, obtains final product silk-screen printing circuit electrode finished product.
Silk-screen printing circuit electrode after being sintered through continuous tunnel furnace is in glassy yellow, has carried out electric conductivity, tension to its performance strong
Degree, solderability, metallographic pattern, air inoxidizability dependence test, as a result show：Copper alloy electric slurry is in substrate surface shape
Into two electrodes, the film layer of three electrodes, each performance indications are all good, reach industrial application requirement, and specific embodiment is as follows：
Embodiment one
It is spherical silver powder, the spherical titanium that 10g granularities are 1um of the spherical copper powder of 1um, 10g granularities for 1um to take 80g granularities
Powder obtains 100g conduction phase mixtures；300 DEG C of Low Temperature Zn-aluminium-silica glass powder, titanium-aluminium-silica glass powder and conductive crystallite glass dust
1000 mesh sieves are crossed respectively, the lower glass dust of sieve is taken, and 1g zinc-aluminium-silica glass powder, 1g titanium-aluminium-silica glass powder, 8g conductions are taken respectively micro-
Crystal glass powder is mutually mixed and obtains 10g bonding phase mixtures；Take 1g butyral resins, 8g terpinols, 0.5g castor oil, 0.5g oleic acid
It is mutually mixed and heating water bath is to whole dissolvings, 100g organic phase solutions is obtained；Take 80gA, 10gB, 10gC mixing, agitated device
Stirring 2h, grinds through three-roll grinder, and grinding space is 10um and 5um, repeatedly 3 times.Copper alloy slurry is obtained, using metatitanic acid
Strontium piezoresistor will print electrode in continuous tunnel furnace dumping for base material in silk screen brush electrode, then through continuous tunnel furnace；Dumping process：Logical nitrogen
Gas excludes air to oxygen content 1%；Gas moves in circles mixing in continuous tunnel furnace；250 DEG C of dump temperature；The dumping time from enter stove to
Come out of the stove 15min；Above-mentioned printing electrode is sintered again in continuous tunnel furnace；Sintering process：Vacuumize same nitrogen control oxygen content
10ppm；Gas moves in circles in continuous tunnel furnace and is used in mixed way；600 DEG C of sintering temperature；15 DEG C/min of programming rate；Heating-up time
40min；Sintered heat insulating time 15min；Blow-on door and ventilating fan are rapidly cooled to room temperature；Cool time 5min, is obtained product warp
Cross and detect qualified, as shown in table 1, prepared copper electrode and circuit material are qualified by detection, and specific data are shown in Table one for specific data.
Embodiment two
The spherical copper powder of 80g granularities 1um, the spherical silver powder of 5g granularities 1um, the spherical titanium valve of 15g granularities 1um is taken to obtain
100g conduction phase mixtures；300 DEG C of Low Temperature Zn-aluminium-silica glass powder, titanium-aluminium-silica glass powder and conductive crystallite glass dust cross 1000
Mesh sieve, takes the lower glass dust of sieve, and 1g zinc-aluminium-silica glass powder, 1g titanium-aluminium-silica glass powder, 8g conductive crystallite glass dust phases are taken respectively
Mutually it is mixed to get 10g and bonds phase mixture；1g butyral resins, 8g terpinols, 0.5g castor oil, 0.5g oleic acid are taken, is mutually mixed
And heating water bath is to whole dissolvings, 10g organic phase solutions are obtained；80gA, 10gB, 10gC mixing are taken, after agitated device stirring 2h,
Ground through three-roll grinder again, grind space 10um and 5um, repeatedly 3 times.Copper alloy slurry is obtained, it is pressure-sensitive using strontium titanates
Resistor will print electrode in continuous tunnel furnace dumping for base material in silk screen brush electrode, then through continuous tunnel furnace；Dumping process：Logical nitrogen is excluded
To oxygen content 1%, gas moves in circles mixing air in continuous tunnel furnace；250 DEG C of dump temperature；The dumping time is from entering stove to coming out of the stove
15min；Above-mentioned printing electrode is sintered again in continuous tunnel furnace；Sintering process：Vacuumize same nitrogen control oxygen content 10ppm；Gas
Body moves in circles in continuous tunnel furnace and is used in mixed way；600 DEG C of sintering temperature；15 DEG C/min of programming rate；Heating-up time 40min；Sintering
Soaking time 15min；Blow-on door and ventilating fan are rapidly cooled to room temperature；Cool time 5min, prepared product is qualified by detection,
As shown in table 1, prepared copper electrode and circuit material are qualified by detection, and specific data are shown in Table one for specific data.
Embodiment three
The spherical copper powder of 80g granularities 3um is taken, the spherical silver powder of 15g granularities 1um, the spherical titanium valve of 5g granularities 1um are obtained
100g conduction phase mixtures；300 DEG C of Low Temperature Zn-aluminium-silica glass powder, titanium-aluminium-silica glass powder and conductive crystallite glass dust cross 1000
Mesh sieve, takes the lower glass dust of sieve, and 1g zinc-aluminium-silica glass powder, 1g titanium-aluminium-silica glass powder, 8g conductive crystallite glass dust phases are taken respectively
Mutually it is mixed to get 10g and bonds phase mixture；1g butyral resins, 8g terpinols, 0.5g castor oil, 0.5g oleic acid are taken, is mutually mixed
And heating water bath is to whole dissolvings, 100g organic phase solutions are obtained；80gA, 10gB, 10gC mixing are taken, agitated device stirs 2h
Afterwards, then through three-roll grinder grind, grinding space is 10um and 5um, repeatedly 3 times.Copper alloy slurry is obtained, using strontium titanates
Piezoresistor will print electrode in continuous tunnel furnace dumping for base material in silk screen brush electrode, then through continuous tunnel furnace；Dumping process：Logical nitrogen
Exclude air to oxygen content 1%；Gas moves in circles mixing in continuous tunnel furnace；250 DEG C of dump temperature；The dumping time is from entering stove to going out
Stove 15min；Above-mentioned printing electrode is sintered again in continuous tunnel furnace；Sintering process：Same nitrogen control oxygen content 10ppm is vacuumized,
Gas moves in circles in continuous tunnel furnace and is used in mixed way；Sintered heat insulating temperature is 600 DEG C, 15 DEG C/min of programming rate, heating-up time
40min, sintered heat insulating time 15min；Product is rapidly cooled to room temperature cool time 5min by blow-on door and ventilating fan, is obtained and is produced
Product are qualified by detection, and specific data are as shown in Table 1.
Example IV
The spherical copper powder of 80g granularities 1um, the spherical silver powder of 10g granularities 1um, the spherical titanium valve of 10g granularities 1um is taken to obtain
100g conduction phase mixtures；300 DEG C of Low Temperature Zn-aluminium-silica glass powder, titanium-aluminium-silica glass powder and conductive crystallite glass dust cross 1000
Mesh sieve, takes the lower glass dust of sieve, and 1g zinc-aluminium-silica glass powder, 1g titanium-aluminium-silica glass powder, 8g conductive crystallite glass dust phases are taken respectively
Mutually it is mixed to get 10g and bonds phase mixture；2g ethyl celluloses, 7g terpinols, 0.5g castor oil, 0.5g oleic acid are taken, it is mutually mixed
Merge heating water bath to whole dissolvings, 100g organic phase solutions are obtained；80gA, 10gB, 10gC mixing are taken, agitated device stirs 2h
Afterwards, then through three-roll grinder grind, grinding space is 10um and 5um, repeatedly 3 times.Copper alloy slurry is obtained, using strontium titanates
Piezoresistor will print electrode in continuous tunnel furnace dumping for base material in silk screen brush electrode, then through continuous tunnel furnace；Dumping process：Logical nitrogen
Air is excluded to oxygen content 1%, gas moves in circles mixing in continuous tunnel furnace；250 DEG C of dump temperature；The dumping time is from entering stove to going out
Stove 15min；Above-mentioned printing electrode is sintered again in continuous tunnel furnace；Sintering process：Same nitrogen control oxygen content 10ppm is vacuumized,
Gas moves in circles in continuous tunnel furnace and is used in mixed way；Sintered heat insulating temperature is 600 DEG C, 15 DEG C/min of programming rate, heating-up time
40min；Sintered heat insulating time 15min；Product is rapidly cooled to room temperature cool time 5min by blow-on door and ventilating fan, is obtained and is produced
Product are qualified by detection, and specific data are as shown in Table 1.
The copper alloy electric slurry of table one forms electric conductivity, thickness and the tensile strength properties of three electrode film layers in substrate surface
Wherein, E10 is the magnitude of voltage that logical 10V voltages reflect on three electrodes, the good critical field of electric conductivity
For：Higher limit 6.60V, lower limit 4.00V.
In sum, silk-screen printing circuit electrode of the present invention and preparation method thereof sinters to be formed by copper alloy electric slurry
Alloy can well prevent copper of the copper alloy electric slurry in sintering process from aoxidizing, copper alloy electric slurry can be attached well
On base material, adhesive property is good, good with cheap, easy preparation, adhesive property, solderability, tensile strength, electric conductivity
The advantages of.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Therefore limitation of the scope of the invention can not be interpreted as.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
Enclose.Therefore, protection scope of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of silk-screen printing circuit electrode, it is characterised in that：Including base material and copper alloy electric slurry, the copper alloy electronics
Slurry is coated on base material, and the copper alloy electric slurry includes conductive phase, 10~40% that percentage by weight is 50~80%
Organic phase and 5~10% Binder Phase, the conductive phase for copper powder, silver powder and titanium valve mixture, wherein, copper powder, silver powder
And the percentage by weight of titanium valve is 10~90%：5~10%：5~10%.
2. silk-screen printing circuit electrode according to claim 1, it is characterised in that：The Binder Phase is zinc-aluminium-silica glass
The mixture of powder, titanium-aluminium-silica glass powder and conductive crystallite glass dust.
3. silk-screen printing circuit electrode according to claim 2, it is characterised in that：Zinc-aluminium-silica glass the powder, titanium-
The particle size range of aluminium-silica glass powder and conductive crystallite glass dust is 1~10 μm.
4. silk-screen printing circuit electrode according to claim 1, it is characterised in that：The organic phase includes thickener, has
Machine solvent, thixotropic agent and dispersant, wherein, the percentage by weight of thickener, organic solvent, dispersant and thixotropic agent for 10~
20%：75~80%：5~15%：0~10%.
5. silk-screen printing circuit electrode according to claim 4, it is characterised in that：The thickener be ethyl cellulose,
At least one in NC Nitroncellulose, butyral resin.
6. silk-screen printing circuit electrode according to claim 4, it is characterised in that：The organic solvent is terpinol, fourth
At least one in base click pyrrole alcohol, ATBC.
7. silk-screen printing circuit electrode according to claim 1, it is characterised in that：The particle diameter of the copper powder be nanoscale or
Micron order.
8. a kind of preparation method of silk-screen printing circuit electrode as described in any one of claim 1~7, it is characterised in that bag
Include following steps：
(1) conductive phase, is prepared：According to percentage by weight by 10~90% copper powder, 5~10% silver powder and 5~10% titanium
Powder carries out proportioning mixing, obtains final product conductive phase；
(2) Binder Phase, is prepared：According to weight than 0~20：0~20：60~80 respectively by zinc-aluminium-silica glass powder, titanium-aluminium-silicon
Glass dust and conductive crystallite glass dust are mixed at a temperature of being less than 300 DEG C, obtain final product Binder Phase；
(3) organic phase, is prepared：By weight percentage by 10~20% thickener, 75~80% organic solvent, 5~15%
Dispersant and 0~10% thixotropic agent mixed, obtain final product organic phase；
(4) blister copper alloy electric slurry, is prepared：Conductive phase in step (1), (2), (3), Binder Phase and organic phase is agitated
Device is obtained blister copper alloy electric slurry after being sufficiently mixed；
(5) thin copper alloy electric slurry, is prepared：Blister copper alloy electric slurry is placed in three-roll grinder and is ground place
Reason, after grinding preset times, is obtained thin copper alloy electric slurry；
(6) semi-finished product silk-screen printing circuit electrode, is prepared：Obtained copper alloy electric slurry is existed by screen printer print
Screen printing electrode or circuit are obtained on base material, semi-finished product silk-screen printing circuit electrode is obtained；
(7), dumping：Semi-finished product silk-screen printing circuit electrode is carried out into dumping operation in continuous tunnel furnace；
(8), sinter：Semi-finished product silk-screen printing circuit electrode is sintered operation in continuous tunnel furnace；
(9), cool down：Open tunnel furnace door to take out semi-finished product silk-screen printing circuit electrode, room is rapidly cooled to ventilating fan
Temperature, obtains final product silk-screen printing circuit electrode finished product.
9. a kind of preparation method of silk-screen printing circuit electrode as claimed in claim 8, it is characterised in that：The step (7)
Middle dumping operation is to lead to nitrogen in continuous tunnel furnace to exclude air, and the oxygen content in continuous tunnel furnace is reduced into 1~10%, sets tunnel
Temperature value in stove is 200~300 DEG C, and dumping activity time is 10~15min.
10. a kind of preparation method of silk-screen printing circuit electrode as claimed in claim 8, it is characterised in that：The step (8)
Middle sintering circuit is to being vacuumized in continuous tunnel furnace and leads to nitrogen, and it is 10~50ppm, the burning in setting continuous tunnel furnace to control oxygen content
Knot holding temperature is 400~600 DEG C, wherein, the programming rate in continuous tunnel furnace is set as 10~15 DEG C/min, heating-up time setting
It is 40~60min, the sintered heat insulating time is set as 10~15min.
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| CN111489865A (en) * | 2020-03-31 | 2020-08-04 | 昆明理工大学 | Preparation method of self-promoting antioxidant copper electrode |
| CN111489865B (en) * | 2020-03-31 | 2021-07-30 | 昆明理工大学 | Preparation method of self-promoting antioxidant copper electrode |
| CN111548194A (en) * | 2020-05-29 | 2020-08-18 | 南京凯泰化学科技有限公司 | Preparation method of printed circuit board |
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