CN106886325A - Contact panel and electronic installation - Google Patents
Contact panel and electronic installation Download PDFInfo
- Publication number
- CN106886325A CN106886325A CN201510943583.6A CN201510943583A CN106886325A CN 106886325 A CN106886325 A CN 106886325A CN 201510943583 A CN201510943583 A CN 201510943583A CN 106886325 A CN106886325 A CN 106886325A
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- China
- Prior art keywords
- engagement pin
- contact panel
- pin
- conducting block
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a kind of contact panel and electronic installation, wherein contact panel is included：Substrate, transparency conducting layer, metal level, coating, Anisotropically conductive material layer and flexible circuit board.Transparency conducting layer is arranged on substrate, and transparency conducting layer engages pin including touch control electrode pattern with least one.Metal level is arranged on substrate and including at least one plain conductor, and plain conductor is electrically connected with touch control electrode pattern and engages pin.Coating covers touch control electrode pattern and plain conductor.Anisotropically conductive material layer is arranged on engagement pin.Flexible circuit board includes at least one engagement pin, and engagement pin is arranged on Anisotropically conductive material layer, and is electrically connected with engagement pin by Anisotropically conductive material layer.Whereby, contact panel of the invention, conducting block can provide low-resistance conductive path.
Description
Technical field
The present invention relates to a kind of contact panel, and more particularly to a kind of metal in electric connection touch control electrode
Between wire and the engagement pin of flexible circuit board, there is provided the contact panel of low resistance path is touched with using this
Control the electronic installation of panel.
Background technology
Multiple touch control electrodes are provided with the middle of general contact panel, those touch control electrodes are by electrically conducting transparent
Made by material, and changed by the capacitance of touch control electrode and can detect the operation of touch-control.In touch-control
Those touch control electrodes can be electrically connected to multiple engagement pin (bonding by a plurality of plain conductor on panel
Pin), those engagement pins are electrically connected to the soft of touch-control IC (integrated circuit, IC)
Property circuit board is launching and receive driving and the sensing signal of touch control electrode.In some existing ways,
The material of plain conductor includes aluminium or copper, and in order to save processing step, engagement pin is typically and metal
Wire is made in the technique along with.But when reliability is tested, because metal material is perishable,
The characteristic of contact panel can jointly be influenceed.Additionally, because when contact panel is subjected to electrostatic problem, it is quiet
Electricity is understood Electro-static Driven Comb by the electrostatic discharging path of plain conductor/engagement pin to avoid buildup of static electricity from destroying
Contact panel, therefore when searching is solved to corrode and extends to the scheme of plain conductor by engagement pin, while
It is this art personnel's subject under discussion of concern to avoid electrostatic breakdown contact panel.
The content of the invention
It is an object of the invention to provide a kind of contact panel and electronic installation, conducting block can provide low resistance
Conductive path, the problem of static discharge can be improved whereby.
Embodiments of the invention propose a kind of contact panel, it include substrate, transparency conducting layer, metal level,
The engagement pin of coating, Anisotropically conductive material layer and flexible circuit board.Transparency conducting layer is disposed on base
On plate, transparency conducting layer includes touch control electrode pattern and engages pin.Metal level be disposed on substrate it
Above and comprising plain conductor, plain conductor is electrically connected with touch control electrode pattern and engages pin.Coating is then
It is covering touch control electrode pattern and plain conductor.Anisotropically conductive material layer is disposed on engagement pin.
The engagement pin of flexible circuit board is disposed on Anisotropically conductive material layer, and by the Anisotropically conductive
Material layer is electrically connected with those engagement pins.
In certain embodiments, throwing of the distance of end to the side of coating of engagement pin on substrate
Shadow length is less than 200 microns.
In certain embodiments, contact panel also include conducting block, conducting block be disposed on engagement pin it
Engagement pin is gone up and be electrically connected to, there is gap, wherein conducting block wherein between conducting block and plain conductor
Resistance coefficient less than engagement pin resistance coefficient.
In certain embodiments, conducting block belongs to metal level, and conducting block directly contact engagement pin.
In certain embodiments, coating covers at least part of conducting block.
In certain embodiments, from the normal vector of substrate, pin, conducting block is engaged and pin is engaged
It is to overlap at least in part.
In certain embodiments, conducting block directly contact engages pin or by Anisotropically conductive material layer electricity
Property connection engagement pin.
In certain embodiments, the material of conducting block includes aluminium or copper.
In certain embodiments, substrate includes active area and non-active area.Touch control electrode pattern is position
In in active area；Conducting block, Anisotropically conductive material layer with pin is engaged are located in non-active area.
Embodiments of the invention propose a kind of electronic installation, and this electronic installation includes above-mentioned contact panel.
In electronic installation set forth above and contact panel, conducting block provides low-resistance coefficient
Conductive path, can improve the problem of static discharge whereby.
It is that features described above of the invention and advantage can be become apparent, special embodiment below, and coordinate
Institute's accompanying drawings are described in detail below.
Brief description of the drawings
Fig. 1 is the contact panel schematic top plan view of first embodiment of the invention.
Fig. 2 is the profile of the tangent line AA ' of corresponding diagram of the present invention 1.
Fig. 3 a to Fig. 3 d are the electrostatic discharging path figures of different embodiments in first embodiment of the invention.
Fig. 4 is the contact panel schematic top plan view of second embodiment of the invention.
Fig. 5 is the profile of the tangent line AA ' of corresponding diagram of the present invention 4.
Fig. 6 a, Fig. 6 b are that the present invention does not have conducting block and the electrostatic discharging path figure with conducting block.
Fig. 7 a, Fig. 7 b, Fig. 7 c are the profiles of different coverings embodiment in second embodiment of the invention.
Fig. 8 is the contact panel schematic top plan view of another embodiment of second embodiment of the invention.
Fig. 9 a, Fig. 9 b are the electrostatic discharging path figures of different embodiments in second embodiment of the invention.
Figure 10 a, Figure 10 b are the electrostatic discharging path figures of different embodiments in second embodiment of the invention.
Figure 11 a, Figure 11 b, Figure 11 c, Figure 11 d are different coverings implementation in second embodiment of the invention
The profile of example.
Specific embodiment
When read in conjunction with the accompanying drawings, the implementation that the present invention may be better understood according to the following detailed description
Example.It is emphasized that the standard practice in industry, it is not drawn to come in illustrating figure
Feature, actually each feature can be arbitrarily increased or reduced.In addition, unless following especially indicate directly
Contact, can also add other features otherwise between feature and feature.
First embodiment
Fig. 1 is the schematic top plan view of the contact panel 100 of first embodiment of the invention, and Fig. 2 is corresponding diagram 1
The profile of tangent line AA '.Referring to Fig. 1 and Fig. 2, contact panel 100 includes substrate 210, base
Plate 210 includes active area (active region) 110 (also referred to as touch area) and non-active area (non-active
Region) 112 (also referred to as peripheral region).Touch control electrode 121a, 122a (also referred to as touch control electrode pattern) and a plurality of gold
Category wire 131,132 is respectively formed in active area 110 and non-active area 112, plurality of to touch
Control electrode 121a forms the first touch control electrode row 121 for extending along the Y direction by bridge part 121b,
Multiple touch control electrode 122a form the second touch control electrode for extending along the X direction by connecting portion 122b and arrange
122.First touch control electrode row 121 and second touch control electrode row 122 are spatially mutually insulated (spatially
Isolated).In the present embodiment, touch control electrode 121a is driving electrodes, and touch control electrode 122a is
Sensing electrode, but the present invention is not limited thereto, and touch control electrode 121a can also be in other embodiments
Sensing electrode, and touch control electrode 122a is driving electrodes.First touch control electrode row 121 and the second touch-control electricity
Pole row 122 are electrically connected with one end of plain conductor 131,132.Plain conductor 131,132 it is another
One end is then electrically connected with engagement pin (Bonding Pin) 140, and engaging pin 140 is led by incorgruous
Material layer (Anisotropic Conductive Film, ACF) 150 connects with the multiple of flexible circuit board 160
Pin 160a (general habit is referred to as golden finger) is closed to be electrically connected with.As shown in Fig. 2 flexible circuit board 160 is included
The flexible substrate 160b and multiple engagement pin 160a being arranged on flexible substrate 160b.Though Fig. 2
The profile that plain conductor 132 is electrically connected with engagement pin 140 is only illustrated, simply the electricity of plain conductor 131
Property connection engagement pin 140 profile it is identical with Fig. 2, therefore identical narration is not repeated.Need explanation
Though, multiple engagement pin 160a that Fig. 1 does not illustrate flexible circuit board 160 are by flexible circuit board
160 conductive trace (conductive trace) is electrically connected to the touch-control being arranged on flexible circuit board 160
Circuit element (such as touch-control IC) (not shown) or be arranged on flexible circuit board 160 be electrically connected with printing
Touch-control circuit element in circuit board (not shown), simply its by the technical field tool usually intellectual showed
Have, therefore repeat no more.As shown in the profile of Fig. 2, Anisotropically conductive material layer (Anisotropic
Conductive Film, ACF) the 150 engagement pin 160a for being provided in flexible circuit board 160 in Z-direction
With engage between pin 140, be for electrically connecting to the engagement pin 160a of flexible circuit board 160 and engage
Pin 140.Contact panel 100 also comprising be formed at touch control electrode 121a, 122a and plain conductor 131,
Coating (over coating layer) 240 on 132, the function with protection touch control electrode with plain conductor.
Coating 240 covers active area 110 and part non-active area 112, and with appearing engagement pin
140 opening 240a, so that Anisotropically conductive material layer 150 may be disposed at the top of engagement pin 140, and
And the engagement pin 160a of flexible circuit board 160 can press Anisotropically conductive material layer 150 and cause engagement pin
160a is electrically connected with engagement pin 140.In the present embodiment, the thickness of coating 240 is 1 micron to 2
Micron between, and in fig. 2 coating 240 extend beyond plain conductor 131,132 apart from OV1
Between for 10 microns to 50 microns, and preferably between 20 microns to 30 microns, but coating of the present invention 240
Thickness and coating 240 extend beyond the distance of plain conductor 131,132 and be not limited.Fig. 1 and
Though Fig. 2 illustrates the side 240s of the side 150s contact coatings 240 of Anisotropically conductive material layer 150,
The present invention is not limited, because Anisotropically conductive material layer 150 is for being electrically connected with engagement in Z-direction
Pin 160a and engagement pin 140, therefore the allocation position of Anisotropically conductive material layer 150 can not contact and cover
The side 240s of cap rock 240, and the side 150s of Anisotropically conductive material layer 150 is to the side of coating 240
The distance of side 240s also can be in the case of the electric connection for not influenceing to engage pin 160a and engagement pin 140
Voluntarily adjust according to the actual requirements.Configuration more than, and by touch-control circuit element (such as touch-control IC)
The printed circuit board (PCB) for being arranged on flexible circuit board 160 or being electrically connected with flexible circuit board 160 (is schemed not
Show) on, can by touch-control drive signal and sensing signal by flexible circuit board 160 engagement pin 160a/
The engagement pin 140/ of Anisotropically conductive material layer 150/ plain conductor 131,132/ touch control electrode 121a, 122a
Path transmission, to sense touch point coordinate of the user to contact panel 100.
In this embodiment, touch control electrode 121a, 122a is by transparent conductive material such as tin indium oxide
(indium tin oxide；ITO), indium zinc oxide (indium zinc oxide；) or other are electrically conductive and transparent IZO
Material formed, plain conductor 131,132 can as made by aluminium, copper or other suitable metal or alloy,
And the material that engages pin 140 is different from plain conductor 131,132, and preferably with touch control electrode 121a,
The material of 122a it is identical and be in the processing step along with formed, with cost-effective.In prior art
In, it is identical with plain conductor 131,132 to engage the material of pin 140, therefore is doing reliability test
When, the corrosion (for example aluminium is rotten) for engaging pin 140 can extend to plain conductor 131,132, cause touch-control
The property abnormality of panel 100.Set in touch-control drive signal and sensing signal transmission path by the present invention
The engagement pin 140 different from plain conductor 131,132 materials, can avoid doing touch control display apparatus 100
Reliability test when because engagement pin 140 corrosion cause the property abnormality of contact panel 100.
It should be noted that, in the present embodiment, plain conductor 131,132 is with to engage pin 140 direct
Contact being electrically connected to each other, but in the present invention plain conductor 131,132 with engage the electrical of pin 140
Connected mode is not limited.For example, in other embodiments, engage pin 140 and be located at it
On plain conductor 131,132 between can have insulating barrier, and insulating barrier has conductive through hole to be electrically connected with
Engagement pin 140 and plain conductor 131,132 disposed thereon.
Additionally, the shape of touch control electrode 121a, 122a and configuration are only examples in Fig. 1, the present invention is simultaneously
Shape, configuration and the forming method of touch control electrode pattern are not limited.For example, although Fig. 1's
In embodiment, touch control electrode pattern is existing one side tin indium oxide (single sided ITO, SITO) structure,
But the present invention is not limited.In other embodiments, touch control electrode pattern can be single-layer solution
(One layer solution, OLS) structure or two-sided tin indium oxide (double sided ITO, DITO) are tied
Structure.In addition, although the touch control electrode of contact panel 100 is designed as mutual capacitance in Fig. 1
(mutual-capacitance) form, but the present invention is not limited, in other embodiments, contact panel
Touch control electrode design or self-capacitance (self-capacitance) form.
In actual applications, touch-control is fitted into display panel after contact panel 100 can be independently formed to show
Show fluorescent screen, or the touch-control that contact panel and display panel can be integrated into On-cell or In-cell forms
Display fluorescent screen.In the touch-control display fluorescent screen embodiment of On-cell or In-cell forms, the base of Fig. 2
Plate 210 is to correspond to colored filter substrate or tft array substrate.Additionally, contact panel 100 is
Comprising in an electronic, this electronic installation can be TV, smart mobile phone, panel computer, notebook
Computer or any device with touch controllable function, but be not limited.
Then Fig. 2 is continued referring to.The material of substrate 210 for example include glass, polymer (polymer),
Composite, or its combination.Available material is, for example, but is not limited to, PET
(polyethylene terephthalate, PET), makrolon (polycarbonate, PC), polyether sulfone
(polyether sulfone, PES), Triafol T (triacetyl cellulose, TAC), poly- methyl-prop
E pioic acid methyl ester (PMMA), polyethylene (polyethylene), cyclic olefin polymer (COP), pi
(polyimide, PI), and makrolon (PC) is compound with what polymethyl methacrylate (PMMA) was constituted
Material etc..
There is transparency conducting layer 230, transparency conducting layer 230 is included in active area 110 on substrate 210
Touch control electrode pattern (namely touch control electrode 121a, 122a) and engagement in non-active area 112
Pin 140.The material of transparency conducting layer 230 includes tin indium oxide, indium zinc oxide or other are conductive and thoroughly
Bright material.On substrate 210 also have metal level 220, metal level 220 include plain conductor 131,
132, the material of metal level 220 includes copper, aluminium or other suitable metal or alloy.Coating 240
Covering touch control electrode pattern and plain conductor 131,132, and with appear engagement pin 140 opening
240a, coating 240 can be as made by the insulating materials being arbitrarily adapted to.By by plain conductor 131,
132 are electrically connected with engagement pin 140, and Anisotropically conductive material layer 150 is provided with engagement pin 140, and
The engagement pin 160a of flexible circuit board 160 is provided with Anisotropically conductive material layer 150 so that metal is led
Line 131,132 is electrically connected to flexible circuit board 160, the engagement pin 160a's of flexible circuit board 160
Material for example includes copper or gold, but is not limited.
In this embodiment, the side 240s of the end 160a1 of engagement pin 160a and coating 240
Between distance be D1.When contact panel 100 meet with electrostatic problem when, electrostatic be by plain conductor 131,
The engagement pin 160a's of the flexible circuit board 160 of 132/ 140/ Anisotropically conductive material layer of engagement pin 150/ puts
Power path 280 is by Electro-static Driven Comb (as shown by the arrows in Figure 2).Although the present invention is in touch-control drive signal and sense
Survey and the engagement pins 140 different from plain conductor 131,132 materials are set in signal transmission path, to keep away
Exempt to cause plain conductor 131,132 to corrode when the reliability for doing touch control display apparatus 100 is tested, but because
The resistance of the engagement pin 140 formed with transparent conductive material for the present invention is led with metal more in the prior art
The engagement pin resistance of the identical material of line is big, and (sheet resistance of general transparent conductive material is about 18ohm/sq, electricity
Resistance coefficient is about 10-4 power ohmcm, and the plain conductor sheet resistance comprising aluminium or copper is about 0.5
Ohm/sq, resistance coefficient is about 10-8 power ohmcm), and electrostatic is just easy within a very short time
Current potential very high is accumulated, therefore easily because the impedance of discharge path 280 is larger so that electrostatic has little time
Discharge and accumulate and damaged on contact panel 100.Additionally, because formed with transparent conductive material
The resistance for engaging pin 140 is larger, therefore engagement pin 140 is also subjected to power higher in electric discharge,
So that engagement pin 140 easily melts down when electrostatic problem is met with.Therefore the present invention apart from D1 by will set
Be set to less than 200 microns, with reduce discharge path 280 impedance (namely during Electro-static Driven Comb, via compared with
The short path of engagement pin 140 up can be discharged to flexible circuit board by Anisotropically conductive material layer 150
160 engagement pin 160a).Consequently, it is possible to can solve because the larger institute of resistance of engagement pin 140
The electrostatic discharge problem of generation.
It should be noted that, although in the discharge path 280 depicted in Fig. 2, in Anisotropically conductive material layer 150
In discharge path be to be depicted as inclining and there is angle with Z axis, but it is only to illustrate.Because engagement is drawn
Pin 160a is by the conducting particles (not shown) in pressing Anisotropically conductive material layer 150 with pin 140 is engaged
To form the conducting of vertical direction, and conducting particles is dispersed in Anisotropically conductive material layer 150,
Therefore actual engagement pin 140 is according to Anisotropically conductive material with the discharge path engaged between pin 160a
Determined by the position of the conducting particles of pressing conducting in layer 150, therefore in certain embodiments, incorgruous
Discharge path in conductive material layer 150 is also likely to be substantially parallel with Z axis.
Additionally, because the end 160a1 and coating 240 of the engagement pin 160a for illustrating in fig. 2
240s projections in the Z-axis direction in side have overlap (namely to engage height of the pin 160a on Z axis
With high superposed of the coating 240 on Z axis), therefore the end for engaging pin 160a illustrated in Fig. 2
Between 160a1 and the side 240s of coating 240 apart from D1 be parallel X-Y plane.The present invention its
In his embodiment, if because the thickness of Anisotropically conductive material layer 150 causes to engage the end of pin 160a
The side 240s of 160a1 and coating 240 projections in the Z-axis direction it is non-overlapping (namely on Z axis,
The upper surface of the lower surface higher than coating 240 of engagement pin 160a), then engage the end of pin 160a
Between 160a1 and the side 240s of coating 240 will not parallel X-Y plane, and and X-Y apart from D1
Plane has angle.Because the impedance of discharge path 280 be with engage the end 160a1 of pin 160a with
The projected length apart from D1 over the substrate 210 between the side 240s of coating 240 is directly proportional, therefore
The present invention is to be set smaller than 200 microns by by the projected length apart from D1 over the substrate 210, to drop
The impedance in low discharge path 280.In the embodiment of fig. 2, because being parallel X-Y plane apart from D1,
So the projected length apart from D1 over the substrate 210 is equal to D1.
Next the end that Fig. 3 a to Fig. 3 d, Fig. 3 a are the engagement pin 160a of flexible circuit board 160 please be join
Between the side 240s of portion 160a1 and coating apart from D1 more than 200 microns of schematic diagram, Fig. 3 b are
Schematic diagram apart from D1 less than 200 microns and more than 0 micron, Fig. 3 c are to be equal to 0 micron apart from D1
Schematic diagram, and the end 160a1 that Fig. 3 d are engagement pin 160a is positioned over the top of layer 240.By scheming
3a to Fig. 3 d understands that in Electro-static Driven Comb the engagement pin 160a configurations compared with Fig. 3 a, Fig. 3 b extremely scheme
3d up can be discharged to soft via the shorter path of engagement pin 140 by Anisotropically conductive material layer 150
The engagement pin 160a of property circuit board 160, therefore electrostatic breakdown contact panel 100 when can reduce Electro-static Driven Comb
Or the risk that engagement pin 140 melts down, to improve the antistatic capacity of contact panel 100.
Second embodiment
Next Fig. 4 to Fig. 5 is refer to, Fig. 4 is bowing for the contact panel 200 of second embodiment of the invention
Depending on schematic diagram, Fig. 5 is the profile of the tangent line AA ' of corresponding diagram 4.Fig. 4 to Fig. 5 and Fig. 1's to Fig. 2
Be Fig. 4 to Fig. 5 at difference forms conducting block 310 in the upper surface of engagement pin 140, remainder with
First embodiment is similar to, and identical narration is not repeated herein.In the present embodiment, conducting block 310 and gold
Category wire 131,132 is to belong to metal level 220, therefore conducting block 310 and plain conductor 131,132
Can be formed in identical processing step, with cost-effective.But the present invention is not limited, conducting block
310 material can also be different from plain conductor 131,132.As shown in figure 5, conducting block 310 is towards X
The length that direction extends is L, in the distance of segment length L, as long as the resistance of conducting block 310 is compared with it
Resistance of the lower section engagement pin 140 in segment length L distances is low, then electric charge can be upward during Electro-static Driven Comb
Moved toward the relatively low conducting block 310 of resistance, with quickly by Electro-static Driven Comb.Therefore the material of conducting block 310
The preferably resistance coefficient metal material or other conductive materials low compared with engagement pin 140, but the present invention
It is not limited.Conducting block 310 is provided in coating 240 with flexible circuit board 160 in X-direction
Between engagement pin 160a, and it is electrically connected with engagement pin 140.In the 5 embodiment of figure 5, it is conductive
Block 310 is that directly contact engages pin 140, but the present invention is not limited.For example, in other realities
In applying example, when conducting block 310 and plain conductor 131,132 are when belonging to metal level 220, and engagement
There is insulating barrier between pin 140 and plain conductor 131,132 disposed thereon and conducting block 310, and it is exhausted
Edge layer has conductive through hole to be electrically connected with engagement pin 140 and plain conductor 131,132 disposed thereon
And during conducting block 310, because conductive through hole is typically the gold far below transparent conductive material by resistance coefficient
Category material is formed, therefore electric charge can be from engagement pin 140 upward by conductive through hole toward resistance during Electro-static Driven Comb
The relatively low conducting block 310 of value is moved.
Therefore, the electrostatic discharging path 280 of the present embodiment contains the conducting block 310 of low resistance, that is,
Compared to the first embodiment for not having conducting block 310, the present embodiment is by the electrostatic discharging path 280 of script
In one section of higher resistance value engagement pin 140 with the substitution of conducting block 310 compared with low resistance, hence in so that
The electrostatic that contact panel 200 meets with can be discharged quickly via discharge path 280, to avoid contact panel
200 are subjected to electrostatic breakdown, and (please join discharge path and Fig. 6 b that Fig. 6 a do not have conducting block 310 has conducting block
310 discharge path).Specifically, the embodiment in Fig. 3 a and Fig. 3 b that can arrange in pairs or groups of the invention,
Conducting block 310 is arranged at the end 160a1 of the engagement pin 160a and side 240s of coating 240
Between, and conducting block 310 with engage pin 140 between do not have Anisotropically conductive material layer 150, that is, this implementation
Example do not limit the end 160a1 of engagement pin 160a to coating side 240s apart from D1.Citing
For, can be formed in the upper surface of engagement pin 140 in the embodiment apart from D1 less than 200 microns
Conducting block 310 lifts electro-static discharge protective ability further to reduce the impedance of electrostatic discharging path.Or
It is apart from D1 because length, the width and coating of Anisotropically conductive material layer 150 of engagement pin 160
The factors such as 240 opening 240a sizes and when cannot be decreased to less than 200 microns, can be by engagement pin
140 upper surface forms conducting block 310, to lift electro-static discharge protective ability.Additionally, such as Fig. 4 and figure
Shown in 5 because conducting block 310 is not directly contacted with plain conductor 131,132, and with plain conductor 131,
There is clearance G between 132, therefore conducting block 310 is to be electrically connected to plain conductor by engagement pin 140
131、132.Configuration mode more than, when the reliability for doing contact panel is tested, even if leading
The corrosion phenomenon of electric block 310 is produced, and corrosion does not extend to generation plain conductor 131,132 yet so that
Contact panel still can normal operation (because even when the heavy corrosion of conducting block 310 cause resistance raise or break
When, touch-control drive signal and sensing signal still can be incorgruous by the engagement pin 160a/ of flexible circuit board 160
Conductive material layer 150/ engages the path transmission of the plain conductor 131,132 of pin 140/).
It should be noted that, the present invention does not limit length, width, thickness or the length-width ratio of conducting block 310,
Also not limiting the width of conducting block 310 needs the width of the relatively engagement pin 140 illustrated such as Fig. 4 as wide.Lift
For example, Fig. 5 is refer to, the length that conducting block 310 extends towards X-direction is L, in segment length L
Distance in, as long as the resistance of conducting block 310 engages pin 140 in segment length L distances more below
In resistance it is low, then electric charge can be moved toward the relatively low conducting block 310 of resistance upward during Electro-static Driven Comb, with fast
Speed is by Electro-static Driven Comb.Therefore technical field tool usually intellectual can voluntarily design according to contact panel and need
Ask and technological ability and adjust position, shape, thickness, length or the width of conducting block.
In the 5 embodiment of figure 5, conducting block 310 does not have directly contact coating 240, and is to set
In between the end 160a1 of engagement pin 160a and the side 240s of coating 240, but the present invention is not with this
It is limited.Please join Fig. 7 a to Fig. 7 c, in the embodiment of Fig. 7 a, the side 310s of conducting block 310 is direct
The side 240s of coating 240 is contacted, and in the embodiment of Fig. 7 b and Fig. 7 c, 240 points of coating
Conducting block 310 is not partly covered and be completely covered, equally all can reach the effect for improving antistatic capacity.
Namely coating 240 whether directly contact or covering conducting block 310 have no effect on antistatic capacity,
Therefore technical field tool usually intellectual can determine according to technological ability and contact panel design requirement
Whether coating 240 contacts or covers conducting block 310.Additionally, because the reality of Fig. 5, Fig. 7 a and Fig. 7 b
At least partly conducting block 310 is exposed in air in applying example, it is easy to meet with aqueous vapor corrosion, therefore Fig. 7 c
Embodiment in coating 240 is completely covered conducting block 310 can avoid above-mentioned aqueous vapor etching conductive block 310
Problem.
In the embodiment of Fig. 5, Fig. 7 a to Fig. 7 c, conducting block 310 does not have directly contact flexible circuit
The engagement pin 160a of plate 160.However, refer to Fig. 8, Fig. 9 a, Fig. 8 is contact panel of the present invention
300 schematic top plan view, Fig. 9 a are the profiles of the tangent line AA ' of corresponding diagram 8.As shown in Fig. 8 and Fig. 9 a,
In vertical direction (Z-direction) (from the normal vector of substrate 210), conducting block 310, engagement pin 140
Engagement pin 160a with flexible circuit board 160 is overlap at least in part.In the implementation of Fig. 8, Fig. 9 a
Conducting block 310 is the engagement pin 160a of directly contact flexible circuit board 160 in example, is to be formed in implementation
Conducting block 310 more long.The present invention is not limited with the embodiment of Fig. 8, Fig. 9 a, also can be as shown in figure 9b
The bonding wire 160a of flexible circuit board 160 is designed as length more long, can equally make conducting block 310
It is the engagement pin 160a of directly contact flexible circuit board 160.The present invention be not intended to limit conducting block 310 with
The length of the engagement pin 160a of flexible circuit board 160.Then refer to Fig. 6 b, Fig. 7 a to Fig. 7 c,
The electrostatic discharging path 280 of Fig. 9 a to Fig. 9 b, the discharge path 280 of Fig. 6 b, Fig. 7 a to Fig. 7 c is gold
140/ conducting block of the category engagement pin of wire 131,132/ 310/ engages the Anisotropically conductive material layer 150/ of pin 140/
The engagement pin 160a of flexible circuit board 160, and the electrostatic discharging path 280 of Fig. 9 a to Fig. 9 b is then
The engagement pin 160a of the flexible circuit board 160 of 140/ conducting block of the engagement pin of plain conductor 131,132/ 310/,
Therefore the embodiment compared to Fig. 6 b, Fig. 7 a to Fig. 7 c, Fig. 9 a, the embodiment of Fig. 9 b provide relatively low
The electrostatic discharging path 280 of impedance, can further lift the antistatic capacity of contact panel.
Next Figure 10 a, Figure 10 b be refer to.Figure 10 a, Figure 10 b and Fig. 9 a, the difference of Fig. 9 b are
There is Anisotropically conductive material layer 150 between the engagement pin 160a of conducting block 310 and flexible circuit board 160.
When conducting block 310 and Anisotropically conductive material layer 150 difference in thickness (for example, if conducting block 310
Thickness much smaller than Anisotropically conductive material layer 150 thickness) cause conducting block 310 cannot be such as Fig. 9 a, Fig. 9 b
During the engagement pin 160a of directly contact flexible circuit board 160, can be by by Anisotropically conductive material layer 150
It is arranged on engagement pin 140 and conducting block 310, then again by the engagement pin of flexible circuit board 160
160a is pressed in Anisotropically conductive material layer 150 so that the engagement pin 160a of flexible circuit board 160 can
It is electrically connected with engagement pin 140 and conducting block 310 simultaneously by Anisotropically conductive material layer 150.Then please join
According to Fig. 6 b, Fig. 7 a to Fig. 7 c, the electrostatic discharging path 280 of Figure 10 a to Figure 10 b, Fig. 6 b, Fig. 7 a
Discharge path 280 to Fig. 7 c is that the engagement conducting block 310/ of pin 140/ of plain conductor 131,132/ is engaged
The engagement pin 160a of the flexible circuit board 160 of 140/ Anisotropically conductive material layer of pin 150/, and Figure 10 a,
The electrostatic discharging path 280 of 10b is then that the engagement conducting block 310/ of pin 140/ of plain conductor 131,132/ is different
To the engagement pin 160a of the flexible circuit board 160 of conductive material layer 150/, therefore compared to Fig. 6 b, Fig. 7 a
To the embodiment of Fig. 7 c, Figure 10 a, the embodiment of Figure 10 b provide more low-impedance electrostatic discharging path
280。
Next Figure 11 a to Figure 11 d be refer to.In the implementation of Fig. 9 a to Fig. 9 b and Figure 10 a to Figure 10 b
In example, though coating 240 does not cover conducting block 310, other embodiments of the invention are variable to be turned to such as figure
The part of coating 240 is covered conducting block 310 by 11a to Figure 11 d, to avoid aqueous vapor etching conductive block 310
Problem.It should be noted that, though the right edge of coating 240 in Figure 11 a to Figure 11 d is not in contact with soft electricity
The engagement pin 160a or Anisotropically conductive material layer 150 of road plate 160, but the present invention is not limited,
In other embodiment, the engagement pin 160a or different of the accessible flexible circuit board 160 in the side of coating 240
To conductive material layer 150, with engagement pin 160a or Anisotropically conductive material layer with flexible circuit board 160
150 are completely covered conducting block 310.
One skilled in the art works as can be by Fig. 4, Fig. 5, Fig. 7 a to Fig. 7 c, Fig. 8, Fig. 9 a extremely
Fig. 9 b, Figure 10 a to Figure 10 b, the embodiment of Figure 11 a to Figure 11 d are retouched or changed and implementation goes out it
The conducting block of his form, as long as in plain conductor 131,132 and the electrical connection part for engaging pin 140 extremely
Discharge path 280 between the engagement pin 160a of flexible circuit board 160 provide resistance it is smaller (with connect
The resistance of splice grafting pin 140 is in the case where equal length L is compared) conducting block, in the scope just invented herein.
Although the present invention is disclosed as above with embodiment, so it is not limited to the present invention, Ren Heben
Art personnel, without departing from the spirit and scope of the present invention, when can make it is a little variation with retouching,
Therefore protection scope of the present invention ought be defined depending on as defined in claim.
Claims (10)
1. a kind of contact panel, it is characterised in that the contact panel includes：
Substrate；
Transparency conducting layer, it is arranged on the substrate, and the transparency conducting layer includes touch control electrode figure
Case engages pin with least one；
Metal level, it is arranged on the substrate and including at least one plain conductor, and the metal is led
Line is electrically connected with the touch control electrode pattern and the engagement pin；
Coating, its described touch control electrode pattern of covering and the plain conductor；
Anisotropically conductive material layer, it is arranged on the engagement pin；And
Flexible circuit board, it includes at least one engagement pin, and the engagement pin is arranged at described incorgruous
On conductive material layer, and the engagement pin is electrically connected with by the Anisotropically conductive material layer.
2. contact panel as claimed in claim 1, it is characterised in that the end of the engagement pin is extremely
The distance of the side of coating projected length on the substrate is less than 200 microns.
3. contact panel as claimed in claim 1, it is characterised in that the contact panel includes:
At least one conducting block, it is arranged on the engagement pin and is electrically connected to described connecing
Pin, wherein between the conducting block and the plain conductor have gap, and the conducting block resistance system
Resistance coefficient of the number less than the engagement pin.
4. contact panel as claimed in claim 3, it is characterised in that the conducting block belongs to the gold
Category layer, and engage pin described in the conducting block directly contact.
5. contact panel as claimed in claim 3, it is characterised in that led described in the coating covering
Electric block.
6. contact panel as claimed in claim 3, it is characterised in that from the normal vector of the substrate
See, the engagement pin, the conducting block are overlap at least in part with the engagement pin.
7. contact panel as claimed in claim 6, it is characterised in that the conducting block directly contact institute
State engagement pin or be electrically connected with the engagement pin by the Anisotropically conductive material layer.
8. contact panel as claimed in claim 3, it is characterised in that the material of the conducting block includes
Aluminium or copper.
9. contact panel as claimed in claim 3, it is characterised in that the substrate includes active area
With non-active area, the touch control electrode pattern is located in the active area, the conducting block, described
Anisotropically conductive material layer is with the pin that engages in the non-active area.
10. a kind of electronic installation, it is characterised in that the electronic installation includes：
Contact panel, the contact panel includes：
Substrate；
Transparency conducting layer, it is arranged on the substrate, and the transparency conducting layer includes touch-control electricity
Pole figure case engages pin with least one；
Metal level, it is arranged on the substrate and including at least one plain conductor, the gold
Category wire is electrically connected with the touch control electrode pattern and the engagement pin；
Coating, its described touch control electrode pattern of covering and the plain conductor；
Anisotropically conductive material layer, it is arranged on the engagement pin；And
Flexible circuit board, it includes at least one engagement pin, and the engagement pin is arranged at described
On Anisotropically conductive material layer, and the engagement pin is electrically connected with by the Anisotropically conductive material layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510943583.6A CN106886325B (en) | 2015-12-16 | 2015-12-16 | Touch panel and electronic device |
| CN202010175013.8A CN111399681B (en) | 2015-12-16 | 2015-12-16 | Touch panel and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510943583.6A CN106886325B (en) | 2015-12-16 | 2015-12-16 | Touch panel and electronic device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010175013.8A Division CN111399681B (en) | 2015-12-16 | 2015-12-16 | Touch panel and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106886325A true CN106886325A (en) | 2017-06-23 |
| CN106886325B CN106886325B (en) | 2020-05-12 |
Family
ID=59175148
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510943583.6A Active CN106886325B (en) | 2015-12-16 | 2015-12-16 | Touch panel and electronic device |
| CN202010175013.8A Active CN111399681B (en) | 2015-12-16 | 2015-12-16 | Touch panel and electronic device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010175013.8A Active CN111399681B (en) | 2015-12-16 | 2015-12-16 | Touch panel and electronic device |
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| Country | Link |
|---|---|
| CN (2) | CN106886325B (en) |
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| CN109558023A (en) * | 2017-09-27 | 2019-04-02 | 华为终端（东莞）有限公司 | Touch display screen and terminal device |
| CN111292612A (en) * | 2018-12-10 | 2020-06-16 | 北京小米移动软件有限公司 | Display module and mobile terminal |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111399681A (en) | 2020-07-10 |
| CN111399681B (en) | 2023-06-16 |
| CN106886325B (en) | 2020-05-12 |
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