CN106879168A - A kind of printed circuit board (PCB), PCBA board and electronic equipment - Google Patents
A kind of printed circuit board (PCB), PCBA board and electronic equipment Download PDFInfo
- Publication number
- CN106879168A CN106879168A CN201710271722.4A CN201710271722A CN106879168A CN 106879168 A CN106879168 A CN 106879168A CN 201710271722 A CN201710271722 A CN 201710271722A CN 106879168 A CN106879168 A CN 106879168A
- Authority
- CN
- China
- Prior art keywords
- crystal oscillator
- layer
- pcb
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000013078 crystal Substances 0.000 claims abstract description 83
- 239000003989 dielectric material Substances 0.000 claims abstract description 29
- 238000009413 insulation Methods 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 230000003071 parasitic effect Effects 0.000 abstract description 7
- 230000010355 oscillation Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The present invention is applied to technical field of electronic products, there is provided a kind of printed circuit board (PCB), PCBA board and electronic equipment.PCBA board includes crystal oscillator, electric capacity, chip and printed circuit board (PCB).Printed circuit board (PCB) includes the dielectric material of insulation, and the top surface of dielectric material is provided with top surface routing layer, and bottom surface is provided with bottom surface routing layer, and the inside of dielectric material is provided with intermediate traces layer.Top surface routing layer is provided with the crystal oscillator region for fixing crystal oscillator, at least one layer intermediate traces layer near top surface routing layer, and it corresponds to crystal oscillator pad location directly below for insulating regions.Due to there is no conducting medium on insulating regions, so being avoided that or reducing the insulating regions and crystal oscillator pad generation parasitic capacitance, prevent frequency of oscillation from shifting.Meanwhile, the insulating regions can form a space with the insulating dielectric materials of top, be conducive to heat-insulated, and entering face prevents crystal oscillator to be subject to the big component influences of neighbouring caloric value.
Description
Technical field
The invention belongs to technical field of electronic products, more particularly to a kind of printed circuit board (PCB), PCBA board and electronic equipment.
Background technology
Crystal oscillator is the oscillator of high accuracy and high stability, is widely used in colour TV, computer, remote control etc.
Be used for frequency generator in all kinds of oscillating circuits, and in communication system, for data processing equipment produces clock signal and be spy
Determine system and reference signal is provided.Quartz oscillator is divided into active crystal oscillator and passive crystal oscillator, and passive crystal oscillator need not be external
Power supply, but need external capacitor and coordinate chip internal phase inverter could produce vibration.
From the principle of electric capacity, as long as there are two pieces of conducting metal pole plates separated by a distance, electric capacity will be formed, such as
Filled media between fruit pole plate, capacitance can increase.Current PCBA board (Printed Circuit Board
Assembly, PCB hollow plate are by after SMT upper parts and DIP plug-in units), the crystal inside crystal oscillator draws two pins, and the two draw
The pad of pin is than larger, floor file copper sheet formation parasitic capacitance of the meeting with next layer, the capacitance size at crystal two ends, with oscillation frequency
Rate is related, therefore parasitic capacitance can cause the skew of frequency of oscillation, and then influences the performance of electronic equipment.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of printed circuit board (PCB), PCBA board and electronic equipment, purport
Parasitic capacitance is formed with next layer of floor file copper sheet in the pad for solving the crystal oscillator pin of PCBA board of the prior art, is led
Cause the problem of oscillation frequency shifts.
The present invention is achieved in that a kind of printed circuit board (PCB), including the dielectric material for insulating, the top of the dielectric material
Face is provided with top surface routing layer, and the bottom surface of the dielectric material is provided with bottom surface routing layer, and the inside of the dielectric material is set
There is the intermediate traces layer more than one layer of intermediate traces layer or two-layer being spaced；The top surface routing layer is provided with for fixing crystal
The crystal oscillator region of oscillator, electric capacity pad, the chip area for fixed chip, conductive cabling and insulating regions, it is described
Crystal oscillator region includes crystal oscillator pad, and the chip area includes chip bonding pad；Walking for conduction is provided with the intermediate traces layer
Line and insulating regions；The plate main reference ground of level is provided with the bottom surface routing layer；At least one layer is walked near the top surface
The intermediate traces layer of line layer, it corresponds to the crystal oscillator pad location directly below for insulating regions.
Further, the first via is provided with the dielectric material below the crystal oscillator region, is worn in first via
It is provided with the first ground wire for being electrically connected with crystal oscillator pad, the cabling on the intermediate traces layer includes the second ground wire, described the
One ground wire is connected with the second ground wire, and the whole printed circuit board (PCB) of insertion is provided with the dielectric material below the chip area
The second via, be equipped with the 3rd ground wire electrically connected with chip bonding pad in second via, second ground wire with it is described
3rd is electrically connected to ground, and the 3rd ground wire is electrically connected with the plate main reference ground of level set on the bottom surface routing layer.
Further, on the top surface routing layer crystal oscillator pad, electric capacity pad and chip bonding pad are to be covered in medium
One layer of Copper Foil on material top surface.
Further, the cabling on the intermediate traces layer is to be embedded at one layer of Copper Foil inside dielectric material.
Further, the insulating regions are a sunk area on the intermediate traces layer.
Further, the plate main reference ground of level on the bottom surface routing layer is a layer be covered on dielectric material bottom surface
Copper Foil.
The present invention is in order to solve the above technical problems, additionally provide a kind of PCBA board, including crystal oscillator, electric capacity and core
Piece, the PCBA board also includes above-mentioned printed circuit board (PCB)；The crystal oscillator is located on the crystal oscillator region, the crystal
Oscillator has the pin of the reference ground of crystal oscillator and electric capacity, the pin of the crystal oscillator and the crystal oscillator pad
Welding；The electric capacity is welded on the electric capacity pad, and the electric capacity is shaken by the cabling on top surface routing layer with the crystal
Swing device electrical connection；The chip is located on the chip area, and the chip has the pin of crystal oscillator reference ground, the chip
The pin of crystal oscillator reference ground is welded with the chip bonding pad.
The present invention is in order to solve the above technical problems, additionally provide a kind of electronic equipment, including above-mentioned PCBA board.
Compared with prior art, beneficial effect is the present invention：Printed circuit board (PCB) in the present invention, at least one layer is close to
The intermediate traces layer of top surface routing layer, its position for corresponding to crystal oscillator pad is provided with insulating regions, due on the insulating regions
There is no conducting medium, thus it is possible to avoid or reduce the insulating regions produces parasitic capacitance with crystal oscillator pad above, prevent
Frequency of oscillation shifts.Simultaneously as not having conducting medium on insulating regions, the insulating regions can be with the dielectric of top
Material forms a space, is conducive to heat-insulated, and entering face prevents crystal oscillator to be subject to the big component influences of neighbouring caloric value.
Brief description of the drawings
One or more embodiments are illustrative by the picture in corresponding accompanying drawing, these exemplary theorys
The bright restriction not constituted to embodiment, the element with same reference numbers label is expressed as similar element in accompanying drawing, removes
It is non-to have especially statement, the figure not composition limitation in accompanying drawing.
Fig. 1 is a kind of longitudinal schematic cross-sectional view of printed circuit board (PCB) provided in an embodiment of the present invention；
Fig. 2 is the schematic top plan view in the crystal oscillator region of printed circuit board (PCB) shown in Fig. 1；
Fig. 3 is a kind of longitudinal schematic cross-sectional view of PCBA board provided in an embodiment of the present invention.
Specific embodiment
In order that the technical problems to be solved by the invention, technical scheme and beneficial effect become more apparent, below tie
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
It is used to explain the present invention, is not intended to limit the present invention.
As shown in Figure 1 to Figure 3, it is of the invention one good embodiment, there is provided a kind of printed circuit board (PCB), including Jie insulated
Material 100.The top surface of dielectric material 100 is provided with top surface routing layer 1, and dielectric material 100 is internally provided with one layer of centre
The intermediate traces layer 3 more than routing layer 2 or two-layer being spaced, the bottom surface of dielectric material 100 is provided with bottom surface routing layer 3.
Above-mentioned top surface routing layer 1 be provided with for fix crystal oscillator crystal oscillator region 11, electric capacity pad, for fixing
The chip area 12 of chip, conductive cabling and insulating regions.Crystal oscillator region 11 includes crystal oscillator pad 111.Chip area 12
Including chip bonding pad 121, the cabling and insulating regions of conduction are provided with intermediate traces layer 2, are provided with bottom surface routing layer 3
The main reference ground 31 of plate level.Wherein, at least one layer intermediate traces layer 2 near top surface routing layer 1, it corresponds to crystal oscillator pad
111 location directly below are insulating regions 21.The present embodiment is illustrated with one piece three layers of printed circuit board (PCB), from Fig. 1
Can be seen that, the printed circuit board (PCB) of the present embodiment has three layers of dielectric material, 100, one layer of top surface routing layer 1, two-layer intermediate traces layer
2 and one layer of bottom surface routing layer 3, wherein, two intermediate traces layers 2 are absolutely corresponding to the location directly below of crystal oscillator pad 111
Edge region 21.
Specifically, the first via is provided with the dielectric material 100 of the lower section of crystal oscillator region 11, use is equipped with the first via
Include the second ground wire 22, chip area 12 in the cabling on the first ground wire 4 electrically connected with crystal oscillator pad 111, intermediate traces layer 2
The second via of the whole printed circuit board (PCB) of insertion is provided with the dielectric material 100 of lower section, is equipped with the second via and chip
3rd ground wire 5 of the electrical connection of pad 121, the 3rd ground wire 5 is electrically connected with the plate main reference ground 31 of level of setting on bottom surface routing layer 3
Connect, the main reference ground 31 of the first ground wire 4, the second ground wire 22, the 3rd ground wire 5 and plate level is sequentially connected electrically.Shaken by by crystal
Swing device and peripheral electric capacity constitutes a clock generation system together with the clock module of chip internal, by the ground wire whole of this system
It is connected to the clock reference of chip on the ground, then is connected to the plate main reference ground 31 of level together, it is ensured that the crystal oscillator of clock system,
Electric capacity, the ground of chip internal clock module three are not disturbed by other ground.Even if additionally, being interfered, it is also ensured that when
Voltage difference between the ground wire of the different components of master slave system is minimum.
Alternatively, on top surface routing layer 1 crystal oscillator pad 111, electric capacity pad and chip bonding pad 121 are to be covered in medium
One layer of Copper Foil on the top surface of material 100.The second ground wire 22 on intermediate traces layer 2 is to be embedded inside dielectric material 100
Layer Copper Foil.The plate main reference ground 31 of level on bottom surface routing layer 3 is one layer of Copper Foil being covered on the bottom surface of dielectric material 100.And
Insulating regions 21 above are a sunk areas on intermediate traces layer 2, are not arrange Copper Foil or only a small amount of the
The region that two ground wire 22 passes through, its with each layer on cabling decision in the board design stage.
Refer to Fig. 3, the present embodiment additionally provides a kind of PCBA board, including crystal oscillator 6, electric capacity, chip 7 and on
The printed circuit board (PCB) stated.In the present embodiment, crystal oscillator 6 is passive crystal resonator, itself and external electric capacity, and coordinates chip 7
Internal phase inverter produces oscillating condition.
Crystal oscillator 6 is located on crystal oscillator region 11, and crystal oscillator 6 has the reference ground of crystal oscillator and electric capacity
Pin 61, pin 61 and the crystal oscillator pad 111 of crystal oscillator 6 are welded.Electric capacity is welded on condenser welding disk, and electric capacity is by top
Cabling on face routing layer 1 is electrically connected with crystal oscillator 6.Chip 7 is located on chip area 12, and chip 7 is referred to crystal oscillator
The pin 71 on ground, the chip bonding pad 121 of pin 71 of the crystal oscillator reference ground of chip 7 is welded.
In order to away from pyrotoxin, electrically connect the input on top surface routing layer 1 and output track lengths with crystal oscillator 6
3~10mm is traditionally arranged to be, generate heat larger mainboard, track lengths are set to 6~10mm, and the bottom of the big device of caloric value is not
Allow to place crystal oscillator 6；In order to reduce the parasitic capacitance that crystal oscillator 6 is input into, exports, the width of cabling is less than
3mil。
The present embodiment additionally provides a kind of electronic equipment, including above-mentioned PCBA board.
It can be seen that, the printed circuit board (PCB) in the present embodiment in PCBA board or electronic equipment corresponds on two intermediate traces layers 2
The position of crystal oscillator pad 111 is provided with insulating regions 21, due to not having conducting medium on the insulating regions 21, thus it is possible to avoid
Or the insulating regions 21 and the generation parasitic capacitance of crystal oscillator pad 111 above are reduced, prevent frequency of oscillation from shifting.Together
When, due to not having conducting medium on insulating regions 21, the insulating regions 21 can form one with the insulating dielectric materials 100 of top
Space, is conducive to heat-insulated, and entering face prevents crystal oscillator to be subject to the big component influences of neighbouring caloric value.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (8)
1. a kind of dielectric material of printed circuit board (PCB), including insulation, the top surface of the dielectric material is provided with top surface routing layer, institute
The bottom surface for giving an account of material is provided with bottom surface routing layer, and the dielectric material is internally provided with one layer of intermediate traces layer or two
The intermediate traces layer at more than layer interval；The top surface routing layer is provided with crystal oscillator region, electric capacity for fixing crystal oscillator
Pad, the chip area for fixed chip, conductive cabling and insulating regions, the crystal oscillator region include crystal oscillator pad,
The chip area includes chip bonding pad；The cabling and insulating regions of conduction are provided with the intermediate traces layer；The bottom
The plate main reference ground of level is provided with the routing layer of face；Characterized in that, at least one layer centre near the top surface routing layer
Routing layer, it corresponds to the crystal oscillator pad location directly below for insulating regions.
2. printed circuit board (PCB) as claimed in claim 1, it is characterised in that set in the dielectric material below the crystal oscillator region
There is the first via, the first ground wire for being electrically connected with crystal oscillator pad, the intermediate traces layer are equipped with first via
On cabling include the second ground wire, first ground wire is connected with the second ground wire, in the dielectric material below the chip area
The second via of the whole printed circuit board (PCB) of insertion is provided with, is equipped with what is electrically connected with chip bonding pad in second via
3rd ground wire, second ground wire is electrically connected to ground with the described 3rd, is set on the 3rd ground wire and the bottom surface routing layer
The main reference ground electrical connection of plate level.
3. printed circuit board (PCB) as claimed in claim 1 or 2, it is characterised in that crystal oscillator pad, electricity on the top surface routing layer
It is one layer of Copper Foil being covered on dielectric material top surface to hold pad and chip bonding pad.
4. printed circuit board (PCB) as claimed in claim 1 or 2, it is characterised in that cabling on the intermediate traces layer is to set
One layer of Copper Foil inside dielectric material.
5. printed circuit board (PCB) as claimed in claim 4, it is characterised in that the insulating regions are on the intermediate traces layer
One sunk area.
6. printed circuit board (PCB) as claimed in claim 1 or 2, it is characterised in that the plate main reference of level on the bottom surface routing layer
Ground wire is one layer of Copper Foil being covered on dielectric material bottom surface.
7. a kind of PCBA board, including crystal oscillator, electric capacity and chip, it is characterised in that the PCBA board also includes right
It is required that the printed circuit board (PCB) in 1 to 6 described in any one；The crystal oscillator is located on the crystal oscillator region, the crystal
Oscillator has the pin of the reference ground of crystal oscillator and electric capacity, the pin of the crystal oscillator and the crystal oscillator pad
Welding；The electric capacity is welded on the electric capacity pad, and the electric capacity is shaken by the cabling on top surface routing layer with the crystal
Swing device electrical connection；The chip is located on the chip area, and the chip has the pin of crystal oscillator reference ground, the chip
The pin of crystal oscillator reference ground is welded with the chip bonding pad.
8. a kind of electronic equipment, it is characterised in that including PCBA board as claimed in claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710271722.4A CN106879168A (en) | 2017-04-24 | 2017-04-24 | A kind of printed circuit board (PCB), PCBA board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710271722.4A CN106879168A (en) | 2017-04-24 | 2017-04-24 | A kind of printed circuit board (PCB), PCBA board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106879168A true CN106879168A (en) | 2017-06-20 |
Family
ID=59161339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710271722.4A Pending CN106879168A (en) | 2017-04-24 | 2017-04-24 | A kind of printed circuit board (PCB), PCBA board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879168A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072035A (en) * | 2017-05-25 | 2017-08-18 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB), circuit board assemblies and electronic installation |
| CN107734851A (en) * | 2017-09-21 | 2018-02-23 | 郑州云海信息技术有限公司 | A kind of method for adding copper foil automatically under crystal oscillator |
| CN113365424A (en) * | 2021-06-04 | 2021-09-07 | 中科芯集成电路有限公司 | PCB wiring structure for improving stability of chip passive crystal oscillator and manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1960600A (en) * | 2005-11-04 | 2007-05-09 | 鸿富锦精密工业（深圳）有限公司 | Printing circuit board |
| US20070114638A1 (en) * | 2005-11-23 | 2007-05-24 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board with quartz crystal oscillator |
| CN104302097A (en) * | 2014-10-16 | 2015-01-21 | 深圳市华星光电技术有限公司 | Multilayer printed circuit board |
| CN205566781U (en) * | 2016-02-04 | 2016-09-07 | 广州视源电子科技股份有限公司 | Printed circuit board |
| CN106100662A (en) * | 2016-05-27 | 2016-11-09 | 上海传英信息技术有限公司 | Printed circuit board (PCB) and there is the radio communication device of printed circuit board (PCB) |
| CN206650919U (en) * | 2017-04-24 | 2017-11-17 | 广东欧珀移动通信有限公司 | A kind of printed circuit board (PCB), PCBA board and electronic equipment |
-
2017
- 2017-04-24 CN CN201710271722.4A patent/CN106879168A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1960600A (en) * | 2005-11-04 | 2007-05-09 | 鸿富锦精密工业（深圳）有限公司 | Printing circuit board |
| US20070114638A1 (en) * | 2005-11-23 | 2007-05-24 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board with quartz crystal oscillator |
| CN104302097A (en) * | 2014-10-16 | 2015-01-21 | 深圳市华星光电技术有限公司 | Multilayer printed circuit board |
| CN205566781U (en) * | 2016-02-04 | 2016-09-07 | 广州视源电子科技股份有限公司 | Printed circuit board |
| CN106100662A (en) * | 2016-05-27 | 2016-11-09 | 上海传英信息技术有限公司 | Printed circuit board (PCB) and there is the radio communication device of printed circuit board (PCB) |
| CN206650919U (en) * | 2017-04-24 | 2017-11-17 | 广东欧珀移动通信有限公司 | A kind of printed circuit board (PCB), PCBA board and electronic equipment |
Non-Patent Citations (1)
| Title |
|---|
| 胡宴如: "电子实习（I）", 31 December 1996, 中国电力出版社, pages: 97 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072035A (en) * | 2017-05-25 | 2017-08-18 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB), circuit board assemblies and electronic installation |
| CN107734851A (en) * | 2017-09-21 | 2018-02-23 | 郑州云海信息技术有限公司 | A kind of method for adding copper foil automatically under crystal oscillator |
| CN113365424A (en) * | 2021-06-04 | 2021-09-07 | 中科芯集成电路有限公司 | PCB wiring structure for improving stability of chip passive crystal oscillator and manufacturing method |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: OPPO Guangdong Mobile Communications Co.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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