CN106879167B - Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof - Google Patents
Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof Download PDFInfo
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- CN106879167B CN106879167B CN201710222032.XA CN201710222032A CN106879167B CN 106879167 B CN106879167 B CN 106879167B CN 201710222032 A CN201710222032 A CN 201710222032A CN 106879167 B CN106879167 B CN 106879167B
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- Prior art keywords
- aluminum substrate
- double
- ceramic
- copper foil
- drilled
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 60
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 239000000758 substrate Substances 0.000 title claims abstract description 58
- 239000000919 ceramic Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011229 interlayer Substances 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000011889 copper foil Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000007547 defect Effects 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000011224 oxide ceramic Substances 0.000 description 6
- 229910052574 oxide ceramic Inorganic materials 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and a manufacturing method thereof. The invention thoroughly solves all defects caused by filling the traditional resin, and the heat conductivity coefficient of the alumina ceramic block is 29.3W/(M.K), which is about 150 times of that of the epoxy resin, so that the heat dissipation function of the aluminum substrate is greatly improved, and meanwhile, the interlayer interconnection can be realized, the problem that the aluminum substrate cannot be interconnected is well solved, the application range of the aluminum substrate is greatly expanded, the market prospect is considerable, and the invention has wide development prospect in the field of LEDs.
Description
Technical Field
The invention relates to a double-sided aluminum substrate, in particular to a double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and a manufacturing method thereof.
Background
The LED greatly reduces the electric energy consumption, and the electric energy consumption of the LED is reduced by 300 percent on the premise of the same brightness. In recent years, due to the reduction of the cost of the LEDs, the LED lamps gradually replace tungsten filament lamps, and the application prospect and market of the LEDs are quite considerable. The aluminum substrate has high heat dissipation performance and well solves the heat dissipation problem of the LED lamp, so that the aluminum substrate is also receiving more and more attention from the market. However, aluminum is conductive, and thus cannot realize interlayer interconnection, so that the use of an aluminum substrate is limited.
The traditional resin is adopted to fill the macropores when the existing double-sided aluminum substrate is manufactured so as to realize interlayer interconnection, but the prior double-sided aluminum substrate has a plurality of defects: firstly, bubbles are easy to generate when the traditional resin fills the macropores, cracks are easy to generate at high temperature, and the yield is very low when the interlayer interconnection is realized; secondly, the traditional epoxy resin has a low heat conductivity coefficient of only 0.2W/(M.K), the heat dissipation requirement of the aluminum substrate is not met more and more, and the heat dissipation coefficient at the heat dissipation coefficient hole site of the aluminum substrate produced in this way is different from the heat dissipation coefficient between layers, so that the quality required by the product is not met.
Disclosure of Invention
In order to overcome the defects, the invention provides the double-sided aluminum substrate with the high-precision embedded ultrahigh heat conduction ceramic block and the manufacturing method thereof, which can solve the problem of good heat dissipation performance of hole sites, realize interlayer interconnection and greatly expand the application range of the aluminum substrate.
The technical scheme adopted by the invention for solving the technical problems is as follows: the double-sided aluminum substrate with the high precision and the embedded ultrahigh heat conduction ceramic blocks comprises a first copper foil layer, an aluminum substrate and a second copper foil layer which are sequentially laminated, wherein a hole site which is required to be communicated with the aluminum substrate is drilled with a large hole with the radius larger than that of a position to be drilled, and the large hole is filled with ceramic with high heat conduction performance; and small holes are drilled on the ceramic and the corresponding first copper foil layer and the corresponding copper foil layer, and a metal conducting layer is electroplated on the inner side surface of each small hole.
As a further improvement of the invention, the macroporous internally filled ceramic is alumina ceramic block and alumina ceramic PP.
As a further development of the invention, the small hole is located in the center of the large hole.
As a further improvement of the invention, the metal conducting layer is a copper layer.
As a further improvement of the invention, the holes which are required to be communicated with the aluminum substrate are drilled with large holes with the radius larger than the position to be drilled by more than 0.3 mm.
The invention also provides a manufacturing method of the double-sided aluminum substrate with the high-precision embedded ultrahigh heat conduction ceramic block, which comprises the following steps:
step 1, drilling a large hole with a radius larger than that of a position to be drilled on an aluminum substrate, wherein the hole is required to be communicated with the aluminum substrate;
step 2, filling the macropores with ceramic with high heat conductivity;
step 3, sequentially laminating and pressing the first copper foil layer aluminum substrate and the second copper foil layer together;
step 4, drilling small holes, namely through holes, for interlayer interconnection on the ceramic and the corresponding first copper foil layer and the second copper foil layer;
and step 5, electroplating a metal conducting layer on the inner side surface of the small hole.
As a further improvement of the invention, in the step 1, the holes which need to be communicated on the aluminum substrate are drilled with large holes with the radius larger than 0.3mm or more than the position to be drilled.
As a further improvement of the present invention, in the step 2, the ceramic is an alumina ceramic block and an alumina ceramic PP.
As a further improvement of the present invention, in the step 3, the center of the small hole coincides with the center of the large hole.
The beneficial effects of the invention are as follows: the double-sided aluminum substrate with the high-precision embedded ultrahigh heat-conducting ceramic block and the manufacturing method thereof adopt the aluminum oxide ceramic block and the aluminum oxide ceramic PP to be matched for filling, so that all defects caused by traditional resin filling can be thoroughly solved, the heat conductivity coefficient of the aluminum oxide ceramic block is 29.3W/(M.K), and is 150 times of that of epoxy resin, the heat dissipation function of the aluminum substrate is greatly improved, interlayer interconnection can be realized, the problem that the aluminum substrate cannot be interconnected is well solved, the application range of the aluminum substrate is greatly expanded, and the market prospect is considerable, and particularly the aluminum substrate has wide development prospect in the field of LEDs.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention.
The following description is made with reference to the accompanying drawings:
1-first copper foil layer 2-aluminum substrate
3-second copper foil layer 21-macropores
22-ceramic 23-pores
24-interlayer conducting layer
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings, but the scope of the invention is not limited to the following examples, but is intended to cover all the modifications and equivalent changes within the scope of the present invention as defined by the appended claims and the description.
Referring to fig. 1, a double-sided aluminum substrate with a high-precision embedded ultrahigh heat-conducting ceramic block according to the invention comprises a first copper foil layer 1, an aluminum substrate 2 and a second copper foil layer 3 which are sequentially laminated. The holes which are needed to be communicated with the aluminum substrate 2 are drilled with large holes 21 with the radius larger than that of the holes to be drilled, and the large holes 21 are filled with ceramics 22 with high heat conductivity. The ceramic 22 and the corresponding first copper foil layer 1 and the copper foil layer 3 are drilled with small holes 23, and the inner side surfaces of the small holes 23 are electroplated with a metal conducting layer 24.
Wherein, the hole site of the aluminum substrate to be communicated is drilled with a large hole 21 with the radius larger than 0.3mm of the position to be drilled; the ceramic filled in the macropores is an alumina ceramic block and an alumina ceramic PP; the small hole is positioned at the center of the large hole; the metal conducting layer is a copper layer.
The manufacturing method of the double-sided aluminum substrate with the high-precision embedded ultrahigh heat conduction ceramic block comprises the following steps:
step 1, drilling a large hole 21 with a radius larger than that of a position to be drilled on a hole position to be communicated on an aluminum substrate 2;
step 2, filling the macropores with ceramic 22 with high heat conductivity;
step 3, sequentially stacking and pressing the first copper foil layer 1, the aluminum substrate 2 and the second copper foil layer 3 together;
step 4, drilling small holes 23 for interlayer interconnection, namely through holes, on the ceramic and the corresponding first copper foil layer and the second copper foil layer;
and step 5, electroplating a metal conducting layer 24 on the inner side surface of the small hole.
In the step 1, a hole 21 with a radius larger than 0.3mm of the hole to be drilled is drilled on a hole position to be communicated on the aluminum substrate 2; in the step 2, the ceramics are alumina ceramic blocks and alumina ceramic PP; in the step 3, the center of the small hole coincides with the center of the large hole.
According to the double-sided aluminum substrate with the high-precision embedded ultrahigh heat-conducting ceramic block and the manufacturing method thereof, all defects caused by traditional resin filling can be thoroughly solved by adopting the aluminum oxide ceramic block and adopting the aluminum oxide ceramic PP for filling, the heat conductivity coefficient of the aluminum oxide ceramic block is 29.3W/(M.K), and is 150 times of that of epoxy resin, so that the heat dissipation function of the aluminum substrate is greatly improved, interlayer interconnection can be realized, the problem that the aluminum substrate cannot be interconnected is well solved, the application range of the aluminum substrate is greatly expanded, and the market prospect is considerable, and particularly the LED substrate has a wide development prospect.
According to the double-sided aluminum substrate with the high precision and the embedded ultrahigh heat conduction ceramic block and the manufacturing method thereof, the blank of the high-density interconnection technology of the LED lamp is filled, the LED core technology is broken through, and the core competitiveness of the whole industry is improved; on one hand, the continuous coordinated development of local economy and society is promoted, and the local industry is driven to provide a large number of employment posts; on one hand, the improvement of the technical performance index of the product is promoted, and the technical requirements of the current new generation of LEDs and the market guiding requirements of the LEDs are met.
Therefore, the invention well solves the technical problem that the aluminum substrates cannot be interconnected between layers, overcomes the defects of the traditional resin, improves the product quality, expands the application range and has good development prospect.
Claims (4)
1. The utility model provides a high precision embeds two-sided aluminium base board of super high heat conduction ceramic block, includes first copper foil layer (1), aluminium base board (2) and second copper foil layer (3) that stacks gradually, its characterized in that: a large hole (21) with the radius larger than the position to be drilled is drilled on a hole position, which is required to be communicated, of the aluminum substrate, and ceramic (22) with high heat conductivity is filled in the large hole; the ceramic and the corresponding first copper foil layer and the copper foil layer are drilled with small holes (23), and the inner side surfaces of the small holes are electroplated with metal conducting layers (24);
a hole site which needs to be communicated with the aluminum substrate is drilled with a large hole (21) with the radius larger than 0.3mm of the position to be drilled;
the manufacturing method of the double-sided aluminum substrate with the high-precision embedded ultrahigh heat conduction ceramic block comprises the following steps:
step 1, drilling a large hole (21) with the radius larger than that of a hole to be drilled on a hole site which is required to be communicated on an aluminum substrate (2);
step 2, filling the macropores with ceramic (22) with high heat conductivity;
step 3, sequentially stacking and pressing the first copper foil layer (1), the aluminum substrate (2) and the second copper foil layer (3) together;
step 4, small holes (23) for interlayer interconnection, namely through holes, are drilled on the ceramic and the corresponding first copper foil layer and the second copper foil layer;
and step 5, electroplating a metal conducting layer (24) on the inner side surface of the small hole.
2. The double-sided aluminum substrate with high precision and embedded ultra-high thermal conductivity ceramic block according to claim 1, wherein the double-sided aluminum substrate is characterized in that: the ceramic filled in the macropores is alumina ceramic blocks and alumina ceramic PP.
3. The double-sided aluminum substrate with high precision and embedded ultra-high thermal conductivity ceramic block according to claim 1, wherein the double-sided aluminum substrate is characterized in that: the small hole is positioned at the center of the large hole.
4. The double-sided aluminum substrate with high precision and embedded ultra-high thermal conductivity ceramic block according to claim 1, wherein the double-sided aluminum substrate is characterized in that: the metal conducting layer is a copper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710222032.XA CN106879167B (en) | 2017-04-06 | 2017-04-06 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710222032.XA CN106879167B (en) | 2017-04-06 | 2017-04-06 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106879167A CN106879167A (en) | 2017-06-20 |
| CN106879167B true CN106879167B (en) | 2023-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710222032.XA Active CN106879167B (en) | 2017-04-06 | 2017-04-06 | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109699115B (en) * | 2017-10-23 | 2020-06-23 | 苏州旭创科技有限公司 | Optical module |
| CN107911937B (en) * | 2017-11-10 | 2020-03-27 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN113015339A (en) * | 2021-03-01 | 2021-06-22 | 鹤山市世拓电子科技有限公司 | Manufacturing method of embedded ceramic circuit board and embedded ceramic circuit board |
| CN113286435A (en) * | 2021-05-25 | 2021-08-20 | 胜宏科技（惠州）股份有限公司 | Method for plating copper in aluminum plate hole |
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2017
- 2017-04-06 CN CN201710222032.XA patent/CN106879167B/en active Active
Patent Citations (9)
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| JPH05136537A (en) * | 1991-11-12 | 1993-06-01 | Mitsubishi Electric Corp | Metallic bace circuit board and its manufacturing method |
| JP2002164660A (en) * | 2000-11-22 | 2002-06-07 | Tdk Corp | Multilayer board, manufacturing method thereof and electronic component |
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