CN106876851A - A kind of radio frequency strip transmission line - Google Patents
A kind of radio frequency strip transmission line Download PDFInfo
- Publication number
- CN106876851A CN106876851A CN201710140045.2A CN201710140045A CN106876851A CN 106876851 A CN106876851 A CN 106876851A CN 201710140045 A CN201710140045 A CN 201710140045A CN 106876851 A CN106876851 A CN 106876851A
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- CN
- China
- Prior art keywords
- radio frequency
- transmission line
- conduction band
- metal level
- ground metal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to microwave interconnecting field, more particularly to a kind of radio frequency strip transmission line.The transmission line structure that the present invention is provided, using bottom substrate, current-carrying conduction band, upper substrate three-decker so that main current-carrying conduction band line quilt " folder " for playing signal transmission is in two ground planes（Top layer ground metal level, bottom layer ground metal level）Between, then by being filled with dielectric between two ground plane surfaces so that the structure can be effectively reduced radiation loss and interference, so as to avoid the radio frequency self-excitation of T/R module.
Description
Technical field
The present invention relates to microwave interconnecting field, more particularly to a kind of radio frequency strip transmission line.
Background technology
Active phase array antenna due to advantages more more than traditional fire control radar, as the focus skill for developing in recent years
Art；T/R module is important key component in phased array antenna, the T/R module of wherein X-band be even more with transmission power it is big, penetrate
The characteristics of frequency high gain, but thus also it is particularly easy to produce radio frequency self-excitation, in turn result in the deterioration of module performance.Therefore, such as
It is always the important topic in high-power T/R module design that what avoids high-power T/R module from producing radio frequency self-excitation.
The main occurring principle of T/R module radio frequency self-excitation is：The high-power RF letter that final stage device in radio frequency link is produced
Number it is radiated in module interior space, can be by the radio frequency of whole radio frequency link after the prime in link receives radiation signal
Amplification forms positive feedback, finally produces self-excitation.Traditional T/R module design, as the radio-frequency transmission line of prime, is somebody's turn to do using microstrip line
Structure generally uses individual layer pcb board, and current-carrying conduction band lower section is ground connection dielectric substrates, and top is then free space.This structure
It is very easy to absorb radiation, and then produces radio frequency self-excitation.And in some designs, in order to avoid self-excitation is generally required in TR moulds
Many absorbing materials and shielding paper are additionally pasted in block, operation is extremely complex, and the effect for producing is also very limited, also drops significantly
The low production of module, while increased production cost.
The content of the invention
It is an object of the invention to overcome the above-mentioned deficiency in the presence of prior art, there is provided a kind of radio frequency strip transmission line
Structure, is effectively prevented from the radio frequency self-excitation produced in the high-power T/R module of X-band.
In order to realize foregoing invention purpose, the invention provides following technical scheme：
A kind of radio frequency strip transmission line, including bottom substrate, upper substrate, and be arranged between bottom substrate upper substrate
Current-carrying conduction band；
The bottom substrate uploads the both sides of conductance band, is also arranged with the middle ground gold not contacted with the current-carrying conduction band in parallel
Category layer；Grounded metal via is provided with the middle ground metal level；
The bottom substrate bottom is provided with bottom layer ground metal level, and the grounded metal via is by middle ground metal level and bottom
Layer ground metal layer connection；
The upper substrate top layer is additionally provided with top layer ground metal level.
Further, bottom substrate, upper substrate use Rogers5880, TLY-5 or Rogers6002 as material.
Further, the current-carrying conduction band includes conduction band body using copper as material, and is covered in conduction band this body surface
The Gold plated Layer in face.
Further, the conduction band body thickness is 0.5 ~ 1 ounce, and plated thickness is 1 ~ 4um.
Further, the middle ground metal level includes the middle ground metal level body using copper as material, and
It is covered in the ground connection Gold plated Layer of middle ground metal level body surface.
Further, the middle ground metal level body thickness is 0.5 ~ 1 ounce, and ground connection plated thickness is 1 ~ 4um.
Further, the radius of the metallic vias is 0.1 ~ 0.3mm.
Further, the current-carrying conduction band is banded structure.
Further, the input of the current-carrying conduction band banded structure, output end are microstrip line construction, and it is used for the load
Conductance band and other devices are connected.
Compared with prior art, beneficial effects of the present invention：The radio frequency banding transmission line structure that the present invention is provided, the bottom of using
Layer substrate, current-carrying conduction band, the three-decker of upper substrate so that the main current-carrying conduction band line for playing signal transmission is existed by " folder "
Two ground planes（Top layer ground metal level, bottom layer ground metal level）Between, then have electric Jie by between two ground plane surfaces
Matter so that the structure can be effectively reduced radiation loss and interference, so as to avoid the radio frequency self-excitation of T/R module.
Brief description of the drawings：
The radio frequency strip transmission line overall structure figure that Fig. 1 is provided for the present invention.
Fig. 2 is current-carrying conduction band and middle ground metal level distribution map in the present invention.
The radio frequency strip transmission line profile that Fig. 3 is provided for the present invention.
Marked in figure：1- bottom substrates, 11- bottom layer ground metal levels, 2- upper substrates, 21- top layer ground metal levels, 3-
Current-carrying conduction band, 31,32- conduction bands input, output end, 4- intermediate layers ground metal layer, 5- metallic vias.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in further detail.But this should not be interpreted as this
The scope for inventing above-mentioned theme is only limitted to following embodiment, and all technologies realized based on present invention belong to the present invention
Scope.
Embodiment 1：A kind of as shown in Figure 1 to Figure 3, radio frequency strip transmission line of the present embodiment offer, including bottom substrate 1,
Upper substrate 2, and it is arranged at the current-carrying conduction band 3 between the upper substrate 2 of bottom substrate 1；The bottom substrate 1 uploads conductance band
3 both sides, are also arranged with the middle ground metal level 4 not contacted with the current-carrying conduction band 3 in parallel；The middle ground metal level
Grounded metal via 5 is provided with 4；The bottom of the bottom substrate 1 is provided with bottom layer ground metal level 11, the grounded metal mistake
With bottom layer ground metal level 11 be connected middle ground metal level 4 by hole 5；When using, the radio frequency strip transmission line passes through bottom
Ground metal layer and functional module（Such as T/R module）Cavity adhesion, to be grounded；The top layer of upper substrate 2 is additionally provided with top layer and connects
Ground metal level 21, when using, the top layer ground metal level is required and functional module（T/R module）Cavity bonding, with realize connect
Ground.
Current-carrying conduction band 3 includes the conduction band body using copper as material, and the Gold plated Layer for being covered in conduction band body surface；Lead
Band body is banded structure, and the input of banded structure, output end are microstrip line construction, for the current-carrying conduction band 3 and other
Device is connected；The conduction band body thickness is 0.5 ~ 1 ounce, and plated thickness is 1 ~ 4um.Meanwhile, the middle ground metal
Layer 4 includes the body of middle ground metal level 4 using copper as material, and is covered in the body surface of middle ground metal level 4
Ground connection Gold plated Layer.The body thickness of middle ground metal level 4 is 0.5 ~ 1 ounce, and ground connection plated thickness is 1 ~ 4um.The metal
The radius of via 5 is 0.1 ~ 0.3mm.When the strip lines configuration that the present embodiment is provided is used, such as apply in high-power T/R module
When middle, the strip transmission line that the present embodiment is provided is arranged on the input of T/R module；One end that radiofrequency signal passes through current-carrying conduction band 3
Input, exports to radio frequency chip in the other end（It should be noted that the input of current-carrying conduction band 3, output port can be exchanged, its is mutual
Change to use and do not influence final performance）, when being connected with other modules, can be using welding or gold wire bonding or other any commonly employed companies
Connect mode.The present embodiment operation principle is：Using three-decker, upper and lower surface is grounded metal, middle uniform filled media.
The structure that the ground metal layer of upper and lower surface, middle ground metal level 4 are formed together with ground via, can shield electromagnetic field,
It is down to the leakage of field and interference very low, when the strip line is arranged on the input of high-power T/R module, because it can be effective
Interference of the radio-frequency radiation to input signal produced by ground shielding final stage device such that it is able to avoid the hair of radio frequency link positive feedback
It is raw, fundamentally avoid producing radio frequency self-excitation.In the present embodiment, bottom substrate 1, upper substrate 2 use Rogers5880 conducts
Material.
In a preferred embodiment, the width of bottom substrate 1 is 2mm ~ 5mm, bottom substrate 1, the substrate thickness of upper substrate 2
Be 0.127mm ~ 0.508mm, the width of current-carrying conduction band 3 is 0.18mm ~ 0.72mm, current-carrying conduction band 3 be distributed in connecing for its both sides
In more than 0.4mm, it is because such as each part is beyond upper why each part dimension to be defined as above to the distance of ground metal level 4
Size is stated, not only resulting in can cause processing difficulties, complex process, and device loss can be caused to increase, while causing resistance
Anti- adaptation, the problem of penalty.
Claims (9)
1. a kind of radio frequency strip transmission line, it is characterised in that including bottom substrate, upper substrate, and be arranged at bottom substrate,
Current-carrying conduction band between upper substrate；
The bottom substrate uploads the both sides of conductance band, is also arranged with the middle ground gold not contacted with the current-carrying conduction band in parallel
Category layer；Grounded metal via is provided with the middle ground metal level；
The bottom substrate bottom is provided with bottom layer ground metal level, and the grounded metal via is by middle ground metal level and bottom
Layer ground metal layer connection；
The upper substrate top layer is additionally provided with top layer ground metal level.
2. radio frequency strip transmission line as claimed in claim 1, it is characterised in that bottom substrate, upper substrate are used
Rogers5880, TLY-5 or Rogers6002 are used as material.
3. radio frequency strip transmission line as claimed in claim 1, it is characterised in that the current-carrying conduction band is included using copper as material
Conduction band body, and the Gold plated Layer for being covered in conduction band body surface.
4. radio frequency strip transmission line as claimed in claim 3, it is characterised in that the conduction band body thickness is 0.5 ~ 1 ounce,
Plated thickness is 1 ~ 4um.
5. radio frequency strip transmission line as claimed in claim 1, it is characterised in that the middle ground metal level includes making with copper
It is the middle ground metal level body of material, and the ground connection Gold plated Layer for being covered in middle ground metal level body surface.
6. radio frequency strip transmission line as claimed in claim 5, it is characterised in that the middle ground metal level body thickness is
0.5 ~ 1 ounce, ground connection plated thickness is 1 ~ 4um.
7. radio frequency strip transmission line as claimed in claim 1, it is characterised in that the radius of the metallic vias is 0.1 ~
0.3mm。
8. radio frequency strip transmission line as claimed in claim 1, it is characterised in that the current-carrying conduction band is banded structure.
9. radio frequency strip transmission line as claimed in claim 8, it is characterised in that the input of the current-carrying conduction band banded structure
End, output end are microstrip line construction, and it is used for the current-carrying conduction band and other devices are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710140045.2A CN106876851A (en) | 2017-03-10 | 2017-03-10 | A kind of radio frequency strip transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710140045.2A CN106876851A (en) | 2017-03-10 | 2017-03-10 | A kind of radio frequency strip transmission line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106876851A true CN106876851A (en) | 2017-06-20 |
Family
ID=59170322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710140045.2A Pending CN106876851A (en) | 2017-03-10 | 2017-03-10 | A kind of radio frequency strip transmission line |
Country Status (1)
| Country | Link |
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| CN (1) | CN106876851A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346808A (en) * | 2018-10-11 | 2019-02-15 | 西安电子科技大学 | The transmission line structure mixed from encapsulation suspended coplanar waveguide with micro-strip based on multilayer |
| CN109390649A (en) * | 2018-10-25 | 2019-02-26 | 深圳市信维通信股份有限公司 | A kind of microwave transmission line |
| CN113270714A (en) * | 2020-01-29 | 2021-08-17 | 上海诺基亚贝尔股份有限公司 | Antenna assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226360A (en) * | 2015-08-24 | 2016-01-06 | 上海交通大学 | Substrate integrated coaxial waveguide interconnection array structure |
| CN105226359A (en) * | 2014-07-09 | 2016-01-06 | 上海交通大学 | The coaxial substrate integration wave-guide interconnection structure in side |
| CN105789804A (en) * | 2016-03-11 | 2016-07-20 | 南京邮电大学 | Broadband transition structure from micro-strip line to folded substrate-integrated waveguide |
| CN206490160U (en) * | 2017-03-10 | 2017-09-12 | 成都雷电微力科技有限公司 | A kind of strip transmission line |
-
2017
- 2017-03-10 CN CN201710140045.2A patent/CN106876851A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226359A (en) * | 2014-07-09 | 2016-01-06 | 上海交通大学 | The coaxial substrate integration wave-guide interconnection structure in side |
| CN105226360A (en) * | 2015-08-24 | 2016-01-06 | 上海交通大学 | Substrate integrated coaxial waveguide interconnection array structure |
| CN105789804A (en) * | 2016-03-11 | 2016-07-20 | 南京邮电大学 | Broadband transition structure from micro-strip line to folded substrate-integrated waveguide |
| CN206490160U (en) * | 2017-03-10 | 2017-09-12 | 成都雷电微力科技有限公司 | A kind of strip transmission line |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346808A (en) * | 2018-10-11 | 2019-02-15 | 西安电子科技大学 | The transmission line structure mixed from encapsulation suspended coplanar waveguide with micro-strip based on multilayer |
| CN109346808B (en) * | 2018-10-11 | 2020-12-08 | 西安电子科技大学 | Transmission line structure based on multilayer self-packaging suspension coplanar waveguide and microstrip mixing |
| CN109390649A (en) * | 2018-10-25 | 2019-02-26 | 深圳市信维通信股份有限公司 | A kind of microwave transmission line |
| CN109390649B (en) * | 2018-10-25 | 2023-10-17 | 深圳市信维通信股份有限公司 | Microwave transmission line |
| CN113270714A (en) * | 2020-01-29 | 2021-08-17 | 上海诺基亚贝尔股份有限公司 | Antenna assembly |
| US11557823B2 (en) | 2020-01-29 | 2023-01-17 | Nokia Shanghai Bell Co., Ltd | Antenna component |
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Application publication date: 20170620 |
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