CN106876541B - A kind of LED encapsulation method uniformly coated based on fluorescent powder - Google Patents
A kind of LED encapsulation method uniformly coated based on fluorescent powder Download PDFInfo
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- CN106876541B CN106876541B CN201710182800.3A CN201710182800A CN106876541B CN 106876541 B CN106876541 B CN 106876541B CN 201710182800 A CN201710182800 A CN 201710182800A CN 106876541 B CN106876541 B CN 106876541B
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- 239000000843 powder Substances 0.000 title claims abstract description 229
- 238000005538 encapsulation Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000012216 screening Methods 0.000 claims abstract description 58
- 239000003292 glue Substances 0.000 claims abstract description 43
- 238000003756 stirring Methods 0.000 claims abstract description 32
- 238000005192 partition Methods 0.000 claims abstract description 31
- 239000006185 dispersion Substances 0.000 claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 238000011049 filling Methods 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 21
- 229920001971 elastomer Polymers 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 238000010792 warming Methods 0.000 claims description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 8
- 150000002910 rare earth metals Chemical class 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 6
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 5
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000004062 sedimentation Methods 0.000 claims description 5
- 239000006228 supernatant Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000007873 sieving Methods 0.000 claims description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 235000019441 ethanol Nutrition 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 claims description 2
- 150000004645 aluminates Chemical class 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000004568 cement Substances 0.000 claims description 2
- WZWSOGGTVQXXSN-UHFFFAOYSA-N cyclohexanone;toluene Chemical compound CC1=CC=CC=C1.O=C1CCCCC1 WZWSOGGTVQXXSN-UHFFFAOYSA-N 0.000 claims description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims description 2
- 229940043265 methyl isobutyl ketone Drugs 0.000 claims description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 claims description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 229940090181 propyl acetate Drugs 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 claims 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims 1
- 229940117389 dichlorobenzene Drugs 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 22
- 238000002955 isolation Methods 0.000 description 8
- 239000007791 liquid phase Substances 0.000 description 8
- 239000011324 bead Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- BVWCFOXBDSMXEP-UHFFFAOYSA-N 1-(5-acetyl-2-methoxyphenyl)-3-methylbutan-1-one Chemical compound COC1=CC=C(C(C)=O)C=C1C(=O)CC(C)C BVWCFOXBDSMXEP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000004816 dichlorobenzenes Chemical class 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- IBIRZFNPWYRWOG-UHFFFAOYSA-N phosphane;phosphoric acid Chemical compound P.OP(O)(O)=O IBIRZFNPWYRWOG-UHFFFAOYSA-N 0.000 description 1
- 238000009700 powder processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
Abstract
The present invention relates to belong to LED encapsulation field, and in particular to a kind of LED encapsulation method uniformly coated based on fluorescent powder.Fluorescent powder is sieved using fluorescent powder partial size screening plant first, a feeding inlet is provided at the top of the screening plant, device is internally provided with the accommodating cavity of a filling dispersion solution, and the feeding inlet is connect with the accommodating cavity, and the accommodating cavity bottom is provided with a stirring rotator；At least one rewinding partition is set on described device outer wall；The rewinding partition is parallel with the bottom of the accommodating cavity.Described device and packaging method are easy to operate, are suitable for large batch of industrial operation.Fluorescent powder partial size consistency is improved, is easy to fluorescent powder and is mixed with encapsulation the uniform of glue, reduce the equipment requirement and operation difficulty of glue stirring technique；The output concentration degree of gained LED is improved, shipment rate is improved, Business Economic Benefit can be obviously improved.
Description
Technical field
The present invention relates to belong to LED encapsulation field, and in particular to a kind of encapsulation side LED uniformly coated based on fluorescent powder
Method.
Background technique
Compared with conventional light source, light emitting diode (LED) is due to high-color rendering (high colour gamut, high color rendering index (CRI)), height
Many advantages, such as brightness, long-life, energy conservation and environmental protection, real-time color be controllable, impact resistance vibration and rapidly developed.Entire
In LED industry chain, LED encapsulation is vital link.Current LED packaging technology mainly include die bond, bonding wire, dispensing,
The techniques such as light splitting, packaging.Wherein, gluing process is that fluorescent powder and encapsulation glue are first mixed to form fluorescent glue, then by fluorescent glue
It is injected into LED support, chip, bonding line in protective cradle.In addition to protection, another important function of gluing process is:
Encapsulate the capable of emitting visible light under the excitation of chip of the fluorescent powder in glue, the light that the light that fluorescent powder issues can be issued with chip
It is mutually compound, and realize the light emitting of different colours, brightness.
During dispensing, the coating uniformity of the fluorescent powder amount and fluorescent powder injected in every LED determines this
Criticize actual color, the brightness output of LED product.Currently, LED encapsulates enterprise when carrying out gluing process, first carrys out buying
Fluorescent powder (usually two or more) is directly mixed with encapsulation glue, then carries out dispensing.But since variety classes are glimmering
Light powder diameter is not of uniform size；Fluorescent powder even of the same race, particle diameter distribution is also uneven, and (particle size distribution range is big, fluorescent powder
Particle big one is inconsistent).And fluorescent powder partial size is inconsistent or particle size range is too wide, fluorescent powder is just difficult to encapsulation glue
It is uniformly mixed.Mixing unevenly will lead in dispensing, and the fluorescent glue volume injected in every LED is identical, but practical glimmering
Fluorescent powder amount in optical cement will appear difference, meanwhile, fluorescent powder is difficult to be difficult to realize uniformly coat in bracket.Finally, it is criticizing
When amount production, since difference occurs in the amount of fluorescent powder, intrinsic brilliance, the color that will lead to encapsulation gained LED product become
Change, to reduce the output concentration degree of batch production.
Summary of the invention
For this purpose, technical problem to be solved by the present invention lies in the bottlenecks for overcoming the prior art, to propose that one kind is based on
The LED encapsulation method that fluorescent powder uniformly coats.
In order to solve the above technical problems, the invention discloses a kind of LED encapsulation method uniformly coated based on fluorescent powder, it is first
Fluorescent powder is first sieved using fluorescent powder partial size screening plant, is provided with a feeding inlet at the top of the screening plant, inside device
It is provided with the accommodating cavity of a filling dispersion solution, the feeding inlet is connect with the accommodating cavity, the accommodating cavity bottom setting
There is a stirring rotator；At least one rewinding partition is set on described device outer wall；The rewinding partition and the accommodating cavity
Bottom is parallel.
Preferably, at least two socket is provided on the accommodating cavity of described device, the rewinding partition is pacified by the socket
If on such devices.
Preferably, 2~20 dry and ventilated mouths are additionally provided in described device.
Preferably, the dispersion solution is water, ethyl alcohol, benzene,toluene,xylene, pentane, hexane, octane, hexamethylene, ring
Hexanone, toluene cyclohexanone, chlorobenzene, dichloro-benzenes, methylene chloride, methanol, isopropanol, ether, propylene oxide, methyl acetate, acetic acid
Ethyl ester, propyl acetate, acetone, espeleton, methylisobutylketone, glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol only son
At least one of ether, acetonitrile, pyridine, phenol.
Preferably, steps are as follows for the LED encapsulation method uniformly coated based on fluorescent powder:
1) by the first fluorescent powder from being poured into feeding inlet in the liquid phase fluorescent powder partial size screening plant；
2) stirring rotator started in the liquid phase fluorescent powder partial size screening plant is stirred, and keeps the first fluorescent powder uniform
It is distributed in dispersion solution；
4) stirring rotator is closed, the first fluorescent powder free settling is made, forms the first fluorescent powder mixed liquor；
5) it is inserted into rewinding partition and the first fluorescent powder mixed liquor obtained by step 4) is isolated；
6) the first fluorescent powder mixed liquor that processing will be isolated obtained by step 5) carries out stewing process, make to keep apart the
One fluorescent powder continues sufficiently sedimentation；
7) all dry and ventilated mouths of screening plant are opened, the supernatant liquor of every layer of mixed liquor is discharged, then, alignment
The dry and ventilated mouth for sieving the separating device is blowed, and keeps first fluorescent powder on every layer of rewinding partition abundant
It is dry；
8) respectively collection step 7) gained every layer of rewinding partition on first fluorescent powder, complete the first fluorescence
The screening of powder；
9) take the second fluorescent powder, repeat the above steps 2)~8) mode, complete the second fluorescent powder screening；
10) belong to the first fluorescent powder on same level-one rewinding partition and second glimmering after taking in step 8) and step 9) after screening
Light powder, the mass ratio of the two are 0.01~100:1；Then the two is collectively disposed in encapsulation glue, forms rubber powder mixture；Institute
The mass ratio for stating the gross mass of both the first fluorescent powder and the second fluorescent powder and the rubber powder mixture of formation is 0.01~
0.80:1；
11) rubber powder mixture obtained by step 10) is stirred, mixes rubber powder mixture uniformly, is stirred evenly
Fluorescent glue.Described 20~40 DEG C of stirring built-in temperature, vacuum degree is 0~2.6Kpa in blender, and blender centrifugal rotational speed is
320~1600rpm/min, mixing time are 45~1500S.
12) instillation of fluorescent glue obtained by step 11) has been fixed in the bracket of LED chip, the fluorescence of instillation
Glue total volume accounts for the 77~100% of LED support volume；
13) LED support obtained by step 12) is subjected to baking processing, solidifies fluorescent glue sufficiently, be cooled to room temperature to get
LED lamp bead.
Preferably, for the first fluorescent powder particle size at 0.1~100 μm, the wavelength of transmitted light of the first fluorescent powder is 480
~550nm, transmitting light color are blue, blue-green or green；The second fluorescent powder particle size is at 0.2~140 μm, second
The wavelength of transmitted light of fluorescent powder is 550~680nm, and transmitting light color is yellow, orange or red.
Preferably, first fluorescent powder and second fluorescent powder be rare earth doped silicate, aluminate,
Phosphate, nitride, fluoride inorganic fluorescent powder.
Preferably, the baking processing specifically: first with the heating rate of 1~9 DEG C/min, be warming up to 45~115 DEG C, in advance
Toast 0.5~8h；Again with the heating rate of 1~6 DEG C/min, it is warming up to 115~260 DEG C again, toasts 1~16h.
Preferably, the LED chip is the ultraviolet light or blue chip that wavelength of transmitted light is 230~480nm.
More preferably, viscosity >=1100mPaS of the encapsulation glue mixing, is epoxies packaging plastic, organic silicon
One of packaging plastic, polyurethane packaging plastic.
The above technical solution of the present invention has the following advantages over the prior art:
(1) operation of the present invention is simple, using liquid phase fluorescent powder partial size screening plant carry out fluorescent powder processing, can according to
Grain particle size carries out automatic sieving to fluorescent powder, is suitable for large batch of industrial operation.
(2) present invention carries out partial size screening to fluorescent powder using liquid phase fluorescent powder partial size screening plant, improves fluorescent powder
Grain diameter consistency is easy to fluorescent powder and mixes with encapsulation the uniform of glue, so that the equipment for reducing glue stirring technique is wanted
It asks and operation difficulty.
(3) present invention carries out partial size screening process to fluorescent powder, mixed uniformly fluorescent glue is obtained, thus in dispensing
In the process, fluorescent powder amount in injection LED lamp bead can be effectively controlled, ensure that the uniform coating of fluorescent powder, to improve encapsulation
The output concentration degree of gained LED product improves encapsulation enterprise's shipment rate, can be obviously improved Business Economic Benefit.
Detailed description of the invention
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is that screening plant process schematic is added in first fluorescent powder in embodiment 1.
Fig. 2 is the second fluorescent powder infall process schematic diagram in embodiment 2.
Fig. 3 is the first fluorescent powder mixed liquor isolation processes schematic diagram in embodiment 4.
Fig. 4 is the first fluorescent powder secondary settlement process schematic in embodiment 3.
Fig. 5 is solution discharge process schematic diagram in embodiment 6.
Fig. 6 is the first fluorescent powder drying course schematic diagram in embodiment 5.
Fig. 7 is the second fluorescent powder schematic diagram collected after screening in embodiment 4.
Fig. 8 is ungarbled first fluorescent powder partial size distribution histogram in embodiment 2.
Fig. 9 is the second fluorescent powder partial size distribution histogram after sieving in embodiment 3.
Figure 10 is the emission spectrum of 3 gained LED lamp bead of embodiment.
Figure 11 is the emission spectrum of 6 gained LED lamp bead of embodiment.
Appended drawing reference indicates in figure are as follows: 1- feeding inlet；2- dry and ventilated mouth；3- accommodating cavity；4- stirring rotator；5- rewinding every
Plate.
Specific embodiment
Embodiment 1 (is specifically shown in Fig. 1-11 based on the LED encapsulation method that fluorescent powder uniformly coats present embodiment discloses a kind of
It is shown), the method processing step is as follows:
1) fluorescent powder is sieved using fluorescent powder partial size screening plant first, is provided with a pan feeding at the top of the screening plant
Mouth 1, device are internally provided with the accommodating cavity 3 of a filling dispersion solution, and the feeding inlet 2 is connect with the accommodating cavity 3, described
2 bottom of accommodating cavity is provided with a stirring rotator 4；At least one rewinding partition 5 is set on described device outer wall；The rewinding every
Plate 5 is parallel with the bottom of the accommodating cavity 3.
According to the fluorescent powder of different-grain diameter (weight), decrease speed is different in dispersion liquid, will be mixed with the solution of fluorescent powder by
According to isolation isolation is highly carried out, to realize the screening of fluorescent powder partial size.Wherein, dispersion solution is water and methanol, dry and ventilated
Mouth quantity is 20.
2) suitable dispersion solution is injected in screening plant, then taking suitable first fluorescent powder, (the first fluorescent powder is
Rare earth doped silicate fluorescent powder material, the first fluorescent powder particle size is between 0.1~100 μm, the first fluorescent powder
Wavelength of transmitted light be 480nm, transmitting light color be blue) poured into screening plant from feeding inlet.
3) stirring rotator for starting liquid phase fluorescent powder partial size screening plant, the revolving speed for controlling stirring rotator is 2200rpm/
Min, stirring rotator working time are 2min, are uniformly distributed in the first fluorescent powder in dispersion solution.
4) stirring rotator is closed, 350S is stood, makes the first fluorescent powder free settling, forms the first fluorescent powder mixed liquor.
5) rewinding partition is inserted into each socket, by the first fluorescent powder mixed liquor obtained by step 4) according to high degree of isolation.
6) by step 5) gained, segregate first fluorescent powder mixed liquor stands 30h, makes the first fluorescent powder kept apart
Continue sufficiently sedimentation (secondary settlement), until every layer of mixed liquor upper liquid is as clear as crystal.
7) opening steps 6) resulting first fluorescent powder settle completely after all dry and ventilated mouths of screening plant, by every layer
The supernatant liquor of mixed liquor is discharged.Then, the dry and ventilated mouth of starting air blower alignment screening plant, controls in screening plant
Wind speed is 4m/S, and temperature is 45 DEG C, keeps the first fluorescent powder on every layer of rewinding partition sufficiently dry.
8) collection step 7 respectively) the first fluorescent powder on every layer of rewinding partition of gained, i.e., the is completed according to particle size
The screening of one fluorescent powder.
9) take appropriate second fluorescent powder (the second fluorescent powder can for rare earth doped nitride phosphor material, the
For two fluorescent powder particle sizes between 10~140 μm, the wavelength of transmitted light of the second fluorescent powder is 550nm, and transmitting light color is Huang
Color), repeat the above steps 2)~8) mode, the screening and collection of the second fluorescent powder of different-grain diameter can be completed.
10) it weighs respectively and belongs to same level-one receipts after being separated in a certain amount of step 8) and step 9) according to particle size range
Expect the first fluorescent powder and the second fluorescent powder on partition, control the quality of the first fluorescent powder: quality=0.5 of the second fluorescent powder:
1.First fluorescent powder and the second fluorescent powder are collectively disposed in encapsulation glue, rubber powder mixture is formed.(it is mixed wherein, to encapsulate glue
Viscosity >=1500mPaS is closed, encapsulation glue is organic silicon packaging plastic.) control fluorescent powder quality: rubber powder mixture (fluorescence
Powder and encapsulation glue) gross mass=0.44:1.
11) rubber powder mixture obtained by step 10) is placed in automatic agitator, 40 DEG C of built-in temperature of control stirring,
Vacuum degree is 2.6Kpa in blender, and blender centrifugal rotational speed is 1600rpm/min, mixing time 1500S.
12) instillation of fluorescent glue obtained by step 11) has been fixed in the bracket of LED chip to (LED chip is transmitting light
Wavelength is the UV chip of 230nm), the fluorescent glue total volume for controlling instillation accounts for the 100% of LE D bracket volume.
13) LED support obtained by step 12) is placed in baking oven, first with the heating rate of 9 DEG C/min, is warming up to 115 DEG C,
Prebake conditions 8h；Again with the heating rate of 6 DEG C/min, it is warming up to 220 DEG C again, toasts 1h, solidifies fluorescent glue sufficiently, it is cold with furnace
But to taking-up after room temperature to get LED lamp bead.
Present embodiment discloses a kind of LED encapsulation method uniformly coated based on fluorescent powder, the method techniques for embodiment 2
Steps are as follows:
1) fluorescent powder is sieved using fluorescent powder partial size screening plant first, is provided with a pan feeding at the top of the screening plant
Mouth 1, device are internally provided with the accommodating cavity 3 of a filling dispersion solution, and the feeding inlet 2 is connect with the accommodating cavity 3, described
2 bottom of accommodating cavity is provided with a stirring rotator 4；At least one rewinding partition 5 is set on described device outer wall；The rewinding every
Plate 5 is parallel with the bottom of the accommodating cavity 3.
According to the fluorescent powder of different-grain diameter (weight), decrease speed is different in dispersion liquid, will be mixed with the solution of fluorescent powder by
According to isolation isolation is highly carried out, to realize the screening of fluorescent powder partial size.Wherein, dispersion solution is ethyl alcohol, dry and ventilated mouth number
Amount is 4.
2) suitable dispersion solution is injected in screening plant, then taking suitable first fluorescent powder, (the first fluorescent powder is
Rare earth doped nitride phosphor material, the first fluorescent powder particle size is between 1~65 μm, the hair of the first fluorescent powder
Penetrate between a length of 520nm of light wave, transmitting light color is green) it is poured into screening plant from feeding inlet.
3) stirring rotator for starting liquid phase fluorescent powder partial size screening plant, the revolving speed for controlling stirring rotator is 150rpm/
Min, stirring rotator working time are 25min, are uniformly distributed in the first fluorescent powder in dispersion solution.
4) stirring rotator is closed, 35S is stood, makes the first fluorescent powder free settling, forms the first fluorescent powder mixed liquor.
5) rewinding partition is inserted into each socket, by the first fluorescent powder mixed liquor obtained by step 4) according to high degree of isolation.
6) by segregate first fluorescent powder mixed liquor stands 4h obtained by step 5), make the first fluorescent powder kept apart after
Continuous sufficiently sedimentation (secondary settlement), until every layer of mixed liquor upper liquid is as clear as crystal.
7) opening steps 6) resulting first fluorescent powder settle completely after all dry and ventilated mouths of screening plant, by every layer
The supernatant liquor of mixed liquor is discharged.Then, the dry and ventilated mouth of starting air blower alignment screening plant, controls in screening plant
Wind speed is 0.25m/S, and temperature is 35 DEG C, keeps the first fluorescent powder on every layer of rewinding partition sufficiently dry.
8) collection step 7 respectively) the first fluorescent powder on every layer of rewinding partition of gained, i.e., the is completed according to particle size
The screening of one fluorescent powder.
9) taking appropriate second fluorescent powder, (the second fluorescent powder can be the inorganic fluorescent powders materials such as rare earth doped fluoride
Material, for the second fluorescent powder particle size between 0.2~115 μm, the wavelength of transmitted light of the second fluorescent powder is 670nm, emits light face
Color be red), repeat the above steps 2)~8) mode, the screening and collection of the second fluorescent powder of different-grain diameter can be completed.
10) it weighs respectively and belongs to same level-one receipts after being separated in a certain amount of step 8) and step 9) according to particle size range
Expect the first fluorescent powder and the second fluorescent powder on partition, control the quality of the first fluorescent powder: quality=0.8 of the second fluorescent powder:
1.First fluorescent powder and the second fluorescent powder are collectively disposed in encapsulation glue, rubber powder mixture is formed.(it is mixed wherein, to encapsulate glue
Viscosity >=1250mPaS is closed, encapsulation glue is epoxies packaging plastic.) control fluorescent powder quality: rubber powder mixture (fluorescent powder
With encapsulation glue) gross mass=0.73:1.
11) rubber powder mixture obtained by step 10) is placed in automatic agitator, 33 DEG C of built-in temperature of control stirring,
Vacuum degree is 0.5Kpa in blender, and blender centrifugal rotational speed is 450rpm/min, mixing time 420S.
12) instillation of fluorescent glue obtained by step 11) has been fixed in the bracket of LED chip to (LED chip is transmitting light
Wavelength is the blue chip of 460nm), the fluorescent glue total volume for controlling instillation accounts for the 91% of LED support volume.
13) LED support obtained by step 12) is placed in baking oven, first with the heating rate of 4 DEG C/min, is warming up to 105 DEG C,
Prebake conditions 0.5h；Again with the heating rate of 3 DEG C/min, it is warming up to 225 DEG C again, toasts 2h, solidifies fluorescent glue sufficiently, with furnace
It takes out after being cooled to room temperature to get LED lamp bead.
Present embodiment discloses a kind of LED encapsulation method uniformly coated based on fluorescent powder, the method techniques for embodiment 3
Steps are as follows:
1) a kind of liquid phase fluorescent powder partial size screening plant, including feeding inlet, dry and ventilated mouth, dispersion solution, stirring rotator
And the parts such as rewinding partition, stirring rotator are placed in dispersion solution, each dry and ventilated mouth has socket.According to different grains
The fluorescent powder of diameter (weight) decrease speed in dispersion liquid is different, by the solution for being mixed with fluorescent powder according to be highly isolated every
From to realize the screening of fluorescent powder partial size.Dispersion solution is the inorganic and organic solution of water, dichloro-benzenes, glycol monoethyl ether,
Dry and ventilated mouth quantity is 13.
2) suitable dispersion solution is injected in screening plant, then taking suitable first fluorescent powder, (the first fluorescent powder can
Think rare earth doped phosphate phosphor material, the first fluorescent powder particle size is between 4~75 μm, the first fluorescent powder
Wavelength of transmitted light be 510nm) poured into screening plant from feeding inlet.
3) stirring rotator for starting liquid phase fluorescent powder partial size screening plant, the revolving speed for controlling stirring rotator is 220rpm/
Min, stirring rotator working time are 20min, are uniformly distributed in the first fluorescent powder in dispersion solution.
4) stirring rotator is closed, 45S is stood, makes the first fluorescent powder free settling, forms the first fluorescent powder mixed liquor.
5) rewinding partition is inserted into each socket, by the first fluorescent powder mixed liquor obtained by step 4) according to high degree of isolation.
6) by segregate first fluorescent powder mixed liquor stands 3h obtained by step 5), make the first fluorescent powder kept apart after
Continuous sufficiently sedimentation (secondary settlement), until every layer of mixed liquor upper liquid is as clear as crystal.
7) opening steps 6) resulting first fluorescent powder settle completely after all dry and ventilated mouths of screening plant, by every layer
The supernatant liquor of mixed liquor is discharged.Then, the dry and ventilated mouth of starting air blower alignment screening plant, controls in screening plant
Wind speed is 2.5, and temperature is 25 DEG C, keeps the first fluorescent powder on every layer of rewinding partition sufficiently dry.
8) collection step 7 respectively) the first fluorescent powder on every layer of rewinding partition of gained, i.e., the is completed according to particle size
The screening of one fluorescent powder.
9) taking appropriate second fluorescent powder, (the second fluorescent powder is rare earth doped thioaluminate phosphor powder material, and second is glimmering
Light powder particle size is between 1.8~95 μm, and for the wavelength of transmitted light of the second fluorescent powder between 631nm, transmitting light color is red
Color), repeat the above steps 2)~8) mode, the screening and collection of the second fluorescent powder of different-grain diameter can be completed.
10) it weighs respectively and belongs to same level-one receipts after being separated in a certain amount of step 8) and step 9) according to particle size range
Expect the first fluorescent powder and the second fluorescent powder on partition, controls the quality of the first fluorescent powder: quality=41:1 of the second fluorescent powder.
First fluorescent powder and the second fluorescent powder are collectively disposed in encapsulation glue, rubber powder mixture is formed and (it is viscous wherein, to encapsulate glue mixing
Degree >=2300mPaS, encapsulation glue can be epoxies packaging plastic).Control the quality of fluorescent powder: rubber powder mixture (fluorescent powder
With encapsulation glue) gross mass=0.52:1.
11) rubber powder mixture obtained by step 10) is placed in automatic agitator, 31 DEG C of built-in temperature of control stirring,
Vacuum degree is 0.3Kpa in blender, and blender centrifugal rotational speed is 1000rpm/min, mixing time 600S.
12) instillation of fluorescent glue obtained by step 11) has been fixed in the bracket of LED chip to (LED chip is transmitting light
Wavelength is the blue chip of 445nm), the fluorescent glue total volume for controlling instillation accounts for the 82% of LED support volume.
13) LED support obtained by step 12) is placed in baking oven, first with the heating rate of 8 DEG C/min, is warming up to 55 DEG C, in advance
Toast 6h；Again with the heating rate of 5 DEG C/min, it is warming up to 200 DEG C again, toasts 3h, solidifies fluorescent glue sufficiently, furnace cooling
It takes out after to room temperature to get LED lamp bead.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (9)
1. a kind of LED encapsulation method uniformly coated based on fluorescent powder, which is characterized in that first using fluorescent powder partial size screening dress
Screening fluorescent powder is set, a feeding inlet is provided at the top of the screening plant, device is internally provided with a filling dispersion solution
Accommodating cavity, the feeding inlet connect with the accommodating cavity, and the accommodating cavity bottom is provided with a stirring rotator；Described device
At least one rewinding partition is set on outer wall；The rewinding partition is parallel with the bottom of the accommodating cavity；According to different-grain diameter or
The fluorescent powder of weight decrease speed in dispersion liquid is different, by the solution for being mixed with fluorescent powder according to being highly isolated, thus real
The screening of existing fluorescent powder partial size；
The packaging method includes the following steps:
1) by the first fluorescent powder from being poured into feeding inlet in the fluorescent powder partial size screening plant；
2) stirring rotator started in the fluorescent powder partial size screening plant is stirred, and is uniformly distributed in the first fluorescent powder point
It dissipates in solution；
4) stirring rotator is closed, the first fluorescent powder free settling is made, forms the first fluorescent powder mixed liquor；
5) rewinding partition is inserted into the first fluorescent powder mixed liquor and is isolated；
6) the first fluorescent powder mixed liquor that processing will be isolated obtained by step 5) carries out stewing process, makes keep apart first glimmering
Light powder continues sufficiently sedimentation；
7) all dry and ventilated mouths of screening plant are opened, the supernatant liquor of every layer of mixed liquor are discharged, then, described in alignment
The dry and ventilated mouth of screening plant is blowed, and keeps first fluorescent powder on every layer of rewinding partition sufficiently dry
It is dry；
8) respectively collection step 7) gained every layer of rewinding partition on first fluorescent powder, complete the first fluorescent powder
Screening；
9) take the second fluorescent powder, repeat the above steps 2)~8) mode, complete the second fluorescent powder screening；
10) belong to the first fluorescent powder and the second fluorescence on same level-one rewinding partition after taking after sieving in step 8) and step 9)
Powder, the mass ratio of the two are 0.01~100:1；Then the two is collectively disposed in encapsulation glue, forms rubber powder mixture；It is described
The mass ratio for stating the gross mass of both the first fluorescent powder and the second fluorescent powder and the rubber powder mixture of formation is 0.01~
0.80:1；
11) rubber powder mixture obtained by step 10) is stirred, mixes rubber powder mixture uniformly, obtain stir evenly it is glimmering
Optical cement, described 20~40 DEG C of stirring built-in temperature, in blender vacuum degree be 0~2.6Kpa, blender centrifugal rotational speed be 320~
1600rpm/min, mixing time are 45~1500S；
12) instillation of fluorescent glue obtained by step 11) has been fixed in the bracket of LED chip, the fluorescent glue of instillation is total
Volume accounts for the 77~100% of LED support volume；
13) LED support obtained by step 12) is subjected to baking processing, solidifies fluorescent glue sufficiently, is cooled to room temperature to get LED light
Pearl.
2. the LED encapsulation method uniformly coated based on fluorescent powder as described in claim 1, which is characterized in that described device
At least two socket is provided on accommodating cavity, the rewinding partition is installed on such devices by the socket.
3. the LED encapsulation method uniformly coated based on fluorescent powder as claimed in claim 2, which is characterized in that in described device
It is additionally provided with 2~20 dry and ventilated mouths.
4. the LED encapsulation method uniformly coated based on fluorescent powder as claimed in claim 3, which is characterized in that the dispersion is molten
Liquid is water, ethyl alcohol, benzene,toluene,xylene, pentane, hexane, octane, hexamethylene, cyclohexanone, toluene cyclohexanone, chlorobenzene, dichloro
Benzene, methylene chloride, methanol, isopropanol, ether, propylene oxide, methyl acetate, ethyl acetate, propyl acetate, acetone, methyl fourth
Ketone, methylisobutylketone, glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, acetonitrile, pyridine, at least one in phenol
Kind.
5. the LED encapsulation method uniformly coated based on fluorescent powder as claimed in claim 4, which is characterized in that described first is glimmering
For light powder particle size at 0.1~100 μm, the wavelength of transmitted light of the first fluorescent powder is 480~550nm, transmitting light color be blue,
Blue-green or green；The second fluorescent powder particle size at 0.2~140 μm, the wavelength of transmitted light of the second fluorescent powder is 550~
680nm, transmitting light color are yellow, orange or red.
6. the LED encapsulation method uniformly coated based on fluorescent powder as claimed in claim 5, which is characterized in that described first is glimmering
Light powder and second fluorescent powder are that rare earth doped silicate, aluminate, phosphate, nitride, fluoride are inorganic
Fluorescent powder.
7. the LED encapsulation method uniformly coated based on fluorescent powder as claimed in claim 6, which is characterized in that at the baking
Reason specifically: first with the heating rate of 1~9 DEG C/min, be warming up to 45~115 DEG C, 0.5~8h of prebake conditions；Again with 1~6 DEG C/
The heating rate of min is warming up to 115~260 DEG C again, toasts 1~16h.
8. the LED encapsulation method uniformly coated based on fluorescent powder as claimed in claim 7, which is characterized in that the LED chip
It is the ultraviolet light or blue chip that wavelength of transmitted light is 230~480nm.
9. the LED encapsulation method uniformly coated based on fluorescent powder as claimed in claim 8, which is characterized in that the packaging plastic
Viscosity >=1100mPa S of water mixing is one of epoxies packaging plastic, organic silicon packaging plastic, polyurethane packaging plastic.
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| CN102712013A (en) * | 2010-04-23 | 2012-10-03 | 日清工程株式会社 | Method for classifying powder |
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