CN106843320A - A kind of spray drying device temperature control system of microencapsulation material - Google Patents
A kind of spray drying device temperature control system of microencapsulation material Download PDFInfo
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- CN106843320A CN106843320A CN201710200222.1A CN201710200222A CN106843320A CN 106843320 A CN106843320 A CN 106843320A CN 201710200222 A CN201710200222 A CN 201710200222A CN 106843320 A CN106843320 A CN 106843320A
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- 238000001694 spray drying Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 title claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 230000001012 protector Effects 0.000 claims abstract description 12
- 239000003990 capacitor Substances 0.000 claims description 59
- 238000006243 chemical reaction Methods 0.000 claims description 44
- 238000001035 drying Methods 0.000 abstract description 15
- 238000004088 simulation Methods 0.000 abstract description 11
- 230000006870 function Effects 0.000 abstract description 5
- 238000007711 solidification Methods 0.000 abstract description 4
- 230000008023 solidification Effects 0.000 abstract description 4
- 239000003094 microcapsule Substances 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 241001125929 Trisopterus luscus Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
- B01J13/02—Making microcapsules or microballoons
- B01J13/04—Making microcapsules or microballoons by physical processes, e.g. drying, spraying
- B01J13/043—Drying and spraying
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Fire-Detection Mechanisms (AREA)
- Networks Using Active Elements (AREA)
Abstract
The invention discloses a kind of spray drying device temperature control system of microencapsulation material; it is characterized in that; mainly by single-chip microcomputer; data memory module, buzzer, display screen, relay and the signal processing unit being connected with single-chip microcomputer; the overvoltage protector being connected with relay; the transmitter being connected with signal processing unit, and the thermocouple composition being connected with transmitter.Thermocouple of the invention is monitored to the temperature in drying chamber, and the DC simulation signal linear with temperature signal is converted into the signal that thermocouple is input into by transmitter, signal processing unit of the invention can be processed current signal, monolithic function is set to receive accurate signal, ensure that the present invention can be accurately processed the temperature signal for receiving, effectively the temperature in drying chamber is accurately controlled, makes the Solidification Quality of wall material higher, heartwood is difficult to be damaged.
Description
Technical field
It is that a kind of spray drying device of microencapsulation material is used specifically the present invention relates to a kind of temperature control system
Temperature control system.
Background technology
Microcapsules technology (Microencapsulation) is the technology during micro substance is wrapped in thin polymer film, is one
Plant store solids, liquid, the microdisplay package technology of gas.With continuing to develop for microcapsules technology, the drying equipment of microcapsules
Also constantly increasing, spray drying microcapsules equipment is then the one kind in the drying equipment of numerous microcapsules.Spray drying is micro-
Capsule device be one kind can and meanwhile heartwood is wrapped up with dry equipment, i.e., spray drying be that emulsion is placed in high temperature
In drier, emulsion is atomized into by small drop by fog-spray nozzle, drop is sufficiently contacted with the hot-air in drier
When, the moisture of dissolving wall material evaporates rapidly after being heated, and solidifies wall material, so as to heartwood be wrapped up.And this spray drying
Microcapsules equipment heartwood is wrapped up with dry quality, then whether the temperature depending on hot-air in the hothouse of equipment steady
It is fixed.
However, the signal transacting that is transmitted to thermocouple of temperature control system of existing spray drying microcapsules equipment
Effect is poor, causes temperature control system certain error occur to the temperature control in hothouse, causes the solidification matter of wall material
Amount is not high, and heartwood is easily damaged.
The content of the invention
It is an object of the invention to overcome the temperature control system of existing spray drying microcapsules equipment to thermocouple institute
The poor defect of the accuracy of the signal transacting of transmission, there is provided a kind of microencapsulation material spray drying device temperature control
System.
The present invention is achieved through the following technical solutions：A kind of spray drying device of microencapsulation material temperature control system
System, mainly by single-chip microcomputer, data memory module, buzzer, display screen, relay and the signal transacting being connected with single-chip microcomputer
Unit, the overvoltage protector being connected with relay, the transmitter being connected with signal processing unit, and be connected with transmitter
The thermocouple composition for connecing；The signal frequency amplifying circuit that the signal processing unit is connected by input with transmitter, input
The integrating circuit that end is connected with the output end of signal frequency amplifying circuit, and be connected with the output end of input integrating circuit
The A/D converter circuit composition for connecing；The output end of the A/D converter circuit is connected with single-chip microcomputer.
The signal frequency amplifying circuit by triode VT1, negative pole after resistance R1 with being connected of triode VT1, just
The polar capacitor C2 that pole is connected with the emitter stage of triode VT1, one end is connected with the negative pole of polar capacitor C2, the other end with
The resistance R2 that the base stage of triode VT1 is connected, negative pole is connected with the base stage of triode VT1, positive pole after resistance R3 with three
Polar capacitor C1, the P pole that the emitter stage of pole pipe VT1 is connected is connected with the positive pole of polar capacitor C1, the diode of N poles ground connection
D1, the polar capacitor C3 that positive pole is connected with the positive pole of polar capacitor C1, negative pole is connected with the N poles of diode D1, one end with
The adjustable resistance R4 being grounded after the colelctor electrode of triode VT1 is connected, the other end is connected with the negative pole of polar capacitor C2, and
One end is connected with the colelctor electrode of triode VT1, the other end as signal frequency amplifying circuit output end and and integrating circuit
The inductance L compositions being connected；The negative pole of the polar capacitor C2 is connected with transmitter；The positive pole of the polar capacitor C3 also with
Outside 12V dc sources are connected.
By amplifier P, one end is connected the output of the other end and amplifier P the integrating circuit with the positive pole of amplifier P
The resistance R5 that end is connected, the polarity that positive pole is connected with the positive pole of amplifier P, negative pole is connected with the output end of amplifier P
Electric capacity C4, and P poles are connected with the output end of amplifier P, N poles are connected with the negative pole of amplifier P after resistance R6 and are followed by
The diode D2 compositions on ground；Colelctor electrode of the positive pole of the amplifier P with triode VT1 after inductance L is connected, the amplifier
The output end of P as integrating circuit output end and be connected with A/D converter circuit.
The A/D converter circuit by conversion chip U, triode VT2, one end is connected with the output end of amplifier P, another
The resistance R7 that is connected with the IN pins of conversion chip U of end, positive pole is connected with the A/C pins of conversion chip U, negative pole and conversion
The polar capacitor C5 that the GND pins of chip U are connected, positive pole is connected after resistance R8 with the negative pole of polar capacitor C5, negative pole
The polar capacitor C6 being connected with the THR pins of conversion chip U, one end is connected with the REN pins of conversion chip U, the other end
The resistance R9 being connected with the base stage of triode VT2, positive pole is connected with the colelctor electrode of triode VT2, negative pole and conversion chip U
THR pins be connected after polar capacitor C8, the P pole that is grounded be connected with the emitter stage of triode VT2, N poles and triode VT2
The diode D3 that is connected of base stage, and positive pole be connected with the REN pins of conversion chip U, negative pole after resistance R10 with three
The polar capacitor C7 compositions that the emitter stage of pole pipe VT2 is connected；The negative pole ground connection of the polar capacitor C5；The triode VT2
Base stage be also connected with the REWN pins of conversion chip U, the emitter stage of triode VT2 as A/D converter circuit output end
And be connected with single-chip microcomputer；The VS pins of the conversion chip U2 are connected with+5V the dc sources of outside, conversion chip U2
A/C pins be also connected with outside -5V dc sources.
For practical effect of the invention, the conversion chip U is LM3312 integrated chips.
The present invention compared with prior art, with advantages below and beneficial effect：
(1) simple structure of the invention, practical, and thermocouple of the invention is monitored to the temperature in drying chamber,
And the DC simulation signal linear with temperature signal is converted into the signal that thermocouple is input into by transmitter, it is of the invention
Signal processing unit can be processed current signal, monolithic function is received accurate signal, ensure that the present invention
The temperature signal for receiving can accurately be processed, effectively the temperature in drying chamber is accurately controlled, be made wall material
Solidification Quality it is higher, heartwood is difficult to be damaged.
(2) signal processing unit of the invention is provided with signal frequency amplifying circuit and integrating circuit and AD conversion electricity
Road, its signal frequency amplifying circuit can be adjusted to the Slight undulations of signal frequency and bandwidth, after integrating circuit can be to adjustment
Signal be integrated, make signal with stabilization；And A/D converter circuit can carry out Frequency mixing processing to signal, and signal is accurately turned
It is changed to data-signal, it is ensured that monolithic function receives accurate information, ensures that the temperature that the present invention can be to receiving is believed
Number accurately processed.
(3) overvoltage protection is carried out to the voltage for exporting present invention employs overvoltage protector, it is negative so as to be effectively prevented
Load is damaged by high voltage.
Brief description of the drawings
Fig. 1 is entire block diagram of the invention.
Fig. 2 is the electrical block diagram of signal processing unit of the invention.
Specific embodiment
The present invention is described in further detail with reference to embodiment and its accompanying drawing, but embodiments of the present invention are not
It is limited to this.
Embodiment
It is the data memory module being connected with single-chip microcomputer, buzzer, aobvious as shown in figure 1, the present invention is main by single-chip microcomputer
Display screen, relay and signal processing unit, the overvoltage protector being connected with relay, the change being connected with signal processing unit
Device is sent, and the thermocouple composition being connected with transmitter.Wherein, the signal processing unit as shown in Fig. 2 its by signal frequently
Rate amplifying circuit and integrating circuit and A/D converter circuit composition.
During implementation, single-chip microcomputer of the invention employs AT89C51 single-chip microcomputers to realize, the P1 pins and data of the single-chip microcomputer
Memory module is connected, and P3 pins are connected with display screen, and P1.4 pins are connected with buzzer, RESET pins and restorer
It is connected, P0 pins are connected with signal processing unit, P1.5 pins are connected with relay, VCC pins and external power source phase
Connection.External power source of the invention is 6V DC voltages, and the 6V DC voltages are powered to single-chip microcomputer.Wherein, relay is employed
The MGR-1D4860 type single-phase solid relays of your production of MAG, the environment temperature of the relay is -30 DEG C~+75 DEG C, and it makes
With lasting a long time.Overvoltage protector of the invention is connected with the heater of spray drying device.
Thermocouple of the invention employs the WRET-01 type thermocouples of Shanghai Wo Lan finite instruments company production, the thermoelectricity
Occasionally it is arranged in drying chamber, for being monitored to the temperature in drying chamber, the resistance of thermocouple can be with drying cavity temperature
Change and change, i.e., thermocouple output signal can change with the change for drying cavity temperature, thermocouple passes signal
It is defeated by transmitter.The transmitter employs the transmitter of the WP-9077 series of Fujian Shang Run companies production, and transmitter is to thermocouple
The signal of input is converted into the DC simulation signal linear with temperature signal, transmitter and by the DC simulation signal after conversion
It is transferred to signal processing unit.Signal processing unit is adjusted to the Slight undulations of signal frequency and bandwidth, can be to adjustment after
Signal be integrated, make signal with stabilization；And Frequency mixing processing is carried out to signal, and signal is accurately converted to data letter
Number, the data signal transmission after conversion to single-chip microcomputer, effectively ensure that monolithic function is received accurately by signal processing unit
Information.Data identifier in the single-chip microcomputer obtains a temperature value after processing data-signal, the ratio in single-chip microcomputer
The temperature value that will be obtained compared with device is compared with the temperature value of data memory module memory storage.Data memory module of the invention is adopted
The AS01-ML01DP3 data memory modules produced with Liao Zeyao scientific ＆ technical corporation, prestore emulsification liquid mist in the data memory module
Change the storage temperature value needed for being dried with wall material solidification.
When the temperature value that single-chip microcomputer is obtained is less than the temperature value prestored in data memory module, single-chip microcomputer then output control
Electric current to relay, single-chip microcomputer simultaneously output control electric current to buzzer, buzzer sends prompt tone, in order to point out work people
Member can timely learn in the drying chamber of spray drying device the too low phenomenon of temperature occur.Relay obtains electric adhesive, relay
The normally opened contact closure of device, overvoltage protector obtains electric, and the overvoltage protector is using the electric scientific ＆ technical corporation's production in Baoding Oran
TBP-0.5 type overvoltage protectors, overvoltage protector carries out overvoltage protection to voltage, is effectively prevented load and is damaged by high voltage
Bad, overvoltage protector exports the heater of the voltage to spray drying device of stabilization, and heater obtains electric, and heater begins to warm up,
Heater is heated to the air in drying chamber.Until the temperature value prestored in the temperature in drying chamber and data memory module
Unanimously, single-chip microcomputer stop output control electric current, relay electric-loss and discharge, overvoltage protector dead electricity, spray drying device plus
Hot device stops heating.
Display screen of the invention employs the LCDs with touch control key, and the display screen is used in drying chamber
The temperature that prestores of actual temperature and data memory module is shown.And data can be deposited by the membrane keyboard on display screen
Temperature value in storage module is adjusted, and the temperature value in data memory module is coagulated according to different emulsion atomizations and wall material
Gu the storage temperature value needed for drying is adjusted.
The present invention is accurately processed in order to ensure the signal to reception, set signal processing unit such as Fig. 2 institutes
Show, it is made up of signal frequency amplifying circuit and integrating circuit and A/D converter circuit.Wherein, the signal frequency amplifying circuit
As shown in Fig. 2 its triode VT1 by model 3DG12, resistance is the resistance R1 of 20K Ω, and resistance is the resistance R2 of 10K Ω,
Resistance is the resistance R3 of 40K Ω, and resistance is the adjustable resistance R4 of 0~100K Ω, and capacitance is the polar capacitor C1 of 1 μ F, and capacitance is
The polar capacitor C2 of 10 μ F, capacitance is the polar capacitor C3 of 1000 μ F, the diode D1 of model 1N4013, and is from inductance value
The inductance L compositions of 50 μ H.
During connection, the negative pole of polar capacitor C2 is connected after resistance R1 with triode VT1, positive pole and triode VT1
Emitter stage be connected.One end of resistance R2 is connected with the negative pole of polar capacitor C2, the base stage phase of the other end and triode VT1
Connection.The negative pole of polar capacitor C1 is connected with the base stage of triode VT1, positive pole after resistance R3 with the transmitting of triode VT1
Pole is connected.
The P poles of diode D1 are connected with the positive pole of polar capacitor C1, N poles ground connection.The positive pole and polarity of polar capacitor C3
The positive pole of electric capacity C1 is connected, and negative pole is connected with the N poles of diode D1.One end of adjustable resistance R4 and the collection of triode VT1
Electrode is connected, and the other end is grounded after being connected with the negative pole of polar capacitor C2.
One end of inductance L is connected with the colelctor electrode of triode VT1, the other end as signal frequency amplifying circuit output
Hold and be connected with integrating circuit.The negative pole of the polar capacitor C2 is connected with transmitter；The positive pole of the polar capacitor C3
Also it is connected with outside 12V dc sources.
Further, the integrating circuit as shown in Fig. 2 its by model OP364 amplifier P, resistance is 390 Ω
Resistance R5, resistance is the resistance R6 of 47K Ω, and capacitance is the polar capacitor C4 of 10 μ F, and model 1N4013 diode D2
Composition.
During connection, one end of resistance R5 other end that is connected with the positive pole of amplifier P is connected with the output end of amplifier P
Connect.The positive pole of polar capacitor C4 is connected with the positive pole of amplifier P, and negative pole is connected with the output end of amplifier P.Diode D2
P poles be connected with the output end of amplifier P, N poles be connected with the negative pole of amplifier P after resistance R6 after be grounded.It is described to put
Colelctor electrode of the positive pole of big device P with triode VT1 after inductance L is connected, and the output end of amplifier P is used as integrating circuit
Output end is simultaneously connected with A/D converter circuit.
Further, the A/D converter circuit as shown in Fig. 2 its by model LM331 conversion chip U, model
The triode VT2 of 3AX81, resistance is resistance R7, the resistance R10 of 10K Ω, and resistance is the resistance R8 of 22K Ω, and resistance is 47K Ω
Resistance R9, capacitance is the polar capacitor C5 of 2 μ F, and capacitance is the polar capacitor C6 of 1 μ F, and capacitance is the polar capacitor C7 of 4 μ F, hold
It is the polar capacitor C8 of 10 μ F to be worth, and the diode D3 of model 2N4013 is constituted.
During connection, one end of resistance R7 is connected with the output end of amplifier P, the IN pins of the other end and conversion chip U
It is connected.The positive pole of polar capacitor C5 is connected with the A/C pins of conversion chip U, the GND pin phases of negative pole and conversion chip U
Connection.Negative pole of the positive pole of polar capacitor C6 with polar capacitor C5 after resistance R8 is connected, the THR of negative pole and conversion chip U
Pin is connected.One end of resistance R9 is connected with the REN pins of conversion chip U, and the other end is connected with the base stage of triode VT2
Connect.
The positive pole of polar capacitor C8 is connected with the colelctor electrode of triode VT2, the THR pin phases of negative pole and conversion chip U
It is grounded after connection.The P poles of diode D3 are connected with the emitter stage of triode VT2, and N poles are connected with the base stage of triode VT2.
The positive pole of polar capacitor C7 is connected with the REN pins of conversion chip U, negative pole after resistance R10 with the emitter stage of triode VT2
It is connected.
The negative pole ground connection of the polar capacitor C5；The base stage of the triode VT2 also with the REWN pin phases of conversion chip U
Connection, the emitter stage of triode VT2 as A/D converter circuit output end and be connected with single-chip microcomputer；The conversion chip U2
VS pins be connected with+5V the dc sources of outside, the A/C pins of conversion chip U2 also with outside -5V dc sources
It is connected.
During operation, the voltage that polar capacitor C3, diode D1 and polar capacitor C1 constitute signal frequency amplifying circuit is permanent
Stream device, the galvanostat carries out constant current, circuit is obtained an operating voltage for temperature to the 12V DC voltages being input into.Transmitter
, through resistance R1 current limlitings, the DC simulation signal transmission after current limliting is to triode VT1, resistance R2 and pole for the DC simulation signal of output
Property the amplifier that is formed of electric capacity C2, the amplifier is adjusted to the frequency of DC simulation signal and the Slight undulations of bandwidth, with
It is easy to signal feedback processing, the signal after amplifier treatment carries out electric current regulation, makes DC simulation signal through adjustable resistance R4
Electric current is consistent with the electric current of sampled signal, and integrating circuit is transferred to after being electrolysed finally by inductance L, so that signal frequency
Amplifying circuit realizes the adjustment to the frequency and bandwidth of signal.
Wherein, the integrator that the amplified device P of signal, the resistance R6 and diode D2 of signal frequency amplifying circuit output are formed
Treatment is integrated to signal, output signal and deviation integration is directly proportional, the stability of signal is effectively raised, at integration
The feedback filter that signal after reason is then formed through polar capacitor C4 and resistance R5 is filtered, and effectively eliminates dry in signal
Signal is disturbed, makes signal more steady, integrating circuit is by the signal transmission after treatment to A/D converter circuit.
The operating voltage of the A/D converter circuit is 5V DC voltages, voltage is provided by external power source, and by changing core
The VS pins and A/C pins of piece U are powered for A/D converter circuit.Resistance R7 is limited the electric current of input DC simulation signal
System, the IN pins of the converted chip U of DC simulation signal after current limit are transferred to conversion chip U, and the chip is LM331 collection
Into chip, it has the functions such as signal identification, Frequency mixing processing and signal conversion, and conversion chip U is mixed to the signal being input into
Treatment, the converter of signal after treatment then in converted chip U carries out signal conversion, and conversion chip U believes DC simulation
Number data-signal is converted to, then the POUT pins and REN pins of converted chip U and THR pins are exported the data-signal.Its
The low-frequency data signal of POUT pins output is filtered through the low pass filter that polar capacitor C7 and resistance R10 is formed, effectively
Signal high-frequency signal is eliminated.The high-frequency signal of the REN pins output of conversion chip U is suppressed through resistance R9,
The effective low frequency signal to signal suppresses, and the signal transmission for carrying out low-frequency signal processing through low-resistance filtering and resistance R9 is given
The amplifier that triode VT2, polar capacitor C8 and diode D3 are formed, the amplifier is amplified to the frequency of signal, makes defeated
The signal for going out is consistent with the frequency of sampled signal, A/D converter circuit by the data signal transmission after conversion to single-chip microcomputer, effectively
The accuracy of the signal that single-chip microcomputer is received is ensure that, so that signal processing unit is realized to the trickle of signal frequency and bandwidth
Fluctuation is adjusted, and the signal after adjustment can be integrated, and makes signal with stabilization；And Frequency mixing processing is carried out to signal, and
Signal is accurately converted to the effect of data-signal, the accuracy that signal transacting is received in present invention docking is effectively raised.
According to above-described embodiment, you can realize the present invention well.
Claims (5)
1. the spray drying device temperature control system of a kind of microencapsulation material, it is characterised in that main by single-chip microcomputer, with
Data memory module, buzzer, display screen, relay and signal processing unit that single-chip microcomputer is connected, are connected with relay
Overvoltage protector, the transmitter being connected with signal processing unit, and be connected with transmitter thermocouple composition；It is described
The signal frequency amplifying circuit that signal processing unit is connected by input with transmitter, input and signal frequency amplifying circuit
The integrating circuit that is connected of output end, and the A/D converter circuit composition being connected with the output end of input integrating circuit；
The output end of the A/D converter circuit is connected with single-chip microcomputer.
2. a kind of spray drying device temperature control system of microencapsulation material according to claim 1, its feature exists
In, the signal frequency amplifying circuit by triode VT1, negative pole after resistance R1 with being connected of triode VT1, positive pole and three
The polar capacitor C2 that the emitter stage of pole pipe VT1 is connected, one end is connected with the negative pole of polar capacitor C2, the other end and triode
The resistance R2 that the base stage of VT1 is connected, negative pole is connected with the base stage of triode VT1, positive pole after resistance R3 with triode VT1
Polar capacitor C1, the P pole that is connected of emitter stage be connected with the positive pole of polar capacitor C1, the diode D1 of N poles ground connection, positive pole
Be connected with the positive pole of polar capacitor C1, the polar capacitor C3 that negative pole is connected with the N poles of diode D1, one end and triode
After the colelctor electrode of VT1 is connected, the other end is connected with the negative pole of polar capacitor C2 be grounded adjustable resistance R4, and one end with
The colelctor electrode of triode VT1 is connected, the other end as signal frequency amplifying circuit output end and be connected with integrating circuit
Inductance L composition；The negative pole of the polar capacitor C2 is connected with transmitter；The positive pole of the polar capacitor C3 also with outside
12V dc sources are connected.
3. a kind of spray drying device temperature control system of microencapsulation material according to claim 2, its feature exists
In, the integrating circuit by amplifier P, one end other end that is connected with the positive pole of amplifier P is connected with the output end of amplifier P
The resistance R5 for connecing, the polar capacitor C4 that positive pole is connected with the positive pole of amplifier P, negative pole is connected with the output end of amplifier P,
And two poles that P poles are connected with the output end of amplifier P, N poles are grounded after being connected with the negative pole of amplifier P after resistance R6
Pipe D2 is constituted；Colelctor electrode of the positive pole of the amplifier P with triode VT1 after inductance L is connected, the output of amplifier P
Hold the output end as integrating circuit and be connected with A/D converter circuit.
4. a kind of spray drying device temperature control system of microencapsulation material according to claim 3, its feature exists
In, the A/D converter circuit by conversion chip U, triode VT2, one end is connected with the output end of amplifier P, the other end with turn
The resistance R7 that the IN pins of chip U are connected is changed, positive pole is connected with the A/C pins of conversion chip U, negative pole and conversion chip U
The polar capacitor C5 that is connected of GND pins, positive pole is connected after resistance R8 with the negative pole of polar capacitor C5, negative pole and conversion
The polar capacitor C6 that the THR pins of chip U are connected, one end is connected with the REN pins of conversion chip U, the other end and three poles
The resistance R9 that the base stage of pipe VT2 is connected, positive pole is connected with the colelctor electrode of triode VT2, the THR of negative pole and conversion chip U
Polar capacitor C8, the P pole that pin is grounded after being connected is connected with the emitter stage of triode VT2, the base of N poles and triode VT2
The diode D3 that pole is connected, and positive pole be connected with the REN pins of conversion chip U, negative pole after resistance R10 with triode
The polar capacitor C7 compositions that the emitter stage of VT2 is connected；The negative pole ground connection of the polar capacitor C5；The base of the triode VT2
Pole is also connected with the REWN pins of conversion chip U, the emitter stage of triode VT2 as A/D converter circuit output end and with
Single-chip microcomputer is connected；The VS pins of the conversion chip U2 are connected with+5V the dc sources of outside, the A/ of conversion chip U2
C pins are also connected with outside -5V dc sources.
5. a kind of spray drying device temperature control system of microencapsulation material according to claim 4, its feature exists
In the conversion chip U is LM331 integrated chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710200222.1A CN106843320B (en) | 2017-03-30 | 2017-03-30 | A kind of spray drying device temperature control system of microencapsulation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710200222.1A CN106843320B (en) | 2017-03-30 | 2017-03-30 | A kind of spray drying device temperature control system of microencapsulation material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106843320A true CN106843320A (en) | 2017-06-13 |
| CN106843320B CN106843320B (en) | 2019-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710200222.1A Expired - Fee Related CN106843320B (en) | 2017-03-30 | 2017-03-30 | A kind of spray drying device temperature control system of microencapsulation material |
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| CN (1) | CN106843320B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09145491A (en) * | 1995-11-16 | 1997-06-06 | Kokusai Electric Co Ltd | Temperature control device of heat treatment furnace |
| CN102650496A (en) * | 2012-06-05 | 2012-08-29 | 苏州市金翔钛设备有限公司 | Automatic control system of multifunctional drying machine |
| CN203518535U (en) * | 2013-10-14 | 2014-04-02 | 叶文明 | Monitoring system for drying cistanche |
| CN203605671U (en) * | 2013-09-02 | 2014-05-21 | 重庆跃腾电器有限公司 | Drying control system |
| CN205725665U (en) * | 2016-04-22 | 2016-11-23 | 金陵科技学院 | A kind of RF broadband amplifier of gain controllable |
| CN206773552U (en) * | 2017-03-30 | 2017-12-19 | 成都优创复材科技有限公司 | A kind of spray drying device temperature control system of microencapsulation material |
-
2017
- 2017-03-30 CN CN201710200222.1A patent/CN106843320B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09145491A (en) * | 1995-11-16 | 1997-06-06 | Kokusai Electric Co Ltd | Temperature control device of heat treatment furnace |
| CN102650496A (en) * | 2012-06-05 | 2012-08-29 | 苏州市金翔钛设备有限公司 | Automatic control system of multifunctional drying machine |
| CN203605671U (en) * | 2013-09-02 | 2014-05-21 | 重庆跃腾电器有限公司 | Drying control system |
| CN203518535U (en) * | 2013-10-14 | 2014-04-02 | 叶文明 | Monitoring system for drying cistanche |
| CN205725665U (en) * | 2016-04-22 | 2016-11-23 | 金陵科技学院 | A kind of RF broadband amplifier of gain controllable |
| CN206773552U (en) * | 2017-03-30 | 2017-12-19 | 成都优创复材科技有限公司 | A kind of spray drying device temperature control system of microencapsulation material |
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| CN106843320B (en) | 2019-01-25 |
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