CN106833405A - It is a kind of improved without base material adhesive tape - Google Patents
It is a kind of improved without base material adhesive tape Download PDFInfo
- Publication number
- CN106833405A CN106833405A CN201611259268.2A CN201611259268A CN106833405A CN 106833405 A CN106833405 A CN 106833405A CN 201611259268 A CN201611259268 A CN 201611259268A CN 106833405 A CN106833405 A CN 106833405A
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- China
- Prior art keywords
- layer
- pressure
- sensitive adhesive
- base material
- release layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
Abstract
It is improved without base material adhesive tape the invention discloses one kind, successively including the first release layer, pressure-sensitive adhesive layer and the second release layer, the peeling force of the peeling force less than the second release layer of the first release layer；First release layer and the second release layer are banded structure, and pressure-sensitive adhesive layer is that the spacing of adjacent rectangle block is 0.5mm 10mm along the off-style paper layer of banded structure first equally distributed multiple rectangular blocks；The 3mm of first off-style paper layer edge 0.5 described in the Edge Distance of pressure-sensitive adhesive layer.The present invention has relatively strong viscosity, easy to use, after bonded assemblies will not viscose glue, the advantages of remove easy.The addition that the present invention passes through sodium bicarbonate particle and toner mixture, can be effectively improved the radiating mode inside pressure-sensitive adhesive layer, significantly improve its radiating effect, thus provide a kind of novel improved for possessing good heat radiating function without base material adhesive tape.
Description
Technical field
The present invention relates to adhesive tape area, and in particular to a kind of industrial electronic electrical equipment（Such as computer, mobile phone, digital camera, LCD
Deng）It is improved without base material adhesive tape that the stickup of inter-module and the stickup of motor vehicle interior are used.
Background technology
It is directly to be formed by acrylate glue coating compacting without base material double faced adhesive tape, adhesive tape color is transparent, common thickness specification
For：0.06-0.13mm, with excellent bonding effect, can prevent from coming off and excellent water resistance, and processability is good, temperature tolerance
Good, dimensional stability, heat endurance, chemical stability are good, tack and to hold viscosity good.
At present, traditional industry has been obtained for being widely applied without base material adhesive tape as the stickup of electronic apparatus inter-module,
And electron electrical apparatus industry brings revolutionary leap.Such as Chinese utility model patent, application number 201020186120.2, name
Claim：One kind is without base material adhesive tape.The patent discloses the structure without base material adhesive tape for electron trade first.The adhesive tape includes poly-
Acrylate pressure-sensitive adhesive layer and PEK film release liners, the polyacrylate pressure-sensitive layer are parallel multiple with PEK film release liners
Close and set.But the colloform texture is excessively simple, intensity itself is not strong, easy viscose glue, and using inconvenience, loss is very big, Er Qie
Easily there is excessive glue, the phenomenon of kiss-coating in the edge of adhesive tape in production process, to follow-up producing process and using making troubles.
Therefore need to make improvements, there is provided, with being difficult to tear viscose glue, viscosity is strong, with Rapid pasting feature for one kind
Without base material adhesive tape.
Meanwhile, existing adhesive tape is used primarily in electronic component, and electronic component is often in the working condition of high temperature,
When the heat dispersion of adhesive tape is not good, electronic component can be caused to be failed because local heating is too high, damaged, and in the prior art
Adhesive tape often only serve sealing and fixation, not only can not heat conduction well, also because its thermal insulation be more unfavorable for radiating；
Therefore, existing adhesive tape how is improved, preferable heat dispersion is reached, is the technical barrier of this area urgent need to resolve.
The content of the invention
The invention technical problem to be solved
In order to solve the above technical problems, it is improved without base material adhesive tape we have proposed one kind, it is easy to use with relatively strong viscosity,
After bonded assemblies will not viscose glue, the advantages of remove easy.
Technical scheme
To reach above-mentioned purpose, technical scheme is as follows：
A kind of improved without base material adhesive tape, successively including the first release layer, pressure-sensitive adhesive layer and the second release layer, described first is release
Peeling force of the peeling force of layer less than the second release layer；First release layer and the second release layer are banded structure, described
Pressure-sensitive adhesive layer is that, along the equally distributed multiple rectangular blocks of the off-style paper layer of banded structure first, the spacing of adjacent rectangle block is
0.5mm-10mm ；First off-style paper layer edge 0.5-3mm described in the Edge Distance of the pressure-sensitive adhesive layer.Preferably, it is described pressure-sensitive
Glue-line is the one kind in elastomeric-type pressure sensitive adhesive, resin pressure sensitive adhesive and acrylic pressure-sensitive adhesivee.
Preferably, first release layer and the second release layer are PEK paper or PET mould release membrances.
Preferably, the end of the rectangular block for being fitted in the first release layer or the second release layer side is middle slightly raised
Arcuate structure.
Preferably, the end of the arcuate structure is provided with removable glue-line.
Further, the pressure-sensitive adhesive layer also includes following component：The mixture of sodium bicarbonate particle and carbon dust, and this is mixed
The particle diameter of compound is less than 0.1mm.
Further, when this is improved is just used without base material adhesive tape, the hot blast blown out by hair-dryer is heated to
More than 50 DEG C, heating is stopped after continuing 30S.
Beneficial effect
Compared with prior art, the beneficial effects of the invention are as follows：
Pressure sensitive adhesive both sides of the invention are provided with the different release layer of peel force, and easy to use, sanitation and hygiene use process
In, finger is not required to directly contact pressure sensitive adhesive；Pressure-sensitive adhesive layer leaves space with the edge of release layer, can prevent pressure sensitive adhesive from spilling over release
Layer outside, prevents the unnecessary pressure-sensitive adhesive occurred in process of manufacture on machine or on hand, cleans the problem of inconvenience；Rectangle
The side of block pressure sensitive adhesive is provided with removable glue-line, easy to use when the parts for needing to combine are separated, and is not required to load
The problem of heart cull, influence outward appearance；Pressure-sensitive adhesive layer be it is transparent, can Rapid pasting, to the firm pasting of part, after stickup operate
Property it is good, reduce and paste bad, and the gap of inter-module can be reduced.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of improved planar structure schematic diagram without base material adhesive tape disclosed in the embodiment of the present invention 1；
Fig. 2 is the side structure schematic view of Fig. 1；
Fig. 3 is a kind of improved side structure schematic view without base material adhesive tape disclosed in the embodiment of the present invention 2.
Corresponding component title in figure represented by numeral.
1. the first release layer；2. pressure-sensitive adhesive layer（Rectangular block）；3. the second release layer；4. removable glue-line.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only one embodiment of the present of invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
With reference to embodiment and specific embodiment, the present invention is further detailed explanation.
Embodiment 1.
It is a kind of improved without base material adhesive tape as shown in Fig. 1 and Fig. 2, successively including the first release layer 1, pressure-sensitive adhesive layer 2 and second
Release layer 3, wherein peeling force of the peeling force of the first release layer 1 less than the second release layer 3, the first release layer 1 and second from
Type layer 3 is banded structure, pressure-sensitive adhesive layer 2 be along the equally distributed multiple rectangular blocks of the first release layer of banded structure,
The spacing of adjacent rectangle block is 3mm（Its value can also be other values between 0.5mm-10mm, be not required to little by little tear and move
It is easy to use except glue-line）；The first off-style paper layer of Edge Distance edge 2mm of pressure-sensitive adhesive layer 2（Its value can also be 0.5-3mm
Between other values, it is ensured that do not had in production glue spilling, be not required to cleaning robot equipment, during stickup, finger will not be stained with
Glue, sanitation and hygiene paste convenient）.
Above-mentioned pressure-sensitive adhesive layer 2 is acrylic pressure sensitive adhesive（Pressure sensitive adhesive can also be elastomeric-type pressure sensitive adhesive, resin type pressure
Other classifications in quick glue and acrylic pressure-sensitive adhesivee）.It is adapted to the combination of electronic product, pastes.
First release layer and the second release layer are PET mould release membrances（Or PEK paper）, simply peeling force is different.Peeling force
It is of different sizes, make the order for being easy to grasp power and paste when the stickup of people, i.e., the side being easily peeled off first is glued, after the completion of
The big release layer of the peeling force of opposite side is peeled off again.
It is fitted in the first release layer（Or second release layer）The end of the rectangular block of side is middle slightly raised arcuate structure.It is viscous
Patch is convenient, convenient, it is easy to discharge the air of interlayer, it is ensured that sticking strength.
Embodiment 2.
It is a kind of improved without base material adhesive tape as shown in Fig. 1 and Fig. 3, successively including the first release layer 1, pressure-sensitive adhesive layer 2 and second
Release layer 3, wherein peeling force of the peeling force of the first release layer 1 less than the second release layer 3, the first release layer 1 and second from
Type layer 3 is banded structure, pressure-sensitive adhesive layer 2 be along the equally distributed multiple rectangular blocks of the first release layer of banded structure,
The spacing of adjacent rectangle block is 5mm（Its value can also be other values between 0.5mm-10mm, be not required to little by little tear and move
It is easy to use except glue-line）；The first off-style paper layer of Edge Distance edge 1mm of pressure-sensitive adhesive layer 2（Its value can also be 0.5-3mm
Between other values, it is ensured that do not had in production glue spilling, be not required to cleaning robot equipment, during stickup, finger will not be stained with
Glue, sanitation and hygiene paste convenient）.
Above-mentioned pressure-sensitive adhesive layer 2 is polyacrylate pressure-sensitive（Pressure sensitive adhesive can also be elastomeric-type pressure sensitive adhesive, resin
Other classifications in type pressure sensitive adhesive and acrylic pressure-sensitive adhesivee）.It is adapted to the combination of electronic product, pastes.
First release layer and the second release layer are PEK paper（Or PET mould release membrances）, simply peeling force is different.Peeling force
It is of different sizes, make the order for being easy to grasp power and paste when the stickup of people, i.e., the side being easily peeled off first is glued, after the completion of
The big release layer of the peeling force of opposite side is peeled off again.
It is fitted in the first release layer（Or second release layer）The end of the rectangular block of side is middle slightly raised arc knot
Structure.Paste convenient, convenient, it is easy to discharge the air of interlayer, it is ensured that sticking strength.And the end of arcuate structure is provided with removable plastic
Layer 4.In some technical process, when people need the isolation of components that will be combined to recombinate, can very easily be moved
Remove, and not cull, product surface not damaged, very useful convenience.
Compared with prior art, the beneficial effects of the invention are as follows：
Pressure sensitive adhesive both sides of the invention are provided with the different release layer of peel force, and easy to use, sanitation and hygiene use process
In, finger is not required to directly contact pressure sensitive adhesive；Pressure-sensitive adhesive layer leaves space with the edge of release layer, can prevent pressure sensitive adhesive from spilling over release
Layer outside, prevents the unnecessary pressure-sensitive adhesive occurred in process of manufacture on machine or on hand, cleans the problem of inconvenience；Rectangle
The side of block pressure sensitive adhesive is provided with removable glue-line, easy to use when the parts for needing to combine are separated, and is not required to load
The problem of heart cull, influence outward appearance；Pressure-sensitive adhesive layer be it is transparent, can Rapid pasting, to the firm pasting of part, after stickup operate
Property it is good, reduce and paste bad, and the gap of inter-module can be reduced.
Meanwhile, in the present embodiment, pressure-sensitive adhesive layer also includes following component：The mixture of sodium bicarbonate particle and carbon dust, and
The particle diameter of the mixture is less than 0.1mm.When this is improved is just used without base material adhesive tape, by hair-dryer blow out hot blast by its
More than 50 DEG C are heated to, heating is stopped after continuing 30S.Because solid sodium bicarbonate starts gradually to decompose generation two more than 50 DEG C
Carbonoxide, carbon dioxide is generated inside pressure-sensitive adhesive layer so that pressure-sensitive adhesive layer is internally formed porous small ventilating structure, favorably
In the heat convection of pressure-sensitive adhesive layer（Because above-mentioned ventilating structure is small, can't form larger to the watertightness performance of pressure-sensitive adhesive layer
Influence）；Meanwhile, while pressure-sensitive adhesive layer internal porous ventilating structure is formed, a part of carbon dust can automatically be packed into pressure sensitive adhesive
In hole inside layer, toner passage is formed, so as to be internally formed the heat conduction via based on toner passage in pressure-sensitive adhesive layer,
Be conducive to the heat transfer of pressure-sensitive adhesive layer.By the addition of sodium bicarbonate particle above and toner mixture, pressure can be effectively improved
The radiating mode of quick glue layer, significantly improves its radiating effect, so as to provide and a kind of possess the new of good heat radiating function and change
Enter without base material adhesive tape.（This application case is China Patent No.：201420167389.4 further improvement.）
Above-described is only the preferred embodiment of the present invention, it is noted that for the person of ordinary skill of the art,
Without departing from the concept of the premise of the invention, various modifications and improvements can be made, these belong to guarantor of the invention
Shield scope.
Claims (7)
1. it is a kind of improved without base material adhesive tape, it is characterised in that release including the first release layer, pressure-sensitive adhesive layer and second successively
Layer, the peeling force of the peeling force less than the second release layer of first release layer；First release layer and the second release layer are equal
It is banded structure, the pressure-sensitive adhesive layer is along the equally distributed multiple rectangular blocks of the off-style paper layer of banded structure first, adjacent square
The spacing of shape block is 0.5mm-10mm；First off-style paper layer edge 0.5-3mm described in the Edge Distance of the pressure-sensitive adhesive layer.
2. it is a kind of improved without base material adhesive tape according to claim 1, it is characterised in that the pressure-sensitive adhesive layer is elasticity
One kind in build pressure sensitive adhesive, resin pressure sensitive adhesive and acrylic pressure-sensitive adhesivee.
3. it is a kind of improved without base material adhesive tape according to claim 2, it is characterised in that first release layer and
Two release layers are PEK paper or PET mould release membrances.
4. it is a kind of improved without base material adhesive tape according to claim 3, it is characterised in that described to be fitted in first release
The end of the rectangular block of layer or the second release layer side is middle slightly raised arcuate structure.
5. it is a kind of improved without base material adhesive tape according to claim 4, it is characterised in that the end of the arcuate structure
It is provided with removable glue-line.
6. it is improved without base material adhesive tape according to claim 1, it is characterised in that the pressure-sensitive adhesive layer also includes following
Composition：The mixture of sodium bicarbonate particle and carbon dust, and the particle diameter of the mixture is less than 0.1mm.
7. according to claim 6 improved without base material adhesive tape, it is characterised in that：Just make without base material adhesive tape when this is improved
Used time, the hot blast blown out by hair-dryer is heated to more than 50 DEG C, and heating is stopped after continuing 30S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611259268.2A CN106833405A (en) | 2016-12-30 | 2016-12-30 | It is a kind of improved without base material adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611259268.2A CN106833405A (en) | 2016-12-30 | 2016-12-30 | It is a kind of improved without base material adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106833405A true CN106833405A (en) | 2017-06-13 |
Family
ID=59113685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611259268.2A Pending CN106833405A (en) | 2016-12-30 | 2016-12-30 | It is a kind of improved without base material adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106833405A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108570292A (en) * | 2018-03-27 | 2018-09-25 | 昆山市飞荣达电子材料有限公司 | A method of producing keyboard special adhesive tape |
| CN111668362A (en) * | 2020-06-19 | 2020-09-15 | 京东方科技集团股份有限公司 | Conductive film and preparation method thereof, manufacturing method of display substrate and display panel |
| CN112878594A (en) * | 2021-01-11 | 2021-06-01 | 安徽金川防水防腐新型材料有限公司 | Preparation process of waterproof material with metal mesh interlayer inside |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812280A (en) * | 2010-04-09 | 2010-08-25 | 连云港昭华科技有限公司 | Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method |
| CN203451419U (en) * | 2013-04-10 | 2014-02-26 | 深圳市法鑫忠信新材料有限公司 | Base-material-free double-side adhesive tape |
| CN203782082U (en) * | 2014-04-09 | 2014-08-20 | 皇冠（太仓）胶粘制品有限公司 | Improved transfer tape |
| CN205011688U (en) * | 2015-09-25 | 2016-02-03 | 常州昊天塑胶科技有限公司 | No substrate double -sided tape |
-
2016
- 2016-12-30 CN CN201611259268.2A patent/CN106833405A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812280A (en) * | 2010-04-09 | 2010-08-25 | 连云港昭华科技有限公司 | Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method |
| CN203451419U (en) * | 2013-04-10 | 2014-02-26 | 深圳市法鑫忠信新材料有限公司 | Base-material-free double-side adhesive tape |
| CN203782082U (en) * | 2014-04-09 | 2014-08-20 | 皇冠（太仓）胶粘制品有限公司 | Improved transfer tape |
| CN205011688U (en) * | 2015-09-25 | 2016-02-03 | 常州昊天塑胶科技有限公司 | No substrate double -sided tape |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108570292A (en) * | 2018-03-27 | 2018-09-25 | 昆山市飞荣达电子材料有限公司 | A method of producing keyboard special adhesive tape |
| CN108570292B (en) * | 2018-03-27 | 2020-10-16 | 昆山市飞荣达电子材料有限公司 | Method for producing adhesive tape special for keyboard |
| CN111668362A (en) * | 2020-06-19 | 2020-09-15 | 京东方科技集团股份有限公司 | Conductive film and preparation method thereof, manufacturing method of display substrate and display panel |
| CN111668362B (en) * | 2020-06-19 | 2022-08-12 | 京东方科技集团股份有限公司 | Conductive film and preparation method thereof, manufacturing method of display substrate and display panel |
| CN112878594A (en) * | 2021-01-11 | 2021-06-01 | 安徽金川防水防腐新型材料有限公司 | Preparation process of waterproof material with metal mesh interlayer inside |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
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