CN106832775B - High-strength blue-light-proof LED packaging material - Google Patents
High-strength blue-light-proof LED packaging material Download PDFInfo
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- CN106832775B CN106832775B CN201710053572.XA CN201710053572A CN106832775B CN 106832775 B CN106832775 B CN 106832775B CN 201710053572 A CN201710053572 A CN 201710053572A CN 106832775 B CN106832775 B CN 106832775B
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- 239000005022 packaging material Substances 0.000 title claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 39
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical class O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000004113 Sepiolite Substances 0.000 claims abstract description 33
- 229910052624 sepiolite Inorganic materials 0.000 claims abstract description 33
- 235000019355 sepiolite Nutrition 0.000 claims abstract description 33
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 20
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920000180 alkyd Polymers 0.000 claims abstract description 10
- 238000007334 copolymerization reaction Methods 0.000 claims abstract description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 10
- 229920002492 poly(sulfone) Polymers 0.000 claims abstract description 10
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 10
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 18
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 13
- 238000001914 filtration Methods 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 239000002041 carbon nanotube Substances 0.000 claims description 10
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 9
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 9
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 9
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 9
- 239000000243 solution Substances 0.000 claims description 7
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- PBLNBZIONSLZBU-UHFFFAOYSA-N 1-bromododecane Chemical compound CCCCCCCCCCCCBr PBLNBZIONSLZBU-UHFFFAOYSA-N 0.000 claims description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 3
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 3
- 239000001530 fumaric acid Substances 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001509 sodium citrate Substances 0.000 claims description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000002715 modification method Methods 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 abstract description 4
- 238000002834 transmittance Methods 0.000 abstract description 4
- 239000003973 paint Substances 0.000 abstract 1
- 239000002994 raw material Substances 0.000 description 5
- VCKPUUFAIGNJHC-UHFFFAOYSA-N 3-hydroxykynurenine Chemical compound OC(=O)C(N)CC(=O)C1=CC=CC(O)=C1N VCKPUUFAIGNJHC-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 210000001525 retina Anatomy 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 208000002177 Cataract Diseases 0.000 description 1
- 206010010741 Conjunctivitis Diseases 0.000 description 1
- WTDRDQBEARUVNC-LURJTMIESA-N L-DOPA Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-LURJTMIESA-N 0.000 description 1
- WTDRDQBEARUVNC-UHFFFAOYSA-N L-Dopa Natural products OC(=O)C(N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-UHFFFAOYSA-N 0.000 description 1
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 description 1
- YJPIGAIKUZMOQA-UHFFFAOYSA-N Melatonin Natural products COC1=CC=C2N(C(C)=O)C=C(CCN)C2=C1 YJPIGAIKUZMOQA-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- 208000003464 asthenopia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 206010023332 keratitis Diseases 0.000 description 1
- 208000002780 macular degeneration Diseases 0.000 description 1
- DRLFMBDRBRZALE-UHFFFAOYSA-N melatonin Chemical compound COC1=CC=C2NC=C(CCNC(C)=O)C2=C1 DRLFMBDRBRZALE-UHFFFAOYSA-N 0.000 description 1
- 229960003987 melatonin Drugs 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- 208000029257 vision disease Diseases 0.000 description 1
- 230000004393 visual impairment Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Wrappers (AREA)
Abstract
The invention relates to the technical field of LED electronic products, in particular to a high-strength blue-light-proof LED packaging material. The paint comprises the following components in parts by weight: 60-70 parts of polysulfone modified epoxy resin, 23-25 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 5-8 parts of polydimethylsiloxane, 0.1-1 part of modified or unmodified melanin, 0.1-0.3 part of hydroquinone, 5-8 parts of styrene modified alkyd resin and 3-10 parts of modified sepiolite powder. The prepared material has good blue light blocking performance, can effectively filter blue light, enables the transmitted light to be softer, and protects eyes of people from being injured to a certain extent. Meanwhile, the material has good light transmittance and small influence on color temperature; the thermal resistance value of the package can be reduced as much as possible; the material prepared by the invention also has good mechanical property.
Description
Technical Field
The invention relates to the technical field of LED electronic products, in particular to a high-strength blue-light-proof LED packaging material.
Background
Because of a series of advantages of long service life, energy saving, small volume and the like, a semiconductor Light Emitting Diode (LED) has been recognized as the most valuable new light source in the 21 st century in various illumination fields such as decorative illumination, automobile illumination, backlight sources and the like. However, the white light LED commonly used in the market generally uses blue light generated by the blue light LED to excite the phosphor to generate mixed white light, and due to this principle, many manufacturers directly increase the intensity of the blue light in order to increase the brightness of the LED lamp, so that the generated yellow light is also increased, thereby increasing the brightness of the white light LED. The actual LED spectrum therefore contains a strong blue component.
According to Planck's radiation law E = hc/l, the shorter the wavelength, the more energy, so the blue light has great harm to human body. The tissue in the human eye that receives light is called the retina, and if the brightness of the blue light band of 400-500 nm in the light source is too high, the photochemical damage of the retina can be caused after the eye directly looks at the light source for a long time. Causing asthenopia, visual impairment, conjunctivitis, keratitis, and even destruction of the lens of the eye causing cataracts and macular degeneration of the retina. Excessive blue light also disturbs the body's biological clock, reduces the reduction of melatonin at night, and affects the body's sleep.
Therefore, how to filter the blue light of the LED lamp so as to protect the human body from being injured is a problem which needs to be solved urgently in the field of the LED lamp.
Meanwhile, with the increase of chip power, especially the development requirement of solid-state lighting technology, new and higher requirements are put on the optical, thermal, electrical and mechanical structures of LED packages. The hardness of the packaging material has a great effect on the use of the LED, and the lower hardness can cause the mechanical property of the packaging material to be reduced, thereby reducing the product quality of the LED.
Disclosure of Invention
The invention aims to solve the problems and provides a high-strength blue-light-proof LED packaging material.
In order to achieve the purpose, the invention adopts the following technical scheme:
a high-strength blue-light-proof LED packaging material comprises the following components in parts by weight: 60-70 parts of polysulfone modified epoxy resin, 23-25 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 5-8 parts of polydimethylsiloxane, 0.1-1 part of modified or unmodified melanin, 0.1-0.3 part of hydroquinone, 5-8 parts of styrene modified alkyd resin and 3-10 parts of modified sepiolite powder.
As a further preference, the following components are included in parts by weight: 65-70 parts of polysulfone modified epoxy resin, 23-25 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 5-8 parts of polydimethylsiloxane, 0.1-0.5 part of modified or unmodified melanin, 0.1-0.3 part of hydroquinone, 5-8 parts of styrene modified alkyd resin and 3-5 parts of modified sepiolite powder.
More preferably, the method for modifying melanin specifically comprises:
(1) uniformly dispersing 5 parts of melanin powder in 100 parts of dimethyl sulfoxide, adding 2-5 parts of sodium citrate, and then keeping at 130-140 ℃ for 30 min;
(2) adding 50-80 parts of n-butanol and 1-5 parts of dodecyl bromide into the system, stirring for 30min at 110 ℃, then adding 3-5 parts of silane coupling agent and 1-3 parts of disodium ethylene diamine tetraacetate, and stirring for 30-60min at 120 ℃; filtering, washing and drying; the drying temperature is 70-80 ℃;
(3) adding 1-3 parts of the obtained product into 10-30 parts of dimethylformamide, then adding 2-5 parts of maleic anhydride and 1-3 parts of fumaric acid, stirring at 60 ℃ for 20-30min, and adding 0.5-1 part of citric acid into the mixture;
(4) and filtering, washing and drying the obtained product to obtain modified melanin powder.
As a further preference, the modified sepiolite powder is prepared by the following steps: mixing sepiolite powder with a mixed solution of pentanediol with the mass concentration of 13% and ethyl acetate, stirring, mixing and dispersing uniformly to obtain a dispersion liquid, wherein the mass ratio of the pentanediol to the ethyl acetate is 2: 1; then adding hydrochloric acid accounting for 0.5-1% of the dispersion liquid by mass into the dispersion liquid, carrying out ultrasonic treatment for 5-10 minutes, filtering, washing with deionized water, and drying at 60 ℃; and then mixing the sepiolite powder with a compound solution, wherein the compound solution is a mixed solution of 3% by mass of sodium dodecyl benzene sulfonate, 20% by mass of isopropyl titanate and 5% by mass of aniline, the solutes are sodium dodecyl benzene sulfonate, aniline and isopropyl titanate, the mixed solution is prepared by mixing the sodium dodecyl benzene sulfonate, the isopropyl titanate and the aniline at 40 ℃ for 30min, filtering and drying at 70-80 ℃ to obtain the modified sepiolite powder.
Preferably, the obtained modified sepiolite powder is further modified, specifically, the sepiolite powder is mixed with the carbon nano tubes treated by acid, specifically, the carbon nano tubes are ground and mixed by a ball mill for 30-60min, wherein the ratio of the dried product to the carbon nano tubes is 5-10: 1.
Further preferably, the carbon nanotubes have a diameter of 20 to 50nm in length.
Further preferably, the particle size of the modified or unmodified melanin is 50 to 100 nm.
Further preferably, the particle size of the modified sepiolite powder is 50 to 150 nm.
Compared with the prior art, the invention has the beneficial effects that: the prepared material has good blue light blocking performance, can effectively filter blue light, enables the transmitted light to be softer, and protects eyes of people from being injured to a certain extent. Meanwhile, the material has good light transmittance and small influence on color temperature; the thermal resistance value of the package can be reduced as much as possible; the material prepared by the invention also has good mechanical property.
Detailed Description
The technical solution of the present invention is further described below by means of specific examples.
The raw materials used in the examples of the present invention are those commonly used in the art, and the methods used in the examples are those conventional in the art, unless otherwise specified.
A high-strength blue-light-proof LED packaging material comprises the following components in parts by weight: 60-70 parts of polysulfone modified epoxy resin, 23-25 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 5-8 parts of polydimethylsiloxane, 0.1-2 parts of modified or unmodified melanin, 0.1-0.3 part of hydroquinone, 5-8 parts of styrene modified alkyd resin and 3-10 parts of modified sepiolite powder.
The particle size of the modified or unmodified melanin is 50-100 nm; the particle size of the modified sepiolite powder is 50-150 nm.
Specifically, the method for modifying melanin comprises the following steps:
(1) uniformly dispersing 5 parts of melanin powder in 100 parts of dimethyl sulfoxide, adding 2-5 parts of sodium citrate, and then keeping at 130-140 ℃ for 30 min;
(2) adding 50-80 parts of n-butanol and 1-5 parts of dodecyl bromide into the system, stirring for 30min at 110 ℃, then adding 3-5 parts of silane coupling agent and 1-3 parts of disodium ethylene diamine tetraacetate, and stirring for 30-60min at 120 ℃; filtering, washing and drying; the drying temperature is 70-80 ℃;
(3) adding 1-3 parts of the obtained product into 10-30 parts of dimethylformamide, then adding 2-5 parts of maleic anhydride and 1-3 parts of fumaric acid, stirring at 60 ℃ for 20-30min, and adding 0.5-1 part of citric acid into the mixture;
(4) and filtering, washing and drying the obtained product to obtain modified melanin powder.
Specifically, the modified sepiolite powder is prepared by the following steps: mixing sepiolite powder with a mixed solution of pentanediol with the mass concentration of 13% and ethyl acetate, stirring, mixing and dispersing uniformly to obtain a dispersion liquid, wherein the mass ratio of the pentanediol to the ethyl acetate is 2: 1; then adding hydrochloric acid accounting for 0.5-1% of the dispersion liquid by mass into the dispersion liquid, carrying out ultrasonic treatment for 5-10 minutes, filtering, washing with deionized water, and drying at 60 ℃; and then mixing the sepiolite powder with a compound solution, wherein the compound solution is a mixed solution of 3% by mass of sodium dodecyl benzene sulfonate, 20% by mass of isopropyl titanate and 5% by mass of aniline, the solutes are sodium dodecyl benzene sulfonate, aniline and isopropyl titanate, the mixed solution is prepared by mixing the sodium dodecyl benzene sulfonate, the isopropyl titanate and the aniline at 40 ℃ for 30min, filtering and drying at 70-80 ℃ to obtain the modified sepiolite powder. In order to further improve the strength of the material and improve the packaging thermal resistance of the prepared LED after packaging, the obtained modified sepiolite powder is further modified, specifically, the sepiolite powder is mixed with the carbon nano tube treated by acid, specifically, the sepiolite powder is ground and mixed by a ball mill for 30-60min, wherein the ratio of the dried product to the carbon nano tube is 5-10: 1. The diameter of the carbon nanotube is 20-50nm in length.
The melanin includes natural melanin extracted from animal and plant bodies, and artificial melanin obtained by synthesis. The main component is a polymer formed by tyrosine or 3, 4-dihydroxyphenylalanine through a series of chemical reactions. Crystal Pigment (OLP, Ocular lens Pigment), the chemical composition is: 3-Hydroxykynurenine (3-OHKyn), an oxidative polymerization product of 3-Hydroxykynurenine.
Example 1:
a high-strength blue-light-proof LED packaging material comprises the following raw materials in parts by weight: 60 parts of polysulfone modified epoxy resin, 25 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 5 parts of polydimethylsiloxane, 0.1 part of modified or unmodified melanin, 0.1 part of hydroquinone, 8 parts of styrene modified alkyd resin and 3 parts of modified sepiolite powder.
Example 2:
a high-strength blue-light-proof LED packaging material comprises the following raw materials in parts by weight: 68 parts of polysulfone modified epoxy resin, 23 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 8 parts of polydimethylsiloxane, 0.2 part of modified or unmodified melanin, 0.3 part of hydroquinone, 5 parts of styrene modified alkyd resin and 10 parts of modified sepiolite powder.
Example 3:
a high-strength blue-light-proof LED packaging material comprises the following raw materials in parts by weight: 70 parts of polysulfone modified epoxy resin, 24 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 6 parts of polydimethylsiloxane, 0.5 part of modified or unmodified melanin, 0.1 part of hydroquinone, 5 parts of styrene modified alkyd resin and 3 parts of modified sepiolite powder.
Example 4:
a high-strength blue-light-proof LED packaging material comprises the following raw materials in parts by weight: 68 parts of polysulfone modified epoxy resin, 23 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 8 parts of polydimethylsiloxane, 1 part of modified or unmodified melanin, 0.2 part of hydroquinone, 6 parts of styrene modified alkyd resin and 5 parts of modified sepiolite powder.
Based on the mixture ratios of the above embodiments, the finished products are prepared by adopting the processes of mixing, stirring and melt blending, and the prepared finished products are detected to obtain the following data:
| tensile strength MPa | Transmittance of blue light | Preparing the packaged thermal resistance value of the finished product | Light transmittance | |
| Example 1 | >50 | <40% | <30 C/W | >90% |
| Example 2 | >60 | <30% | <30 C/W | >90% |
| Example 3 | >50 | <20% | <30 C/W | >90% |
| Example 4 | >50 | <15% | <30 C/W | >85% |
The above table shows that the product prepared by the invention has excellent performance, and the blocking rate of blue light reaches more than 80% when the addition amount of melanin is gradually increased, so that the blocking rate of blue light reaches more than half even when the addition amount is small, and therefore, the material prepared by the invention effectively prevents the blue light from transmitting. Meanwhile, the material prepared by the invention has good mechanical property and can sufficiently meet the processing requirement.
Claims (6)
1. The high-strength blue-light-proof LED packaging material is characterized by comprising the following components in parts by weight: 60-70 parts of polysulfone modified epoxy resin, 23-25 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 5-8 parts of polydimethylsiloxane, 0.1-5 parts of modified or unmodified melanin, 0.1-0.3 part of hydroquinone, 5-8 parts of styrene modified alkyd resin and 3-10 parts of modified sepiolite powder;
the modification method of the melanin comprises the following specific steps:
(1) uniformly dispersing 5 parts of melanin powder in 100 parts of dimethyl sulfoxide, adding 2-5 parts of sodium citrate, and then keeping at 130-140 ℃ for 30 min;
(2) adding 50-80 parts of n-butanol and 1-5 parts of dodecyl bromide into the system, stirring for 30min at 110 ℃, then adding 3-5 parts of silane coupling agent and 1-3 parts of disodium ethylene diamine tetraacetate, and stirring for 30-60min at 120 ℃; filtering, washing and drying; the drying temperature is 70-80 ℃;
(3) adding 1-3 parts of the obtained product into 10-30 parts of dimethylformamide, then adding 2-5 parts of maleic anhydride and 1-3 parts of fumaric acid, stirring at 60 ℃ for 20-30min, and adding 0.5-1 part of citric acid into the mixture;
(4) filtering, washing and drying the obtained product to obtain modified melanin powder;
the modified sepiolite powder is prepared by the following steps: mixing sepiolite powder with a mixed solution of pentanediol with the mass concentration of 13% and ethyl acetate, stirring, mixing and dispersing uniformly to obtain a dispersion liquid, wherein the mass ratio of the pentanediol to the ethyl acetate is 2: 1; then adding hydrochloric acid accounting for 0.5-1% of the dispersion liquid by mass into the dispersion liquid, carrying out ultrasonic treatment for 5-10 minutes, filtering, washing with deionized water, and drying at 60 ℃; and then mixing the sepiolite powder with a compound solution, wherein the compound solution is a mixed solution of 3% by mass of sodium dodecyl benzene sulfonate, 20% by mass of isopropyl titanate and 5% by mass of aniline, the solutes are sodium dodecyl benzene sulfonate, aniline and isopropyl titanate, the mixed solution is prepared by mixing the sodium dodecyl benzene sulfonate, the isopropyl titanate and the aniline at 40 ℃ for 30min, filtering and drying at 70-80 ℃ to obtain the modified sepiolite powder.
2. The high-strength blue-light-proof LED packaging material as claimed in claim 1, characterized by comprising the following components in parts by weight: 65-70 parts of polysulfone modified epoxy resin, 23-25 parts of bisphenol F/resorcinol copolymerization type epoxy resin, 5-8 parts of polydimethylsiloxane, 0.1-1 part of modified or unmodified melanin, 0.1-0.3 part of hydroquinone, 5-8 parts of styrene modified alkyd resin and 3-5 parts of modified sepiolite powder.
3. The high-strength blue-light-proof LED packaging material as claimed in claim 1, wherein the obtained modified sepiolite powder is further modified, specifically, the sepiolite powder is mixed with the carbon nanotubes treated by acid, specifically, the sepiolite powder is ground and mixed by a ball mill for 30-60min, wherein the ratio of the dried product to the carbon nanotubes is 5-10: 1.
4. The high-intensity blue-light-proof LED packaging material as claimed in claim 3, wherein the diameter of the carbon nanotube is 20-50 nm.
5. The high-intensity blue-light-proof LED packaging material as claimed in claim 1 or 2, wherein the particle size of the modified or unmodified melanin is 50-100 nm.
6. The high-strength blue-light-proof LED encapsulating material as claimed in claim 1 or 2, wherein the particle size of the modified sepiolite powder is 50-150 nm.
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