CN106826602A - A kind of plunge grinding soldering manufacture of diamond dressing roller and preparation method thereof - Google Patents
A kind of plunge grinding soldering manufacture of diamond dressing roller and preparation method thereof Download PDFInfo
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- CN106826602A CN106826602A CN201710207891.1A CN201710207891A CN106826602A CN 106826602 A CN106826602 A CN 106826602A CN 201710207891 A CN201710207891 A CN 201710207891A CN 106826602 A CN106826602 A CN 106826602A
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- abrasive particle
- ring base
- roller
- former
- matrix
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The present invention provides a kind of plunge grinding soldering manufacture of diamond dressing roller, roller matrix, ring base, solder layer and abrasive particle that it sets gradually including from-inner-to-outer, roller matrix is bonded by tack coat with the ring base, the solder layer is arranged on the ring base outside, and the abrasive particle is annularly equidistantly integrally disposed upon the outer ring of the solder layer.The preparation method of the roller is additionally provided, is comprised the following steps：1）Make former；2）Make roller matrix and ring base；3）Apply heat-resistant adhesive；4）It is put into ring base；5）Insert abrasive particle；6）Addition solder；7）Liquid-phase sintering；8）Bond roller matrix；9）Processing roller matrix endoporus and end face；10）Shaping.The above method has the advantages that design science, the accuracy of manufacture high, the equidistant ordered arrangement of abrasive particle, brazing process are controllable, and the roller prepared has the advantages that diamond abrasive grain hold is high, abrasive particle utilization is abundant, service life of roller is long and use cost is low.
Description
Technical field
The present invention relates to a kind of contact roller for dressing, specifically, a kind of plunge grinding soldering diamond finishing rolling is relate to
Wheel, further relates to the preparation method of the contact roller for dressing.
Background technology
Plunge grinding is to realize many complicated surface machine components in the industries such as current aerospace space flight, automobile, precision assembly
In high precision, high efficiency, the main machine adding method of inexpensive processing request.In order that emery wheel can have correctly in plunge grinding
Work shape face, it is essential link that it repair, while the quality of crushing effect is also to ensure that part adds
The key of working medium amount.
For multilayer abrasive grinding wheel, not only efficiency high is repaired to emery wheel using CNC trimmers, and can also lead to
Cross setting different motion track and repair out various required stone shape faces, therefore the method is obtained extensively in plunge grinding
General application.At this stage, CNC trimmers are often with electroplated diamond roller as supporting dressing tool.
But, plating tool is low to the mechanical hold of diamond abrasive grain, and its abrasive particle effective rate of utilization is usual less than 30%,
Thus the problem that dressing tool service life is short, use cost is high is brought, this is also difficult always in emery wheel CNC dressing technique applications
With the bottleneck broken through.
At present, super hard abrasive soldering tech has successfully realized the hold high to abrasive particle.
Therefore, under the premise of the instrument accuracy of manufacture is ensured, how instrument is improved to diamond abrasive grain by soldering tech
Hold high, so as to lift the utilization rate and its service life of abrasive particle, it has also become reduce emery wheel CNC dressing technique use cost urgency
The technical problem that need to be solved.
In order to solve the problem present on, people are seeking a kind of preferable technical solution always.
The content of the invention
The purpose of the present invention is directed to the deficiencies in the prior art, so that providing, a kind of diamond abrasive grain hold is high, abrasive particle
Using a kind of plunge grinding soldering manufacture of diamond dressing roller that abundant, service life of roller is long and use cost is low.Additionally provide one
The controllable plunge grinding soldering diamond of design science, the accuracy of manufacture high, the equidistant ordered arrangement of abrasive particle, brazing process is planted to repair
The preparation method of whole roller.
To achieve these goals, the technical solution adopted in the present invention is：A kind of plunge grinding soldering diamond is repaiied
Whole roller, including roller matrix, ring base, solder layer and the abrasive particle that from-inner-to-outer sets gradually, the roller matrix is by viscous
Knot layer is bonded with the ring base, and the solder layer is arranged on the ring base outside, the abrasive particle equidistantly one annular in shape
It is arranged on the outer ring of the solder layer.
Described on base, the solder layer is fixed on the ring base outside by powder brazing alloy by liquid-phase sintering, while institute
Abrasive particle is stated to be fixed with the solder layer in liquid sintering process.
Described on base, the ring base is interior thick outer thin symmetrical slope body structure.
A kind of manufacture plunge grinding method of soldering manufacture of diamond dressing roller, comprises the following steps：
1）Make former：Axial locating surface, the abrasive particle locating surface of level are processed in the endoporus of former and the oblique of ring base is placed
Face；
2）Make roller matrix and ring base：The roller matrix is a circular ring, the outer end of the ring base upper surface
Open up a hierarchic structure；
3）Apply heat-resistant adhesive：A thin layer heat-resistant adhesive is circumferentially coated with equal intervals in the middle and lower part of former axial locating surface；
4）It is put into ring base：Ring base is put into former, the inclined-plane of former aligns with the inclined-plane of ring base lower surface, adjusts ring group
External periphery is concentric with the axial locating surface of former；
5）Insert abrasive particle：Abrasive particle is inserted the gap between former and ring base, abrasive grain locations and heat-resistant adhesive position at equal intervals
Correspondence, keeps the bottom surface laminating abrasive particle locating surface of abrasive particle, the one side of abrasive particle abut axial locating surface and with the heat-resisting splicing
Touch and realize positioning；
6）Addition solder：Take an annular cover die, by the gap between annular cover die insertion abrasive particle and ring base, annular cover die with
Hierarchic structure constitutes the space for accommodating solder powder, and solder powder is inserted in the space and is compacted；
7）Liquid-phase sintering：Cover die is taken out, then the former, the abrasive particle, the ring base, the solder is put into very in the lump
High-temperature liquid-phase sintering is carried out in empty stove, roller working lining is formed；
8）Bond roller matrix：First roller working lining and former are bonded, then roller matrix and ring base are bonded；
9）Processing roller matrix endoporus and end face：Using the reference plane of former, ensured in roller matrix using machining process
Hole and the axial locating surface unifying datum of former, and ensure the perpendicularity requirement between roller matrix both ends of the surface and its endoporus；
10）Shaping：The appearance and size of removal former, processing ring base and roller matrix is to desired size.
It is described on base, step 1）In, the former material is high purity graphite, and the width of abrasive particle locating surface is abrasive particle grain
The 60%~70% of footpath, the bevel angle for placing the ring base is 10~30 °.
It is described on base, step 2）In, the ring base is metal, and periphery width is 1~3 times of the Abrasive Particle Size,
The hierarchic structure carries 5~20 ° of oblique angles from inside to outside.
It is described on base, step 4）In, ring base periphery is L, its computing formula apart from the distance of former inside diameter surface
For：
L=d0 + d1；
d0The particle diameter of=the abrasive particle；
d1 =0.1~0.2mm；
The thickness of the annular cover die is less than d1。
It is described on base, step 3）In, the heat resisting temperature of the heat-resistant adhesive is higher than brazing temperature.
It is described on base, step 5）In, the abrasive particle is heat resistant type diamond, and particle diameter is more than between 0.5mm, the abrasive particle
Away from being 1~3mm.
It is described on base, step 6）In, the solder layer trickles to solidify and is formed by powder brazing alloy after liquid-phase sintering, and solder
Layer embedding abrasive particle thickness is more than the 20% of particle diameter.
Beneficial effect
The present invention has prominent substantive distinguishing features progressive with significant compared with the prior art, and specifically, the present invention utilizes pricker
Welding technology increases to the hold of diamond abrasive grain, and then improves the abrasive particle utilization rate of the contact roller for dressing, final to realize extension
The contact roller for dressing service life, the purpose for reducing contact roller for dressing use cost.
Further, prepare in the method for contact roller for dressing, inserted on the basis of axial locating surface, the abrasive particle locating surface of level
Abrasive particle, using the heat-resistant adhesive bonded-abrasive being coated on axial locating surface so that the surface accuracy and positional precision of abrasive particle are controllable；Profit
With aforementioned advantages so that the equidistant ordered arrangement of abrasive particle is convenient；Hierarchic structure is opened up, coordinates annular cover die, for solder powder
End is filled into row constraint, and optimize solder powder inserts operation so that brazing process solder layer is controllable to the embedding thickness of abrasive particle.
Whole preparation process has the advantages that process is simple, the accuracy of manufacture be high, brazing process is controllable.
Brief description of the drawings
Fig. 1 is the structural representation of plunge grinding soldering manufacture of diamond dressing roller in the present invention.
Fig. 2 is the sectional view of plunge grinding soldering manufacture of diamond dressing roller in the present invention.
Fig. 3 is the schematic diagram of powder brazing alloy filling and its cover die use state before liquid-phase sintering in the present invention.
Fig. 4 is the structural representation of the roller working lining with former of liquid-phase sintering postforming in the present invention.
Fig. 5 is the structural representation being adhesively fixed between roller working lining and former in the present invention.
In figure：1. former；2. abrasive particle；3. solder layer；4. ring base；5. roller matrix；6. tack coat；7. heat-resistant adhesive；8.
Cover die；9. axial locating surface；10. abrasive particle locating surface；11. hierarchic structures；12. solder powders；13. bond regions；14. second references
Face.
Specific embodiment
Below by specific embodiment, technical scheme is described in further detail.
As shown in figure 1, a kind of plunge grinding soldering manufacture of diamond dressing roller, including the roller that from-inner-to-outer sets gradually
Matrix 5, ring base 4, solder layer 3 and abrasive particle 2, the roller matrix 5 are bonded by tack coat 6 with the ring base 4, tack coat
6 material is the mixture of A/B glue and metallic aluminium powder, the A/B glue and the metallic aluminium powder by volume 1：1 is prepared,
The thickness of the tack coat 6 is 0.1mm.The solder layer 3 is arranged on the outside of the ring base 4, between single layer of abrasive particles 2 is annularly waited
Away from the outer ring for being integrally disposed upon the solder layer 3, the solder layer 3 is fixed on the ring group by powder brazing alloy by liquid-phase sintering
The outside of body 4, while the abrasive particle 2 is fixed in liquid sintering process with the solder layer 3.The ring base 4 is interior thick outer thin
Symmetrical slope body structure.
Because the hold for using soldering tech, abrasive particle is greatly improved, while the exposed height of abrasive particle is big, therefore roller
Cutting is sharp, and the utilization rate of abrasive particle is improved, so that the service life of contact roller for dressing increases, while also reduce repairing
The use cost of whole roller.
A kind of method for preparing above-mentioned plunge grinding soldering manufacture of diamond dressing roller, comprises the following steps：
1）Make former 1.The material of the former 1 is high purity graphite, and former 1 has endoporus, axial locating surface is processed in endoporus
9th, the inclined-plane of the abrasive particle locating surface 10 of level and placement ring base 4, the width of abrasive particle locating surface 10 is 0.7mm, the angle on inclined-plane
It is 20 °.
2）Make roller matrix 5 and ring base 4.The roller matrix 5 is a circular ring, and its diameter of bore size is
3mm, is mainly used in follow-up precision correction, and the outer end of the upper surface of the ring base 4 opens up a hierarchic structure 11, and cascaded surface angle is
15 °, for being subsequently stuffed into solder powder 12, lower surface is used to coordinate with the inclined-plane on the former 1, and the periphery of ring base 4 is wide
It is 2mm to spend.
3）Apply heat-resistant adhesive.A thin layer heat-resistant adhesive is circumferentially coated with equal intervals in the middle and lower part of the axial locating surface 9 of former 1
7, heat-resistant adhesive of the heat-resistant adhesive 7 using heat resisting temperature more than 1000 degree, during specific implementation, can be in predetermined dispensing position
Mark is drawn, then dispensing, the precision of lifting dispensing position is carried out in mark.
4）It is put into ring base 4.The inclined-plane of former 1 aligns with the inclined-plane of the lower surface of ring base 4, adjusts the excircle of ring base 4
Face is concentric with the axial locating surface 9 of former 1, wherein, the periphery of ring base 4 is L apart from the distance of the inside diameter surface of former 1, its
Computing formula is：
L=d0 + d1；
d0The particle diameter of=abrasive particle；
d1 =0.1~0.2mm.
In the present embodiment, d0=1mm, d1 =0.2mm, L=1.2mm.
5）Insert abrasive particle 2.The abrasive particle 2 is heat resistant type diamond, and particle diameter is what is used on 1mm, and single-piece roller
The particle size of abrasive particle 2 should be as far as possible consistent by screening；Abrasive particle 2 is inserted between former 1 and ring base 4 at equal intervals
Gap, it is ensured that abrasive grain locations are corresponding with the dispensing position of heat-resistant adhesive, and the control of spacing between abrasive particle keeps the bottom of abrasive particle 2 in 2mm
Face laminating abrasive particle locating surface 10, the one side of abrasive particle 2 abuts axial locating surface 9 and is simultaneously contacted with heat-resistant adhesive, by axial locating surface 9
On heat-resistant adhesive 7 fix itself, the heat resisting temperature of the heat-resistant adhesive 7 is higher than brazing temperature.
6）Addition solder.As shown in figure 3, taking an annular cover die 8, cover die 8 is plastic foil, and the thickness of annular cover die is less than
d1, the annular cover die 8 is inserted into the gap between abrasive particle 2 and ring base 4, annular cover die 8 surrounds a closing with hierarchic structure 11
Space, enter row constraint during for being filled to solder powder 12.Annular cover die 8 should be between abrasive particle during specifically used
Retention gap, is in order to give solder powder reserved location, while without impinging on abrasive particle, solder powder 12 then is inserted into ring base 4
On hierarchic structure 11 in and be compacted, solder powder number determine embedding abrasive particle thickness.
7）Liquid-phase sintering.Cover die 8 is taken out, then by the former 1, the abrasive particle 2, the ring base 4, the solder powder
End 12 carries out high-temperature liquid-phase sintering liquid-phase sintering in being put into vacuum drying oven in the lump, and powder brazing alloy trickles into gap after liquid-phase sintering
And solidification forms solder layer 3, above-mentioned solder powder selects Cu-Sn-Ti alloy powders, controls solder layer 3 to embed abrasive particle thickness and is
The 30% of particle diameter, ultimately forms roller working lining as shown in Figure 4.
8）As shown in figure 5, bonding roller matrix.Roller working lining is further bonded with former 1, the material of bond regions 13
Expect to be A/B glue, afterwards again bonded the roller matrix 5 and ring base 4.The material of tack coat 6 is A/B glue and metallic aluminium powder
Mixture, the A/B glue and the metallic aluminium powder by volume 1：1 is prepared, and the thickness of the tack coat is 0.1mm.
9）Processing roller matrix endoporus and end face, axial locating surface 9 is used as the first reference plane, the upper surface conduct of former 1
Second reference plane 14, processes the endoporus and end face of roller matrix.The purpose is to ensure the endoporus of roller matrix 5 with abrasive particle on former 1
The unifying datum of axial locating surface 9, and ensure the perpendicularity requirement between the both ends of the surface of roller matrix 5 and its endoporus.
10）Shaping.Removal former 1, processes the appearance and size of ring base 4 and roller matrix 5 to desired size, by ladder knot
Structure is polished, and ring base is trimmed into symmetrical slope body structure.
In other embodiments, the particle diameter of the abrasive particle is 1mm, and the width of abrasive particle locating surface is 0.6mm, places the ring
The bevel angle of matrix is 10 °, and the cylindrical face thickness of ring base is 3mm, the hierarchic structure 10 ° of oblique angles, institute from inside to outside
Abrasive particle spacing is stated for 3mm, solder layer embedding abrasive particle thickness is the 15% of particle diameter, has reached the more frivolous characteristic of volume.More
In embodiment, it would however also be possible to employ other sizes in the scope of application, to obtain the contact roller for dressing of different qualities.
Finally it should be noted that:The above embodiments are merely illustrative of the technical solutions of the present invention rather than its limitations；To the greatest extent
Pipe has been described in detail with reference to preferred embodiment to the present invention, and those of ordinary skill in the art should be understood：Still
Specific embodiment of the invention can be modified or equivalent is carried out to some technical characteristics；Without deviating from this hair
The spirit of bright technical scheme, it all should cover in the middle of claimed technical scheme scope of the invention.
Claims (10)
1. a kind of plunge grinding soldering manufacture of diamond dressing roller, it is characterised in that：The rolling that it sets gradually including from-inner-to-outer
Wheel matrix, ring base, solder layer and abrasive particle, the roller matrix are bonded by tack coat with the ring base, the solder layer
The ring base outside is arranged on, the abrasive particle is annularly equidistantly integrally disposed upon the outer ring of the solder layer.
2. plunge grinding according to claim 1 soldering manufacture of diamond dressing roller, it is characterised in that：The solder layer by
Powder brazing alloy is fixed on ring base outside by liquid-phase sintering, at the same the abrasive particle in liquid sintering process with the pricker
The bed of material is fixed.
3. plunge grinding according to claim 1 and 2 soldering manufacture of diamond dressing roller, it is characterised in that：The ring group
Body is interior thick outer thin symmetrical slope body structure.
It is 4. a kind of to manufacture the plunge grinding method of soldering manufacture of diamond dressing roller, it is characterised in that：
Comprise the following steps：
1）Make former：Axial locating surface, the abrasive particle locating surface of level are processed in the endoporus of former and the oblique of ring base is placed
Face；
2）Make roller matrix and ring base：The roller matrix is a circular ring, the outer end of the ring base upper surface
Open up a hierarchic structure；
3）Apply heat-resistant adhesive：A thin layer heat-resistant adhesive is circumferentially coated with equal intervals in the middle and lower part of former axial locating surface；
4）It is put into ring base：Ring base is put into former, the inclined-plane of former aligns with the inclined-plane of ring base lower surface, adjusts ring group
External periphery is concentric with the axial locating surface of former；
5）Insert abrasive particle：Abrasive particle is inserted the gap between former and ring base, abrasive grain locations and heat-resistant adhesive position at equal intervals
Correspondence, keeps the bottom surface laminating abrasive particle locating surface of abrasive particle, the one side of abrasive particle abut axial locating surface and with the heat-resisting splicing
Touch and realize positioning；
6）Addition solder：Take an annular cover die, by the gap between annular cover die insertion abrasive particle and ring base, annular cover die with
Hierarchic structure constitutes the space for accommodating solder powder, and solder powder is inserted in the space and is compacted；
7）Liquid-phase sintering：Cover die is taken out, then the former, the abrasive particle, the ring base, the solder is put into very in the lump
High-temperature liquid-phase sintering is carried out in empty stove, roller working lining is formed；
8）Bond roller matrix：First roller working lining and former are bonded, then roller matrix and ring base are bonded；
9）Processing roller matrix endoporus and end face：Using the reference plane of former, ensured in roller matrix using machining process
The axial locating surface unifying datum and the perpendicularity requirement between guarantee roller matrix both ends of the surface and its endoporus of hole and former；
10）Shaping：The appearance and size of removal former, processing ring base and roller matrix is to desired size.
5. method according to claim 4, it is characterised in that：Step 1）In, the former material is high purity graphite, abrasive particle
The width of locating surface is the 60%~70% of the Abrasive Particle Size, and the bevel angle for placing the ring base is 10~30 °.
6. method according to claim 4, it is characterised in that：Step 2）In, the ring base is metal, periphery width
It it is 1~3 times of the Abrasive Particle Size, the hierarchic structure carries 5~20 ° of oblique angles from inside to outside.
7. the method according to claim any one of 4-6, it is characterised in that：Step 4）In, ring base periphery distance is cloudy
The distance of mould inside diameter surface is L, and its computing formula is：
L=d0 + d1；
d0The particle diameter of=the abrasive particle；
d1 =0.1~0.2mm；
The thickness of the annular cover die is less than d1。
8. method according to claim 4, it is characterised in that：Step 3）In, the heat resisting temperature of the heat-resistant adhesive is higher than pricker
Weldering temperature.
9. method according to claim 7, it is characterised in that：Step 5）In, the abrasive particle is heat resistant type diamond,
Particle diameter is more than 0.5mm, and the abrasive particle spacing is 1~3mm.
10. method according to claim 8 or claim 9, it is characterised in that：Step 6）In, the solder layer is existed by powder brazing alloy
Solidification of being trickled after liquid-phase sintering is formed, and solder layer embedding abrasive particle thickness is more than the 20% of particle diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710207891.1A CN106826602B (en) | 2017-03-31 | 2017-03-31 | A kind of plunge grinding soldering manufacture of diamond dressing roller and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710207891.1A CN106826602B (en) | 2017-03-31 | 2017-03-31 | A kind of plunge grinding soldering manufacture of diamond dressing roller and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106826602A true CN106826602A (en) | 2017-06-13 |
| CN106826602B CN106826602B (en) | 2019-02-12 |
Family
ID=59141711
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710207891.1A Active CN106826602B (en) | 2017-03-31 | 2017-03-31 | A kind of plunge grinding soldering manufacture of diamond dressing roller and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108044531A (en) * | 2017-12-12 | 2018-05-18 | 中国航发沈阳黎明航空发动机有限责任公司 | A kind of diamond roller manufacturing method for merging grinding for multiple operation |
| CN108857940A (en) * | 2018-07-19 | 2018-11-23 | 河南工业大学 | A kind of single layer high-precision soldering super-abrasive grinding wheel and its manufacturing method |
| CN112589608A (en) * | 2020-12-09 | 2021-04-02 | 陕西涵阳机械有限责任公司 | Grinding process of ball spline shaft raceway |
| CN112676568A (en) * | 2020-12-03 | 2021-04-20 | 西安博奥达金刚石工磨具有限公司 | Preparation method of parallel surface CVD diamond roller |
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| CN108044531A (en) * | 2017-12-12 | 2018-05-18 | 中国航发沈阳黎明航空发动机有限责任公司 | A kind of diamond roller manufacturing method for merging grinding for multiple operation |
| CN108857940A (en) * | 2018-07-19 | 2018-11-23 | 河南工业大学 | A kind of single layer high-precision soldering super-abrasive grinding wheel and its manufacturing method |
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| CN112589608B (en) * | 2020-12-09 | 2023-08-01 | 陕西涵阳机械有限责任公司 | Grinding technology for ball spline shaft roller path |
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| CN106826602B (en) | 2019-02-12 |
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